SPC563M64L5COBR - 32-bit Automotive MCU 1.5MB Flash 64MHz | STMicroelectronics
N.º da peça: SPC563M64L5COBR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.75 | $167,50 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.4 | $6.700,00 |
| 1.000 | $12.1 | $12.100,00 |
SPC563M64L5COBR Visão geral
A 32-bit automotive microcontroller (MCU) is a System-on-Chip (SoC) device optimized for in-vehicle electronic control units, combining a CPU core, on-chip memory, and automotive-bus peripherals on a single die. Within the broader IC hierarchy, an MCU sits inside the microcontroller sub-category of Integrated Circuits, which itself belongs to the embedded processing family used for real-time control. SPC56-series parts target chassis, body, and powertrain ECUs where deterministic interrupt latency and AEC-Q100 automotive qualification are mandatory.
Key features of the SPC563M64L5COBR include a fully static 0–80 MHz operating range (with 2% frequency modulation up to 82 MHz), 150 °C junction temperature rating for under-hood environments, less than 400 mW typical power dissipation, and a calibration external bus interface. The device provides rich connectivity (CAN, LIN, SCI, SPI, UART/USART), DMA, watchdog, PWM, and power-on reset peripherals, suiting closed-loop motor and engine control loops.
Architecturally, the SPC563M64L5COBR pairs the e200z3 Harvard core with dual-port Flash and on-chip SRAM, while the SPC563M family adds hardware cryptography and a decoupled timer coprocessor for angle-clock generation. Compared with SPC560x predecessors built on the e200z0h core, the e200z3 offers faster single-cycle execution and a richer interrupt controller. The 144-LQFP (20 × 20 mm) package supports standard SMT lines and provides adequate thermal dissipation for 150 °C junction operation with proper PCB copper.
Typical applications include automotive powertrain controllers (engine management, transmission control), electric power steering, body control modules with CAN/LIN gateways, and industrial CAN-FD nodes. The AEC-Q100 orientation combined with 1.5 MB Flash makes it well suited for bootloader + application firmware partitioning in safety-relevant modules.
When designing with this part, allocate adequate copper area on the LQFP thermal pad to keep junction rise within limits at 150 °C ambient, and place decoupling capacitors within 2 mm of each VDD/VSS pair to meet the 80 MHz noise budget. Choose the SPC563M64L5COBR over lower-density SPC560x variants when 1.5 MB Flash is required for combined bootloader + calibration data plus application code.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the same SPC56 family, and practical PCB/thermal design notes not found in the manufacturer datasheet.
Alternativas drop-in para SPC563M64L5COBR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com SPC563M64L5COBR (mesmo formato e footprint) — diferindo em Supply Voltage, Core Processor, Operating Temperature, Package, Program Memory Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
SPC563M64L5COBY
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SPC563M64L5COAR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8.5 / unidade
Ver ficha técnica →SPC563M64L5COAAR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
SPC560P54L5CEFAR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SPC560B54L3C6E0X
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SPC563M64L5COBR Classificações máximas e características elétricas
| Core Processor | e200z3 (32-bit Power Architecture) |
| Core Size | 32-bit |
| Frequência máxima de clock | 80 MHz (with 2% FM up to 82 MHz) |
| Program Memory Size | 1.5 MB (1.5M x 8) Flash |
| Encapsulamento | 144-pin LQFP, 20 x 20 mm, 1.40 mm height |
| Number of I/O | 80 |
| Connectivity | CAN, EBI/EMI, LIN, SCI, SPI, UART/USART |
| Peripherals | DMA, POR, PWM, WDT |
| Tensão de alimentação | 5 V |
| Faixa de temperatura de operação | -40 °C to +125 °C (TA) |
| Junction Temperature | 150 °C max |
| Power Dissipation | Less than 400 mW typical |
| Process Technology | 90 nm CMOS |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Series | SPC56 (SPC563M family) |
| Packaging | Reel |
Guia de Configuração de Pinos do SPC563M64L5COBR 144-pin lqfp, 20 x 20 mm, 1.40 mm height
Configuração de pinos para SPC563M64L5COBR (pacote 144-pin lqfp, 20 x 20 mm, 1.40 mm height). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para SPC563M64L5COBR.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
SPC563M64L5COBR é adequado para 6 aplicaçãos: Automotive Powertrain ECU, Transmission Control Module (TCM), Electric Power Steering (EPS), Body Control Module with CAN/LIN Gateway, Industrial CAN-FD Field Node, Chassis Electronics / ABS Module.
