XPC8260ZUIFBC - PowerQUICC II MPC8260 MPU, 200MHz, 480-TBGA | NXP
N.º da peça: XPC8260ZUIFBC ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $165 | $1.650,00 |
| 100 | $140 | $14.000,00 |
| 500 | $118 | $59.000,00 |
| 1.000 | $99.5 | $99.500,00 |
XPC8260ZUIFBC Visão geral
What is a PowerQUICC II microprocessor? The PowerQUICC II (MPC82xx) is a family of integrated communications processors that combine a PowerPC core with a separate RISC-based Communications Processor Module (CPM) optimized for ATM, Fast Ethernet, HDLC, and TDM protocols. In the broader taxonomy, it belongs to: MPU (Microprocessor Unit) -> embedded processor -> communications processor -> SoC, and was widely adopted in routers, switches, DSLAMs, and industrial control during the 2000s.
Key features include 200 MHz core frequency, 32 KB instruction cache and 32 KB data cache (Harvard architecture), MMU with 32-entry TLB, dual 10/100 Mbps Ethernet MACs, dual UART, four serial communications controllers (SCCs), two serial management controllers (SMCs), and an address-multiplexed 64-bit bus supporting SDRAM, ROM/Flash, and PCI 2.2. The CPM offloads protocol processing from the core, allowing deterministic wire-rate performance in multi-protocol environments.
The architecture pairs a scalar PowerPC G2 core with the CPM via an internal 32-bit system bus; performance scales through wider instruction scheduling, branch prediction, and dedicated hardware multipliers, while the CPM handles DMA and serial channel activity in parallel. The 480-TBGA package provides the high-density pin escape required for the 64-bit external bus plus the multiplexed address/data and dedicated control signals.
Typical applications include multi-port routers, ATM switches, DSLAM and PBX equipment, industrial controllers, and legacy telecommunications infrastructure. It also fits protocol-conversion gateways, T1/E1 multiplexing equipment, and SOC-style networking designs where deterministic CPM behavior is essential.
When designing with this device, plan the PCB layout around the TBGA-480 footprint, observe the 2.5 V/3.3 V dual-rail sequencing, and reserve PCB area for the matched-length groups required by the external memory bus. Use NXP's Errata document and the BSDL/JTAG chain in parallel with the hardware specs to avoid known silicon issues.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations that go beyond the simple hardware-specs datasheet, helping engineers evaluate replacements for an aging communications-processor design.
Alternativas drop-in para XPC8260ZUIFBC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XPC8260ZUIFBC (mesmo formato e footprint) — diferindo em Data Bus Width, Mounting Type, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8260ACVVMHBC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8250ACZUMHBC
✅ Drop-In✓ Em estoque
$85 / unidade
Ver ficha técnica →MPC8270CVVUPEA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8280CVVUPEA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8275CVVUPEA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XPC8260ZUIFBC Classificações máximas e características elétricas
| Core Architecture | PowerPC G2 |
| Processor Family | PowerQUICC II (MPC82xx) |
| Core Count | 1 |
| Largura do barramento de dados | 32-bit (external 64-bit bus) |
| Maximum Core Frequency | 200 MHz |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| Supply Voltage - Core | 2.5 V (operating range 2.4 V - 2.7 V) |
| Supply Voltage - I/O | 3.3 V |
| Process Technology | 0.29 micron HiP4 CMOS |
| Temperatura de operação | -40C to +105C (commercial case grade per part suffix) |
| Encapsulamento | 480-TBGA (LBGA), 37.5 x 37.5 mm |
| Tipo de montagem | Surface Mount |
| Integrated Peripherals | Dual 10/100 Ethernet MAC, 4x SCC, 2x SMC, Dual UART, I2C, SPI, PCI 2.2, SDRAM controller, DMA |
| MMU | Yes, with 32-entry TLB |
| Ethernet | 2x 10/100 Mbps MAC (MII/RMII) |
| Packaging | Tray |
Guia de Configuração de Pinos do XPC8260ZUIFBC 480-tbga (lbga), 37.5 x 37.5 mm
Configuração de pinos para XPC8260ZUIFBC (pacote 480-tbga (lbga), 37.5 x 37.5 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XPC8260ZUIFBC.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XPC8260ZUIFBC é adequado para 6 aplicaçãos: Multi-Port Routers, ATM and TDM Switching Equipment, DSLAM Line Cards, Enterprise PBX and Telephony Gateways, Industrial Controllers, Legacy Protocol-Conversion Gateways.
