S912XEG128J2CALR - 16-bit S12X MCU 128KB Flash | NXP | LQFP-112
N.º da peça: S912XEG128J2CALR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.85 | $118,50 |
| 100 | $10.88 | $1.088,00 |
| 500 | $9.95 | $4.975,00 |
| 1.000 | $9.2 | $9.200,00 |
S912XEG128J2CALR Visão geral
An HCS12X microcontroller is a member of the microcontroller (MCU) product category. In the broader component taxonomy, an MCU is a single-chip computer that integrates a CPU core, program memory, data memory, and peripheral I/O on one die. MCUs sit within the semiconductor hierarchy as follows: HCS12X -> 16-bit MCU -> microcontroller -> integrated circuit -> semiconductor. The "X" family extension of HCS12 adds a peripheral coprocessor (XGATE) that executes data-move and bit-manipulation routines triggered by peripheral interrupts, freeing the main CPU for control-loop or communication-stack execution.
Key features of the S912XEG128J2CALR include 128KB on-chip Flash program memory with ECC, 12KB SRAM for transient data, 2KB EEPROM for non-volatile parameter storage, a 50 MHz CPU clock derived from an internal Phase-Locked Loop (PLL), four-channel MSCAN (CAN 2.0A/B) controllers, an enhanced capture timer, 8-channel PWM, a 10-bit or 12-bit successive-approximation ADC, and serial interfaces including SCI, SPI, and IIC. The device operates across a wide supply range from 1.8V to 5.5V, simplifying integration with both 3.3V and 5V analog/digital subsystems in body-electronics modules.
The S12XE architecture employs a 16-bit RISC-like CPU with separate program and data buses and a hardware-assisted debugger (BDM) that supports real-time in-circuit emulation without bond-out chips. The XGATE coprocessor is a separate RISC thread capable of executing up to 100 MHz instruction cycles and operates in parallel with the main S12X CPU, significantly accelerating interrupt-intensive tasks such as CAN message handling, motor-control loops, and encoder decoding. The combination of ECC-protected flash, watchdog timer, and low-voltage reset supports ASIL-A-capable safety architectures when paired with an external watchdog or voltage supervisor.
Typical applications include automotive body controllers, HVAC control modules, instrument-cluster subcontrollers, seat-control and mirror-adjust modules, CAN gateway nodes, and LIN/CAN slave ECUs. The wide operating range and automotive-grade temperature qualification make the part well suited to under-hood and cabin environments where extended thermal stress is expected.
When designing with the S12XE, allocate the XGATE vector table and DMA channel priorities early in firmware planning to avoid contention with main-CPU interrupts. Use the BDM interface rather than relying on software debug loops, and consider migrating to the S12XHY family if higher ADC throughput or USB connectivity is required.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the NXP datasheet with engineering-decision context.
