VSC8479YY - 11.3 Gbps 1:16 Transceiver | Microchip Technology
N.º da peça: VSC8479YY ✓ AtivoVSC8479YY Visão geral
A high-speed serial interface transceiver is a semiconductor device that converts between parallel or narrower-width data paths and high-speed serial communication links. The VSC8479YY belongs to the broader interface IC and telecommunications IC hierarchy. Integrating the transceiver, CDR, and CMU functions in one package reduces the number of separate clock-recovery and multiplexing blocks required in a multi-lane optical or backplane interconnect system.
The principal functional characteristics are a 1:16 parallel-to-serial transmission ratio, a 16:1 serial-to-parallel reception ratio, integrated clock recovery, and integrated clock multiplication. These functions support systems requiring multiple high-speed lanes to be aggregated or recovered efficiently. The 11.3 Gbps data-rate capability is particularly relevant to optical transport, backplane, and other high-bandwidth telecommunications infrastructure where parallel-to-serial conversion and deterministic clocking are required.
The VSC8479 architecture integrates clocking with data conversion instead of treating the CDR and CMU as independent blocks. This combination is intended to provide a comprehensive interface solution for designs that need recovered clocks, multiplied reference clocks, and bidirectional lane conversion. Exact recovery ranges, jitter specifications, reference-clock requirements, lane polarity, voltage levels, and power consumption were not included in the supplied verified records and must therefore be confirmed in the manufacturer documentation.
Typical implementation areas include telecommunications equipment, optical transport modules, network switching systems, and other multi-lane serial links that require parallel-to-serial and serial-to-parallel conversion. System designers should also account for the FCBGA package requirements, including fine-pitch escape routing, multilayer PCB construction, controlled impedance, and power and ground distribution across 244 package contacts.
The principal design consideration is package integration. A 17 mm by 17 mm FCBGA requires careful PCB footprint design, thermal management, and high-density routing rules. Power rails, reference clocks, high-speed differential pairs, and control interfaces should be evaluated against the manufacturer's pinout, reference design, and layout guidance before schematic or PCB sign-off.
This product page combines the verified Microchip product summary, distributor package information, availability references, and practical implementation guidance. It distinguishes published VSC8479 characteristics from parameters that still require datasheet confirmation and does not treat unverified substitute parts as drop-in replacements.
Alternativas drop-in para VSC8479YY — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasVSC8479YY Especificações
| Product Type | Telecom interface transceiver IC |
| Transmit Ratio | 1:16 |
| Receive Ratio | 16:1 |
| Maximum Data Rate | 11.3 Gbps |
| Continuous Frequency of Operation | 9.953 Gbps minimum stated operating frequency |
| Clock and Data Recovery | Integrated CDR |
| Clock Multiplication | Integrated CMU |
| Encapsulamento | 244-pin FCBGA, 17 mm x 17 mm |
| Contagem de pinos | 244 pins |
| Tipo de montagem | Surface mount |
| Product Family | VSC8479 |
Guia de Configuração de Pinos do VSC8479YY 244-pin fcbga, 17 mm x 17 mm
Configuração de pinos para VSC8479YY (pacote 244-pin fcbga, 17 mm x 17 mm). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para VSC8479YY.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
VSC8479YY é adequado para 6 aplicaçãos: Optical Transport Equipment, Telecommunications Backplanes, Network Switching Systems, High-Speed Test Equipment, Data Center Interconnect Cards, Clock-Distribution Backplanes.
Optical Transport Equipment
The VSC8479YY fits evaluation in high-speed optical transport equipment requiring a 1:16 transmit aggregation and 16:1 receive desegregation function. Its listed 11.3 Gbps data rate and continuous operating frequency beginning at 9.953 Gbps support multi-lane serial architectures, while the integrated CDR and CMU consolidate clock recovery and multiplication with the transceiver. Integration can reduce the number of separate high-speed interface blocks, but optical-module vendors must still verify lane timing, reference-clock architecture, jitter, BER, power integrity, and the manufacturer's thermal and layout requirements before using the device in production.
Telecommunications Backplanes
The VSC8479YY is applicable to telecommunications backplane designs that exchange multiple high-speed serial lanes between line cards or switching elements. Its 1:16 transmit and 16:1 receive ratios map multiple parallel data paths into a high-speed serial stream and recover the reverse direction, while the integrated CDR and CMU support the required clock functions. The 244-pin FCBGA permits integration in a compact module, but its 17 mm by 17 mm footprint demands careful escape routing. Channel loss, insertion loss, skew, connector behavior, and signal integrity must be verified at the system level.
