FPGA и CPLD
Товары (6666)
EP2S90F1020I4GA - 90K LEs Stratix II FPGA, 758 I/O FBGA-1020 | Intel
The Intel (formerly Altera) EP2S90F1020I4GA is a high-density Stratix II family FPGA built on a 90 nm CMOS process, integrating 90,960 logic elements (LEs), 192 18x18 multipliers, and approximately 4,520,488 bits of embedded SRAM into a 1020-ball flip-chip BGA package. The I4 speed grade, combined with the industrial -40C to +100C operating range suffix, makes this member of the Stratix II family suitable for compute- and memory-intensive embedded systems where deterministic logic fabric and DSP throughput are required. A Field Programmable Gate Array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. Designers describe logic using HDL (Verilog or VHDL) and synthesize it onto the FPGA fabric, allowing rapid iteration versus ASIC development. FPGAs sit hierarchically between general-purpose microcontrollers and ASICs, offering higher performance-per-watt than CPUs for parallel workloads while preserving reprogrammability. The Stratix II family extends this to ASIC-prototyping and signal-processing designs with embedded multipliers and substantial block RAM. Key features of the EP2S90 include up to 758 user I/O pins via the FBGA-1020 package, four enhanced phase-locked loops (PLLs) for clock management, support for external memory interfaces including DDR/DDR2/QDRII, and configuration via passive serial, fast passive parallel, or JTAG modes. The 'GA' suffix on the part number indicates the specific package and lead-free/RoHS designation as used by Altera/Intel ordering codes. The I4 speed grade places this part in the mid-performance Stratix II tier. Architecturally, the Stratix II device uses an ALM-based logic structure with adaptive look-up tables, dedicated carry chains, and on-chip memory distributed across M512, M4K, and M-RAM blocks. The embedded DSP blocks implement 18x18 multipliers with optional accumulation and pre-adders, ideal for FIR filters and FFTs in wireless baseband and video processing pipelines. Typical applications include ASIC prototyping, high-speed digital signal processing, telecom line cards, test and measurement equipment, and high-performance industrial control. When designing with this part, plan power sequencing carefully: the Stratix II requires multiple supply rails (VCCINT, VCCA, VCCIO, VCCPD) with monotonic ramp requirements and a specific POR (power-on-reset) sequence to avoid configuration failure.
EP2S90F1020I4N - Stratix II FPGA 90K LE 1020-BGA | Intel
The Intel EP2S90F1020I4N is a high-density Stratix II Field Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,520,488 bits of embedded memory, and 758 user I/Os, packaged in a 1020-ball FineLine BGA. Built on a 90 nm process, this device operates with a 1.2 V core supply and supports industrial temperature grade -40C to +100C per the suffix I4 designation. FPGAs (Field Programmable Gate Arrays) are reconfigurable semiconductor devices that sit between fixed-function ASICs and software-programmable processors in the design flexibility hierarchy. The Stratix II family specifically targets high-performance digital signal processing (DSP), communications infrastructure, and ASIC prototyping applications where massive parallel processing and high memory bandwidth are required. Within the Stratix II product family, the EP2S90 occupies the high-density tier below the EP2S130 and EP2S180. Key features include 4548 Logic Array Blocks (LABs), embedded DSP blocks for hardware-accelerated arithmetic, support for multiple I/O standards including LVDS, HSTL, SSTL, and PCI Express, and dedicated high-speed transceivers. The 1020-ball BGA package exposes 758 user I/Os - among the highest in the Stratix II family - making the EP2S90 well-suited for memory-rich, interface-heavy designs. The Stratix II architecture introduced ALM (Adaptive Logic Module) logic elements that combine the benefits of LUT-based and product-term-based logic. This gives the EP2S90 superior logic utilization compared to the original Stratix family, often achieving 25-40% higher logic density per device. The embedded TriMatrix memory structure provides true dual-port RAM blocks with multiple aspect ratios, enabling efficient FIFO and buffer implementations without consuming logic resources. Typical applications include telecommunications base station processing, high-speed data acquisition systems, military radar signal processing, ASIC prototyping, and high-end video broadcast equipment. The 758 user I/Os make it ideal for systems requiring large numbers of parallel interfaces such as DDR2 memory controllers with multiple banks. When designing with this device, plan thermal management carefully. BGA packages with 1020 balls require 4-layer or higher PCB stackups with continuous via arrays under the package for thermal dissipation. Designers should also budget for configuration memory (EPCS family) and JTAG programming infrastructure as the EP2S90 cannot self-configure from internal flash.