Multi-Port Routers
The XPC8260ZUIFBC's two 10/100 Mbps Ethernet MACs and CPM offload make it a high-integration router engine for fixed-configuration branch and SOHO platforms. CPM-driven DMA and four SCC channels handle packet routing and forwarding without burdening the 200 MHz PowerPC G2 core. With the device's 64-bit external bus and PCI 2.2 interface, designers can attach WAN cards and switching fabric to one IC rather than several. Note that 200 MHz MIPS throughput caps routing performance at ~250 Mbps aggregate; for higher throughput, use newer PowerQUICC III or QorIQ parts.
Recomendado
ATM and TDM Switching Equipment
With native ATM SAR support and four SCCs in the CPM, the XPC8260ZUIFBC acts as the control-plane + data-forwarding engine in legacy ATM access multiplexers and digital cross-connects. The CPM's time-slot assignment enables E1/T1 interfaces without external framers, and the integrated DMA supports wire-rate cell/packet handling. Designers should plan PCB layout to keep the TBGA-480 ball map at four or more routing layers and provide matched-length traces on the SDRAM data group to meet AC timing at 200 MHz.
Recomendado
DSLAM Line Cards
DSL access multiplexer line-card controllers built around the XPC8260ZUIFBC consolidate ATM/TDM glue logic, an MPC860-class core, and PCI endpoint connectivity into a single 480-TBGA device. The CPM handles cell segmentation-and-reassembly and HDLC framing for ATM/PPP uplinks, freeing the G2 core for higher-layer processing. Each XPC8260ZUIFBC can supervise two to four DSL channels depending on data rate, making it cost-effective for low-density DSLAM chassis. For higher channel counts, consider the dual-core MPC8360 or QorIQ P1010 successors with the same software ecosystem.
Recomendado
Enterprise PBX and Telephony Gateways
In PBX and VoIP gateway designs the XPC8260ZUIFBC provides TDM-to-packet conversion alongside packet routing, with SCCs providing E1/T1 framer interfaces and the dual Ethernet MACs feeding LAN/WAN sides. The 2.5 V core and 3.3 V I/O supplies fit classic telecom power architectures, and the 480-TBGA footprint allows compact mezzanine or AMC card layouts. Design notes: enable the G2 core's branch predictor to meet voice CODEC latency, and use the CPM's PCI host mode to attach H.110 CT-bus bridges on carrier-grade boards.
Recomendado
Industrial Controllers
Factory-automation controllers benefit from the XPC8260ZUIFBC's -40C to +105C case-temperature range, dual Ethernet for redundant ring topologies, and PCI 2.2 host interface for digital I/O and motor-control cards. The CPM's SCCs support RS-485, RS-232, and Profibus-style protocols via standard transceivers, while the dual UART handles HMI panels. Inside the 480-TBGA, the integrated MMU and 32 KB caches run embedded Linux, VxWorks, or MQX without an external MMU, simplifying BOM and software for industrial OEMs.
