XC6SLX25-2FT256I - Spartan-6 LX FPGA, 24K Logic Cells | AMD
N.º da peça: XC6SLX25-2FT256I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $84.5 | $84,50 |
| 10 | $78.2 | $782,00 |
| 100 | $71.4 | $7.140,00 |
| 500 | $64.9 | $32.450,00 |
| 1.000 | $58.1 | $58.100,00 |
XC6SLX25-2FT256I Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and clock-management tiles (CMTs). FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers: they deliver ASIC-class parallelism and data-path throughput while remaining fully re-programmable in the field. The Spartan-6 LX family is positioned at the low-cost, low-power end of the AMD/Xilinx FPGA portfolio and is widely used in bridging, motor control, video processing, and industrial automation.
Key features of the XC6SLX25-2FT256I include 24,051 logic cells, 1,879 CLBs, 4,824 Kbits of distributed RAM, 38 DSP48A1 slices running up to 390 MHz, 2 CMTs for PLL-based clock management, and a 32-bit MultiBoot configuration controller. Industrial temperature grade -I supports -40C to +100C operation. The FT256 package provides 186 user I/O across 256 balls with 1.0 mm pitch and 17 x 17 mm body. The -2 speed grade offers the standard balance of performance and power consumption for cost-sensitive embedded designs.
The architecture pairs 6-input Look-Up Tables (LUT6) with dual flip-flops per slice, enabling efficient state-machine and pipelined datapath implementations. The Memory Controller Block (MCB) supports DDR, DDR2, DDR3, and LPDDR external memories at up to 800 Mb/s, while the SelectIO technology supports voltages from 1.2 V to 3.3 V on the same bank.
Typical applications include industrial control and bridging, automotive infotainment head units, motor and servo drive feedback, low-cost video processing, custom glue logic replacement, and consumer electronics requiring low-power parallel DSP. The wide temperature grade also makes it suitable for factory automation and outdoor display systems.
When designing with this part, note that Spartan-6 FPGAs require a separate configuration memory or JTAG programming interface; the device does not boot from internal flash. Plan the bank I/O voltage ahead of placement to avoid level-shifter overhead.
This page consolidates distributor pricing for the AMD XC6SLX25-2FT256I, drop-in FT256 Spartan-6 variants, and practical design notes that go beyond the manufacturer datasheet summary.
Alternativas drop-in para XC6SLX25-2FT256I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC6SLX25-2FT256I (mesmo formato e footprint) — diferindo em DSP48A1 Slices, Package, Mounting Type, Speed Grade, Clock Management Tiles (CMTs).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC6SLX25-2FTG256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX25-3FT256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX25-3FTG256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX16-2FT256I
✅ Drop-In✓ Em estoque
$63.85 / unidade
Ver ficha técnica →XC6SLX25-2FT256C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XA6SLX25-2FT256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX25-2FT256I Classificações máximas e características elétricas
| Family | Spartan-6 LX |
| Logic Cells | 24,051 |
| Configurable Logic Blocks (CLBs) | 1,879 |
| Block RAM (Kbits) | 958 |
| Distributed RAM (Kbits) | 4,824 |
| DSP48A1 Slices | 38 |
| User I/O | 186 |
| Clock Management Tiles (CMTs) | 2 |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | -2 (standard) |
| Temperature Grade | -I (Industrial, -40C to +100C) |
| Process Technology | 45 nm CMOS |
| Encapsulamento | FTBGA-256 (FT256), 17 x 17 mm, 1.0 mm pitch |
| Supply Voltage (Core) | 1.2 V |
| Memory Controller | Hardened MCB (DDR/DDR2/DDR3/LPDDR up to 800 Mb/s) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant (Pb-free) |
Configuração de pinos do XC6SLX25-2FT256I
| Pino A1 | IO_L1N_0 — Bank 0, user I/O differential pair N (per AMD Spartan-6 FT256 package pinout) |
| Pino A2 | IO_L1P_0 — Bank 0, user I/O differential pair P |
| Pino B1 | IO_L2N_0 — Bank 0, user I/O |
| Pino B2 | IO_L2P_0 — Bank 0, user I/O |
| Pino C1 | VCCO_0 — Bank 0 I/O supply |
| Pino C2 | VCCO_0 — Bank 0 I/O supply |
| Pino D1 | VCCAUX — Auxiliary 2.5 V/3.3 V supply |
| Pino D2 | GND — Ground |
| Pino E1 | VCCINT — Core 1.2 V supply |
| Pino E2 | GND — Ground |
| Pino F1 | CCLK — Configuration clock input |
| Pino F2 | DONE — Configuration DONE pin |
| Pino G1 | PROG_B — Active-low program/reset |
| Pino G2 | INIT_B — Active-low configuration init |
| Pino H1 | M0 — Configuration mode pin M0 |
| Pino H2 | M1 — Configuration mode pin M1 |
| Pino J1 | TCK — JTAG test clock |
| Pino J2 | TMS — JTAG test mode select |
| Pino K1 | TDI — JTAG test data in |
| Pino K2 | TDO — JTAG test data out |
Aplicações típicas
XC6SLX25-2FT256I é adequado para 6 aplicaçãos: Industrial Control and PLC Logic, Automotive Infotainment Bridging, Motor Drive and Servo Control, Low-Cost Video Processing Pipeline, Custom Glue Logic and ASIC Replacement, Portable Test and Measurement Instrumentation.
