TLE75602ESHXUMA1 - 8-Ch SPI Power Switch 330mA | Infineon
N.º da peça: TLE75602ESHXUMA1 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.2 | $5,20 |
| 10 | $4.68 | $46,80 |
| 100 | $4.15 | $415,00 |
| 500 | $3.74 | $1.870,00 |
| 1.000 | $3.32 | $3.320,00 |
| 2.500 | $2.95 | $7.375,00 |
TLE75602ESHXUMA1 Visão geral
An SPI-controlled power switch (sometimes called a multi-channel high-side switch, low-side switch, or smart solid-state relay) is a power-management IC that replaces discrete MOSFETs, fuses, and relay driver circuitry with an integrated, microcontroller-addressable load driver. It sits hierarchically as a child of power distribution switches, which themselves are a sub-family of power management ICs. By consolidating eight independently controllable outputs behind a serial-peripheral-interface (SPI) command set, the TLE75602-ESH eliminates dozens of discrete components while providing per-channel fault reporting, current monitoring, and PWM dimming that discrete implementations cannot match.
Key features include an operating voltage range that supports 3.0 V cranking transients (typical 4.5 V to 28 V with load-dump survivability above this range), per-channel Rds(on) in the sub-200 mΩ class, integrated reverse-battery protection via an external resistor, programmable overcurrent shutdown, open-load detection in both on and off states, and overtemperature pre-warning and shutdown. The 16-bit SPI runs at clock rates up to 5 MHz and allows parallel operation of multiple TLE75602 devices for systems requiring more than eight channels.
Architecturally, each of the eight channels combines an N-channel MOSFET output stage with charge pump, gate driver, current-sense amplifier, and fault logic. The on-chip diagnostic block can flag short-to-battery, short-to-ground, open load, and overtemperature events back to the host microcontroller through dedicated SPI status registers, enabling ASIL-aware functional-safety implementations under ISO 26262.
Typical applications include automotive body controllers driving lamps, LEDs, relays, and small motors; zone-ECU load switching; industrial 24 V PLC discrete I/O; HVAC blower control; and centralized power distribution modules. The device's AEC-Q100 qualification and 3.0 V cranking capability make it well suited for cold-start conditions.
When designing with this part, place at least one 100 nF decoupling capacitor close to the VCC pin and follow the PCB layout recommendations in the Infineon datasheet to keep the exposed thermal pad soldered for low RthJA. Always configure unused channels in a defined OFF state via SPI to avoid floating-output diagnostic noise.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para TLE75602ESHXUMA1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com TLE75602ESHXUMA1 (mesmo formato e footprint) — diferindo em Package, Product Type, Number of Channels, Operating Temperature Range, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
TLE75602-ESH
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TLE75008-ES
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TLE94110ESXUMA1
✅ Drop-In✓ Em estoque
$2.45 / unidade
Ver ficha técnica →TLE92633BQXXUMA2
✅ Drop-In✓ Em estoque
$3.78 / unidade
Ver ficha técnica →TLE9180D32QKXUMA1
✅ Drop-In✓ Em estoque
$4.71 / unidade
Ver ficha técnica →BTS710336ESAXUMA1
✅ Drop-In✓ Em estoque
$2.45 / unidade
Ver ficha técnica →TLE75602ESHXUMA1 Classificações máximas e características elétricas
| Product Type | 8-channel SPI power switch (low-side / high-side) |
| Number of Channels | 8 |
| Per-channel Output Current | 330 mA |
| Switch Configuration | 1:8 N-Channel |
| Operating Voltage Range | 4.5 V to 28 V (supports 3.0 V cranking) |
| Interface | 16-bit SPI |
| PWM Generation | Configurable per channel, on-chip |
| Encapsulamento | PG-TSDSO-24-21 (exposed pad) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +150 C (junction, AEC-Q100 automotive grade) |
| AEC-Q100 Qualified | Yes |
| Diagnostic Features | Open-load detect, short-to-battery, short-to-ground, overtemperature, current sense |
| Reverse Battery Protection | Via external resistor |
| Load Dump Protection | Yes |
| Status RoHS | Compliant |
Configuração de pinos do TLE75602ESHXUMA1
| Pino 1 | OUT0 — Channel 0 power output |
| Pino 2 | OUT1 — Channel 1 power output |
| Pino 3 | OUT2 — Channel 2 power output |
| Pino 4 | GND — Power ground |
| Pino 5 | OUT3 — Channel 3 power output |
| Pino 6 | OUT4 — Channel 4 power output |
| Pino 7 | OUT5 — Channel 5 power output |
| Pino 8 | VS — Battery supply input |
| Pino 9 | OUT6 — Channel 6 power output |
| Pino 10 | OUT7 — Channel 7 power output |
| Pino 11 | GND — Power ground |
| Pino 12 | VCC — 5 V logic supply |
| Pino 13 | CSN — SPI chip-select (active low) |
| Pino 14 | SCLK — SPI clock |
| Pino 15 | SDI — SPI data in |
| Pino 16 | SDO — SPI data out |
| Pino 17 | GND — Logic ground |
| Pino 18 | NC — Not connected (per datasheet) |
| Pino 19 | NC — Not connected (per datasheet) |
| Pino 20 | NC — Not connected (per datasheet) |
| Pino 21 | NC — Not connected (per datasheet) |
| Pino 22 | NC — Not connected (per datasheet) |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
Aplicações típicas
TLE75602ESHXUMA1 é adequado para 6 aplicaçãos: Automotive Body Control Module (BCM) Load Driving, Automotive LED Rear-Lighting Arrays, Industrial 24 V PLC Discrete Output Modules, HVAC Blower and Flap Motor Control, Zone ECU Power Distribution, Small DC Motor and Solenoid Driver Hub.
