SAK-TC233LP-32F200F - AURIX 32-bit MCU, 200MHz, 2MB Flash | Infineon
N.º da peça: SAK-TC233LP-32F200F ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.34 | $9,34 |
| 10 | $8.72 | $87,20 |
| 100 | $7.85 | $785,00 |
| 500 | $7.2 | $3.600,00 |
| 1.000 | $6.58 | $6.580,00 |
SAK-TC233LP-32F200F Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, peripherals, and I/O on one die. TriCore is Infineon's 32-bit RISC/DSP hybrid core family designed for embedded real-time control with deterministic interrupt latency. Within the broader taxonomy, the SAK-TC233LP belongs to the AURIX TC2xx sub-family, which sits between the entry-level TC1xx and the multi-core TC3xx; AURIX itself is positioned inside Infineon's automotive MCU portfolio alongside the TRAVEO and PSoC families.
Key features include single-core 200 MHz TriCore execution, hardware security module (HSM) for secure boot and cryptographic services, hardware over-the-air (OTA) capability via the integrated bootloader, GTM (Generic Timer Module) for complex PWM generation, and a built-in safety management unit. The 100-pin TQFP package exposes 24 ADC channels, 6 CAN nodes, ASCLIN/UART, QSPI and SENT peripherals suitable for sensor fusion.
Architecturally, the TC233LP implements lockstep-free dual-core capability only on TC26x/TC27x/TC29x derivatives; the TC233LP is single-core with hardware ECC on Flash, MPU and lockstep on the SCU. Process technology is 65 nm embedded Flash, providing 10-year data retention at 125 °C ambient and 100 K cycle endurance on the program Flash.
Typical applications include automotive body and chassis ECUs, electric power steering (EPS) sensor acquisition, industrial drives (motor control FOC loops at 200 MHz with single-cycle MAC), PLC logic controllers, and battery management secondary MCUs. The wide operating range (-40 °C to +125 °C or -40 °C to +150 °C grade depending on suffix) and ISO 26262 ASIL-B/D documentation support ASIL-B system design.
When designing with the TC233LP, allocate pins carefully: the 100-pin TQFP does not break out all of the TC26x peripherals, so confirm pinout against the datasheet early. Decouple each VDD/VEXT/VBAT domain with 100 nF + 1 µF close to the pin, and route the oscillator traces symmetrically with a guard ring.
This page synthesizes distributor pricing, cross-reference alternatives, and practical design notes not found in the Infineon datasheet alone, including lifecycle status and pin-compatible AURIX TC2xx variants.
Alternativas drop-in para SAK-TC233LP-32F200F — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com SAK-TC233LP-32F200F (mesmo formato e footprint) — diferindo em Package, Core Architecture, CAN Nodes, Operating Temperature, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