Network Switching Systems
The VSC8479YY can be evaluated for switching systems that need a high-speed serial interface between routing silicon, line-card backplanes, or pluggable optical subsystems. A listed rate of 11.3 Gbps and integrated clock recovery and clock multiplication make it relevant to bandwidth-dense transport paths, while the 1:16 and 16:1 ratios support lane aggregation and distribution. Qualification should compare the device against the switch fabric's supported rates, clocking topology, training requirements, and error thresholds. The FCBGA land pattern, thermal budget, and reference design must also be reviewed before PCB implementation.
High-Speed Test Equipment
The VSC8479YY may fit test and measurement platforms that generate, analyze, or route multiple high-speed serial lanes. Its 1:16 transmit and 16:1 receive structure can support compact fan-in and fan-out arrangements, and the integrated CDR and CMU reduce the number of independent clock-management components in the signal path. The verified maximum data rate is 11.3 Gbps, with continuous operation beginning at 9.953 Gbps. Instrumentation engineers must still account for deterministic jitter, reference-clock purity, calibration behavior, lane skew, loss, power consumption, and the very large number of high-speed and supply connections in the 244-pin FCBGA.
Data Center Interconnect Cards
The VSC8479YY is relevant to data center interconnect cards that need to combine many lower-width paths into high-speed serial links and recover data in the opposite direction. Its 1:16 transmit and 16:1 receive ratios align with lane aggregation, while the integrated CDR and CMU consolidate clock functions needed by a serial interconnect. The listed 11.3 Gbps capability makes it suitable for evaluation in bandwidth-dense infrastructure, subject to protocol, BER, and reach requirements. Board design must provide the required 244-pin FCBGA footprint, controlled-impedance routing, robust power delivery, and sufficient thermal spreading for sustained operation.
Clock-Distribution Backplanes
The VSC8479YY can be evaluated for backplane subsystems in which recovered and multiplied clocks must accompany high-speed data conversion. Because the device integrates a clock and data recovery unit and a clock multiplier unit with its 1:16 transmit and 16:1 receive transceiver, it may simplify clock architecture compared with a design using separate multiplexer and recovery blocks. The available records do not specify reference frequencies, jitter limits, lane synchronization rules, or output-clock accuracy. Those parameters are critical for clock-distribution use and must be obtained from the official datasheet before architecture selection or schematic release.
Dados de referência de engenharia para VSC8479YY — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto |
|---|---|
| Product Type | 1:16 transmit, 16:1 receive transceiver with integrated CDR and CMU |
| Brand | Microchip Technology |
| Package | 244-pin FCBGA, 17 mm x 17 mm |
| Transmit Ratio | 1:16 |
| Receive Ratio | 16:1 |
| Maximum Data Rate | 11.3 Gbps |
| Continuous Operating Frequency | 9.953 Gbps minimum stated operating frequency |
| Clock and Data Recovery | Integrated CDR |
| Clock Multiplication | Integrated CMU |
Principais diferenciais
- Integrated clocking and lane-conversion functions (vs No verified drop-in alternative)
- High-speed serial capability (vs No verified drop-in alternative)
- Large highly integrated package (vs No verified drop-in alternative)
Notas de projeto
Use the official VSC8479YY package drawing as the controlling source for the 244-pin, 17 mm by 17 mm FCBGA land pattern. The fine-pitch array requires deliberate escape routing, and the multilayer stackup should provide short high-speed connections with continuous reference planes. Verify differential impedance, pair-length matching, layer transitions, and via geometry against the manufacturer's layout guidance. Do not derive the footprint from a generic FCBGA library or from reseller pinout images.
Power and ground delivery must be planned before routing the high-speed interfaces. The supplied records do not state the supply voltage, rail count, or power consumption, so those values must be obtained from the manufacturer datasheet before capacitors and regulators are selected. Use the recommended high-frequency decoupling topology and provide low-impedance planes or vias where required. Confirm the thermal design under worst-case traffic and environmental conditions rather than assuming that the compact FCBGA can dissipate all permitted power without a defined copper and airflow budget.
Treat the high-speed serial lanes, recovered clocks, and reference-clock inputs as controlled-impedance structures. The verified headline rate is 11.3 Gbps, but signal-integrity margins depend on the complete channel, including loss, jitter, skew, connector and package parasitics, and return paths. Review the manufacturer's reference design and evaluation results, and complete channel simulation or measurements with the intended board material and stackup before freezing timing and impedance constraints.
Informações de conformidade
The supplied verified records identify the product, package, data-rate information, and sourcing links but do not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations.