Automotive Body Control Module (BCM) Load Driving
The TLE75602ESHXUMA1 directly drives 12 V automotive body loads (turn indicators, marker lamps, small relays, mirror heaters) inside a body control module. Its 8 channels at 330 mA each cover typical BCM lamp clusters with headroom, while the 3.0 V cranking support keeps outputs defined during engine cold-start. The 16-bit SPI bus allows the BCM microcontroller to multiplex many loads over a single chip-select, and per-channel diagnostics flag bulb-out failures to meet FMVSS 108 lighting requirements.
Recomendado
Automotive LED Rear-Lighting Arrays
Rear-lighting modules (tail, brake, reverse, turn) increasingly use serial-controlled LED strings with PWM dimming. The TLE75602ESHXUMA1's per-channel PWM generators drive LED strings with programmable duty cycles, enabling animated turn-indicator patterns without MCU timer overhead. The on-chip open-load detection catches individual-LED failures, while short-to-ground protection prevents wiring faults from damaging the module. AEC-Q100 qualification supports PPAP submission to OEM lighting Tier-1s.
Recomendado
Industrial 24 V PLC Discrete Output Modules
Programmable Logic Controller (PLC) discrete output cards driving 24 V solenoids, relays, and indicator lamps benefit from the TLE75602ESHXUMA1's 28 V upper rating and per-channel open-load diagnostics. IEC 61131-2 compliance is simplified because the device detects wire-break conditions in both energized and de-energized states. The PG-TSDSO-24-21 exposed-pad package allows 8 channels within a standard 24 mm wide output module outline, doubling density versus 4-channel alternatives.
Recomendado
HVAC Blower and Flap Motor Control
In automotive HVAC modules, the TLE75602ESHXUMA1 drives blower-speed resistors, mode-door actuators, and recirculation flaps. Its PWM capability varies blower speed smoothly by adjusting duty cycle on the high-side FET, while diagnostic outputs flag stalled-motor conditions. The 4.5 V minimum supply keeps the HVAC responsive during cranking dips, an important UX consideration in cold-weather climates.
Recomendado
Zone ECU Power Distribution
Modern zone-oriented vehicle EECs use SPI-controlled switches as the local power-distribution backbone, replacing traditional fuse boxes. The TLE75602ESHXUMA1 acts as a zone-level 12 V switch matrix that re-arms software-defined fuses per SPI command, enables intelligent load shedding during start-stop events, and reports channel-level current to the central vehicle computer. Its AEC-Q100 grade and 3 V cranking tolerance support the most demanding zone-ECU environments.
Recomendado
Small DC Motor and Solenoid Driver Hub
Distributed actuator modules in seat controllers, door modules, and tailgate openers consolidate small motors (mirror-fold, washer pump, lock actuator) behind a single SPI switch. The TLE75602ESHXUMA1's 330 mA per channel is sufficient for the lock actuator and washer pump; higher-current seat motors use companion half-bridge drivers on the same PCB. Per-channel short-to-ground protection prevents motor stall currents from damaging the wiring harness.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para TLE75602ESHXUMA1 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | TLE75602-ESH | TLE75008-ES | TLE94110ESXUMA1 | TLE92633BQXXUMA2 |
|---|---|---|---|---|---|
| Package | PG-TSDSO-24-21 | PG-TSDSO-24-21 - same | PG-TSDSO-24-21 - same | PG-TSDSO-24-21 - same | PG-TSDSO-24-21 - same |
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Channels | 8 | 8 | 8 | 10 | SBC-integrated |
| Operating Voltage | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V |
| Cranking Support | 3.0 V | 3.0 V | 3.0 V | 3.0 V | 3.0 V |
| Interface | 16-bit SPI | 16-bit SPI | 16-bit SPI | 16-bit SPI | SPI (SBC map) |
| PWM Capability | Per-channel configurable | Per-channel | Per-channel | Per-channel | Limited |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes |
| Approx. Unit Price (qty 1) | USD 5.20 | USD 5.20 | USD 6.40 | USD 5.80 | USD 7.20 |
Principais diferenciais
- 8 channels in a single PG-TSDSO-24-21 footprint (vs TLE75008-ES)
- Per-channel independent PWM generators (vs TLE94110ESXUMA1)
- AEC-Q100 qualified with 3.0 V cranking support (vs TLE92633BQXXUMA2)
Notas de projeto
Estimated: at VS=14 V with all 8 channels delivering 330 mA, total package dissipation is roughly (14 V - Vload) * 2.64 A. For a worst-case resistive load at 2 V drop this approaches 32 W, which far exceeds the PG-TSDSO-24-21's thermal budget. Always derate by limiting simultaneous ON channels, or split the load across two TLE75602 devices. Solder the exposed thermal pad to a 1 square inch copper pour with at least 4 thermal vias for low RthJA.
Place a 100 nF ceramic decoupling capacitor within 3 mm of the VCC pin and a 1 uF bulk capacitor near VS. Keep SPI trace impedance at 50 ohm with ground reference; route SDO away from high-current OUT traces to avoid coupling. Refer to the Infineon application note for SPIDER layout guidelines, particularly the requirement for a continuous ground plane beneath the exposed thermal pad.
Do not float unused channels: configure them in OFF state via SPI during initialization to avoid spurious open-load diagnostics. When cascading two TLE75602 devices, ensure CSN lines are independently controlled to prevent SPI bus contention. Reverse-battery protection requires the external resistor described in the datasheet - omitting it can permanently damage the device during a jump-start mis-wire.
Informações de conformidade
AEC-Q100 qualified per Infineon datasheet. RoHS and REACH compliant per DigiKey listing. Halogen-free per SPIDER family datasheet.
