XMC4200Q48F256BAXUMA1 - 80MHz Arm Cortex-M4 MCU | Infineon
N.º da peça: XMC4200Q48F256BAXUMA1 ✓ AtivoXMC4200Q48F256BAXUMA1 Visão geral
A microcontroller is a programmable semiconductor that combines a processor core, memory, peripherals, and communication interfaces on one integrated circuit. The XMC4000 family follows the hierarchy MCU, embedded microcontroller, microcontroller, and semiconductor. Its Arm Cortex-M4 core supports efficient real-time control while the CAN and LIN interfaces allow the device to communicate with industrial automation, automotive networking, and distributed control equipment.
The XMC4200Q48F256BAXUMA1 combines 80 MHz processing performance with 256 KB of Flash and 40 KB of SRAM. The Flash memory provides room for application code and configuration data, while SRAM supports working memory, stack operations, buffers, and real-time data processing. Its integrated CAN and LIN connectivity reduces the need for external communication transceivers when designing networked embedded systems, although transceiver selection and bus protection remain board-level requirements.
The XMC4200 part of the XMC4000 family is positioned for industrial control applications that benefit from an Arm Cortex-M4 processor and dedicated communication peripherals. Compared with a general-purpose Cortex-M4 design, this device integrates communication and timing resources into a compact 48-VQFN package. This consolidation can reduce board area when CAN, LIN, timers, and PWM functions are all required by the application.
Typical applications include industrial automation controllers, CAN-based motor and machine controls, LIN-connected automotive sub-systems, distributed sensor nodes, industrial communication gateways, and compact embedded control panels. The combination of 256 KB Flash, 40 KB SRAM, and 80 MHz operation is suitable for protocol handling, supervisory logic, data acquisition, and closed-loop control without requiring a separate processor.
PCB design should preserve the exposed-pad thermal and electrical requirements of the VQFN package. Use a manufacturer-compliant land pattern, connect the exposed pad to the appropriate ground plane, and place decoupling capacitors close to the power pins. Firmware deployment should also account for the 256 KB Flash limit, boot and application organization, communication timing, and the pin multiplexing required by the selected peripheral configuration.
This page consolidates the component specifications, manufacturer documentation, package information, application guidance, and qualification criteria into a compact engineering reference. It also distinguishes pin-compatible family alternatives from options that require different firmware, package, peripheral, or qualification validation.
Alternativas drop-in para XMC4200Q48F256BAXUMA1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
XMC4200-Q48F256-BA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XMC4100-Q48F256-BA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XMC4200-Q48F256-AA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XMC4200-Q48F256-CA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XMC4200-Q48F256-TA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XMC4200Q48F256BAXUMA1 Classificações máximas e características elétricas
| Product Type | Industrial 32-bit microcontroller |
| Processor Core | Arm Cortex-M4 |
| Maximum CPU Frequency | 80 MHz |
| Flash Memory | 256 KB |
| Flash Organization | 256K x 8 |
| SRAM | 40 KB |
| Architecture | 32-bit |
| Product Series | XMC4000 |
| Device Designation | XMC4200 |
| Communication Interfaces | CAN and LIN |
| Timer/PWM Support | Timer and PWM control |
| Encapsulamento | PG-VQFN-48-71 |
| Package Pin Count | 48 pins |
| Exposed Pad | Present |
| Tipo de montagem | Surface mount |
| Operating Voltage | 1.3 V to 48 V |
Guia de Configuração de Pinos do XMC4200Q48F256BAXUMA1 48 pins
Configuração de pinos para XMC4200Q48F256BAXUMA1 (pacote 48 pins). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XMC4200Q48F256BAXUMA1.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XMC4200Q48F256BAXUMA1 é adequado para 6 aplicaçãos: Industrial Automation Controller, CAN-Based Machine Control, LIN Automotive Sub-System, Motor and PWM Control, Distributed Sensor Node, Communication Gateway.
Industrial Automation Controller
The XMC4200Q48F256BAXUMA1 fits an industrial automation controller that coordinates machine states, processes local inputs, and drives timing-sensitive outputs. Its 80 MHz Arm Cortex-M4 core provides processing headroom, while 256 KB of Flash holds control code and 40 KB of SRAM supports buffers and protocol state. Integrated CAN and LIN connectivity is especially useful when the controller connects to distributed modules. The 48-VQFN package also keeps the controller compact, although the exposed pad must be connected according to the manufacturer land pattern.
Recomendado
CAN-Based Machine Control
The XMC4200Q48F256BAXUMA1 is suited to CAN-based machine control nodes that exchange commands, report machine status, and enforce deterministic local behavior. Its Cortex-M4 core can run communication tasks alongside timers and PWM channels, while the 256 KB Flash budget accommodates application and protocol code. CAN connectivity simplifies network integration compared with a microcontroller that requires an external controller. Board design still needs a suitable transceiver, protection network, termination strategy, and isolation decision appropriate to the installation environment.
Recomendado
LIN Automotive Sub-System
The XMC4200Q48F256BAXUMA1 can serve as the controller in a LIN-connected automotive sub-system such as a door, climate, lighting, or seat module. LIN integration provides a compact interface for low-speed serial networking, while the 80 MHz Cortex-M4 core and 40 KB of SRAM allow application logic, diagnostics, and communication handling to coexist. A LIN transceiver is still required on the board, and developers should validate the device grade, temperature range, sleep behavior, and wake-up strategy against the vehicle requirements.