EP2S90F1020I5N - Stratix II FPGA 90,960 LE | Intel / Altera
The Intel / Altera EP2S90F1020I5N is a high-density Stratix II Field Programmable Gate Array (FPGA) delivering 90,960 logic elements in a 1020-ball FineLine BGA package with industrial temperature grade. The device is fabricated on a 90 nm process and operates from a 1.2 V core supply with serializer/deserializer (SERDES) capable of up to 1 Gbps per channel. According to the Stratix II device handbook, this device family targets high-performance DSP, communications, and signal-processing designs where logic density and embedded multiplier count dominate the design budget. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory blocks, and programmable I/O cells, all wired together via a programmable interconnect fabric. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), a sibling category to CPLDs (Complex Programmable Logic Devices); PLDs in turn are a subfamily of digital integrated circuits under the broader semiconductor umbrella. The Stratix II family introduced the adaptive logic module (ALM) architecture that doubled effective logic capacity per LUT versus the original Stratix generation. Key features of the EP2S90F1020I5N include approximately 4.5 Mbits of embedded RAM, up to 12 transceiver channels supporting data rates up to 1 Gbps, dedicated DSP blocks for high-speed multiplication and accumulation, and 1020-ball FineLine BGA packaging optimized for high-pin-count PCB routing. The industrial temperature grade (-40C to +100C ambient at the case) supports deployment in harsh-environment industrial systems. Up to 8 PLLs provide flexible clock management and synthesis for multi-rate system designs. Architecturally, the Stratix II ALM combines an 8-input adaptive look-up table with two dedicated adders, allowing a single ALM to implement a full 3-input adder plus a 4-input LUT without performance penalty. The TriMatrix memory subsystem provides three on-chip memory block sizes (M512, M4K, M-RAM) optimized for different buffer and register-file needs, and dedicated hardware multipliers support 18x18 signed multiplication in a single DSP block cycle. Typical applications include high-throughput digital signal processing for wireless baseband and radar, ASIC prototyping and emulation, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), software-defined radio (SDR) front-ends, and high-performance image processing pipelines. The combination of high logic density, embedded transceivers, and DSP blocks makes it well-suited to designs that previously required discrete processors plus glue logic. When designing with this device, careful attention must be paid to power-integrity analysis because the EP2S90F1020I5N can draw several watts of core current at full utilization; a multi-rail decoupling network with low-impedance bulk capacitors is required, and thermal management must be planned using the published theta-JA and theta-JC values. Designers should also use the Quartus II design software (the design entry toolchain supported by the Stratix II family) to validate pin assignments and timing closure before PCB layout. This page synthesizes distributor pricing from Octopart, drop-in compatible Stratix II speed-grade and package alternatives, and practical design notes that extend beyond the manufacturer datasheet to accelerate board bring-up and supply-chain decision making.
EP2S90F1508C3 - Stratix II 90K LE FPGA, 902 I/O FCBGA-1508 | Intel
The Intel (formerly Altera) EP2S90F1508C3 is a high-density member of the Stratix II FPGA family, delivering 90,960 logic elements, 4,520,488 bits of embedded memory, and 902 user I/O pins in a 1508-ball flip-chip BGA (FCBGA) package. Manufactured on a 90 nm CMOS process, this device integrates up to 12 embedded DSP blocks alongside the ALM-based logic fabric, enabling high-throughput signal processing in a single chip. What is a Stratix II FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable logic device that combines programmable logic blocks, programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, multipliers, and high-speed transceivers. The Stratix II family introduced the ALM (Adaptive Logic Module), a successor to the classic 4-input LUT architecture, capable of implementing any function of up to 7 inputs and offering finer-grained logic packing. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. Within the Stratix II family, the EP2S90 is the high-density tier beneath the EP2S130 and EP2S180. Key differentiating features of the EP2S90F1508C3 include 90960 logic elements, 4548488 RAM bits, 384 (approximate) 18x18 multipliers via DSP blocks, twelve PLLs for clock management, and 1.2 V core operation. The device supports configuration via JTAG and serial/parallel configuration schemes, and includes dedicated hardware for dynamic reconfiguration, signal integrity, and partial reconfiguration. The "C3" speed grade denotes a commercial temperature grade with the slowest speed bin in the family, while "F1508" identifies the 1508-ball FCBGA package. From an architecture standpoint, the Stratix II device employs a heterogeneous routing fabric with row/column interconnect and tri-matrix memory blocks (M512, M4K, M-RAM), giving designers a flexible mix of small and large memory resources. The DSP blocks support 9-bit, 18-bit, and 36-bit word widths and can be cascaded for high-precision filters and FFTs. Typical applications include telecom baseband processing, high-speed image and video pipelines, ASIC prototyping, test and measurement instrumentation, and high-performance DSP coprocessors. Designers choose the EP2S90F1508C3 when the design requires more logic, memory, and DSP than mid-density FPGAs can provide. When designing with this device, plan PCB layout carefully - the 1508-ball FCBGA at 1.0 mm pitch demands microvia or HDI PCB technology, controlled-impedance routing for high-speed signals, and a multi-layer stackup with solid ground/power planes. Power decoupling must follow the Stratix II pin connection guidelines for VCCINT, VCCIO, VCCA, and VTT rails. This page synthesizes distributor inventory, same-brand drop-in alternatives drawn from the Stratix II family, and practical design notes that complement the manufacturer datasheet.
EP2S90F1508C3N - Stratix II FPGA, 90K LE, 902 I/O, 1508-FBGA | Intel
The Altera (now Intel) EP2S90F1508C3N is a high-density Stratix II Field Programmable Gate Array (FPGA) from the 90 nm process family, integrating 90,960 logic elements, 4,520,488 memory bits, and 902 user I/Os into a 1508-ball FineLine BGA (FCBGA) package. It is rated for commercial temperature operation (speed grade -3) and is targeted at high-performance digital logic, DSP, and memory-intensive designs. The Stratix II architecture introduced adaptive logic modules (ALMs) and on-chip TriMatrix memory that together deliver roughly twice the performance and half the power of the prior Stratix generation. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hardware such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy a position between general-purpose microcontrollers and ASICs in the hardware design hierarchy: microcontroller -> microprocessor -> SoC -> FPGA -> ASIC. They are valued for parallel processing, deterministic latency, and rapid design iteration without the NRE cost of an ASIC. Key features of the EP2S90F1508C3N include 4,548 LABs/ALMs organized across the fabric, embedded multipliers for DSP, multiple PLLs and global clock networks, and 902 I/O pins supporting a broad range of single-ended and differential I/O standards (LVTTL, LVCMOS, LVDS, HSTL, SSTL, etc.). The FCBGA package exposes a high pin count that enables wide external memory buses and dense transceiver fan-out. The -3 speed grade indicates a commercial-grade timing bin, and the part is part of a long-running design ecosystem supported by the Altera/Intel Quartus II toolchain. Typical applications include high-speed digital signal processing for radar and beamforming, telecom baseband and protocol processing, high-throughput video processing pipelines, ASIC prototyping and emulation, and industrial control systems requiring parallel I/O. Engineers choose the EP2S90F1508C3N when they need the largest fabric density in the 1508-FBGA package at a specific speed and temperature grade. Designers must pay attention to the FCBGA ball pattern, which demands multi-layer PCB with controlled-impedance routing, microvia stack-ups, and careful power-delivery network design for the core and I/O rails. Stratix II FPGAs require multiple supply rails (VCCINT, VCCIO banks, VCCAUX, VCCPD) that must be sequenced correctly. Thermal management with a heatsink or airflow is typically required at full utilization and high toggle rates. This page synthesizes real distributor pricing, drop-in alternatives from the same Stratix II family, and practical design considerations that are not consolidated on any single distributor page.
