VSC7157YS-03 - 36-PHY 1.5/3 Gbps SAS Edge/Fanout Expander IC | ADI/Maxim
N.º da peça: VSC7157YS-03 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $44.2 | $442,00 |
| 100 | $39.75 | $3.975,00 |
| 500 | $35.1 | $17.550,00 |
| 1.000 | $31.45 | $31.450,00 |
VSC7157YS-03 Visão geral
A SAS expander is a data-class protocol-aware switch device that aggregates multiple SAS initiator/target ports and transparently extends the SAS address space across SATA-compatible and SAS-compatible storage enclosures. SAS sits within the SCSI storage hierarchy (SAS -> SCSI -> block storage protocol) and inherits from SATA physical-layer signaling while adding dual-port capability, zoning, and expander-based topology scaling. Expanders such as the VSC7157YS-03 enable up to 36 PHYs to be linked, allowing one initiator HBA port to communicate with dozens of drives across a multi-enclosure fabric.
Key features highlighted by Maxim's product family include 36 PHY lanes, automatic SAS 1.5/3.0 Gbps speed negotiation, SSP/SATA/STP/SMP protocol support, and zoning with table-routing and self-configuring capabilities. The 'enhanced' designation indicates a generation that improves upon earlier Vitesse/Maxim SAS expander silicon with reduced latency, expanded zoning, and improved PHY diagnostics for enterprise JBOD and dense server platforms.
The device architecture combines a SerDes-based SAS PHY front end, a routing-table expander engine, and a side-band management interface (typically I2C or SMBus). It supports wide-port aggregation (e.g., 4-wide or 8-wide SAS links) and SSP narrow-port fallback for maximum interoperability with SATA HDDs and SSDs, including 6 Gbps SATA downstream devices when host-side SAS-2 controllers negotiate downward.
Typical applications include enterprise JBOD enclosures, RAID controller fanout cards, multi-rack server storage fabrics, hyperscale datacenter SSD chassis, and external SAS attach subsystems. Compared with discrete SAS switch ASICs, the VSC7157YS-03 integrates PHY plus expander fabric in a single BGA, simplifying PCB stack-up and BOM.
When designing with this device, ensure adequate high-speed SerDes layout practices: matched 100-ohm differential impedance on TX/RX pairs, AC-coupling capacitors per SAS spec, and a solid reference ground plane under the BGA. Thermal management is critical at full 36-PHY load; use a minimum 4-layer PCB with continuous ground and recommend a heatsink for high-ambient deployments.
Alternativas drop-in para VSC7157YS-03 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
VSC7157YS-04
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
VSC7157YS-02
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
VSC7157YS-01
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
VSC7145
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
VSC7157YS-03 Especificações
| Função | 36-PHY SAS Edge/Fanout Expander |
| PHY Count | 36 PHYs |
| Supported Data Rates | 1.5 Gbps and 3.0 Gbps SAS |
| Protocol Support | SSP, STP, SMP, SATA tunnel |
| Topologia | Edge expander and Fanout expander |
| Interface (Host Management) | I2C / SMBus management interface |
| Tipo de montagem | Surface Mount |
| PHY Compliance | SAS 1.0 / SAS 1.1 (3 Gbps SAS-1 spec) |
| Zoning Support | Yes (table-routing, self-configuring) |
| Wide-Port Support | Yes (4-wide / 8-wide SAS links) |
| SATA Downstream Compatibility | SATA 1.5 Gbps (SATA tunneled via SAS) |
Guia de Configuração de Pinos do VSC7157YS-03 standard
Configuração de pinos para VSC7157YS-03 (pacote standard). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para VSC7157YS-03.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
VSC7157YS-03 é adequado para 6 aplicaçãos: Enterprise JBOD SAS Enclosure, RAID Controller Fanout Card, Multi-Rack Server Storage Fabric, Hyperscale Datacenter SSD Chassis, External SAS Attach Subsystem, Storage Test and Validation Platform.
Enterprise JBOD SAS Enclosure
The VSC7157YS-03 is purpose-built for enterprise JBOD enclosures with up to 36 drive bays. Its 36-PHY count allows one 4-wide or 8-wide SAS trunk upstream to fan out to all drive backplane slots. Operating at 1.5/3.0 Gbps SAS, it delivers sufficient bandwidth for SATA-tunneled HDDs and SSDs in datacenter cold-storage tiers. The integrated expander fabric plus PHY eliminates the need for an external switch ASIC, shrinking BOM and PCB area. Compared with discrete SAS switches, the VSC7157YS-03 reduces bill-of-materials complexity while supporting SSP/STP/SMP protocols natively.
Recomendado
RAID Controller Fanout Card
In RAID controller fanout cards, the VSC7157YS-03 expands a single host HBA SAS port into 36 PHY lanes routed to multiple drive enclosures or backplane connectors. Fanout mode supports multiple upstream initiator ports, allowing dual-controller RAID topologies with redundant paths to drives. The device's zoning capability partitions drive access between controllers for failover isolation. Latency through the expander is typically a few microseconds, which is acceptable for HDD/SSD arrays. This makes it a strong fit for 6 Gbps-class RAID subsystems needing cost-effective SAS domain scaling.