Industrial Control and PLC Logic
The XC6SLX25-2FT256I's 24,051 logic cells and 38 DSP48A1 slices provide ample headroom for PID loops, multi-axis motion control, and custom deterministic state machines typical of PLC designs. Its -40C to +100C industrial temperature grade handles factory-floor thermal stress without derating. The hardened Memory Controller Block (MCB) interfaces directly to DDR3 at 800 Mb/s, simplifying fast data acquisition from analog front-ends. Placed as the central processing element on a PLC base board, this FPGA replaces multiple discrete logic ICs and an MCU, reducing BOM cost and PCB area while improving deterministic response time.
Recomendado
Automotive Infotainment Bridging
With 186 user I/O and 24K logic cells, the XC6SLX25-2FT256I is well suited to bridge between automotive MOST/LVDS camera streams, RGB displays, and media processors. SelectIO technology supports 1.2 V to 3.3 V on the same bank, eliminating level shifters when interfacing legacy 3.3 V display panels with 1.8 V SoCs. The 38 DSP slices handle real-time image scaling and color-space conversion at video rates. Automotive-grade XA6SLX25-2FT256I variants are AEC-Q100 qualified when full automotive compliance is required.
Recomendado
Motor Drive and Servo Control
The XC6SLX25-2FT256I's 38 DSP48A1 slices deliver ~38 GMACs of multiply-accumulate throughput, enabling field-oriented control (FOC), space-vector PWM, and encoder decoding at 100 kHz+ loop rates. Its 2 CMTs provide precise PLL-based PWM generation and quadrature decoding on the same die. The 186 user I/O accommodate three-phase gate driver interfaces, Hall/encoder feedback, and current-sense ADCs simultaneously. Industrial -I grade sustains operation in servo cabinet environments with elevated ambient temperatures.
Recomendado
Low-Cost Video Processing Pipeline
The XC6SLX25-2FT256I integrates enough logic and block RAM (958 Kbits) to implement 1080p video scaling, deinterlacing, and overlay pipelines at 60 fps in pure logic. The 38 DSP slices accelerate FIR filters and chroma resampling. The MCB delivers DDR3 bandwidth (800 Mb/s) sufficient to double-buffer 1080p frames, removing off-chip memory bandwidth as a bottleneck. Designers typically pair it with an HDMI transmitter or LVDS display serializer for industrial monitor and digital signage applications.
Recomendado
Custom Glue Logic and ASIC Replacement
At 24K logic cells, the XC6SLX25-2FT256I easily absorbs legacy discrete-logic boards of 10-15 standard TTL/CMOS parts, plus bus arbitration, address decoding, and timing generation - in a single 17x17 mm BGA. Re-programmability in the field lets engineers iterate without respin, drastically shortening development cycles compared to fixed-function ASICs. Industrial -I temperature grade covers most non-automotive harsh environments. The XC6SLX25-2FT256I is the typical choice when designers want one FPGA platform that scales across multiple product variants.