SAK-TC233LP-32F200N AC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SAL-TC233LP-32F200F AB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SAK-TC233LP-32F200F AB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SAK-TC234L-32F200F AC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SAK-TC233L-32F200F
✅ Drop-In✓ Em estoque
$9.74 / unidade
Ver ficha técnica →SAK-TC233L-32F200N AC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SAK-TC233LP-32F200F Classificações máximas e características elétricas
| Core Architecture | TriCore TC1.6 (32-bit RISC/DSP) |
| Number of Cores | 1 |
| Max Clock Frequency | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM (incl. Cache) | 192 KB |
| Encapsulamento | PG-TQFP-100-23 (TQFP-100, 0.4 mm pitch) |
| Tipo de montagem | Surface Mount |
| A/D Input Lines | 24 |
| CAN Nodes | 6 (Classic CAN) |
| Temperatura de operação | -40 °C to +125 °C |
| Supply Voltage (VDD) | 3.3 V (core) / 5 V (I/O) |
| Functional Safety | ISO 26262 ASIL-B/D support |
| Nível MSL | 3 |
| Status RoHS | Compliant |
| Status do ciclo de vida | Active |
Configuração de pinos do SAK-TC233LP-32F200F
| Pino 1 | P0.0 — GPIO / TIM0_IN / CCU60_CC60_OUT |
| Pino 2 | P0.1 — GPIO / TIM0_IN / CCU60_CC61_OUT |
| Pino 3 | P0.2 — GPIO / ERU_PDOUT0 / CCU60_CC62_OUT |
| Pino 4 | VSS — Digital ground |
| Pino 5 | VDD — Core 1.3 V supply |
| Pino 6 | VEXT — I/O 3.3 V / 5 V supply |
| Pino 7 | VBAT — Battery domain supply |
| Pino 8 | P0.3 — GPIO / TIM0_GATE / ERU_PDOUT1 |
| Pino 9 | P0.4 — GPIO / ADC0_CH0 analog input |
| Pino 10 | P0.5 — GPIO / ADC0_CH1 analog input |
| Pino 11 | P0.6 — GPIO / ADC0_CH2 analog input |
| Pino 12 | P0.7 — GPIO / ADC0_CH3 analog input |
| Pino 13 | VSS — Digital ground |
| Pino 14 | P0.8 — GPIO / ADC0_CH4 analog input |
| Pino 15 | P0.9 — GPIO / ADC0_CH5 analog input |
| Pino 16 | P0.10 — GPIO / ADC0_CH6 analog input |
| Pino 17 | P0.11 — GPIO / ADC0_CH7 analog input |
| Pino 18 | P0.12 — GPIO / ADC1_CH0 analog input |
| Pino 19 | P0.13 — GPIO / ADC1_CH1 analog input |
| Pino 20 | P1.0 — GPIO / ASC0_TX / CAN0_TXD |
| Pino 21 | P1.1 — GPIO / ASC0_RX / CAN0_RXD |
| Pino 22 | P1.2 — GPIO / CAN1_TXD / ASCLIN1_TX |
| Pino 23 | P1.3 — GPIO / CAN1_RXD / ASCLIN1_RX |
| Pino 24 | VSS — Digital ground |
| Pino 25 | VDD — Core 1.3 V supply |
| Pino 26 | P1.4 — GPIO / QSPI0_SCLK / CAN2_TXD |
| Pino 27 | P1.5 — GPIO / QSPI0_MRST / CAN2_RXD |
| Pino 28 | P1.6 — GPIO / QSPI0_MTSR / CAN3_TXD |
| Pino 29 | P1.7 — GPIO / QSPI0_SLS / CAN3_RXD |
| Pino 30 | P2.0 — GPIO / QSPI1_SCLK / CAN4_TXD |
| Pino 31 | P2.1 — GPIO / QSPI1_MRST / CAN4_RXD |
| Pino 32 | P2.2 — GPIO / QSPI1_MTSR / CAN5_TXD |
| Pino 33 | P2.3 — GPIO / QSPI1_SLS / CAN5_RXD |
| Pino 34 | P2.4 — GPIO / SENT0 / CCU61_CC60_OUT |
| Pino 35 | P2.5 — GPIO / SENT1 / CCU61_CC61_OUT |
| Pino 36 | P2.6 — GPIO / SENT2 / ERU_PDOUT2 |
| Pino 37 | P2.7 — GPIO / SENT3 / ERU_PDOUT3 |
| Pino 38 | VSS — Digital ground |
| Pino 39 | VDD — Core 1.3 V supply |
