STM32F746VEH6 - 216MHz Cortex-M7 MCU | STMicroelectronics
N.º da peça: STM32F746VEH6 ✓ AtivoSTM32F746VEH6 Visão geral
A microcontroller is an integrated circuit containing a processor core, memory, and peripherals on one semiconductor device. Within the product hierarchy, the STM32F746VEH6 is an Arm Cortex-M7 microcontroller, a 32-bit RISC embedded processor within the STM32 family and the broader microcontroller and embedded-semiconductor market. Its role is to execute firmware, process external data, and control connected peripherals in industrial, communications, consumer, and test equipment.
The verified headline characteristics include an Arm Cortex-M7 core, a maximum operating frequency of 216 MHz, 512 KB of 512K x 8 Flash, 32-bit processing, and a 100-TFBGA package measuring 8 x 8 mm. The high clock rate supports computationally intensive control and signal-processing tasks, while the 512 KB Flash capacity provides room for embedded application code. The compact TFBGA package supports space-constrained designs where a larger leaded or quad-flat package would be unsuitable.
STMicroelectronics positions the STM32F746xx family as a high-performance Cortex-M7 platform, with the STM32F745xx and STM32F746xx devices operating at up to 216 MHz. The STM32F746VEH6 is supplied in a package offering 100 connection positions. Detailed RAM capacity, peripheral configuration, pin functions, voltage limits, temperature range, and electrical characteristics were not present in the supplied web extracts and therefore must be confirmed in the manufacturer documentation before design release.
Typical uses include industrial automation controllers, communications equipment, audio and digital signal-processing systems, graphical human-machine interfaces, and compact embedded control modules. In each case, the Cortex-M7 processing capability and 216 MHz maximum frequency provide a platform for combining real-time control with more demanding application workloads than a general-purpose low-cost microcontroller family.
PCB planning should account for the 100-TFBGA geometry, fine-pitch ball assignment, via requirements, and thermal performance. The development team should verify the complete pinout, exposed-ball assignments, power rails, decoupling values, and peripheral multiplexing against the current STMicroelectronics datasheet because those details were not included in the verified search data.
This page consolidates the verified distributor specifications, available same-family drop-in candidates, packaging information, and design considerations for engineers evaluating the STM32F746VEH6. It also distinguishes documented facts from parameters that remain to be obtained from the manufacturer datasheet.
Alternativas drop-in para STM32F746VEH6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com STM32F746VEH6 (mesmo formato e footprint) — diferindo em Flash Memory, Product Type.
STM32F746VGH6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
STM32F746VHH6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
STM32F746VEM6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
STM32F745VGH6
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →STM32F745VHH6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
STM32F746VEH6 Classificações máximas e características elétricas
| Product Type | 32-bit microcontroller |
| Processor Core | Arm Cortex-M7 |
| Architecture | 32-bit RISC |
| Maximum CPU Frequency | 216 MHz |
| Flash Memory | 512 KB (512K x 8) |
| Encapsulamento | 100-TFBGA (8 x 8 mm) |
| Supported Supply Levels | 1.8 V, 2.5 V, 3.3 V |
| Tipo de montagem | Surface mount |
Guia de Configuração de Pinos do STM32F746VEH6 100-tfbga (8 x 8 mm)
Configuração de pinos para STM32F746VEH6 (pacote 100-tfbga (8 x 8 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para STM32F746VEH6.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
STM32F746VEH6 é adequado para 6 aplicaçãos: Industrial Automation Controller, Communications Gateway, Audio and DSP System, Graphical Human-Machine Interface, Compact Embedded Control Module, Test and Measurement Instrument.
Industrial Automation Controller
The STM32F746VEH6 fits industrial controller concepts requiring deterministic high-speed computation from a 216 MHz Arm Cortex-M7 core. Its 512 KB of Flash provides embedded firmware storage for control loops, communication stacks, diagnostics, and parameter management. The 100-TFBGA 8 x 8 mm package also reduces board footprint compared with larger leaded MCU packages. A production design must still verify the operating-temperature grade, analog and digital I/O limits, communication peripherals, isolation strategy, and safety requirements from the manufacturer datasheet.
Recomendado
Communications Gateway
The 216 MHz Cortex-M7 core and 512 KB of program Flash make the STM32F746VEH6 suitable for gateway concepts that combine protocol handling, local data processing, and system monitoring. The compact 100-TFBGA package supports space-conscious equipment, although high-speed communications layouts require careful signal-integrity work. Before selecting it for a production gateway, engineers must confirm the exact Ethernet, USB, serial, and timer features, along with external transceiver needs, clocking, impedance-controlled interfaces, and brownout behavior in the current STMicroelectronics documentation.
Recomendado
Audio and DSP System
The STM32F746VEH6 can serve in audio and digital signal-processing systems where its Cortex-M7 core operates at up to 216 MHz and its 512 KB of Flash supports embedded control firmware. The fine-pitch 100-TFBGA package is useful when signal-chain, display, and communications electronics must be consolidated on a compact board. For a production implementation, verify the exact timer, DMA, SAI or I2S, USB, and memory interfaces, along with required clock accuracy and audio jitter performance, rather than assuming a specific peripheral set from the family name.