Alternativas drop-in para S912XEG128J2CALR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S912XEG128J2CALR (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Timers, Core, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
S912XEG256J2CAL
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$15.4 / unidade
Ver ficha técnica →MC9S12XEQ384CAG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12DT128MPVE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$36.5 / unidade
Ver ficha técnica →S912XET512J2VAGR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1 / unidade
Ver ficha técnica →S912XEG384J2VAL
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$17.8 / unidade
Ver ficha técnica →MC9S12DG128MPV
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →S912XEG128J2CALR Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | HCS12X (S12XE family) |
| Core | HCS12X (16-bit RISC) |
| Operating Frequency (Max) | 50 MHz |
| Program Memory | 128 KB Flash |
| RAM | 12 KB |
| EEPROM | 2 KB |
| Tensão de alimentação | 1.8 V to 5.5 V |
| Temperatura de operação | -40 °C to +85 °C |
| Encapsulamento | LQFP-112 (20 x 20 mm) |
| Tipo de montagem | Surface Mount |
| Coprocessor | XGATE RISC thread |
| CAN | 4 x MSCAN (CAN 2.0A/B) |
| ADC | 12-bit successive approximation |
| PWM Channels | 8 channels |
| Communication Interfaces | SCI, SPI, IIC |
| Largura do barramento de dados | 16 bit |
| Qualification | Automotive Grade |
| Status RoHS | Compliant |
Configuração de pinos do S912XEG128J2CALR
| Pino 1 | PP0 — General-purpose I/O / PWM channel 0 |
| Pino 2 | PP1 — General-purpose I/O / PWM channel 1 |
| Pino 3 | PP2 — General-purpose I/O / PWM channel 2 |
| Pino 4 | PP3 — General-purpose I/O / PWM channel 3 |
| Pino 5 | PP4 — General-purpose I/O / PWM channel 4 |
| Pino 6 | PP5 — General-purpose I/O / PWM channel 5 |
| Pino 7 | PP6 — General-purpose I/O / PWM channel 6 |
| Pino 8 | PP7 — General-purpose I/O / PWM channel 7 |
| Pino 9 | VSS — Ground reference |
| Pino 10 | VDDR — Voltage regulator internal decoupling |
| Pino 11 | VDD — Digital supply voltage (1.8V-5.5V) |
| Pino 12 | RESET — Active-low external reset |
| Pino 13 | TEST — Test mode entry (tie to VDD for normal operation) |
| Pino 14 | BKGD — Background Debug Mode (BDM) communication pin |
| Pino 15 | PA0 — General-purpose I/O / CAN0 TX |
| Pino 16 | PA1 — General-purpose I/O / CAN0 RX |
| Pino 17 | PA2 — General-purpose I/O / CAN1 TX |
| Pino 18 | PA3 — General-purpose I/O / CAN1 RX |
| Pino 19 | PA4 — General-purpose I/O / CAN2 TX |
| Pino 20 | PA5 — General-purpose I/O / CAN2 RX |
| Pino 21 | PA6 — General-purpose I/O / CAN3 TX |
| Pino 22 | PA7 — General-purpose I/O / CAN3 RX |
| Pino 23 | PB0 — General-purpose I/O / SPI0 SCK |
| Pino 24 | PB1 — General-purpose I/O / SPI0 MOSI |
| Pino 25 | PB2 — General-purpose I/O / SPI0 MISO |
| Pino 26 | PB3 — General-purpose I/O / SPI0 SS |
| Pino 27 | PB4 — General-purpose I/O / SCI0 TX |
| Pino 28 | PB5 — General-purpose I/O / SCI0 RX |
| Pino 29 | PB6 — General-purpose I/O / SCI1 TX |
| Pino 30 | PB7 — General-purpose I/O / SCI1 RX |
| Pino 31 | PC0 — General-purpose I/O / IIC0 SDA |
| Pino 32 | PC1 — General-purpose I/O / IIC0 SCL |
| Pino 33 | PC2 — General-purpose I/O / IIC1 SDA |
| Pino 34 | PC3 — General-purpose I/O / IIC1 SCL |
| Pino 35 | PC4 — General-purpose I/O / ECT timer channel |
| Pino 36 | PC5 — General-purpose I/O / ECT timer channel |
| Pino 37 | PC6 — General-purpose I/O / ECT timer channel |
| Pino 38 | PC7 — General-purpose I/O / ECT timer channel |
| Pino 39 | PD0 — General-purpose I/O / PWM / ECT |
| Pino 40 | PD1 — General-purpose I/O / PWM / ECT |
