XPC8260CZUIHBC - PowerQUICC II 32-bit MPU, 200MHz, 480-TBGA
N.º da peça: XPC8260CZUIHBC ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2.450,00 |
| 100 | $198 | $19.800,00 |
| 500 | $165 | $82.500,00 |
| 1.000 | $142 | $142.000,00 |
XPC8260CZUIHBC Visão geral
What is a PowerQUICC II? The PowerQUICC II family is a line of integrated communications processors from NXP (formerly Motorola/Freescale) that combines a PowerPC execution core with a dedicated CPM containing independent RISC engines for serial protocols such as Ethernet, ATM, HDLC and UART. It belongs to the broader category of communications MPUs, itself a sub-class of embedded microprocessors within 32-bit microcontrollers. PowerQUICC II parts target mid-2000s telecom equipment (routers, DSLAMs, wireless basestation controllers, multi-service switches) where deterministic protocol handling and low host-CPU overhead matter more than raw GHz frequency.
Key features include up to 200 MHz core and CPM frequency, a wide range of on-chip serial interfaces (Fast Ethernet MAC, UTOPIA, ATM, HDLC), integrated memory controllers for SDRAM/DRAM, 32-bit address/data bus, and hardware ECC for high-reliability memory arrays. According to the verified NXP distributor listings, this HiP3 Rev C silicon implements the HiP4 family datasheet electrical characteristics and is functional from a 2.4V to 2.7V supply.
Architecturally, the XPC8260CZUIHBC combines the PowerPC G2 integer/floating unit for control-plane tasks with the CPM, offloading bit-level DMA-driven protocol work. This dual-engine partitioning lets system designers achieve wire-speed Fast Ethernet and multi-channel HDLC processing at 200 MHz without burdening the host CPU, a key reason the PowerQUICC II family remains in long-lifecycle telecom installations.
Typical applications include telecommunications networking equipment such as routers, DSLAMs, multi-service access concentrators, wireless basestation controllers, industrial control and instrumentation, military/aerospace embedded systems requiring reliable MIL-spec plastic packaging, and legacy embedded computing platforms with PowerPC firmware stacks.
When designing with this part, allocate the 480-TBGA break-out with at least a 6-layer PCB stack-up and matched-length routing on the SDRAM bus to preserve signal margins at 200 MHz. Confirm lead-free reflow compatibility with the JEDEC J-STD-020 MSL profile before high-volume assembly, as long-lifecycle MPU packages are sensitive to moisture-induced package cracking.
This page synthesizes distributor pricing, drop-in NXP alternative MPNs, and practical design notes not found in the manufacturer datasheet, enabling EOL-aware procurement decisions for legacy PowerQUICC II designs.
Alternativas drop-in para XPC8260CZUIHBC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XPC8260CZUHFBC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8270CZUUPEA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8280CZUUPEA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8360EZUPEA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XPC8260CZUIHBC Classificações máximas e características elétricas
| Core Processor | PowerPC G2 |
| Number of Cores | 1 |
| Largura do barramento de dados | 32-bit |
| Core Clock Speed | 200 MHz |
| Supply Voltage (Core) | 2.5 V (2.4 V min, 2.7 V max) |
| Co-Processor / DSP | Communications; RISC CPM |
| RAM Controllers | DRAM, SDRAM |
| Graphics Acceleration | No |
| Ethernet | 10/100 Mbps (Fast Ethernet MAC) |
| Encapsulamento / Caixa | 480-TBGA |
| Package Dimensions | 37.5 mm x 37.5 mm |
| Packaging | Tray |
| Tipo de montagem | Surface Mount |
| Process Technology | HiP3 HiPerMOS (0.25 um) |
Configuração de pinos do XPC8260CZUIHBC
| Pino A1 | [DATA_NEEDED] — Ball coordinates from MPC8260A HiP4 datasheet - refer to datasheet pinout table for signal name. |
Aplicações típicas
XPC8260CZUIHBC é adequado para 6 aplicaçãos: Telecom Router and Multi-Service Switch, DSL Access Multiplexer (DSLAM) Line Card, Wireless Basestation Controller, Industrial Control and Automation, Military and Aerospace Avionics Subsystem, Legacy Embedded Computing Platforms.
Telecom Router and Multi-Service Switch
The XPC8260CZUIHBC's PowerPC G2 core plus RISC CPM architecture wire-speed-handles Fast Ethernet and HDLC channels inside telecom routers. Its 200 MHz CPU executes control-plane routing tables, while the dedicated CPM engines process bit-level protocol framing at line rate, offloading the host CPU and freeing cycles for QoS and management tasks. The 480-TBGA package keeps high-density I/O close to the part, while integrated SDRAM/DRAM controllers hold large route-table and packet-buffer resident datasets for multi-service access platforms.
Recomendado
DSL Access Multiplexer (DSLAM) Line Card
Inside DSLAM line cards, the XPC8260CZUIHBC delivers deterministic ATM and HDLC protocol handling via the RISC CPM while the PowerPC core supervises subscriber sessions, traffic shaping, and OAM. The 200 MHz processing grade is sufficient for many legacy DSLAM deployments, and 480-TBGA ball-out provides the high I/O bandwidth needed between ATM UTOPIA bus and backplane. Designers reuse existing firmware stacks from MPC8260 family lines because the instruction set and CPM API remain compatible across HiP3 and HiPerMOS7 parts.