Recomendado
Multi-Rack Server Storage Fabric
The VSC7157YS-03 supports multi-rack server storage fabrics by cascading as fanout expanders across JBOD chassis. Each rack-scale SAS domain aggregates drive enclosures across multiple chassis, with the expander providing edge-expansion at the rack boundary. Support for SSP, STP and SMP enables uniform management and zoning across the fabric. The 1.5/3 Gbps SAS rates target legacy HDD-centric deployments where SAS-2/3 speeds are not required. This application typically pairs the VSC7157YS-03 with multi-mode SATA HDDs tunneled through SAS for cost optimization.
Recomendado
Hyperscale Datacenter SSD Chassis
In hyperscale datacenter SSD chassis, the VSC7157YS-03 enables dense SAS-attached SSD topologies where multiple SSDs per chassis connect through expander fanout to upstream server racks. While native SATA SSDs operate at 1.5/3 Gbps, the SAS expander provides deterministic latency and dual-port failover for high-availability configurations. Zoning capabilities partition SSDs across multiple tenants or compute nodes. Power-efficient expander operation also fits the dense thermal envelope of SSD chassis, where per-port power is a key constraint.
Recomendado
External SAS Attach Subsystem
The VSC7157YS-03 enables external SAS attach subsystems (rack-mounted storage arrays with SAS connectivity to host servers). Its wide-port aggregation (4-wide / 8-wide SAS links) maximizes bandwidth across external cabling, while edge-expander mode isolates the external domain from internal topology changes. SMP support simplifies topology discovery and zoning management across multi-vendor enclosures. The device's enterprise-class feature set makes it well suited for tier-2 and tier-3 storage arrays in mixed-vendor datacenter environments.
Recomendado
Storage Test and Validation Platform
Test and validation platforms for SAS storage components use the VSC7157YS-03 to emulate large fanout topologies with multiple initiator/target combinations. Engineers can drive traffic through 36 PHYs simultaneously to characterize latency, throughput, and protocol-compliance of HDDs/SSDs and HBAs. The expander's table-routing and self-configuring capabilities simplify test setup, while SMP access allows scripted topology manipulation. This application leverages the same BGA package used in production JBOD designs, simplifying correlation between lab and field.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para VSC7157YS-03 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | VSC7157YS-04 | VSC7157YS-02 | VSC7157YS-01 | VSC7145 |
|---|---|---|---|---|---|
| Package | BGA (fine-pitch) | BGA (fine-pitch) - same | BGA (fine-pitch) - same | BGA (fine-pitch) - same | BGA (fine-pitch, same family) |
| Brand | Analog Devices (Maxim Integrated) | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| PHY Count | 36 PHYs | 36 PHYs | 36 PHYs | 36 PHYs | ~28 PHYs (same family, lower density) |
| SAS Data Rate | 1.5 / 3.0 Gbps | 1.5 / 3.0 Gbps | 1.5 / 3.0 Gbps | 1.5 / 3.0 Gbps | 1.5 / 3.0 Gbps |
| Protocol Support | SSP, STP, SMP, SATA tunnel | SSP, STP, SMP, SATA tunnel | SSP, STP, SMP, SATA tunnel | SSP, STP, SMP, SATA tunnel | SSP, STP, SMP, SATA tunnel |
| Topology Mode | Edge + Fanout | Edge + Fanout | Edge + Fanout | Edge + Fanout | Edge + Fanout |
| Lifecycle Status | NRND | Active (recommended for new designs) | NRND / older revision | NRND / older revision | NRND |
| Recommended for New Designs | No (NRND) | Yes | No | No | No |
Principais diferenciais
- Pin-compatible successor available with active lifecycle (vs VSC7157YS-04)
- Highest PHY density in the VSC7157 family at NRND status (vs VSC7145)
- Integrated PHY plus expander fabric reduces BOM (vs Discrete SAS switch ASIC designs)
Notas de projeto
SAS SerDes lanes on the VSC7157YS-03 require matched 100-ohm differential impedance with length-matched TX/RX pairs within the SAS specification skew budget. Use a minimum 4-layer PCB with a continuous reference ground plane beneath the BGA, and route SAS differential pairs over unbroken reference planes with no splits. AC-coupling capacitors should be placed close to each PHY ball per the manufacturer reference design.
Estimated: at full 36-PHY load with all ports active, the BGA package dissipates several watts. Use a thermally enhanced PCB stack-up with copper pours under and around the BGA, and consider a heatsink for high-ambient (above 45C) deployments. Maintain airflow across the BGA to prevent thermal shutdown in dense rack environments.
Decouple each power supply pin with a 0.1uF ceramic capacitor placed adjacent to the BGA ball, plus bulk decoupling on each supply rail. The VSC7157YS-03 typically requires multiple supply rails (core, PHY, I/O); refer to the manufacturer datasheet for exact rail voltages and sequencing requirements. Power-rail sequencing errors can prevent SAS link training.
Do not assume the VSC7157YS-03 supports 6 Gbps SAS-2 or 12 Gbps SAS-3 - this is a SAS-1 generation device limited to 1.5/3.0 Gbps. Connecting to a SAS-2/3 host at 6 Gbps will autonegotiate down to 3 Gbps. Verify SAS domain topology with SMP discovery tools during validation to ensure proper zoning and routing.
Informações de conformidade
Compliance status for VSC7157YS-03 was not available in the verified web data; contact Analog Devices directly for RoHS/REACH declarations. AEC-Q100 is not applicable for storage interface ICs in this category.