Recomendado
Graphical Human-Machine Interface
The 216 MHz Cortex-M7 performance level supports the responsive control logic expected in a graphical human-machine interface, while 512 KB of Flash accommodates interface firmware, graphics assets, and configuration data. The 100-TFBGA 8 x 8 mm package can help compact display controllers fit tightly into instrument or panel-electronics enclosures. Engineers must confirm LCD or MIPI interface availability, external RAM needs, display timing, graphics bandwidth, touch-controller connectivity, and the package's thermal performance in the complete datasheet and reference designs.
Recomendado
Compact Embedded Control Module
The STM32F746VEH6 is appropriate for compact embedded control modules that require more processing throughput than a basic microcontroller while retaining a space-efficient 100-TFBGA footprint. Its 512 KB of Flash supports application firmware, and the 216 MHz core can manage multiple real-time tasks and communication routines. Module designers should account for fine-pitch assembly, via-in-pad or via-fanout strategy, underfill or thermal design as applicable, and complete power-tree requirements. The precise RAM, peripheral, and electrical data remain necessary before a module design is released.
Recomendado
Test and Measurement Instrument
The Cortex-M7 core's 216 MHz maximum operating frequency and 512 KB of Flash make the STM32F746VEH6 relevant to embedded portions of test and measurement instruments, including front-panel control, data acquisition sequencing, and communications. The 100-TFBGA package can reduce controller-board size while leaving more enclosure space for analog or RF hardware. Engineers should verify ADC availability and performance, timer accuracy, external interface counts, low-power behavior, calibration-data storage, and thermal margins using the exact manufacturer documentation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para STM32F746VEH6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | STM32F746VGH6 | STM32F746VHH6 | STM32F746VEM6 | STM32F745VGH6 | STM32F745VHH6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 100-TFBGA (8x8) | 100-TFBGA (8x8) | 100-TFBGA (8x8) | 100-TFBGA (8x8) | 100-TFBGA (8x8) | 100-TFBGA (8x8) |
| Processor Core | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 | Arm Cortex-M7 |
| Maximum Frequency | 216 MHz | Up to 216 MHz | Up to 216 MHz | Up to 216 MHz | Up to 216 MHz | Up to 216 MHz |
| Flash Memory | 512 KB | 1 MB | 2 MB | 512 KB | 1 MB | 2 MB |
| Device Family | STM32F746xx | STM32F746xx | STM32F746xx | STM32F746xx | STM32F745xx | STM32F745xx |
Principais diferenciais
- Matches the verified 512 KB Flash configuration in the STM32F746 family (vs STM32F746VGH6)
- Provides a denser same-package memory option for larger firmware images (vs STM32F746VHH6)
- Uses the H6 temperature-grade ordering option (vs STM32F746VEM6)
- Selects the STM32F746 feature family rather than STM32F745 (vs STM32F745VGH6)
Notas de projeto
Use the exact STMicroelectronics 100-TFBGA land pattern and current package drawing rather than substituting a generic 100-ball BGA footprint. The verified body size is 8 x 8 mm, but ball pitch, ball diameter, solder-mask definition, and pad geometry were not supplied. Validate the PCB with the current STM32F746VE package drawing, inspect it using the manufacturer's assembly guidelines, and account for thermal-via placement under the device where recommended.
Do not finalize the power tree from the verified 1.8 V, 2.5 V, and 3.3 V supply-level statement alone. Obtain the exact VCAP, VDD, VDDA, VDDUSB, and other externally supplied rail requirements from the manufacturer datasheet. Confirm the maximum 216 MHz operating condition and required regulator tolerances, then follow the reference power schematic and decoupling network to prevent supply-noise coupling into high-speed processing and communication interfaces.
Thermal analysis must include the 216 MHz performance condition and the package's actual power dissipation. The supplied extracts do not provide junction temperature, thermal resistance, or package-specific dissipation figures, so these cannot be estimated reliably. Use the manufacturer's power-consumption model, account for ambient temperature and airflow, and provide copper spreading or thermal vias under the package where the package drawing permits them. Validate the assembled board at maximum ambient temperature before production.
High-speed clocks, memory interfaces, camera links, communications, and display signals must be routed according to the current STMicroelectronics reference design. The verified 216 MHz CPU rating does not by itself define external interface edge rates. Keep sensitive analog and communication supplies filtered, provide local high-frequency decoupling at the device, and use controlled-impedance routing where required. Review signal-integrity behavior with the actual peripheral configuration and PCB stack-up rather than a generic MCU assumption.
Do not approve an alternative MPN from its family name or package family alone. Confirm the exact order code, 100-TFBGA ball map, memory density, temperature grade, peripheral set, boot behavior, and device identification in firmware. The listed alternatives are same-brand candidates sourced from parametric family knowledge, not manufacturer-published drop-in approvals. In particular, STM32F745 and STM32F746 devices may differ in peripheral features even when their packages and Cortex-M7 execution rates align.
Informações de conformidade
The supplied verified extracts do not explicitly state material-compliance declarations or automotive qualification. The H6 ordering suffix must not be treated as proof of AEC-Q100 qualification. Obtain current declarations from STMicroelectronics and the authorized distributor.