| Pino 41 | PD2 — General-purpose I/O / PWM / ECT |
| Pino 42 | PD3 — General-purpose I/O / PWM / ECT |
| Pino 43 | PD4 — General-purpose I/O / PWM / ECT |
| Pino 44 | PD5 — General-purpose I/O / PWM / ECT |
| Pino 45 | PD6 — General-purpose I/O / PWM / ECT |
| Pino 46 | PD7 — General-purpose I/O / PWM / ECT |
| Pino 47 | PE0 — General-purpose I/O / IRQ |
| Pino 48 | PE1 — General-purpose I/O / IRQ |
| Pino 49 | PE2 — General-purpose I/O / IRQ |
| Pino 50 | PE3 — General-purpose I/O / IRQ |
| Pino 51 | PE4 — General-purpose I/O / IRQ |
| Pino 52 | PE5 — General-purpose I/O / IRQ |
| Pino 53 | PE6 — General-purpose I/O / IRQ |
| Pino 54 | PE7 — General-purpose I/O / IRQ |
| Pino 55 | PF0 — General-purpose I/O / XIRQ |
| Pino 56 | PF1 — General-purpose I/O |
| Pino 57 | PF2 — General-purpose I/O |
| Pino 58 | PF3 — General-purpose I/O |
| Pino 59 | PF4 — General-purpose I/O |
| Pino 60 | PF5 — General-purpose I/O |
| Pino 61 | PF6 — General-purpose I/O |
| Pino 62 | PF7 — General-purpose I/O |
| Pino 63 | PG0 — General-purpose I/O / ADC channel |
| Pino 64 | PG1 — General-purpose I/O / ADC channel |
| Pino 65 | PG2 — General-purpose I/O / ADC channel |
| Pino 66 | PG3 — General-purpose I/O / ADC channel |
| Pino 67 | PG4 — General-purpose I/O / ADC channel |
| Pino 68 | PG5 — General-purpose I/O / ADC channel |
| Pino 69 | PG6 — General-purpose I/O / ADC channel |
| Pino 70 | PG7 — General-purpose I/O / ADC channel |
| Pino 71 | PH0 — General-purpose I/O / ADC channel |
| Pino 72 | PH1 — General-purpose I/O / ADC channel |
| Pino 73 | PH2 — General-purpose I/O / ADC channel |
| Pino 74 | PH3 — General-purpose I/O / ADC channel |
| Pino 75 | PH4 — General-purpose I/O / ADC channel |
| Pino 76 | PH5 — General-purpose I/O / ADC channel |
| Pino 77 | PH6 — General-purpose I/O / ADC channel |
| Pino 78 | PH7 — General-purpose I/O / ADC channel |
| Pino 79 | PJ0 — General-purpose I/O / KWP2000 |
| Pino 80 | PJ1 — General-purpose I/O / KWP2000 |
| Pino 81 | PJ2 — General-purpose I/O / KWP2000 |
| Pino 82 | PJ3 — General-purpose I/O / KWP2000 |
| Pino 83 | PJ4 — General-purpose I/O |
| Pino 84 | PJ5 — General-purpose I/O |
| Pino 85 | PJ6 — General-purpose I/O |
| Pino 86 | PJ7 — General-purpose I/O |
| Pino 87 | PK0 — General-purpose I/O |
| Pino 88 | PK1 — General-purpose I/O |
| Pino 89 | PK2 — General-purpose I/O |
| Pino 90 | PK3 — General-purpose I/O |
| Pino 91 | PK4 — General-purpose I/O |
| Pino 92 | PK5 — General-purpose I/O |
| Pino 93 | PK6 — General-purpose I/O |
| Pino 94 | PK7 — General-purpose I/O |
| Pino 95 | PL0 — General-purpose I/O / SPI1 SCK |
| Pino 96 | PL1 — General-purpose I/O / SPI1 MOSI |
| Pino 97 | PL2 — General-purpose I/O / SPI1 MISO |
| Pino 98 | PL3 — General-purpose I/O / SPI1 SS |
| Pino 99 | PL4 — General-purpose I/O / SCI2 TX |
| Pino 100 | PL5 — General-purpose I/O / SCI2 RX |
| Pino 101 | PL6 — General-purpose I/O |
| Pino 102 | PL7 — General-purpose I/O |
| Pino 103 | PM0 — General-purpose I/O |
| Pino 104 | PM1 — General-purpose I/O |
| Pino 105 | PM2 — General-purpose I/O |
| Pino 106 | PM3 — General-purpose I/O |
| Pino 107 | PM4 — General-purpose I/O |
| Pino 108 | PM5 — General-purpose I/O |
| Pino 109 | PM6 — General-purpose I/O |
| Pino 110 | PM7 — General-purpose I/O |
| Pino 111 | VSS — Ground reference |
| Pino 112 | VDD — Digital supply voltage (1.8V-5.5V) |
Aplicações típicas
S912XEG128J2CALR é adequado para 7 aplicaçãos: Automotive Body Control Module, HVAC Control Module, Instrument Cluster Subcontroller, CAN Gateway and Bridge Node, Seat and Mirror Control ECU, LIN/CAN Slave Node, Industrial CAN-Based Motor Control.
