XC6SLX4-3TQG144C - 3840-LE Spartan-6 FPGA | AMD
N.º da peça: XC6SLX4-3TQG144C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.6231 | $6,62 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
XC6SLX4-3TQG144C Visão geral
A field-programmable gate array is a semiconductor whose configurable logic, memory, and I/O blocks implement a digital design after manufacture. An FPGA belongs to the programmable-logic-device hierarchy, combining parallel logic fabric, block random-access memory, dedicated digital signal processing resources, and programmable input/output. The Spartan-6 LX family is positioned for low-cost embedded designs where integration and design flexibility matter more than the very high resource density of larger FPGAs.
Verified listings identify 3,840 logic elements, 102 I/Os, 216 Kb of block RAM, 8 DSP slices, and 300 configurable logic blocks. These resources permit parallel datapaths, control-state machines, protocol handling, and small-buffer-based embedded systems in one device. The TQFP-144 package also supports conventional PCB assembly, although its fine-pitch leads require careful inspection and layout. One distributor search result describes a 3840-LE FPGA and one comparison result reports a maximum FPGA frequency of 862 MHz, but timing qualification must be checked against the specific design and operating conditions.
The XC6SLX4-3TQG144C is commonly selected for industrial controls, data acquisition, communications, embedded vision, and compact instrument-control systems. Its 102 I/Os provide substantial board-level connectivity, while block RAM supports buffering and lookup functions. The 8 DSP slices can accelerate multiply-accumulate operations without consuming only general-purpose fabric, although system performance still depends on routing, clocking, and timing closure.
For a new design, verify the exact pinout, recommended power rails, configuration interface, clock requirements, and supported I/O standards in the AMD Spartan-6 documentation before layout. Do not treat a same-package device as a substitute without checking bitstream compatibility, configuration behavior, timing, temperature grade, and all bank-level constraints. The listed inventory and pricing should be checked with authorized distributors before purchase.
This page combines distributor information, package identification, application guidance, and replacement considerations that are not contained in a single distributor listing. Pricing and stock status are time-sensitive, and the current verified commercial signal is the listed starting price of $6.6231 from LCSC as of 2026-10-22.
Alternativas drop-in para XC6SLX4-3TQG144C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC6SLX4-3TQG144C (mesmo formato e footprint) — diferindo em Block RAM, Maximum User I/O, Package, RoHS Status, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasXC6SLX4-3TQG144C Classificações máximas e características elétricas
| FPGA Family | Spartan-6 LX |
| Logic Elements | 3,840 |
| Adaptive Logic Modules | 600 ALM |
| Configurable Logic Blocks | 300 CLB |
| Maximum User I/O | 102 I/O |
| Block RAM | 216 Kb |
| DSP Slices | 8 |
| Speed Grade | -3 |
| Temperature Class | Commercial |
| Encapsulamento | 144-LQFP, TQFP-144, 20 x 20 mm |
| Tipo de montagem | Surface mount |
| Maximum Frequency | 862 MHz |
| Status do ciclo de vida | Active |
| Status RoHS | RoHS3 compliant |
| Export Control Classification | EAR99 |
| Manufacturer | AMD / Xilinx |
Guia de Configuração de Pinos do XC6SLX4-3TQG144C 144-lqfp, tqfp-144, 20 x 20 mm
Configuração de pinos para XC6SLX4-3TQG144C (pacote 144-lqfp, tqfp-144, 20 x 20 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC6SLX4-3TQG144C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC6SLX4-3TQG144C é adequado para 6 aplicaçãos: Industrial Control Logic, Data Acquisition Front Ends, Communications Interface Cards, Embedded Signal Processing, Test and Measurement Instruments, Industrial Networking Gateways.
Industrial Control Logic
The XC6SLX4-3TQG144C fits compact industrial controllers because it combines 3,840 logic elements, 102 I/Os, and 216 Kb of block RAM in one programmable device. Those resources can support sequencing logic, machine-state machines, interlocks, counters, and local communication interfaces without relying on multiple fixed-function devices. A designer can place the FPGA beside sensors and actuators, route signals through its I/Os, and use block RAM for tables or trace storage. The verified data does not provide the industrial temperature range, so environmental suitability still requires checking the AMD device specification before deployment.
Recomendado
Data Acquisition Front Ends
The FPGA's 3,840 logic elements and 102 I/Os make it suitable for coordinating parallel data-acquisition channels, digital filtering, trigger logic, and interface timing. Block RAM can hold captured samples or intermediate results, while the 8 DSP slices can support arithmetic stages such as multiply-accumulate operations. The implementation would typically accept converter or sensor signals, perform timing alignment and filtering, then pass data to a processor or communications interface. Exact input voltage, I/O-standard, and clock requirements are not present in the supplied data and must be verified against the official datasheet.
