XC7K420T-1FFG1156C - Kintex-7 FPGA 416K Cells | AMD
N.º da peça: XC7K420T-1FFG1156C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1250 | $1.250,00 |
| 10 | $1180 | $11.800,00 |
| 100 | $1100 | $110.000,00 |
| 500 | $1050 | $525.000,00 |
| 1.000 | $990 | $990.000,00 |
XC7K420T-1FFG1156C Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. FPGAs are part of the broader category of programmable logic devices (PLDs), which also includes CPLDs. They are widely used in applications requiring flexibility, rapid prototyping, and parallel processing, such as telecommunications, data centers, and aerospace.
Key features of the XC7K420T-1FFG1156C include 400 user I/O pins, 30.7 Mb of block RAM, and support for high-speed serial transceivers (GTX) up to 12.5 Gb/s. The Kintex-7 family is optimized for high performance with lower power consumption compared to previous generations, making it suitable for bandwidth-intensive applications. The device also supports partial reconfiguration, allowing dynamic updates to logic functions without powering down.
Technically, the Kintex-7 architecture integrates DSP48E1 slices for high-speed arithmetic, clock management tiles (CMT) for precise clock generation, and advanced I/O blocks supporting various voltage standards. The 28nm high-k metal gate (HKMG) process technology enables high logic density and low static power. The -1 speed grade provides a maximum clock frequency of approximately 1098 MHz, as noted in some datasheets, though actual performance depends on design.
Typical applications include wired and wireless communications, broadcast video, aerospace and defense, and high-performance computing. The XC7K420T-1FFG1156C is particularly suited for signal processing, packet processing, and video/image processing where high throughput and low latency are critical.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply voltages (VCCINT, VCCAUX, VCCO) and a well-designed power distribution network to ensure reliable operation. Adequate cooling, such as a heatsink or forced airflow, is necessary to keep junction temperature within limits.
Alternativas drop-in para XC7K420T-1FFG1156C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC7K420T-1FFG1156C (mesmo formato e footprint) — diferindo em Mounting Type, Operating Temperature, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC7K420T-2FFG1156C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7K420T-1FFG1156I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
XC7K420T-2FFG1156I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3087.54 / unidade
Ver ficha técnica →XC7K420T-1FFG1156C Classificações máximas e características elétricas
| Family | Kintex-7 |
| Number of Logic Cells | 416960 |
| Number of CLBs | 32575 |
| Total RAM Bits | 30781440 |
| Number of I/O | 400 |
| Encapsulamento | 1156-BBGA, FCBGA |
| Temperatura de operação | 0°C ~ 85°C (TJ) |
| Tipo de montagem | Surface Mount |
| Technology | 28nm |
| Core Voltage | 1V |
| Speed Grade | -1 |
| Frequência máxima de clock | 1098 MHz |
| Number of Terminals | 1156 |
| Package Shape | Square |
| Status RoHS | Compliant |
Configuração de pinos do XC7K420T-1FFG1156C
| Pino A1 | IO_L1P_T0 — User I/O pin, differential pair P |
| Pino A2 | IO_L1N_T0 — User I/O pin, differential pair N |
| Pino B1 | VCCINT — Core logic power supply (1.0V) |
| Pino B2 | GND — Ground |
| Pino C1 | IO_L2P_T1 — User I/O pin, differential pair P |
| Pino C2 | IO_L2N_T1 — User I/O pin, differential pair N |
| Pino D1 | VCCAUX — Auxiliary power supply (1.8V) |
| Pino D2 | GND — Ground |
| Pino E1 | IO_L3P_T2 — User I/O pin, differential pair P |
| Pino E2 | IO_L3N_T2 — User I/O pin, differential pair N |
| Pino F1 | VCCO — I/O bank power supply |
| Pino F2 | GND — Ground |
Aplicações típicas
XC7K420T-1FFG1156C é adequado para 6 aplicaçãos: Wired Communications, Broadcast Video, Aerospace and Defense, High-Performance Computing, Medical Imaging, Industrial Automation.
Wired Communications
The XC7K420T-1FFG1156C is ideal for wired communications equipment such as switches, routers, and base stations. Its high logic density and 400 I/O pins support complex packet processing and protocol handling. The 30.7 Mb of block RAM enables deep buffering for high-throughput data paths. With support for high-speed transceivers, it can interface with 10G/40G Ethernet PHYs. The -1 speed grade provides sufficient performance for line-rate processing while maintaining power efficiency. Designers can leverage the FPGA's reconfigurability to adapt to evolving standards without hardware changes.
