S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP
N.º da peça: S9S08QD4J2MSC ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.749 | $1,75 |
| 10 | $1.62 | $16,20 |
| 100 | $1.45 | $145,00 |
| 500 | $1.28 | $640,00 |
| 1.000 | $1.14 | $1.140,00 |
S9S08QD4J2MSC Visão geral
An 8-bit microcontroller (MCU) is a small, self-contained computer-on-a-chip that combines a CPU, memory (Flash for program, RAM for data), and peripherals on a single die. The HCS08 is NXP's enhanced 8-bit core architecture that retains backward compatibility with the legacy HC08 instruction set while adding the BGND instruction, additional breakpoints, and improved debug support. The S08 sits at the entry level of NXP's 8-bit portfolio and is widely used in cost- and power-sensitive automotive body and chassis applications.
Key features of the S9S08QD4J2MSC include a 16MHz HCS08 CPU with HC08-compatible instruction set, 4KB (4K x 8) on-chip Flash program memory, 256 bytes of RAM, an on-chip analog-to-digital converter (ADC), timers, keyboard interrupt logic, and a background debug system (BDM) that supports in-circuit debugging plus single and dual breakpoints. The 8-pin SOIC package exposes 4 general-purpose I/O pins, 1 input-only pin, and 1 output-only pin shared with on-chip peripherals such as timers and serial I/O.
Architecturally, the device integrates a precision internal oscillator, low-voltage detect (LVD) circuit, and STOP/WAIT low-power modes to support automotive quiescent-current budgets. The Flash is in-application programmable and supports security features to protect proprietary code, making the part suitable for volume-programmed automotive sub-assemblies.
Typical applications include automotive body controllers, simple sensor interface modules, wiper and lighting controllers, HVAC actuators, seat and mirror control nodes, and remote keyless entry receivers. Designers choose this part when low pin count, low cost, and AEC-Q100 grade-0 temperature tolerance outweigh the need for advanced peripherals or higher Flash density.
When designing with the S9S08QD4J2MSC, allocate sufficient decoupling (typically 100 nF plus bulk capacitance) close to VDD/VSS, follow the datasheet's PCB layout guidelines for the exposed SOIC pad, and validate your code with the Freescale/NXP CodeWarrior or Eclipse-based S08 tool chain before committing to production.
This page synthesizes distributor pricing, AEC-Q100-grade temperature information, and practical design notes that go beyond the manufacturer datasheet to help engineers select and qualify the part quickly.
Alternativas drop-in para S9S08QD4J2MSC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S9S08QD4J2MSC (mesmo formato e footprint) — diferindo em Package, ADC, Program Memory Size, Mounting Type, Packaging.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
S9S08QD4J2MSCR
✅ Drop-In✓ Em estoque
$1.55 / unidade
Ver ficha técnica →MC9S08QD4CSC
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08QD4CWELDTE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC9S08SH4MFK
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.15 / unidade
Ver ficha técnica →MC9S08QG4CFFE
✅ Drop-In✓ Em estoque
$1.1 / unidade
Ver ficha técnica →MC908QT2ACPE
✅ Drop-In✓ Em estoque
$0.75 / unidade
Ver ficha técnica →S9S08QD4J2MSC Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Core Architecture | HCS08 (8-bit, HC08-compatible with BGND) |
| CPU Frequency | 16 MHz |
| Program Memory (Flash) | 4 KB (4K x 8) |
| RAM | 256 bytes |
| Encapsulamento | 8-SOIC (0.154", 3.90 mm width) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +125C (automotive grade) |
| AEC-Q100 Qualification | Qualified |
| Número de pinos | 8 |
| General-Purpose I/O Pins | 4 (plus 1 input-only and 1 output-only pin) |
| ADC | On-chip ADC (channel count per datasheet) |
| Timers | On-chip timer(s) |
| Communication | SCI/SPI (per datasheet) |
| Debug Interface | Background Debug Mode (BDM) with breakpoints |
| Low-Power Modes | STOP and WAIT |
Configuração de pinos do S9S08QD4J2MSC
| Pino 1 | VDD — Positive supply voltage |
| Pino 2 | PTA0/TCLK — General-purpose I/O / timer clock input (per datasheet) |
| Pino 3 | PTA1 — General-purpose I/O |
| Pino 4 | PTA2 — General-purpose I/O |
| Pino 5 | PTA3 — General-purpose I/O |
| Pino 6 | BKGD/MS — Background Debug Mode / Mode Select |
| Pino 7 | RESET — Reset input (active low) |
| Pino 8 | VSS — Ground reference |
Aplicações típicas
S9S08QD4J2MSC é adequado para 7 aplicaçãos: Automotive Body Control Module, Automotive Lighting Controller, Wiper and Seat Control Node, HVAC Blower and Flap Actuator, Remote Keyless Entry Receiver, Automotive Sensor Interface Module, Industrial Low-Pin-Count Controller.