Recomendado
Portable Test and Measurement Instrumentation
The XC6SLX25-2FT256I's combination of 38 DSP slices for FFT/FIR processing, 186 I/O for parallel ADC/DAC interfacing, and low 1.2 V core power consumption is ideal for handheld oscilloscope, logic analyzer, and protocol analyzer front ends. The hardened MCB streams captured waveforms to external DDR3 memory for deep buffers. The -40C to +100C industrial temperature grade supports outdoor and field-service environments. The FTBGA-256 package fits inside compact USB-powered enclosures without active cooling at typical 2-3 W dissipation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX25-2FT256I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX25-2FTG256I | XC6SLX25-3FT256I | XC6SLX25-3FTG256I | XC6SLX16-2FT256I | XC6SLX25-2FT256C | XA6SLX25-2FT256I |
|---|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FTBGA-256 (FT256) | FTBGA-256 (FT256) - same | FTBGA-256 (FT256) - same | FTBGA-256 (FT256) - same | FTBGA-256 (FT256) - same | FTBGA-256 (FT256) - same | FTBGA-256 (FT256) - same |
| Logic Cells | 24,051 | 24,051 (identical) | 24,051 (identical) | 24,051 (identical) | 14,579 (-39%) | 24,051 (identical) | 24,051 (identical) |
| DSP Slices | 38 | 38 (identical) | 38 (identical) | 38 (identical) | 32 (-16%) | 38 (identical) | 38 (identical) |
| Speed Grade | -2 (standard) | -2 (identical) | -3 (faster) | -3 (faster) | -2 (identical) | -2 (identical) | -2 (identical) |
| Temperature Grade | -I (Industrial, -40C to +100C) | -I (identical) | -I (identical) | -I (identical) | -I (identical) | -C (Commercial, 0 to +85C) | -I (identical, AEC-Q100) |
| RoHS / Pb-Free | Yes (Pb-free) | Yes | Yes | Yes | Yes | Yes | Yes |
| Automotive Qualified | No | No | No | No | No | No | Yes (AEC-Q100) |
Principais diferenciais
- Hardened DDR3 memory controller on-die (vs XC6SLX16-2FT256I)
- Higher DSP slice count for motor control (vs XC6SLX25-2FTG256I (same die))
- Industrial temperature grade -I vs commercial -C (vs XC6SLX25-2FT256C)
- Automotive-grade option available in same footprint (vs XC6SLX25-2FTG256I)
Notas de projeto
The XC6SLX25-2FT256I requires three distinct supply rails: VCCINT (1.2 V core), VCCAUX (2.5 V or 3.3 V auxiliary), and VCCO (1.2 V to 3.3 V per bank). At ~2-3 W typical dissipation, use a TPS54560 or TPS82140 for VCCINT with at least 30% headroom, and place 100 uF bulk plus 0.1 uF + 10 uF ceramic decoupling within 5 mm of each supply pin. Power-on sequencing is not mandated on Spartan-6, but VCCINT before VCCO is recommended to avoid I/O driving into unpowered transceivers.
Estimated: at 25C ambient and 2.5 W dissipation, the FT256 package's theta_JA of approximately 18 C/W yields a 45C junction temperature rise, well within the 100C -I limit. However, derate by 1.5x for enclosed industrial enclosures lacking forced airflow. Adding four thermal vias in a 2x2 array under the central BGA balls reduces theta_JC significantly; reference AMD UG380 thermal design guidelines for full PCB thermal patterns.
The 1.0 mm pitch FTBGA-256 demands 4-layer PCB minimum with 0.5 mm via-in-pad and 0.8 mm ball pad diameter. Use 50 ohm controlled impedance on SelectIO banks driving DDR3 memories per AMD UG380. JTAG chain (TCK/TMS/TDI/TDO) must be length-matched to within 100 mil to avoid configuration failures; pull PROG_B to VCCO_0 through 4.7 kohm and route DONE as an open-drain indicator.
Do not reuse the FT256 footprint across different Spartan-6 densities (LX9, LX16, LX25, LX45) without verifying pin-for-pin compatibility in the AMD package pinout files; only LX9/LX16/LX25 share the FT256 footprint fully per AMD DS160 Table 2. Avoid configuring the MCB and block RAM in conflicting voltage banks; the hardened MCB requires VCCO of 1.5 V (DDR3) or 1.8 V (DDR2). Finally, do not omit the SPI configuration memory footprint even if JTAG-only programming is planned; field upgrades require a non-volatile boot source.
Informações de conformidade
Standard XC6SLX25-2FT256I is RoHS-compliant with Pb-free balls but is not AEC-Q100 qualified; choose XA6SLX25-2FT256I variant for automotive. REACH and conflict-minerals compliance per AMD product page.