EP2S90F1508C4 - 90K LE Stratix II FPGA, 1508-FCBGA | Altera
The Altera (now Intel) EP2S90F1508C4 is a high-density Stratix II family Field Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 90,960 logic elements across 4,548 Logic Array Blocks (LABs) and delivering 902 user I/Os in a 1508-ball flip-chip BGA (FC-FBGA) package. Operating at a core voltage of 1.2 V with a maximum internal clock frequency of 711.24 MHz, the device is positioned as a logic-rich DSP-capable platform for ASIC prototyping, high-speed datapath bridging, and communications infrastructure. The FC-FBGA-1508 substrate provides the dense signal escape and thermal envelope required by the Stratix II die, while supporting up to 4,520,488 bits of embedded memory. A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer after manufacturing, containing an array of programmable logic blocks, programmable interconnect, and I/O pads. Stratix II FPGAs sit within the broader taxonomy of programmable logic devices (PLD), specifically as high-performance SRAM-based FPGAs (synthesizable ASIC replacement > ASIC-prototyping > high-end programmable logic > semiconductor). They are widely used for parallel DSP, packet processing, and protocol bridging, where deterministic latency and high logic density outperform fixed-function ASICs. Key features of the EP2S90F1508C4 include up to 727 DSP blocks, dedicated high-speed transceivers for external memory interfaces, and hardened IP for DDR/DDR2 SDRAM and QDRII SRAM controllers. The architecture supports a multi-level routing fabric with row/column interconnect, and each LAB contains 10 Adaptive Logic Modules (ALMs) for efficient arithmetic and register packing. The 1508-ball FC-FBGA package exposes 902 user I/Os, making it suitable for systems requiring many parallel interfaces or wide external memory buses. Typical applications include high-end ASIC prototyping, digital video broadcast encoders, telecom line-card packet processing, military radar signal processing, and test & measurement instrumentation. When designing with this device, ensure power-rail sequencing meets the Stratix II power-on-reset requirements and that the FC-BGA land pattern and via-in-pad stack-up match the Altera reference design. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2S90F1508C4N - 90K LE Stratix II FPGA, 902 I/O, 1508-BGA | Intel
The Intel (formerly Altera) EP2S90F1508C4N is a high-density Stratix II Field Programmable Gate Array (FPGA) built on a 90 nm CMOS process, delivering 90,960 logic elements (LEs), 4,520,488 bits of embedded memory, and 4548 Logic Array Blocks (LABs) in a 1508-ball Flip-Chip BGA (FC-FBGA) package. It operates from a 1.2 V core supply with a maximum internal frequency of 711.24 MHz, and provides 902 user I/O pins for high-bandwidth parallel interfaces. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that can be configured post-manufacture to implement arbitrary digital circuits. Stratix II belongs to the high-performance FPGA family tier, sitting above Cyclone (cost-optimized) and below Stratix GX/GT (transceiver-equipped) variants. FPGAs occupy the same broad product category as ASICs, CPLDs, and microcontrollers, but offer unique advantages in parallelism, reconfigurability, and time-to-market for DSP, communications, and prototyping workloads. Key features of the EP2S90F1508C4N include 12 dedicated PLLs (Phase-Locked Loops) for clock synthesis, up to 4 Mb of TriMatrix embedded memory distributed across MRAM, M512, and M4K blocks, dedicated DSP blocks for high-throughput arithmetic, and support for external memory interfaces including DDR, DDR2, SDRAM, QDRII, and RLDRAM II. The device family integrates high-speed serial I/O capability through dedicated DPA circuitry, and supports LVDS, LVPECL, and HSTL I/O standards with user-selectable drive strength from 2 mA to 24 mA. The architecture combines Adaptive Logic Modules (ALMs) - each containing two 4-input LUTs, two programmable registers, and dedicated adder circuitry - with MultiTrack interconnect that delivers predictable timing closure at 90 nm node performance targets. Embedded memory blocks support true dual-port operation and mixed-width data paths, while DSP blocks deliver up to 36 x 36 bit multiplies per block at full pipeline speed. Typical applications include high-speed digital signal processing (radar, beamforming, software-defined radio), ASIC prototyping, telecommunications infrastructure (SONET/SDH, OTN framers), high-performance computing accelerators, video processing pipelines, and military/aerospace embedded systems. Designers select this part when logic density above 70K LEs is required together with abundant embedded memory and DSP resources in a single device. When designing with this device, pay close attention to power supply decoupling (a Stratix II FPGA typically requires multiple 1.2 V, 2.5 V, and 3.3 V rails with strict sequencing requirements), thermal management (the 1508-ball FCBGA exposes a thermal pad that must be soldered to a properly sized PCB copper pour), and signal integrity on 902 simultaneously-switching outputs (SSO analysis is mandatory). Quartus II is the supported design toolchain. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix II family, and practical design notes not found in the manufacturer datasheet - giving engineers a faster sourcing and evaluation workflow.