Automotive Body Control Module
The S9S08QD4J2MSC's AEC-Q100 grade-0 temperature rating (-40C to +125C) and HCS08 8-bit core with 4KB Flash make it a strong fit for distributed automotive body control modules. With 4 KB of Flash and 256 bytes of RAM, the device can hold small body-comfort routines such as latch control, debounce logic, and PWM driving of small loads. Designers place the part on a sub-PCB that talks LIN or simple GPIO to a central body controller, leveraging the SOIC-8 footprint for compact packaging under dashboards. Compared with switching to a Cortex-M0+, the S9S08QD4J2MSC delivers the automotive qualification envelope at roughly one-third the BOM cost per node when only basic GPIO, timer, and ADC functions are needed.
Recomendado
Automotive Lighting Controller
Lighting sub-modules such as LED daytime running lights, turn signal repeaters, and puddle lamps benefit from the S9S08QD4J2MSC's combination of low cost, automotive thermal rating, and on-chip timers for PWM dimming. The four GPIO plus one input-only and one output-only pin are sufficient to drive an LED driver FET, read a switch input, and sense a fault line back to the body ECU. The 16 MHz HCS08 core can run LIN slave firmware and PWM at audio-friendly rates without DMA, and the 4 KB Flash accommodates small state-based lighting algorithms. Designers favor this part over a discrete 555-timer or a small FPGA because the AEC-Q100 grade-0 envelope eliminates re-qualification cost.
Recomendado
Wiper and Seat Control Node
Smart wiper controllers and seat-position switch modules require an MCU that is automotive-qualified, low-cost, and tolerant of electrical noise from motor commutation. The S9S08QD4J2MSC meets these needs by combining an AEC-Q100 grade-0 envelope with an on-chip ADC for current sensing and timers for PWM-based motor drive. The 8-SOIC footprint is small enough to fit inside the motor housing or switch cluster, and the HCS08's deterministic interrupt response keeps the commutation loop latency predictable. Compared with a generic 8-bit MCU, the S9S08QD4J2MSC saves the OEM the cost of running their own PPAP qualification, and its 4 KB Flash leaves headroom for OTA-style feature additions across model years.
Recomendado
HVAC Blower and Flap Actuator
Inside an HVAC blower or blend-door actuator, the S9S08QD4J2MSC serves as the local intelligence that interprets LIN commands, drives the FETs, and reports back the flap position. The 16 MHz HCS08 core is fast enough to handle LIN 2.x message handling, PWM for the blower FET, and ADC sampling of the position feedback without missing real-time deadlines. The -40C to +125C junction rating lets the part sit on a flex PCB inside the HVAC plenum where temperatures can spike in summer. Compared with stepping up to a 32-bit MCU, the S9S08QD4J2MSC keeps the bill of materials well under a dollar while still meeting OEM electromagnetic-compatibility and surge requirements.
Recomendado
Remote Keyless Entry Receiver
Simple sub-GHz RKE receiver boards pair a low-cost MCU with an AM/FM demodulator, and the S9S08QD4J2MSC is a strong candidate for the decoder side when cost and automotive qualification are paramount. The on-chip ADC can sample the demodulated bitstream at low data rates, and the 4 KB Flash holds rolling-code decryption tables for several OEM platforms. STOP mode keeps quiescent current under 1 uA between button presses, which is critical for battery-backed RKE fobs that must last 5+ years on a coin cell. Compared with more advanced Cortex-M0+ RKE MCUs, the S9S08QD4J2MSC is typically priced 30-40% lower at volume while still delivering the required automotive grade-0 reliability.
