XA7A75T-2CSG324I - Automotive Artix-7 FPGA | AMD
N.º da peça: XA7A75T-2CSG324I ✗ Fim de vida| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
XA7A75T-2CSG324I Visão geral
An FPGA is a semiconductor whose digital function is configured after manufacture. A field-programmable gate array belongs to the broader logic-device hierarchy: FPGA, programmable-logic IC, digital semiconductor, and embedded computing component. Instead of relying solely on fixed application-specific logic, an FPGA integrates configurable lookup logic, programmable routing, block resources, memory, and I/O into one reconfigurable device.
Verified listings identify 210 I/O, 75,520 logic cells, and 387,072 fabric bits. The searchable Artix-7 product page states that the family uses a 28 nm process and targets high performance per watt. Additional performance figures such as clock rate, block-RAM capacity, DSP resources, power, and temperature limits were not supplied in the verified input and therefore are not inferred here.
The 324-LFBGA package supports dense PCB integration but requires exact land-pattern, ball-map, and assembly-process control. Verified distributor data separately describes the package as 324-LFBGA or CSPBGA. AMD publishes package pinout files in TXT and CSV formats, giving engineers the authoritative ball assignments needed for PCB and design-signoff work.
Potential uses include automotive sensing, vehicle communication, industrial image processing, embedded control, and high-throughput digital logic. Suitability depends on the complete AMD Artix-7 datasheet, selected tools, automotive qualification requirements, temperature grade, resource utilization, timing closure, and system power budget.
A robust design should begin with the AMD package-pinout files, preserve all required power and configuration pins, and constrain every interface against the appropriate device-speed and automotive qualification constraints. Use Vivado or another AMD-supported implementation flow for constraints, synthesis, implementation, timing analysis, and bitstream generation.
This page consolidates verified distributor identity, package, resource, and sourcing data with replacement analysis and implementation guidance. It does not infer unprovided electrical ratings, pricing, stock status, or full ball assignments; those fields remain explicitly separated from verified facts.
Alternativas drop-in para XA7A75T-2CSG324I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XA7A75T-1CSG324I
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XC7A75T-1CSG324I
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XC7A75T-2CSG324I
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XA7A75T-1CSG324Q
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XA7A75T-2CSG324I Classificações máximas e características elétricas
| Device Type | Artix-7 XA automotive field-programmable gate array (FPGA) |
| Product Family | Artix-7 XA |
| Logic Cells | 75,520 |
| Fabric Size | 3,870,720 bits |
| I/O Count | 210 |
| Encapsulamento | 324-terminal LFBGA (also identified as CSPBGA by verified listings) |
| Package Form | Square ball-grid array |
| Terminal Count | 324 terminals |
| Process Technology | 28 nm |
| Speed Grade | -2 |
| Device Variant | XA automotive Artix-7 |
| Peak Reflow Time | Maximum 30 s at peak reflow temperature |
| Automotive Qualification | AEC-Q100 identified by verified product listing |
Guia de Configuração de Pinos do XA7A75T-2CSG324I square ball-grid array
Configuração de pinos para XA7A75T-2CSG324I (pacote square ball-grid array). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XA7A75T-2CSG324I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XA7A75T-2CSG324I é adequado para 6 aplicaçãos: Automotive Sensor Fusion, Vehicle Network Interface, Industrial Image Processing, High-Speed Data Acquisition, Automotive Control Logic, Programmable Test Equipment.
Automotive Sensor Fusion
The XA7A75T-2CSG324I fits parallel sensor-fusion preprocessing where several inputs must be filtered, timestamped, and combined before reaching a higher-level controller. Its verified 210 I/O provides substantial board-level connectivity, while 75,520 logic cells support configurable pipelines and control state machines. The -2 grade is useful when interface timing margin matters, although engineers must obtain exact timing and power data. Because the part is identified as an XA automotive FPGA, it is preferable when the complete ordering code meets the vehicle program's qualification requirements. Final selection still requires package-specific pin assignment, power budgeting, and timing closure.
Recomendado
Vehicle Network Interface
The XA7A75T-2CSG324I can implement protocol conversion, packet filtering, or data aggregation for vehicle communication systems when deterministic programmable logic is more useful than a fixed controller. Its 210 I/O supports multiple digital interfaces, and the 75,520-cell fabric can host parallel transmit and receive paths. The verified records do not identify specific transceivers or I/O standards, so the designer must map each PHY to the official CSG324 pinout and validate voltage, direction, impedance, and timing. The -2 grade should be retained only after post-route timing confirms that the lower-speed alternative cannot close the same paths.