Automotive Powertrain ECU
The SPC563M64L5COBR's e200z3 32-bit core at 80 MHz and 1.5 MB Flash make it an ideal host for engine management ECUs where deterministic loop times govern injection and ignition control. Its AEC-Q100 qualification, 150 °C junction rating, and CAN/LIN connectivity fit directly into drive-by-wire powertrain networks. The e200z3's single-cycle execution keeps 1 ms engine-cycle tasks well within budget, while 1.5 MB Flash accommodates boot loader, ASIL-relevant application, and on-board calibration tables. Place decoupling capacitors within 2 mm of each VDD/VSS pair and connect the exposed pad to a continuous ground pour to maintain the 150 °C thermal envelope under full 400 mW dissipation at 125 °C ambient.
Recomendado
Transmission Control Module (TCM)
Transmission control requires precise torque model calculations and gear-state management with bounded latency; the SPC563M64L5COBR's e200z3 core and rich timer subsystem deliver the deterministic interrupt behaviour required for solenoid control loops. The 80 I/O lines accommodate multiple PWM channels for clutch/pressure actuators, while on-chip DMA offloads sensor-array sampling. 1.5 MB Flash allows full transmission calibration data plus diagnostics stack to coexist in one MCU. The 5 V supply and -40 °C to +125 °C operating window align with automotive under-hood environments, and CAN connectivity integrates directly with the vehicle's powertrain CAN bus.
Recomendado
Electric Power Steering (EPS)
Electric power steering demands real-time torque and angle processing with strict functional-safety margins; the SPC563M64L5COBR's e200z3 core with deterministic interrupt controller and hardware watchdog supports the ASIL-oriented firmware partitioning that EPS controllers require. The 1.5 MB Flash enables storage of torque maps, look-up tables, and safety self-test routines. CAN-FD connectivity (with external transceiver) provides high-bandwidth communication with the vehicle CAN bus. The 80 MHz core, 80 I/O lines for resolver/motor feedback, and 150 °C junction rating address under-hood thermal constraints while keeping latency well within the steering-loop budget.
Recomendado
Body Control Module with CAN/LIN Gateway
Body control modules consolidate CAN and LIN sub-networks into a central gateway; the SPC563M64L5COBR's multi-CAN plus LIN and UART/USART peripherals handle multiple automotive buses simultaneously. The e200z3 core at 80 MHz runs the gateway routing logic with predictable latency, while 1.5 MB Flash stores network management and diagnostics firmware. 80 I/O lines interface to body loads (lighting, wipers, locks). The AEC-Q100 qualification and -40 °C to +125 °C operating range suit cabin-mounted BCM enclosures. The on-chip DMA unburdens the CPU from message-routing housekeeping, allowing higher-priority LIN/CAN frames to meet their deadlines.
Recomendado
Industrial CAN-FD Field Node
Outside automotive, the SPC563M64L5COBR is well-suited to industrial CAN-FD nodes requiring robust 5 V operation, AEC-Q100-grade temperature resilience, and deterministic processing. The 1.5 MB Flash holds large protocol stacks such as CANopen or J1939 with room for application-specific extensions, while the e200z3 core delivers the throughput for high-speed CAN-FD payload handling. 80 I/O supports analog/digital sensor interfaces typical of industrial actuators, and DMA offloads repetitive sampling tasks. Pair with an isolated CAN-FD transceiver for factory-bus deployments where 150 °C junction and 5 V supply provide margin against industrial cabinet thermal spikes.