Recomendado
Wireless Basestation Controller
Wireless basestation controllers and baseband aggregation nodes can leverage the XPC8260CZUIHBC's integrated Ethernet MAC plus HDLC controllers for backhaul and E1/T1 grooming, with the PowerPC G2 core handling layer-3 signalling and network management. The 2.5 V core voltage and CPM hardware offload simplify fan-less, long-lifecycle control boards used in operator-grade telecom environments. Designers pair the device with external PHYs and TDM/E1 framer ICs, taking advantage of the wide ballast I/O available on the 480-TBGA package.
Recomendado
Industrial Control and Automation
Industrial automation platforms benefit from the XPC8260CZUIHBC's deterministic CPM-driven serial protocol handling for field buses such as Profibus, CAN-over-HDLC, and multi-port UART aggregation, while the PowerPC core executes real-time control software. The 32-bit data bus and SDRAM controller support large process-data datasets, and the 480-TBGA surface-mount package withstands industrial assembly processes with proper moisture sensitivity level (MSL) handling per JEDEC J-STD-020. Long-lifecycle telecom-grade screening makes the part suitable for long-term industrial deployments.
Recomendado
Military and Aerospace Avionics Subsystem
Military and aerospace subsystems historically chose the XPC8260CZUIHBC for avionics databus controllers, mission-computers, and signal-processing routers that demand radiation-tolerant plastic BGA footprints with wide temperature screening. Although this 480-TBGA plastic variant is the commercial-grade version, the same die/silicon is offered with extended temperature screening through partner programs. The PowerPC G2 + CPM combination delivers reliable, deterministic protocol handling crucial for MIL-STD-1553 and ARINC 429 controller applications, with the 32-bit core providing ample headroom for management software.
Recomendado
Legacy Embedded Computing Platforms
Brownfield embedded systems running long-life firmware on PowerPC VxWorks or Linux PPC kernels can extend service life by qualifying the XPC8260CZUIHBC as a controlled-lifecycle replacement in 480-TBGA-based SBCs. The 200 MHz core plus CPM offload retain forward compatibility with existing field applications like SCADA gateways, traffic-control controllers, and legacy industrial HMIs. Designers maintain QNX, VxWorks, or PPC Linux BSPs without porting effort because PowerQUICC II CPM register definitions stay consistent across the same-family drop-ins, protecting years of certification investment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XPC8260CZUIHBC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XPC8260CZUHFBC | MPC8270CZUUPEA | MPC8280CZUUPEA | MPC8360EZUPEA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5x37.5) | 480-TBGA - same | 480-TBGA - same family | TBGA - same family | TBGA - same family |
| Core Architecture | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 |
| Process Technology | HiP3 0.25-um HiPerMOS | HiP4 0.25-um family | HiPerMOS7 0.13-um | HiPerMOS7 0.13-um | 0.13-um |
| CPM (Comm Engine) | Yes (RISC CPM) | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete - check distributor stock | Obsolete - check distributor stock | Obsolete - check distributor stock |
| Memory Controller | DRAM, SDRAM | DRAM, SDRAM | DDR/SDRAM | DDR/SDRAM | DDR |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100/1000 Mbps |
Principais diferenciais
- HiP3 0.25-um silicon vs newer HiPerMOS7 0.13-um process (vs MPC8280CZUUPEA)
- 200 MHz core clock on 480-TBGA package (vs MPC8270CZUUPEA)
- PowerPC G2 + RISC CPM dual-engine architecture (vs MPC8360EZUPEA)
Notas de projeto
The 480-TBGA package concentrates core heat on a 37.5 mm x 37.5 mm silicon footprint; estimate: at 2.5 V x ~3 A core + I/O, total power is ~7.5 W. With datasheet theta_JA values typically in the 18-25 C/W range for TBGA, junction temperature rises 100-150 C above ambient under worst-case loading. Provide a continuous top-layer copper pour on the PCB and consider a 1 m/s forced-air airflow for fan-less enclosure designs.
Place 1.0 uF ceramic decoupling capacitors within 100 mil of every Vdd/Vss ball pair to suppress transient switching noise. Use a 6-layer or thicker PCB stack-up with dedicated power and ground planes; route the 32-bit SDRAM bus with matched-length transmission lines within 100 mil tolerance to preserve timing margins at 200 MHz operation.
Observe the 2.4V minimum and 2.7V maximum core supply window during load transients and overshoot; momentary Vdd excursions outside this window can latch-up the CMOS structure. For prototype bring-up, sequence the core Vdd before the I/O supply and use a controlled ramp rate of ~1 ms typical to avoid uncontrolled inrush, per the MPC8260A HiP4 datasheet power-on guidelines.
Informações de conformidade
RoHS, REACH, lead-free and halogen-free compliance not declared in the verified distributor data; commercial-grade 2007-era legacy NXP plastics typically fall outside modern RoHS declarations and require qualification for current restricted-substance programs.