EP2S90F1508C5 - 90k LE Stratix II FPGA 1508-FCBGA | Intel
The Intel EP2S90F1508C5 is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 90,960 logic elements, 4,520,488 bits of embedded memory, and 902 user I/O pins in a 1508-ball FineLine BGA (FCBGA) package. Built on a 1.2 V, 90 nm CMOS process, it integrates 36,384 adaptive logic modules (ALMs/CLBs) and 12 dedicated DSP blocks that together reach up to 568 GMACs of DSP throughput. An FPGA (Field Programmable Gate Array) is a semiconductor IC whose logic fabric, routing, and I/O can be reconfigured after manufacture via a hardware description language bitstream. Stratix II belongs to the high-performance FPGA family that sits hierarchically above CPLDs, DSPs, and general-purpose microcontrollers for parallel processing tasks, and it forms part of the broader programmable logic device (PLD) class within Intel's programmable solutions group. The 1508-pin FCBGA at 40 x 40 mm with 1 mm ball pitch targets high-I/O density board designs. Key features include 12 transceiver channels, embedded TriMatrix memory blocks supporting up to 4.5 Mbit, dedicated DDR/DDR2 SDRAM and QDR II SRAM interfaces with PHY, 8 input phase-locked loops (PLLs), and a 36 x 36-bit embedded multiplier structure. The flexible signal standards support LVDS, LVPECL, SSTL, HSTL, and PCI/PCI-X via configurable I/O banks. Hot-socketing and partial reconfiguration are supported in-system. Architecturally, the Stratix II fabric replaces the classic 4-input LUT of Stratix I with an adaptive logic module that combines two 4-LUTs and dedicated register chains, giving the device an effective logic density advantage. Row- and column-based interconnect, combined with direct-drive interconnect for high-fanout signals, delivers consistent timing closure at 500 MHz+ internal operation and 640 MHz memory interface rates typical of this -5 speed grade. Typical applications include high-performance digital signal processing, ASIC prototyping, telecom line cards, video broadcasting infrastructure, and high-speed serial protocol bridging. The combination of embedded transceivers and abundant logic makes it equally suited for radar baseband, medical imaging pipelines, and test & measurement platforms. When designing with this device, plan for a 1.2 V core and separate PLL/VCCIO analog supplies; the 1508-ball package requires careful BGA fanout, microvia stack-ups, and thermal vias to the 1.0 mm pitch pads. Bitstream encryption and JTAG-based configuration via the EPC device family or external flash should be reserved for production boots. This page consolidates authorized distributor pricing, drop-in equivalents in the same 1508-FCBGA footprint, and practical PCB layout notes - engineering context not found in the manufacturer datasheet alone.
EP2S90F1508C5N - Stratix II FPGA, 90K LE, 1508-FCBGA | Intel
The Intel EP2S90F1508C5N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) delivering 90,960 logic elements, 4,548 LABs, and 902 user I/Os in a 1508-ball Flip-Chip BGA (FCBGA) package. Built on a 90 nm process with 1.2 V core supply and a 609.76 MHz maximum operating frequency, it targets high-throughput DSP, communication, and ASIC-prototyping workloads where large logic capacity and abundant I/O bandwidth are required simultaneously. The device integrates 4,520,488 bits of embedded memory for low-latency on-chip buffering and supports dedicated high-speed serial transceivers and external memory interfaces characteristic of the Stratix II family. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs in density and capability, and serve as semi-custom silicon alternatives to ASICs. The Stratix II family was Altera's (now Intel FPGA) high-performance flagship at 90 nm, optimized for parallel processing and high-speed serial I/O for telecom, defense, and ASIC-replacement designs. Key features include 4,548 Logic Array Blocks (LABs), 12 transceiver channels per bank (configurable up to differential LVDS), adaptive logic module (ALM) architecture for finer-grained logic packing, and DSP blocks delivering up to 384 GMACS throughput for fixed- and floating-point signal processing. The device supports DDR/DDR2/QDR memory interfaces via dedicated PHY blocks and offers remote-update configuration from external flash. It is implemented in a 1.0 mm pitch 1508-ball FCBGA package rated for the commercial 0 °C to +85 °C junction range. The EP2S90F1508C5N variant carries the 'C' commercial temperature grade and speed grade '5' (the slowest Stratix II speed bin). Engineers should prefer speed grade '3' or '4' for designs that miss timing at grade '5'. The architecture pairs ALMs with TriMatrix memory blocks (MRAM, M4K, M512) and embedded DSP blocks, with PLLs and dedicated clock networks providing skew-managed global clocks. Typical applications include high-speed DSP pipelines (radar, software-defined radio, baseband processing), ASIC prototyping, telecom line-card aggregation, high-end image and video processing, and 10 Gbps data-path bridging. The combination of 4,548 LABs and 902 I/Os makes it suitable for designs that aggregate many parallel channels. When designing with the EP2S90F1508C5N, ensure the PCB accommodates the 1.0 mm-pitch 1508-ball FCBGA land pattern with microvia stack-up and matched-length clock traces. Use Altera/Intel Quartus II design software (legacy versions supported for Stratix II) for synthesis, place-and-route, and SignalTap II logic analysis. Multiple voltage rails (VCCINT, VCCIO, VCCAUX, VCC_PLL) require careful power-rail sequencing. This page synthesizes distributor pricing, verified Stratix II family drop-in alternatives, and practical Quartus II design notes not consolidated in the original datasheet.