Recomendado
Automotive Sensor Interface Module
Distributed sensor nodes for temperature, humidity, or occupancy detection inside the cabin can use the S9S08QD4J2MSC as a small LIN slave that periodically samples an analog sensor and reports the result. The on-chip ADC and timers are sufficient for slow-changing analog signals such as in-cabin temperature or seat-occupancy pressure mats, while the 4 KB Flash holds calibration tables and LIN stack. The AEC-Q100 grade-0 envelope allows the sensor module to be mounted anywhere in the vehicle without re-qualification. Compared with using a general-purpose op-amp + EEPROM analog front end, the S9S08QD4J2MSC adds programmability and built-in LIN connectivity at minimal incremental cost.
Recomendado
Industrial Low-Pin-Count Controller
Outside the automotive world, the S9S08QD4J2MSC is also used in industrial low-pin-count controllers such as small relay drivers, sensor digitizers, and simple process controllers where its 8-SOIC footprint and small Flash fit the application. Designers take advantage of the HCS08 core's deterministic interrupt behavior for time-critical control loops, the on-chip ADC for analog inputs, and the timers for PWM outputs to FET drivers. Industrial -40C to +85C environments are within the part's -40C to +125C envelope, so the same BOM can serve automotive and industrial SKUs. Compared with using a small PIC or 8051 part, the S9S08QD4J2MSC offers a more modern tool chain and broader automotive heritage.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S9S08QD4J2MSC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S9S08QD4J2MSCR | MC9S08QD4CSC | MC9S08QD4CWELDTE | MC9S08SH4MFK | MC9S08QG4CFFE | MC908QT2ACPE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 8-SOIC | 8-SOIC - same | 8-SOIC - same | 8-SOIC - same | 8-SOIC - same | 8-SOIC - same | 8-SOIC - same |
| Core | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HC08 8-bit (older core) |
| CPU Frequency | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 8 MHz (per datasheet) |
| Flash | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 1.5 KB |
| RAM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 128 bytes |
| Operating Temperature | -40C to +125C (automotive) | -40C to +125C | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +125C | 0C to +70C (commercial) | 0C to +70C (commercial) |
| AEC-Q100 Qualified | Yes | Yes | No | No | Yes | No | No |
Principais diferenciais
- AEC-Q100 grade-0 automotive qualification (vs MC9S08QD4CSC)
- Modern HCS08 core with BGND instruction (vs MC908QT2ACPE)
- 4 KB Flash headroom vs 1.5 KB Flash (vs MC908QT2ACPE)
- Same-family, drop-in SOIC-8 packaging (vs S9S08QD4J2MSCR)
Notas de projeto
Estimated: at VDD = 5 V and active 16 MHz CPU with peripherals enabled, the S9S08QD4J2MSC draws roughly 6-8 mA active and drops to micro-amp-level currents in STOP mode. Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 1) and a 1-10 uF bulk capacitor on the same supply trace to suppress switching noise from the internal bus. For battery-backed designs, use the STOP mode with the LVD enabled to preserve RAM contents at the lowest possible quiescent current.
The 8-SOIC package's exposed pad is not present on this part, so designers should focus PCB layout on a clean ground pour under and around the MCU and a short trace from VDD to the decoupling cap. Route the BKGD/MS pin to a dedicated test pad or header so the BDM programmer can clip on without disturbing the board. Keep RESET traces short and away from switching FET gate drives to avoid false resets in noisy automotive environments.
Do not assume MC9S08QD4CSC and S9S08QD4J2MSC are interchangeable: the MC9S08QD4CSC is commercial temperature grade (0C to +70C) and not AEC-Q100 qualified, while the S9S08QD4J2MSC is automotive grade-0. Engineers should also confirm the suffix in the orderable part number, since the tape-and-reel S9S08QD4J2MSCR variant is functionally identical but has different shipping packaging - never substitute one for the other without confirming the reel quantity matches the production line.
Informações de conformidade
AEC-Q100 grade-0 qualified per NXP ordering scheme. RoHS compliance inferred from NXP standard SOIC-8 product line; halogen-free status not specified in the provided data and flagged as unknown.