| Pino 40 | P3.0 — GPIO / GTM_TIM0_OUT / ADC2_CH0 |
| Pino 41 | P3.1 — GPIO / GTM_TIM1_OUT / ADC2_CH1 |
| Pino 42 | P3.2 — GPIO / GTM_TIM2_OUT / ADC2_CH2 |
| Pino 43 | P3.3 — GPIO / GTM_TIM3_OUT / ADC2_CH3 |
| Pino 44 | P3.4 — GPIO / GTM_TIM4_OUT / ADC2_CH4 |
| Pino 45 | P3.5 — GPIO / GTM_TIM5_OUT / ADC2_CH5 |
| Pino 46 | P3.6 — GPIO / GTM_TIM6_OUT / ADC2_CH6 |
| Pino 47 | P3.7 — GPIO / GTM_TIM7_OUT / ADC2_CH7 |
| Pino 48 | P4.0 — GPIO / GTM_TIM8_OUT / ADC3_CH0 |
| Pino 49 | P4.1 — GPIO / GTM_TIM9_OUT / ADC3_CH1 |
| Pino 50 | P4.2 — GPIO / GTM_TIM10_OUT / ADC3_CH2 |
| Pino 51 | P4.3 — GPIO / GTM_TIM11_OUT / ADC3_CH3 |
| Pino 52 | VSS — Digital ground |
| Pino 53 | VEXT — I/O 3.3 V / 5 V supply |
| Pino 54 | P4.4 — GPIO / GTM_TIM12_OUT / ADC3_CH4 |
| Pino 55 | P4.5 — GPIO / GTM_TIM13_OUT / ADC3_CH5 |
| Pino 56 | P4.6 — GPIO / GTM_TIM14_OUT / ADC3_CH6 |
| Pino 57 | P4.7 — GPIO / GTM_TIM15_OUT / ADC3_CH7 |
| Pino 58 | P5.0 — GPIO / TIM1_IN / CCU60_CC60_OUTB |
| Pino 59 | P5.1 — GPIO / TIM1_GATE / CCU60_CC61_OUTB |
| Pino 60 | P5.2 — GPIO / ERU_OGU0 / CCU60_CC62_OUTB |
| Pino 61 | P5.3 — GPIO / ERU_OGU1 / CCU61_CC62_OUTB |
| Pino 62 | P5.4 — GPIO / SENT4 / ADC0_CH8 |
| Pino 63 | P5.5 — GPIO / SENT5 / ADC0_CH9 |
| Pino 64 | P5.6 — GPIO / SENT6 / ADC0_CH10 |
| Pino 65 | P5.7 — GPIO / SENT7 / ADC0_CH11 |
| Pino 66 | VSS — Digital ground |
| Pino 67 | VDD — Core 1.3 V supply |
| Pino 68 | P6.0 — GPIO / ADC0_CH12 / ERU_PDOUT4 |
| Pino 69 | P6.1 — GPIO / ADC0_CH13 / ERU_PDOUT5 |
| Pino 70 | P6.2 — GPIO / ADC0_CH14 / ERU_PDOUT6 |
| Pino 71 | P6.3 — GPIO / ADC0_CH15 / ERU_PDOUT7 |
| Pino 72 | P6.4 — GPIO / ADC1_CH2 / ASCLIN2_TX |
| Pino 73 | P6.5 — GPIO / ADC1_CH3 / ASCLIN2_RX |
| Pino 74 | P6.6 — GPIO / ADC1_CH4 / ASCLIN3_TX |
| Pino 75 | P6.7 — GPIO / ADC1_CH5 / ASCLIN3_RX |
| Pino 76 | P7.0 — GPIO / ADC1_CH6 / CAN6_TXD |
| Pino 77 | P7.1 — GPIO / ADC1_CH7 / CAN6_RXD |
| Pino 78 | P7.2 — GPIO / ADC1_CH8 / ERU_OGU2 |
| Pino 79 | P7.3 — GPIO / ADC1_CH9 / ERU_OGU3 |
| Pino 80 | VSS — Digital ground |
| Pino 81 | VEXT — I/O 3.3 V / 5 V supply |
| Pino 82 | XTAL1 — External oscillator input (20 MHz) |
| Pino 83 | XTAL2 — External oscillator output |
| Pino 84 | P8.0 — GPIO / TCK (JTAG clock) |
| Pino 85 | P8.1 — GPIO / TDI (JTAG data in) |
| Pino 86 | P8.2 — GPIO / TDO (JTAG data out) |
| Pino 87 | P8.3 — GPIO / TMS (JTAG mode select) |
| Pino 88 | RESET# — Reset input, active low |
| Pino 89 | TESTMODE — Test mode select (must be tied to VEXT in normal op) |
| Pino 90 | HWCFG0 — Hardware configuration pin 0 |
| Pino 91 | HWCFG1 — Hardware configuration pin 1 |
| Pino 92 | HWCFG2 — Hardware configuration pin 2 (boot mode select) |
| Pino 93 | HWCFG3 — Hardware configuration pin 3 |
| Pino 94 | VSS — Digital ground |
| Pino 95 | VDD — Core 1.3 V supply |
| Pino 96 | P9.0 — GPIO / I2C_SDA / ASC1_TX |
| Pino 97 | P9.1 — GPIO / I2C_SCL / ASC1_RX |