Recomendado
Chassis Electronics / ABS Module
ABS and chassis modules require tight wheel-speed loop times and deterministic braking-force control, both enabled by the SPC563M64L5COBR's e200z3 core and hardware timer coprocessor. 80 I/O accommodate multiple wheel-speed sensor inputs plus PWM outputs for hydraulic valves, while 1.5 MB Flash supports sensor calibration tables and ABS firmware. AEC-Q100 and 150 °C junction capability ensure reliable operation in wheel-hub environments where temperatures spike during heavy braking. CAN connectivity ties the ABS module to the vehicle dynamics network, and the watchdog plus DMA peripherals improve functional-safety diagnostics without burdening the main CPU.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para SPC563M64L5COBR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | SPC563M64L5COBY | SPC563M64L5COAR | SPC563M64L5COAAR | SPC560P54L5CEFAR | SPC560B54L3C6E0X |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Core | e200z3 (32-bit) | e200z3 (same) | e200z3 (same) | e200z3 (same) | e200z0h | e200z0h |
| Max Clock Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 64 MHz | 64 MHz |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| Connectivity | CAN, EBI/EMI, LIN, SCI, SPI, UART/USART | Same | Same | Same | CAN, LIN, SPI, UART | CAN, LIN, SPI, UART |
Principais diferenciais
- Larger Flash density in same LQFP-144 footprint (vs SPC560P54L5CEFAR)
- Higher-performance e200z3 core in same package (vs SPC560B54L3C6E0X)
- Calibration EBI/EMI interface for external memory (vs SPC560D30L1B4E0X)
Notas de projeto
The LQFP-144 package's exposed thermal pad must be soldered to a continuous ground pour to maintain the 150 °C junction rating. Estimated: at 5 V supply, 80 MHz clock, and <400 mW typical dissipation, junction rise at 125 °C ambient is roughly 25 °C with a 2 oz copper pour of at least 1 square inch. Insufficient copper area will push junction beyond 150 °C during sustained ABS or powertrain loops. Add thermal vias under the exposed pad to inner ground planes for additional spreading.
Place 100 nF decoupling capacitors within 2 mm of every VDD/VSS pair, and add 4.7 µF bulk capacitors near the package corners. For the SPC563M64L5COBR's 80 MHz e200z3 core, the supply noise budget is tight during DMA bursts; star-ground the analog VDD if used separately. Route the external bus interface (EBI/EMI) traces with 50 Ω controlled impedance if interfacing external SRAM/Flash at >40 MHz. Keep high-speed CAN traces short and avoid routing parallel to PWM outputs to reduce crosstalk.
Do not assume SPC563M64L5COBR and SPC560P54L5CEFAR are firmware-drop-in despite both being LQFP-144 ST parts - the e200z3 vs e200z0h core difference requires recompilation and linker-script updates. Confirm ordering-code suffix carefully: COBR is reel, COBY is tray; mixing them will break pick-and-place programming. The 80 I/O count assumes all pins are used in their primary function; if you remap to alternate functions, verify the alternate-function table in the device reference manual to avoid conflicts with EBI/EMI peripheral mappings.
For CAN bus interfaces, place a common-mode choke and TVS diode within 10 mm of the CAN_H/CAN_L pads; keep bus stubs under 30 mm to avoid reflections at 1 Mbit/s. If using CAN-FD at 2-5 Mbit/s, stricter impedance control (target 120 Ω differential) is required and the SPC563M64L5COBR's on-chip CAN module timing must be reconfigured for the shorter bit times per the ST reference manual's FlexCAN section.
Informações de conformidade
AEC-Q100 qualified per SPC563M family documentation. RoHS compliant LQFP-144 package per DigChips package data. Halogen-free status not explicitly stated in retrieved data.