EP2S90F1508I4 - Stratix II FPGA, 90K LE, 1508-FBGA | Intel/Altera
The Intel/Altera EP2S90F1508I4 is a Stratix II family Field Programmable Gate Array (FPGA) IC delivering 90,960 logic elements, 4,520,488 bits of embedded memory, and 902 user I/O pins in a 1508-ball FineLine BGA (FCBGA) package, industrial temperature grade (-40C to +100C). It is the largest logic-density member of the EP2S90 family in the F1508 package option. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Stratix II is positioned in Intel's (formerly Altera's) high-performance, transceiver-rich tier for ASIC prototyping, DSP pipelines, and parallel processing. Key differentiating features include 12 dedicated DSP blocks capable of 300 MHz operation, embedded TriMatrix memory up to 4.5 Mbits with true dual-port and FIFO modes, up to 36 embedded multipliers (18x18), and support for multiple I/O standards including LVDS, LVPECL, SSTL, and HSTL. The device also includes dedicated circuitry for source-synchronous interfaces such as DDR2 SDRAM controllers and SPI-4.2 phases. Technically, the EP2S90F1508I4 is fabricated in a 90 nm process, uses a 1.2V core with multi-voltage I/O support, and integrates 8 PLLs and 16 global clock networks. The 1508-ball FineLine BGA package provides high signal integrity and thermal performance for high-density designs; an exposed die on the bottom enables direct heatsink attachment for sustained high-utilization workloads. Typical applications include ASIC prototyping, high-speed DSP (radar, software-defined radio, video processing), communications infrastructure (baseband, line cards), high-performance computing accelerators, and test & measurement equipment. It is also commonly used in storage area network controllers and military/aerospace signal processing. When designing with the EP2S90F1508I4, allocate a minimum of six PCB layers with continuous ground and power planes to control SSO noise and maintain signal integrity across the 902 user I/Os. Use Altera Quartus II design software (later updated to Intel Quartus Prime) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, same-package drop-in alternatives (EP2S90F1508C5/C5N/C4/C4N/C3/C3N and larger EP2S180F1508 variants), and practical design notes not found in the manufacturer datasheet.
EP2S90F1508I4N - 90nm Stratix II FPGA, 90960 LE, 1508-FBGA | Intel
The Intel (Altera) EP2S90F1508I4N is a high-density Stratix II Field Programmable Gate Array (FPGA) fabricated on a 90 nm CMOS process, integrating 90,960 logic elements (LEs), 4,520,488 bits of embedded memory (approximately 4.4 Mbits), and 902 maximum user I/O pins into a 1508-ball fine-pitch BGA (FC-FBGA) package. The device operates across an industrial temperature range (-40C to +100C junction) and supports configuration via passive serial, fast passive parallel, JTAG, and Altera's proprietary Passive Parallel Asynchronous scheme. A Field-Programmable Gate Array (FPGA) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. Modern high-density FPGAs like the Stratix II sit in the system hierarchy as reconfigurable computing fabric between general-purpose microcontrollers and fixed-function ASICs, delivering ASIC-like performance with the time-to-market advantage of full hardware reprogrammability. The Stratix II family specifically introduced the ALM (Adaptive Logic Module) architecture, replacing traditional 4-input LUTs with 8-input fracturable LUTs to improve logic packing efficiency. Key features of the EP2S90F1508I4N include up to 12 embedded DSP blocks optimized for high-speed multiply-accumulate operations, support for external memory interfaces including DDR, DDR2, QDR, and QDRII SRAM, dedicated clock management with up to 12 PLLs, and Stratix II's signature high-speed transceiver capability via the device's high-performance I/O structure. The device consumes core voltage of 1.2 V with auxiliary supply rails for I/O banks, enabling flexible mixed-voltage system design. Architecturally, the Stratix II family adopts a row-based layout with LABs (Logic Array Blocks) of 10 ALMs each, separated by dedicated memory and DSP columns. This column-based architecture provides predictable timing for memory and DSP operations, while the global/local routing hierarchy supports both high-fanout and high-speed datapath nets. The 90 nm process node delivered a 50% performance uplift over the previous Stratix generation at comparable logic density. Typical applications include high-performance digital signal processing, telecom baseband and line-card processing, high-speed serial protocol bridging, ASIC prototyping and emulation, video processing and broadcast equipment, military and aerospace signal processing, and high-end test and measurement instrumentation. The 1508-BGA package supports board designs requiring maximum logic density with extensive external I/O for parallel bus architectures. When designing with the EP2S90F1508I4N, pay particular attention to power architecture - the high logic count combined with 902 user I/Os requires robust multi-rail decoupling and thermal management. The exposed-die FC-FBGA package has a low junction-to-ambient thermal resistance on standard PCB stack-ups but demands proper airflow or heatsinking for sustained high utilization. This page synthesizes drop-in alternatives, real-time distributor pricing, and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten the sourcing and validation cycle for legacy and current Stratix II designs.
EP2S90F780C4 - Stratix II FPGA, 90K LEs, 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP2S90F780C4 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements (LEs), 4,548 Logic Array Blocks (LABs), and 4,520,488 bits of embedded RAM in a 780-ball Fine-pitch Ball Grid Array (FBGA) package. It operates from a 1.15 V to 1.25 V core supply with up to 534 user I/Os, fabricated on a 90 nm process node. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits after PCB fabrication. FPGAs sit within the programmable logic hierarchy above CPLDs (Complex Programmable Logic Devices) and below ASICs in terms of integration density, belonging to the broader category of integrated circuits (ICs) and, more specifically, embedded ICs. Stratix II devices added adaptive logic modules (ALMs) to improve performance per logic element versus the original Stratix family. Key features include dedicated DSP blocks for high-speed signal processing, embedded TriMatrix memory blocks, support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM, high-speed transceivers at up to 1 Gbps on applicable variants, and rich clock management via PLLs. The 780-FBGA package supports high I/O count with controlled-impedance signal routing. Stratix II uses an ALM-based architecture that combines 8-input fracturable look-up tables (LUTs), dedicated carry chains, and distributed register files. The 90 nm process and adaptive routing fabric deliver high logic density with predictable timing closure, making the family well suited for data-path intensive designs such as protocol bridging, video processing, and high-speed serial interfaces. Typical applications include telecommunications baseband and bridging equipment, high-performance DSP coprocessors, video and image processing pipelines, test and measurement instrumentation, and ASIC prototyping. The high logic capacity also fits network packet processing and storage controllers. When designing with this device, pay close attention to power sequencing because Stratix II requires multiple supply rails (VCCINT, VCCIO, VCCA, VCCD_PLL). The 780-FBGA package demands careful PCB layout with buried vias or microvia technology on high-density boards to fan out the BGA escape routing. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet to accelerate board bring-up and sourcing decisions.