Recomendado
Motor and PWM Control
The XMC4200Q48F256BAXUMA1 fits compact motor-control and PWM generation designs requiring deterministic timing and embedded communications. The 80 MHz Cortex-M4 core can execute control algorithms, while dedicated timer and PWM resources support actuator command generation and timing tasks. Its 256 KB Flash and 40 KB SRAM are adequate for embedded control code and working state. Integration with power electronics still requires suitable gate drivers, current sensing, protection, and a PCB designed for the switching environment rather than the low-power digital domain.
Recomendado
Distributed Sensor Node
The XMC4200Q48F256BAXUMA1 can serve as a distributed sensor node that samples equipment data, performs local calculations, and reports results over CAN or LIN. Its 80 MHz processor provides more than enough capability for filtering, diagnostics, and protocol tasks, while 40 KB of SRAM supports temporary measurement and communication buffers. The compact 48-pin VQFN package helps reduce node size, but low-power requirements should be checked against standby and wake-up specifications before selecting it for battery installations.
Recomendado
Communication Gateway
The XMC4200Q48F256BAXUMA1 is applicable to a compact industrial gateway that bridges equipment communication, performs protocol conversion, and supervises local I/O. Its CAN and LIN interfaces support communication-oriented designs, while 256 KB of Flash and 40 KB of SRAM provide room for application logic and packet handling. The 80 MHz Cortex-M4 core allows concurrent protocol and supervisory tasks without requiring a higher-performance processor. Firmware planning should include protocol memory budgets, update mechanisms, watchdog behavior, and secure boot requirements where applicable.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XMC4200Q48F256BAXUMA1 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Use XMC4200-Q48F256-BA when the manufacturer ordering designation is preferred for catalog and documentation management; it represents the same stated XMC4200 configuration. Consider XMC4100-Q48F256-BA only when its peripherals and firmware support match the design, since a shared footprint does not guarantee identical communications or timer functionality. The AA, CA, and TA ordering options should be selected according to their documented temperature and qualification requirements rather than inferred solely from the package suffix.
A different MCU is preferable when it offers more memory, lower power consumption, a preferred software ecosystem, or qualification better aligned with the end product. Validate exposed-pad layout, power rails, pin multiplexing, peripheral assignments, firmware, and environmental requirements before approving any substitution.
Comparação com alternativas
| Parâmetro | Este produto | XMC4200-Q48F256-BA | XMC4100-Q48F256-BA | XMC4200-Q48F256-AA | XMC4200-Q48F256-CA | XMC4200-Q48F256-TA |
|---|---|---|---|---|---|---|
| Package | PG-VQFN-48-71 | PG-VQFN-48-71 | PG-VQFN-48-71 | PG-VQFN-48-71 | PG-VQFN-48-71 | PG-VQFN-48-71 |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Architecture | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Ordering Designation | XMC4200Q48F256BAXUMA1 | XMC4200-Q48F256-BA | XMC4100-Q48F256-BA | XMC4200-Q48F256-AA | XMC4200-Q48F256-CA | XMC4200-Q48F256-TA |
Principais diferenciais
- Integrated industrial communications (vs XMC4100-Q48F256-BA)
- Direct manufacturer ordering designation (vs XMC4200-Q48F256-BA)
- Compact 48-pin industrial platform (vs XMC4200-Q48F256-AA)
Notas de projeto
Use the Infineon PG-VQFN-48-71 land pattern and exposed-pad guidance without changing pad dimensions or via geometry. Connect the exposed pad to the intended ground structure and provide continuous low-impedance return paths for the 80 MHz processor and communication interfaces. Place bulk and decoupling capacitance close to the relevant supply pins, with the shortest practical routes between the capacitor, package pad, and ground reference.
Treat CAN, LIN, clock-dependent routes, and debug interfaces as controlled-impedance or tightly filtered nets when their implementation permits. Keep switching-power converter paths and high-current actuator routes away from sensitive communication and analog inputs. Review the manufacturer pin-multiplexing table before assigning a function because the package exposes several alternate peripheral signals, and incorrect mux selection can create software-only failures that appear as hardware defects.
Do not assume that two MPNs with the same XMC4200 Q48 footprint are interchangeable solely because their pins appear aligned. Check grade suffix, temperature range, qualification, peripheral options, startup behavior, and firmware support. The XMC4100 family option also requires peripheral-level review because differences in communication or timer resources can change the board firmware even when the footprint remains compatible.
Validate the power architecture against the device's 1.3 V to 48 V operating range and the exact internal supply requirements listed in the manufacturer documentation. Confirm regulator headroom, startup sequencing, voltage tolerance, and current demand at the selected CPU, memory, and peripheral operating state. A wide external input range does not mean every internal rail can be connected directly to the same supply source.
Use the exposed pad and surrounding copper to reduce junction temperature, but base the final thermal design on the actual maximum dissipation, ambient range, board construction, and exposed-pad geometry. Maintain uninterrupted copper where the land pattern permits and avoid thermal relief patterns that impair heat transfer near the pad. Validate worst-case operation in the assembled enclosure because airflow and neighboring heat sources determine the achieved thermal resistance.
Informações de conformidade
No specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declaration was included in the manufacturer or distributor excerpts. Confirm the applicable declaration for the exact grade suffix using Infineon's product documentation.