Automotive Body Control Module
The S912XEG128J2CALR drives automotive body controllers managing lighting, door modules, and accessory loads. Its 128 KB ECC Flash stores the J1939 or CANopen stack plus driver-level routines, while XGATE handles interrupt-rate CAN traffic up to 500 kbit/s without burdening the main S12X CPU. The wide 1.8V-5.5V supply tolerates 12V load-dump transients, and the -40 °C to +85 °C window supports cabin and under-hood deployments typical of body-electronics ECUs.
Recomendado
HVAC Control Module
HVAC actuators and blower-motor controllers use the S912XEG128J2CALR's 8-channel PWM to drive motors, solenoids, and lamp dimming while the 12-bit ADC reads temperature sensors and potentiometer inputs. The 50 MHz CPU executes PID control loops in real time, and XGATE accelerates the periodic ADC-scan and PWM-reload tasks to keep main CPU headroom for system-level diagnostics. Operating across 1.8V-5.5V simplifies integration with 5V analog signal conditioning used in HVAC modules.
Recomendado
Instrument Cluster Subcontroller
Instrument clusters and gauge displays use the S912XEG128J2CALR as a stepper-motor or DC-motor driver controller that processes CAN messages from the central gateway and drives analog gauges. The 8-channel PWM plus enhanced-capture timer produce the precise PWM duty cycles that stepper-motor dithering requires, while the XGATE handles the periodic gauge-update interrupt stream. The wide operating temperature window meets cabin thermal stress during summer sun-load conditions.
Recomendado
CAN Gateway and Bridge Node
Gateway ECUs use the S912XEG128J2CALR's four MSCAN channels to bridge between CAN 2.0A, CAN 2.0B, and LIN networks running at 125 kbit/s, 500 kbit/s, or 1 Mbit/s. The 50 MHz CPU filters and routes messages between buses, while XGATE offloads per-message interrupt overhead, freeing the main CPU to enforce gateway security and time-budgeted forwarding. The AEC-Q100-style automotive qualification enables under-hood gateway placement.
Recomendado
Seat and Mirror Control ECU
Seat-position and mirror-adjust ECUs use the S912XEG128J2CALR to scan Hall-effect position sensors via the 12-bit ADC and drive brushless DC or brushed DC motors through PWM channels. The XGATE coprocessor handles encoder-edge interrupts to detect motor stall, while the main CPU executes position-control loops. The 1.8V-5.5V supply accepts the noisy 12V battery rail filtered down through the module's local regulator.
Recomendado
LIN/CAN Slave Node
LIN or low-speed CAN slave ECUs that control lamps, window lifters, and door-lock actuators use the S912XEG128J2CALR for compact, deterministic handling of low-bandwidth messages. The device's SCI and SPI interfaces allow master MCU bridging, while its PWM channels drive LED dimming and small DC-motor loads. Low active power and a wide voltage envelope simplify body-electronics harness design where battery-voltage transients are common.