Recomendado
Communications Interface Cards
The XC6SLX4-3TQG144C can implement parallel-to-serial conversion, packet framing, CRC processing, buffering, and protocol state machines in a compact communications card. Its 102 I/Os provide connections to transceivers and control logic, while 216 Kb of block RAM can support FIFOs and transmit or receive buffers. The -3 speed grade may be useful when timing margin is important, but the final baud rate and packet throughput depend on the selected I/O standards, clock architecture, routing, and tool timing closure. Use the AMD pinout files to validate every transceiver connection.
Recomendado
Embedded Signal Processing
The device's 8 DSP slices provide dedicated arithmetic resources alongside 3,840 logic elements, making it suitable for small embedded signal-processing functions such as filtering, modulation support, or fixed-point arithmetic. Block RAM can hold coefficients, sample windows, and intermediate results, allowing the FPGA to process streaming data with deterministic latency. This is not a claim of a specific throughput: sampling rate, word width, pipeline depth, memory bandwidth, clocking, and I/O standards must be selected before the design is considered feasible. The Spartan-6 -3 grade should be evaluated against the timing budget in the final implementation.
Recomendado
Test and Measurement Instruments
A programmable FPGA in a measurement instrument can coordinate stimulus, capture timing, execute calibration tables, and format results while keeping the design adaptable. The XC6SLX4-3TQG144C offers 102 I/Os for instrument-control signals and 216 Kb of block RAM for local buffering, while its 3,840 logic elements support control state machines and timing logic. Designers should pay particular attention to clock jitter, I/O voltage compatibility, output-edge quality, and grounding when connecting the FPGA to analog front ends. Those electrical requirements are not supplied here and must be checked in the AMD documentation.
Recomendado
Industrial Networking Gateways
The XC6SLX4-3TQG144C can serve as a gateway controller when an embedded design needs protocol bridging, local buffering, status logic, and multiple digital interfaces. Its 102 I/Os allow connection to Ethernet or serial transceiver components, while block RAM can support FIFOs and protocol state storage. The programmable architecture allows the FPGA to handle data movement without a separate high-performance processor, provided the design fits 3,840 logic elements and the available 216 Kb of memory. Validate protocol timing, clock domains, reset sequencing, and transceiver I/O standards in the implementation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX4-3TQG144C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX4-3TQG144I | XC6SLX4-2TQG144C | XC6SLX4-2TQG144I | XC6SLX4-3TQG144C |
|---|---|---|---|---|---|
| Package | 144-LQFP / TQFP-144 | 144-LQFP / TQFP-144 | 144-LQFP / TQFP-144 | 144-LQFP / TQFP-144 | 144-LQFP / TQFP-144 |
| Brand | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx |
| Logic Elements | 3,840 | 3,840 | 3,840 | 3,840 | 3,840 |
| User I/O | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -3 | -3 | -2 | -2 | -3 |
| Temperature Designation | C | I | C | I | C |
Principais diferenciais
- Higher -3 speed-grade selection (vs XC6SLX4-2TQG144C)
- Commercial temperature designation (vs XC6SLX4-3TQG144I)
- Integrated logic, memory, and DSP resources (vs XC6SLX4-3TQG144I)
Notas de projeto
The supplied data does not provide the XC6SLX4-3TQG144C supply-voltage values or current limits. Do not select regulators or decoupling values from memory. Use the AMD Spartan-6 power specification for the exact device, then place required bulk and high-frequency decoupling capacitors close to the package power pins. Keep regulator output and return paths short, and verify power sequencing and ripple against the target clock and I/O activity.
Treat the 144-LQFP as a fine-pitch, high-pin-count assembly and use the official package drawing for land patterns. The supplied data confirms TQFP-144 and 20 x 20 mm package data but does not provide the complete pin map, so verify every pin assignment against AMD's package-device pinout file before routing. Keep high-speed clocks and configuration-sensitive nets away from noisy switching paths, and preserve assembly clearances for the fine-pitch leads.
The FPGA's 102 I/Os and multiple clock, configuration, power, and ground connections make pin planning a system-level task. Group related interfaces, reserve configuration and clock pins before assigning peripheral signals, and check voltage-tolerance and I/O-standard constraints for every connected transceiver or converter. Use the manufacturer's pinout file rather than relying on distributor package labels, because the exact TQFP-144 variant must match the PCB footprint.
Do not substitute an XC6SLX9 or another FPGA solely because it also appears in a TQFP-144 listing. The verified search results discuss similar-looking devices but do not establish complete pin, resource, configuration, timing, or bitstream compatibility. A replacement must match the exact package outline, pinout, I/O standards, configuration method, resource requirements, temperature class, and timing constraints. Validate migration with the AMD tools and a hardware test before production substitution.
For high-speed interfaces, treat clocks, data buses, and configuration signals as separate routing problems. Match trace lengths where the interface standard requires it, provide continuous reference planes, avoid stubs, and control return current through proper layer transitions. The supplied data does not specify supported I/O standards or maximum interface rates, so the designer must use the official device specifications and tool timing reports to establish margins rather than inferring them from the 862 MHz listing.
Informações de conformidade
ICSuperman lists the part as RoHS3 compliant. No verified REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement was supplied. AEC-Q100 is not applicable to the provided commercial FPGA listing.