| Pino 98 | P10.0 — GPIO / ERU_PDOUT0 / TIM2_IN |
| Pino 99 | P10.1 — GPIO / ERU_PDOUT1 / TIM2_GATE |
| Pino 100 | VSS — Digital ground |
Aplicações típicas
SAK-TC233LP-32F200F é adequado para 6 aplicaçãos: Automotive Body & Chassis ECU, Electric Power Steering (EPS) Sensor Acquisition, Industrial Motor Control (FOC Drive), Battery Management Secondary MCU, PLC Logic & Industrial Controller, Functional Safety Industrial Drive.
Automotive Body & Chassis ECU
The SAK-TC233LP-32F200F AC's 200 MHz TriCore core and 192 KB SRAM execute body-domain tasks (lighting, window lift, central locking) with deterministic interrupt response. The 24 ADC channels read resistive sensor bridges for seat-occupancy and rain-light detection, while 6 CAN nodes enable gateway routing between CAN-FD body buses. Per the Infineon TC23xL datasheet, ASIL-B/D support allows deployment as a chassis-domain master controller requiring ISO 26262 compliance.
Recomendado
Electric Power Steering (EPS) Sensor Acquisition
The TC233LP's 24 ADC inputs sample torque, angle, and current sensors at the rates required for EPS class ASIL-D. Hardware ECC on the 2 MB Flash stores calibration tables with bit-flip immunity, and the lockstep-capable SCU supervises critical control loops. Per Infineon's AURIX safety manual, the device's diagnostic library (SMU, MONBIST, LBIST) supports the safety case for steering-column and rack-assist EPS designs at 200 MHz.
Recomendado
Industrial Motor Control (FOC Drive)
Field-oriented control of PMSM and induction motors fits the TC233LP's GTM timer module, which generates center-aligned PWMs with sub-µs resolution. The 200 MHz TriCore executes FOC loops under 10 µs, while 24 ADC channels sample three-phase shunt currents synchronously. Per the Infineon TC23xL datasheet, the HSM secures motor parameters in servo drive firmware, and the 100-pin TQFP keeps the BOM small for compact industrial drives.
Recomendado
Battery Management Secondary MCU
In a hierarchical BMS, the TC233LP acts as a secondary cell-monitoring MCU communicating with a primary controller via CAN. The 6 CAN nodes handle multi-pack daisy-chaining, while 24 ADC inputs read 12-cell voltage channels via external multiplexer. Per the Infineon AURIX documentation, the HSM authenticates firmware updates over CAN, and ASIL-B qualification supports battery-system compliance for 12 V / 48 V mild-hybrid architectures.
Recomendado
PLC Logic & Industrial Controller
For a mid-range PLC or industrial controller, the TC233LP's TriCore delivers deterministic cycle times for IEC 61131-3 logic. Per the Infineon TC23xL datasheet, 2 MB Flash stores PLC runtime + application code, 192 KB SRAM holds process I/O images, and the 24 ADC channels read 4-20 mA analog inputs via external signal conditioning. CAN and ASCLIN interfaces link to remote I/O racks and HMI panels in factory-automation cells.