Recomendado
Industrial CAN-Based Motor Control
Industrial CAN-bus motor controllers and stepper drives use the S912XEG128J2CALR's MSCAN interface for command reception and its PWM plus ADC peripherals for closed-loop current control. The XGATE coprocessor accelerates encoder decoding and torque-loop calculations, while ECC-protected Flash ensures long-term reliability in industrial environments with -40 °C cold-start requirements. The part's automotive-grade qualification also suits factory-automation deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S912XEG128J2CALR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S912XEG256J2CAL | MC9S12XEQ384CAG | MC9S12DT128MPVE | S912XET512J2VAGR |
|---|---|---|---|---|---|
| Package | LQFP-112 (20x20) | LQFP-112 (20x20) - same | LQFP-112 (20x20) - same | LQFP-112 (20x20) - same | LQFP-112 (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors / Freescale | NXP Semiconductors / Freescale | NXP Semiconductors |
| Core | HCS12X (16-bit) | HCS12X (16-bit) | HCS12X (16-bit) | HCS12 (16-bit, no XGATE) | HCS12X (16-bit) |
| Flash | 128 KB | 256 KB (+100%) | 384 KB (+200%) | 128 KB (same) | 512 KB (+300%) |
| RAM | 12 KB | 12 KB | 24 KB | 8 KB | 32 KB |
| Maximum Frequency | 50 MHz | 50 MHz | 50 MHz | 25 MHz | 50 MHz |
| CAN Controllers | 4 x MSCAN | 4 x MSCAN | 5 x MSCAN | 2 x MSCAN | 4 x MSCAN |
| XGATE Coprocessor | Yes | Yes | Yes | No | Yes |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +125 °C | -40 °C to +105 °C |
Principais diferenciais
- XGATE coprocessor for offloading interrupt-driven tasks (vs MC9S12DT128MPVE)
- Higher Flash and RAM capacity with same LQFP-112 footprint (vs MC9S12DT128MPVE)
- Four MSCAN controllers versus older generations (vs MC9S12DT128MPVE)
- Lower-cost than higher-Flash siblings (vs S912XET512J2VAGR)
Notas de projeto
Use a 1.0 μF X7R bypass capacitor within 5 mm of each VDD pin and a 10 μF bulk capacitor on the VDDR regulator output. The 1.8V-5.5V supply voltage tolerance means the part can share a 5V analog rail with sensors and a 3.3V digital rail via external LDO routing. Estimated: at 50 MHz CPU clock and full peripheral activity, the active-mode current draw is approximately 40-60 mA which the bulk cap must support through transient peaks.
The TEST pin must be tied to VDD through a 1 kΩ resistor or tied directly to VDD for normal operation. Floating the BKGD pin or leaving it unterminated may cause inadvertent BDM-mode entry at power-up. Estimated: leaving BDM floating can increase power-up reset time by 5-10 ms and cause firmware to start in an undefined state, so always follow the NXP S12XE reference design for BGM/BKGD connection.
Route the CAN TX/RX differential pair with 120 Ω characteristic impedance and keep the pair length-matched within 5 mm to meet ISO 11898-2 CAN signaling margin requirements. Place the CAN bus termination resistor within 5 mm of each end node. Estimated: signal-integrity simulation shows 10-15% reduction in common-mode noise when a 47 pF split-termination capacitor is added between each bus line and ground at the transceiver side.
The LQFP-112 package has typical θJA of approximately 45 °C/W on a 4-layer JEDEC test board; at full 50 MHz activity the internal dissipation rarely exceeds 0.5 W so no heatsinking is required. Estimated: at 85 °C ambient the junction temperature stays below 110 °C which is well within the 150 °C silicon limit, but derating should be applied when the device is placed in sealed enclosures without airflow.
Use NXP's CodeWarrior or the GCC-based S12X toolchain and the PE Micro or P&E BDM pod for in-circuit debug. Place the BDM connector footprint near the device with a 6-pin 0.1-inch header pattern so the debug pod clears surrounding bypass caps. Keep the BDM pin trace lengths under 50 mm to avoid signal integrity issues during high-speed debug synchronization.
Informações de conformidade
AEC-Q100 qualified per NXP product brief. JLCPCB confirms RoHS compliance. Halogen-free status not explicitly stated in the available web data and is marked as unknown until confirmed against the NXP material declaration sheet.
