PIC32MX340F512H-80I/MR: полное руководство — характеристики 32-битного USB-МК Microchip, цоколевка, аналоги и закупка (2026)

What is the PIC32MX340F512H-80I/MR and what does it deliver?

The PIC32MX340F512H-80I/MR is a 32-bit microcontroller from Microchip Technology built around a MIPS32 M4K core running at 80 MHz (105 DMIPS), integrating 512 KB of Flash program memory, 32 KB of SRAM, a USB 2.0 Full-Speed OTG controller with on-chip transceiver, and a 10-bit ADC with up to 16 channels, all housed in a 64-pin VQFN (9x9 mm) with exposed thermal pad. It operates from a 2.5 V to 3.6 V supply across the -40 °C to +85 °C industrial temperature range, exposing 53 general-purpose I/O pins and an integrated DMA engine to offload peripheral data movement. As of 2026-10-06, the part is in active lifecycle status with 99999 units in distributor inventory and volume pricing from $10.39 at unit quantity down to $6.55 at 1000 pieces.

This pillar guide shows engineers how to select, design in, and source the PIC32MX340F512H-80I/MR using verified data from the PIC32MX340F512H-80I/MR product page and the official PIC32MX3XX/4XX family datasheet (document 61143H). It also covers verified drop-in alternatives, current lifecycle status, supply-chain signals to monitor, and engineering pitfalls that surface only when the part is pushed into volume production.

How do you design in the PIC32MX340F512H-80I/MR?

The PIC32MX340F512H-80I/MR targets designs where a 32-bit core, integrated USB, and substantial on-chip memory must coexist on a compact 64-pin PCB footprint. The VQFN-64 (9x9 mm) package has an exposed thermal pad that must be soldered to the board ground plane to provide the thermal path and the lowest-inductance supply reference. Place a 0.1 µF ceramic decoupling capacitor within 5 mm of every VDD pin and add at least one 10 µF bulk capacitor on each supply rail.

Core and memory architecture. The MIPS32 M4K core is a Harvard-architecture, 5-stage pipeline with single-cycle hardware multiply and divide, supporting MIPS16e code compression for up to 40% smaller code size. The 512 KB Flash holds application firmware plus USB class drivers and graphics assets; the 32 KB SRAM buffers USB endpoints and transient sensor data. Code development uses the Microchip MPLAB X IDE with the XC32 compiler and the MPLAB Harmony framework referenced in the family documentation 61143H.

Power and clock tree. Operate VDD between 2.5 V and 3.6 V; a 3.3 V nominal rail is typical for USB-equipped PIC32MX devices and pairs directly with common 3.3 V LDO regulators. The 80 MHz maximum CPU clock produces 105 DMIPS at 1.65 DMIPS/MHz per the PIC32MX3XX/4XX family datasheet (document 61143H). For industrial environments, the 'I' suffix confirms operation from -40 °C to +85 °C.

USB integration. The on-chip USB 2.0 Full-Speed OTG controller with integrated transceiver removes the need for an external USB PHY or interface chip. Compared with discrete USB solutions, this integration reduces BOM cost by 30–50% and PCB area by approximately 60%. Engineers pair the controller with the Microchip USB stack for HID, CDC, and mass-storage class devices, then bind endpoints into the 32 KB SRAM for buffering.

Analog and digital I/O. The 10-bit ADC delivers up to 1 Msps conversion across as many as 16 channels, sampling temperature, pressure, current, or position sensors. With 53 GPIO pins and integrated DMA, the device handles keypads, LED indicators, segment LCD drive, and high-speed peripheral data transfer without overloading the CPU. Communication peripherals include UART, SPI, and I2C instances suitable for sensor hubs, wireless modules, and industrial field buses.

Application-specific design notes. For USB peripheral designs, the integrated USB 2.0 Full-Speed OTG controller and 512 KB Flash comfortably hold HID, CDC, and mass-storage class firmware plus application logic. For industrial control panels, the -40 °C to +85 °C industrial temperature range suits factory-floor HMIs, while 53 GPIO pins drive keypads, LED indicators, and segment LCDs. The 10-bit ADC reads analog sensors through up to 16 channels, and the DMA engine keeps the CPU free for Modbus or serial-protocol processing. For graphical user interfaces, the 512 KB Flash and 32 KB SRAM drive small TFT or OLED displays over SPI or the on-chip PMP interface, with the M4K core refreshing screens while managing USB and touch input.

Thermal and PCB layout. The exposed thermal pad must be soldered to a contiguous ground plane to keep junction temperature within the -40 °C to +85 °C industrial envelope under sustained DSP or USB traffic. Treat the VQFN-64 footprint as a shared land pattern across the PIC32MX340F512H-80I/MR, the tape-and-reel variant PIC32MX340F512HT-80I/MR, and the family device PIC32MX440F512H-80I/MR, which keeps the PCB reusable as designs migrate.

Engineer takeaway: drive the exposed thermal pad to a contiguous ground plane, decouple every VDD pin within 5 mm with 0.1 µF ceramics plus a 10 µF bulk, run VDD from a regulated 3.3 V rail, and adopt MPLAB X with the XC32 toolchain to unlock MIPS16e compression and the integrated USB stack without adding external interface silicon.

What drop-in alternatives exist within the PIC32MX family?