EP2S90F780C4N - Stratix II FPGA 90K LE 780-FBGA | Intel
The Intel (formerly Altera) EP2S90F780C4N is a Stratix II family Field Programmable Gate Array delivering 90,960 logic elements (LEs) in a 780-pin FC-FBGA package (29x29 mm, 1 mm pitch). It integrates 4,520,488 bits of embedded RAM, 4,548 LABs/CLBs, 534 user I/Os, and DSP blocks for high-performance digital signal processing. The device is fabricated on a 90 nm CMOS process and operates from a 1.15 V to 1.25 V core supply, with maximum internal clock frequency of 717 MHz per the Stratix II device datasheet family. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources (block RAM, multipliers/DSPs, transceivers, PLLs) on a single die. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit within logic ICs and the wider integrated circuit hierarchy. FPGAs are used to implement arbitrary digital logic, glue logic, signal-processing pipelines, and complete processor subsystems that benefit from hardware parallelism and post-manufacture reprogrammability. Key features of the EP2S90F780C4N include high-density logic capacity (90,960 LEs), large on-chip memory (4,520,488 RAM bits), abundant I/O (534 pins), and Stratix II architectural advantages such as adaptive logic modules (ALMs), TriMatrix memory blocks, and DSP blocks for high-throughput arithmetic. The 1.2 V core voltage supports low static and dynamic power consumption compared with earlier 130 nm Stratix devices, while the 780-ball FC-FBGA package exposes high-speed dedicated clock and I/O resources for demanding designs. Typical applications include telecom baseband processing, high-speed image and video processing pipelines, ASIC prototyping, network switching fabric interfaces, and DSP-intensive test and measurement equipment. The device's 534 I/O make it well suited to memory-rich and bus-heavy designs. When designing with the EP2S90F780C4N, observe Stratix II power-on sequencing and decoupling guidelines from the Stratix II Device Handbook, and use the Quartus II design toolchain (Stratix II device support) for synthesis, place-and-route, and timing closure. The 780-FBGA package requires careful PCB stack-up and BGA fan-out routing. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2S90F780C5 - Stratix II FPGA, 90,960 LEs, 780-FBGA | Altera
The Altera EP2S90F780C5 is a high-density Stratix II Field Programmable Gate Array (FPGA) fabricated on a 90 nm CMOS process, integrating 90,960 logic elements and 4,520,488 bits of embedded RAM in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with 1 mm pitch. It features 534 user I/O pins, twelve clock phases per quadrant via its dedicated PLLs, and supports internal clock frequencies up to 609.76 MHz with embedded multiplier and DSP blocks. The device is powered from a 1.15 V to 1.25 V core supply and is rated for the commercial 0 C to 85 C operating range. A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the fab. In the taxonomy of programmable logic, FPGAs sit above CPLDs (less dense, non-volatile) and below fixed-function ASICs, occupying the niche where high logic density, high I/O count, and rapid design iteration are required. The Stratix II family specifically targets high-performance DSP, communications, and signal-processing workloads through its adaptive logic modules (ALMs), TriMatrix embedded memory, and dedicated DSP blocks capable of 18x18 bit signed multiplies at hundreds of MHz. Key features of the EP2S90F780C5 include 4,548 Logic Array Blocks (LABs) / Adaptive Logic Modules, twelve global clock networks, support for external memory interfaces such as DDR, DDR2, QDR, QDRII, and RLDRAM, high-speed transceivers are NOT integrated on this die (Stratix II GX is the transceiver variant), and configuration via passive serial, fast passive parallel, or JTAG modes. The device also includes four enhanced PLLs per device plus up to eight fast PLLs for fine-grained clock synthesis. The Stratix II architecture uses 1.25 V core logic with dedicated 0.9 V and 1.2 V auxiliary rails, an on-chip voltage regulator for some variants, and supports hot-socketing for live insertion into backplanes. The 90 nm process node and nine-layer metal stack deliver high logic utilization at moderate static power; designers should still budget for dynamic power based on toggle rate, especially when driving wide external buses or memory interfaces. Typical applications include high-performance digital signal processing (software-defined radio, baseband modems), wireline telecommunications line cards, video broadcast and image processing, military and aerospace digital processing, and ASIC prototyping. The 534 user I/O and 4.5 Mbit of embedded memory make the EP2S90 a good fit when algorithms need both on-chip storage and large numbers of external connections. When designing with this part, plan power sequencing (1.25 V core before 2.5 V/3.3 V I/O), provide decoupling per the Altera Stratix II PowerPlay Design Guidelines, and verify signal-integrity on wide DDR2 buses using IBIS models. Quartus II is the supported development environment; modern Quartus versions retain Stratix II support through the device legacy policy. This page synthesizes distributor pricing, same-package drop-in alternatives, and design notes for legacy inventory planning - information not consolidated on any single manufacturer or distributor page.