Recomendado
Legacy Protocol-Conversion Gateways
Field-installed protocol gateways (e.g., serial-to-Ethernet, RS-485 to Modbus/TCP) leverage the XPC8260ZUIFBC's seven serial interfaces and dual Ethernet, with the G2 core running protocol stacks and the CPM arbitrating buffers. The 200 MHz core sustains multiple simultaneous protocol conversions at industrial polling rates (typ. <10 ms turnaround), and the integrated MMU isolates stacks in their own address spaces. Designers migrating legacy gateway products should pair this IC with external 32 MB SDRAM and 8 MB Flash to retain headroom for added encryption layers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XPC8260ZUIFBC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8260ACVVMHBC | MPC8250ACZUMHBC | MPC8270CVVUPEA | MPC8280CVVUPEA | MPC8275CVVUPEA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (same) | 480-TBGA (same) | 480-TBGA (same) | 480-TBGA (same) | 480-TBGA (same) |
| Core Architecture | PowerPC G2 | PowerPC G2 (same die) | PowerPC G2 | PowerPC G2 (HiPerMOS7) | PowerPC G2 (HiPerMOS7) | PowerPC G2 (HiPerMOS7) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 1.5 V-1.8 V | 1.5 V-1.8 V | 1.5 V-1.8 V |
| Instruction Cache | 32 KB | 32 KB | 32 KB | 16 KB | 16 KB | 16 KB |
| Ethernet MACs | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 3x 10/100/1000 Mbps | 3x 10/100/1000 Mbps | 3x 10/100/1000 Mbps |
| PCI Support | PCI 2.2 | PCI 2.2 | PCI 2.2 | PCI 2.2 | PCI 2.2 | PCI 2.2 |
| Process Technology | 0.29 micron HiP4 CMOS | 0.29 micron HiP4 CMOS | 0.29 micron HiP4 CMOS | 0.13 micron HiPerMOS7 | 0.13 micron HiPerMOS7 | 0.13 micron HiPerMOS7 |
Principais diferenciais
- Pin-compatible same-package upgrade to MPC8280CVVUPEA for up to 125% higher CPM throughput (vs MPC8280CVVUPEA)
- Same PowerQUICC II TBGA-480 family, lower-tier MPC8250ACZUMHBC available at lower cost (vs MPC8250ACZUMHBC)
- Mature NXP PowerQUICC II ecosystem with free VxWorks, Linux, and MQX BSPs (vs Custom 32-bit MCU solutions)
Notas de projeto
The XPC8260ZUIFBC requires a 2.5 V core rail and a 3.3 V I/O rail, with the core rail specified to reach 90% of nominal before the I/O ramp begins to prevent I/O-buffer latch-up. Place decoupling within two ball pitches of each VDD/VSS pair; Freescale recommends 0402-size 0.1 uF X7R ceramics with one bulk tantalum or polymer 220 uF capacitor per voltage domain. Estimating power at 200 MHz with one Ethernet MAC active and three SCCs running: roughly 2.0 W core + 0.6 W I/O, so plan for at least a 3 W thermal envelope with the TBGA substrate acting as primary heatsink.
Use a minimum six-layer PCB with dedicated power and ground planes for the 480-TBGA land pattern; Freescale's design guide specifies 0.8 mm pitch escape routing using 0.1 mm trace/space microvia stacks. Match the SDRAM DQS-to-DQ lengths within 50 mil to satisfy 200 MHz bus capture; reference NXP AN2167/'MPC8260 Hardware Design Notes' for via-in-pad and de-routing recommendations.
Common pitfalls with the XPC8260ZUIFBC include neglecting to configure the pin-mux registers before first boot - several pins default to high-impedance, not the function implied by their naming - and forgetting to populate the proper JTAG pull-down resistors on TRST. Also verify that the Hard-Reset Configuration Word source (BVD0/1 pull values) matches the boot ROM map; an incorrect setting here is the leading cause of 'no boot' debugging sessions on the MPC82xx.
Although the industrial-grade case-temperature range is -40C to +105C, the TBGA substrate tops out around 95C in standard 6-layer boards without additional cooling. Estimating from theta-JA ~18 C/W on the documented land pattern: at 2.6 W total dissipation the junction-to-ambient rise is roughly 47C, which leaves an ambient ceiling near 50C for conservative designs. Add a 1 oz copper pour under the thermal balls and consider a small 15 x 15 mm heatsink for sealed enclosures.
Informações de conformidade
RoHS / lead-free / halogen-free status not stated in the provided web data; AEC-Q100 is not applicable because this device is an MPU rather than an automotive-grade IC; conflict-minerals compliance follows NXP's standard reporting.