Recomendado
Industrial Image Processing
The XA7A75T-2CSG324I is suitable for programmable pre-processing in industrial camera systems that need parallel pixel timing, thresholding, and data reduction before transfer to external memory or processors. Its 75,520 logic cells and 210 I/O provide a substantial configurable fabric for pipelines and control logic. The supplied data does not state block-memory or DSP quantities, so video functions requiring those resources must be mapped against the complete AMD device table before commitment. Package escape routing is especially important in image-processing boards because the 324-ball LFBGA requires short, impedance-controlled routes and careful multilayer return paths.
Recomendado
High-Speed Data Acquisition
The XA7A75T-2CSG324I can serve as a configurable capture and conditioning element when multiple digital inputs require parallel sampling, timestamp handling, or data packing. Its verified 210 I/O allows many external channels to be considered, and its -2 grade can provide additional timing headroom over -1 where interfaces are demanding. Actual input rates and supported I/O standards were not supplied, so engineers must use the official datasheet and pin files to select banks, define constraints, and complete SI analysis. The large BGA also requires careful lane matching, reference-plane continuity, and power-delivery-network design.
Recomendado
Automotive Control Logic
The XA7A75T-2CSG324I can consolidate deterministic sequencing, interlocks, and supervisory logic in an automotive electronic control unit. Its 75,520 logic cells provide substantial configurable capacity, while the XA family identification makes it more relevant to automotive sourcing than the XC comparison parts. Suitability is application-specific: engineers must verify the exact temperature grade, automotive qualification status, safety requirements, and tool certification. Any safety claim must be supported by the complete device documentation and system process rather than inferred from the XA prefix alone. Layout and assembly teams should use the official package data before footprint release.
Recomendado
Programmable Test Equipment
The XA7A75T-2CSG324I can implement flexible stimulus sequencing, pattern generation, response capture, and protocol-aware checks in test systems. Its verified 75,520 logic cells and 210 I/O provide a large configurable test fabric, while the -2 grade may help close demanding digital paths. The application remains limited by the package escape geometry and by I/O resources not assigned to power or configuration functions. Since the supplied records do not verify operating temperature, power, memory, DSP, or pin banking, those details must be checked in AMD's device documentation before laboratory or production deployment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XA7A75T-2CSG324I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XA7A75T-1CSG324I | XC7A75T-1CSG324I | XC7A75T-2CSG324I | XA7A75T-1CSG324Q |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 324-LFBGA (CSPBGA) | 324-LFBGA (CSPBGA) | 324-LFBGA (CSPBGA) | 324-LFBGA (CSPBGA) | 324-LFBGA (CSPBGA) |
| Device Family | Artix-7 XA | Artix-7 XA | Artix-7 XC | Artix-7 XC | Artix-7 XA |
| Speed Grade | -2 | -1 | -1 | -2 | -1 |
| Terminal Count | 324 | 324 | 324 | 324 | 324 |
| Process Technology | 28 nm | 28 nm Artix-7 family | 28 nm Artix-7 family | 28 nm Artix-7 family | 28 nm Artix-7 family |
| Automotive Family Identity | XA | XA | XC | XC | XA |
Principais diferenciais
- Retains the verified -2 speed grade and XA family identity (vs XC7A75T-2CSG324I)
- Higher stated speed grade than the same-package -1 XA candidate (vs XA7A75T-1CSG324I)
- Matches the verified 210-I/O, 75,520-cell resource profile (vs XC7A75T-1CSG324I)
Notas de projeto
Do not release the CSG324 footprint from a generic 324-ball library entry. Download the device-specific package files from AMD's official Artix-7 pinout page, select XA7A75T in CSG324, and reconcile every ball against the schematic and constraint set. The verified records establish 324 terminals but do not provide the full map. Also check the package drawing, ball-pitch dimensions, solder-mask definition, and assembly process with the board manufacturer before fabrication.
Plan the complete power tree from the exact AMD device documentation rather than the distributor summary. The verified records do not provide core or I/O voltage tolerances, static and dynamic current, or power coefficients. Those missing values prevent a defensible supply estimate. At minimum, reserve local decoupling at every applicable supply ball, preserve continuous plane connections, and validate startup sequencing, voltage tolerances, and worst-case utilization before schematic approval.
Treat every high-speed package escape as a routed transmission-line problem. Match trace lengths where source-synchronous timing requires it, maintain a continuous reference plane, avoid plane splits under BGA escape paths, and include proper source and termination networks. The verified data supplies I/O count but no supported standards or maximum pin rates, so constraints must be based on bank-specific I/O specifications obtained from the complete datasheet.
Do not assume that a same-package suffix difference is a fully equivalent production substitution. The -1 alternatives preserve the verified footprint but can change timing closure, while XC-versus-XA ordering codes may carry different qualification identities. For every proposed substitute, regenerate the bitstream, rerun implementation and timing, verify configuration behavior, recheck power integrity, and obtain written approval from AMD or the responsible qualification authority.
Informações de conformidade
A verified third-party product page explicitly identifies the target as automotive-grade and associates it with AEC-Q100. RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations were not present in the supplied authoritative data.