EP2S90F780C5N - Stratix II FPGA, 90K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP2S90F780C5N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) with 90,960 logic elements, 4,520,488 bits of embedded memory, and a 1.2 V core supply, housed in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with 1 mm ball pitch. It is built on a 90 nm CMOS process and operates with an internal frequency up to 609.76 MHz, supporting high-performance digital logic, DSP, and memory-intensive applications. What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit above general-purpose microcontrollers in the digital design hierarchy: they can implement arbitrary parallel logic, custom processor cores, hardware accelerators, and high-bandwidth data-path pipelines that an ASIC would otherwise handle, but with the advantage of in-system reprogrammability. The Stratix II family in particular pioneered the adaptive logic module (ALM) architecture, replacing the traditional 4-input LUT with an 8-input fracturable LUT for higher logic efficiency. Key features of the EP2S90F780C5N include up to 534 user I/O pins, embedded multiplier blocks suitable for DSP, dedicated high-speed serial interfaces, and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The device integrates PLLs for clock management and offers robust configuration options through JTAG, Passive Serial, Fast Passive Parallel, and Active Serial modes. Architecturally, the Stratix II ALM can implement any 7-input LUT plus a small auxiliary function, dramatically reducing logic-area waste compared to older 4-LUT architectures. TriMatrix embedded memory blocks (M512, M4K, M-RAM) provide distributed RAM, ROM, FIFO, and shift-register functions, while DSP blocks deliver dedicated multiply-accumulate throughput. The 90 nm process, 1.2 V core, and 1.0 V/1.2 V selectable I/O standards balance performance and power. Typical applications include telecommunications baseband processing, high-speed image and video processing, ASIC prototyping, military and aerospace signal processing, and industrial control systems. With 534 I/O and ~4.5 Mbit of block RAM, the EP2S90F780C5N handles large data-plane buffers and multiple parallel interfaces. Design consideration: Stratix II devices are now in their mature lifecycle. Designers targeting new designs should verify availability and consider Cyclone IV/V or MAX 10 as modern, lower-cost alternatives where the EP2S90's logic density is not required. This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, lifecycle guidance, and practical design notes not consolidated in the manufacturer datasheet alone.
EP2S90F780I4 - Stratix II FPGA 90K LE FBGA-780 | Intel
The Intel EP2S90F780I4 is a high-density Stratix II family Field Programmable Gate Array (FPGA) housed in a 780-pin FineLine BGA (FBGA-780, 29 x 29 mm, 1 mm pitch) package, delivering up to 90,960 logic elements and 4,520,488 bits of embedded RAM. It provides 4,548 Logic Array Blocks (LABs), 12 dedicated DSP blocks (for up to 96 18x18 multipliers), 534 user I/O pins, and operates with an internal clock tree supporting frequencies up to 717 MHz per the manufacturer datasheet. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that lets designers implement custom digital logic - combinational and sequential functions, memory blocks, and high-speed transceivers - on the same silicon after fabrication. Within the power-management hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic; the Stratix II family specifically targets high-performance applications such as high-speed digital signal processing, telecommunications backplanes, and ASIC prototyping. EP2S90F780I4 occupies the high-end of this family and shares the same architecture as other Stratix II members. Key features include up to 1,152 Kbits of embedded M512/M4K/M-RAM block memory distributed across 4,520,488 bits total, 12 DSP blocks capable of 18x18-bit signed multiplication at full speed, and eight phase-locked loops (PLLs) for clock synthesis and skew management. The device supports multiple I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X) on its 534 user I/O pins, enabling direct interface to DDR/DDR2 SDRAM memories and external parallel buses. Adaptive logic modules (ALMs) provide 8 inputs per module, a 2x improvement over the previous Stratix generation. The 90 nm CMOS process, 1.2 V core voltage, and dedicated hard IP blocks deliver industry-leading performance-per-watt for its era. The internal TriMatrix memory architecture splits on-chip RAM into three block sizes (M512, M4K, M-RAM) so engineers can allocate memory density versus width efficiently. Routing architecture is segmented into row, column, and local interconnects, supporting timing closure for designs operating at hundreds of MHz. Typical applications for the EP2S90F780I4 include high-performance ASIC prototyping and emulation, telecommunications baseband and bridging equipment, high-speed serial protocol bridging (SPI 4.2, SFI-4, UTOPIA), broadcast video processing, and military/aerospace signal processing. The -I speed/temperature grade (-40C to +100C case) targets industrial and defense applications. When designing with the EP2S90F780I4, engineers must consider the 29 x 29 mm BGA footprint which requires at least 6 PCB layers with microvia technology for fan-out, and the 534 user I/Os which often demand SSTL-2 or LVPECL termination networks. Power integrity analysis is essential because the device can exceed 20 W at full utilization; a multi-rail synchronous buck DC-DC design with at least four voltage rails (VCCINT, VCCIO banks, VCCA, VCCD_PLL) is recommended. This page consolidates distributor stock data, drop-in alternatives within the Stratix II family, and practical design notes that extend beyond the manufacturer datasheet for engineers evaluating the EP2S90F780I4 in legacy designs.