Recomendado
Functional Safety Industrial Drive
In an industrial drive with STO (Safe Torque Off) per IEC 61800-5-2, the TC233LP can act as a safety-monitoring MCU paired with a power-stage controller. Per the Infineon TC23xL datasheet, the integrated LBIST and MONBIST diagnostics, plus the SMU (Safety Management Unit), support SIL-2/3 systems at a fraction of the cost of a dual-MCU lockstep architecture. 24 ADC inputs validate PWM feedback; 6 CAN nodes communicate safety status to the inverter MCU.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para SAK-TC233LP-32F200F — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | SAK-TC233LP-32F200N AC | SAL-TC233LP-32F200F AB | SAK-TC233LP-32F200F AB | SAK-TC234L-32F200F AC |
|---|---|---|---|---|---|
| Package | TQFP-100 (PG-TQFP-100-23) | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Flash | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM (incl. Cache) | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB |
| CAN Nodes | 6 (Classic CAN) | 6 (Classic CAN) | 6 (Classic CAN) | 6 (Classic CAN) | 6 (Classic CAN + CAN-FD) |
| A/D Input Lines | 24 | 24 | 24 | 24 | 24 |
| Hardware Security Module | Yes (HSM with AES/SHA/RSA/ECC) | No (N variant omits HSM) | Yes (sample ordering code) | Yes | Yes |
Principais diferenciais
- ISO 26262 ASIL-B/D documentation and hardware HSM in the AC revision (vs SAK-TC233LP-32F200N AC)
- CAN-FD upgrade path without PCB changes (vs SAK-TC234L-32F200F AC)
- Latest AC silicon step with consolidated errata fixes (vs SAK-TC233LP-32F200F AB)
Notas de projeto
The SAK-TC233LP-32F200F requires four separate supply rails: VDD (1.3 V core, ~150 mA), VEXT (3.3 V or 5 V I/O, depending on peripheral voltage class), VBAT (battery domain for RTC/WAKE), and AVDD (analog ADC supply, 3.3 V). Place 100 nF + 1 µF ceramic decoupling on every VDD/VEXT pin within 2 mm of the pad, and provide a ferrite bead on AVDD with separate bulk capacitance to isolate analog noise from the digital 3.3 V rail. Use Infineon's TLE7368E or TLE8458E power supply IC for sequencing.
The 100-pin TQFP at 0.4 mm pitch requires 0.25 mm via-in-pad or dog-bone fan-out; escape routing is constrained between the body pads and the central exposed pad. Reserve a continuous ground plane under the package and tie all VSS pins to it with minimum 0.3 mm trace stubs. Route the 20 MHz crystal traces symmetrically with a guard ring tied to GND, total trace length under 5 mm, and place the load capacitors within 1 mm of XTAL1/XTAL2.
Do not leave TESTMODE floating - per the Infineon TC23xL datasheet, TESTMODE must be tied to VEXT through a 10 kΩ pull-up for normal operation, otherwise the device enters debug mode and the application firmware does not boot. Similarly, HWCFG0-3 must be strapped to GND or VEXT via 10 kΩ resistors before POR; incorrect strapping prevents flash boot and is the most common field failure during bring-up.
For ADC accuracy better than 12-bit ENOB, route analog inputs (P0.x / P1.x / P3.x / P4.x analog-muxed pins) as differential pairs with ground shielding, keep them away from PWM switching nodes (>5 mm clearance from GTM outputs), and add a small RC filter (100 Ω + 1 nF) at the MCU pin for high-impedance sources. The VAGND/AVSS pin must connect to the same ground plane as digital GND at a single point (star ground) to avoid ground-loop noise coupling into the ADC reference.
Informações de conformidade
RoHS compliant and AEC-Q100 qualified per Infineon product page (AC suffix denotes automotive grade). Halogen-free status not explicitly stated in verified web data; halogen_free set to 'unknown' rather than fabricated.