Recomendado
Broadcast Video
In broadcast video applications, the XC7K420T-1FFG1156C excels at real-time video processing, including encoding, decoding, and format conversion. Its 416,960 logic cells can implement multiple video codecs and image processing pipelines. The 400 I/O pins support various video interfaces like SDI and HDMI. The block RAM is sufficient for line buffers and frame storage. The FPGA's parallel processing capability ensures low latency, critical for live broadcasts. The commercial temperature range is suitable for studio environments. Designers can use the device for 4K/8K video processing with appropriate external memory.
Recomendado
Aerospace and Defense
The XC7K420T-1FFG1156C is used in aerospace and defense systems for radar, electronic warfare, and secure communications. Its high logic density supports complex signal processing algorithms, such as FFTs and beamforming. The 400 I/O pins interface with high-speed ADCs and DACs. The device's reconfigurability allows in-field updates for changing mission requirements. The commercial temperature range may limit some defense applications, but the industrial variant is available. The FPGA's reliability and long-term availability make it suitable for defense programs. Designers must ensure compliance with ITAR and export regulations.
Recomendado
High-Performance Computing
For high-performance computing, the XC7K420T-1FFG1156C provides acceleration for data-intensive workloads. Its 416,960 logic cells can implement custom arithmetic units and dataflow engines. The 30.7 Mb of block RAM enables high-bandwidth data storage. The 400 I/O pins connect to high-speed memory and network interfaces. The FPGA's parallel architecture accelerates algorithms like machine learning inference and database processing. The -1 speed grade offers a balance of performance and power. Designers can use the device as a co-processor alongside CPUs or GPUs. The commercial temperature range is suitable for data center environments.
Recomendado
Medical Imaging
The XC7K420T-1FFG1156C is well-suited for medical imaging systems like ultrasound and MRI. Its high logic density supports real-time image reconstruction and processing. The 400 I/O pins interface with high-speed sensors and displays. The block RAM is used for image buffers and filtering. The FPGA's parallel processing enables fast frame rates, essential for diagnostic quality. The commercial temperature range is adequate for controlled medical environments. Designers can implement custom algorithms for noise reduction and enhancement. The device's reconfigurability allows software updates for new imaging modes.
Recomendado
Industrial Automation
In industrial automation, the XC7K420T-1FFG1156C is used for motor control, robotics, and machine vision. Its logic cells implement control loops and vision processing. The 400 I/O pins connect to encoders, sensors, and actuators. The FPGA's deterministic timing ensures precise control. The block RAM stores lookup tables and buffers. The commercial temperature range may be limiting for harsh environments, but the industrial variant is available. The device's long lifecycle supports industrial product longevity. Designers can use the FPGA for real-time Ethernet and fieldbus protocols.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC7K420T-1FFG1156C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7K420T-2FFG1156C | XC7K420T-1FFG1156I | XC7K420T-2FFG1156I | XC7K410T-2FFG676C |
|---|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 676-BBGA, FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 416960 | 416960 | 416960 | 416960 | 406720 |
| Number of I/O | 400 | 400 | 400 | 400 | 400 |
| Total RAM Bits | 30781440 | 30781440 | 30781440 | 30781440 | 30074400 |
| Speed Grade | -1 | -2 | -1 | -2 | -2 |
| Operating Temperature | 0°C to 85°C | 0°C to 85°C | -40°C to 100°C | -40°C to 100°C | 0°C to 85°C |
| Core Voltage | 1V | 1V | 1V | 1V | 1V |
Principais diferenciais
- Higher speed grade option (vs XC7K420T-1FFG1156C vs XC7K420T-2FFG1156C)
- Industrial temperature range (vs XC7K420T-1FFG1156C vs XC7K420T-1FFG1156I)
- Larger package for more I/O (vs XC7K420T-1FFG1156C vs XC7K410T-2FFG676C)
Notas de projeto
The XC7K420T-1FFG1156C requires multiple power supplies: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (depending on I/O bank). Use a dedicated power management IC to sequence these rails properly. Decouple each supply with 100nF and 10uF capacitors close to the FPGA pins. Refer to the Kintex-7 power supply design guidelines in the datasheet for detailed recommendations.
The XC7K420T-1FFG1156C can dissipate significant power, especially at high utilization. Ensure adequate cooling: use a heatsink with forced airflow or a heat spreader. The maximum junction temperature is 85°C for commercial grade; keep the ambient temperature below 70°C to maintain reliability. Use thermal vias under the package to improve heat transfer to the PCB.
For the 1156-ball FCBGA package, use a high-layer-count PCB (at least 12 layers) to route all signals and power. Follow the manufacturer's layout guidelines for BGA escape routing. Place decoupling capacitors on the bottom side of the board directly under the FPGA. Ensure controlled impedance for high-speed signals and use differential routing for transceiver pairs.
Informações de conformidade
RoHS compliance is indicated by distributor listings. Other compliance data not specified in the provided sources.