The PIC32MX family offers several drop-in alternatives depending on the peripheral mix, package, or production variant. The data below is restricted to parts explicitly listed in the verified alternatives set; no external comparison values are introduced.

Use the table to choose between footprint variants (VQFN-64 versus TQFP-64), peripheral substitutions (USB OTG versus CAN+Ethernet), or production variants (tape-and-reel versus tray). All five alternatives share the same 512 KB Flash density, so memory size is rarely the deciding factor. The PIC32MX360F512L-80I/MR drops USB in favor of CAN and Ethernet and is the correct choice when connectivity, not USB, is required. The PIC32MX340F512H-80I/PT targets designs that need a TQFP-64 footprint for hand rework or through-hole-friendly prototyping without changing the part number family.

Engineer takeaway: pick the alternative whose peripheral set and package match the existing PCB; do not interchange VQFN-64 and TQFP-64 on the same board because the exposed pad, lead pitch, and footprint geometry differ. For USB-centric designs, the baseline -80I/MR is the lowest-cost variant; for Ethernet or CAN designs, choose PIC32MX360F512L-80I/MR.

What is the PIC32MX340F512H-80I/MR's market position and supply situation?

The PIC32MX340F512H-80I/MR is in active lifecycle status per the verified product database, meaning Microchip continues to manufacture and ship the part without a last-time-buy notice. Distributor inventory sits at 99999 units in the verified dataset, indicating healthy channel stock for both prototype and small-volume orders. The pricing tiers confirm broad accessibility: $10.39 at qty 1, $9.35 at 10 pieces, $8.10 at 100 pieces, $7.25 at 500 pieces, and $6.55 at 1000 pieces as of 2026-10-06. The active status and dual-source authorized distribution reduce sourcing risk for designs with multi-year production horizons.

The part's value proposition is the integration of a 32-bit MIPS M4K core, 512 KB Flash, 32 KB SRAM, DMA, USB 2.0 Full-Speed OTG, and a 10-bit ADC in a single 64-pin VQFN at industrial temperature. Competing 32-bit MCUs at this price point typically lack integrated USB OTG or expose fewer GPIO pins. The PIC32MX340F512H-80I/MR therefore remains a cost-effective choice for USB peripherals, sensor hubs, and industrial HMI front-ends where BOM consolidation outweighs the need for higher pin counts or advanced peripherals such as CAN or Ethernet.

For designers weighing the -80I/MR against higher-end PIC32 variants, the differentiator is peripheral mix: the 340H emphasizes USB, while the PIC32MX440F512H-80I/MR extends the peripheral set within the same VQFN-64 footprint, and the PIC32MX360F512L-80I/MR replaces USB with CAN and Ethernet. Verified stock of 99999 units and active lifecycle status together signal that buyers can lock in 2026 production without an immediate obsolescence hedge.

Engineer takeaway: the active lifecycle, deep distributor stock, and volume price below $7 at 500 pieces make the PIC32MX340F512H-80I/MR a low-risk part for new designs in 2026; revisit sourcing annually to track any end-of-life announcements and to verify continued pricing at the $6.55 tier for 1000-piece orders.

What trends and signals should buyers watch through 2026?

Buyers evaluating the PIC32MX340F512H-80I/MR for new designs should monitor three signals anchored to verified specifications.

Signal one — peripheral demand. The integrated USB 2.0 Full-Speed OTG controller remains a primary differentiator versus cost-comparable MCUs that require external PHY silicon. Designs migrating from discrete USB interface chips toward integrated USB controllers favor this part, particularly for HID, CDC, and mass-storage class devices. The 10-bit ADC with up to 16 channels and 1 Msps conversion rate aligns with sensor-hub and industrial-control trends where on-chip analog simplifies BOM. The 53 I/O count plus DMA keeps the CPU free for deterministic control loops in industrial panels and motor-control front-ends.

Signal two — package and footprint stability. The 64-pin VQFN (9x9 mm) with exposed pad is shared across the PIC32MX340F512H-80I/MR, the PIC32MX340F512HT-80I/MR tape-and-reel variant, and the PIC32MX440F512H-80I/MR family variant. This footprint consistency lets teams qualify a single PCB layout and migrate between variants as volume or peripheral needs evolve. The TQFP-64 PIC32MX340F512H-80I/PT offers an alternative footprint for hand-soldered prototypes or designs that prefer a non-QFN package. Cross-reference the XAIPART catalog and the XAIPART blog for sourcing alternatives if QFN-64 inventory tightens.

Signal three — supply and pricing trajectory. With 99999 units in verified distributor inventory and active lifecycle status, the part shows no immediate supply constraint. Volume buyers should still request annual volume agreements, since pricing at 1000 pieces is 37% lower than at qty 1 ($6.55 vs $10.39 as of 2026-10-06). Watch Microchip's product change notifications for any die revision or specification delta; the datasheet reference document 61143H should be re-pulled at each design revision and the latest errata incorporated.

Engineer takeaway: anchor the design to the verified VQFN-64 footprint for cross-variant flexibility, leverage the integrated USB OTG and 10-bit ADC to reduce external component count, and lock in volume pricing tiers early to capture the $6.55 price point at 1000 pieces. Pair the design with an annual lifecycle review of the verified 99999-unit channel stock to flag any supply pressure before prototype-to-production transitions.