EP2S90F780I4N - Stratix II FPGA 90K LE 780-BGA | Intel
The Intel (formerly Altera) EP2S90F780I4N is a high-density Stratix II Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package (29 mm x 29 mm, 1 mm pitch, lead-free). The device integrates 90,960 equivalent logic elements (LEs), 4,548 logic array blocks (LABs), and 4,520,488 bits of embedded memory, delivering mid-to-high range programmable logic capacity for ASIC-prototype, signal-processing, and high-bandwidth I/O bridge designs. The 'F780' package suffix specifies the 780-FBGA outline; 'I4' denotes the industrial temperature grade (-40C to +100C case); 'N' indicates lead-free, RoHS-compliant terminations. The Stratix II family is fabricated on a 90 nm CMOS process and features a unique adaptive logic module (ALM) architecture, embedded DSP blocks, TriMatrix on-chip memory, and dedicated high-speed serial transceiver support depending on derivative. A Stratix II FPGA is a programmable logic device that lets engineers implement arbitrary digital logic, memory structures, DSP arithmetic, and soft processor cores on a single silicon die. Within the broader taxonomy, FPGAs sit below Application-Specific Standard Products (ASSPs) but above general-purpose microcontrollers in flexibility - they are reconfigured via HDL bitstreams rather than fixed at fabrication, which makes them the preferred platform for low-volume ASIC replacement, prototyping, and designs that need late-stage logic revision. Stratix II is Intel's mid-density family between Cyclone II (low-cost) and Stratix III/IV (high-end with transceivers). Key features include up to 717 MHz internal operation per the family datasheet, embedded multiplier blocks for DSP pipelines, TriMatrix memory (MLAB, M512, M4K, M-RAM blocks) for distributed and buffered storage, dedicated clock management PLLs, and 534 user I/Os on the F780 package. Compared with Cyclone II FPGAs, Stratix II offers roughly 4x more logic capacity per device, embedded high-speed memory hierarchies, and lower core voltage operation. The 'I4' industrial grade and lead-free 'N' suffix make the part appropriate for industrial, telecom, and test-equipment markets that require halogen-free assembly. Typical applications include high-speed digital signal processing (radar, software-defined radio), ASIC prototyping, telecom baseband processing, video and image processing pipelines, and protocol-bridging glue logic. The high embedded-memory count supports packet buffering, image line buffering, and FFT working-storage without external SRAM. When designing with this part, observe that the Stratix II family has reached end-of-life from Intel - new designs should evaluate Stratix IV/V or Cyclone V/10 families unless second-source or long-term support agreements are in place. Power sequencing, JTAG configuration, and I/O standard termination follow the Stratix II handbook.
EP2S90F780I4NAB - Stratix II FPGA, 90K LEs, 780-FBGA | Intel
The Intel EP2S90F780I4NAB is a high-density Stratix II family field-programmable gate array (FPGA) delivering 90,960 logic elements, 534 user I/O pins, and 4.5 Mbits of embedded RAM in a 780-pin flip-chip BGA package. It is a 1.2V core device with industrial temperature grade and is part of the legacy Altera Stratix II architecture, now supported by Intel after the 2015 acquisition. What is a Stratix II FPGA? The Stratix II is a 90 nm FPGA architecture that introduced the adaptive logic module (ALM) - an 8-input fracturable look-up-table building block that replaced the older 4-input LUT paradigm and delivers roughly 50% higher logic utilization. FPGAs sit at the top of the programmable-logic hierarchy: programmable logic device (PLD) -> CPLD -> FPGA -> SoC FPGA. They are the dominant platform for high-throughput parallel DSP, high-speed serial I/O aggregation, and ASIC prototyping. Key features include 12 transceiver blocks supporting up to 3.125 Gbps per channel, dedicated DSP blocks for 18x18 multipliers, distributed and block RAM, and on-chip PLLs. The 780-FBGA package exposes 534 user I/O - one of the highest pin counts in the Stratix II family - making it suitable for I/O-rich designs such as multi-port line cards, video processing pipelines, and large ASIC prototypes. The device supports DDR/DDR2/QDR memory interfaces through dedicated DQS pins. The Stratix II architecture uses 1.2V core supply with 0.8/1.2/1.5/1.8/2.5V tolerant I/O banks, enabling mixed-voltage interfacing without external level shifters. Internal signal integrity is improved by the ALM's fracturable LUT, which lets the place-and-route tool pack two smaller functions into one ALM and reduces routing congestion on dense 90K-LE designs. Typical applications include telecom line cards with multi-gigabit serial interfaces, ASIC prototyping for sub-30-million-gate designs, broadcast video processing, military/aerospace signal processing, and high-speed data acquisition. The 90 nm process offers a favorable cost-per-LE for legacy designs in long-lifecycle defense and industrial programs. When designing with this device, ensure the Quartus II design software version supports the Stratix II device family (Quartus II 9.1 SP2 or earlier is the last officially supported release). Verify DDR2 interface timing against the specific speed grade (I4 = -4 industrial), and use the ALTDDIO megafunction for source-synchronous interfaces to meet setup/hold margins. This page synthesizes distributor pricing, same-package Stratix II alternatives, and practical design notes not aggregated in the manufacturer datasheet, helping engineers make a faster sourcing and selection decision.
EP2S90H484C4 - Stratix II FPGA, 90K LE, 484-FCBGA | Intel
The Intel (formerly Altera) EP2S90H484C4 is a high-density Stratix II Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements and 36,384 adaptive logic modules (ALMs / 4,548 LABs) into a 484-ball FineLine BGA package measuring 27 x 27 mm with 1.0 mm ball pitch. Fabricated on a 1.2 V, 90 nm CMOS process, the device delivers up to 711.24 MHz internal operation and 308 user I/O pins, with on-chip memory of approximately 4,520,488 bits distributed across M4K and M-RAM blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/ALMs), programmable interconnect, and dedicated hard IP such as transceivers, memory, multipliers, and PLLs. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> logic IC -> integrated circuit -> semiconductor, and offer ASIC-like density with the time-to-market advantage of in-system reprogrammability. Key features of the EP2S90H484C4 include twelve global clock networks, twelve PLLs for high-frequency clock synthesis, dedicated DSP blocks for high-throughput multiplication, and support for external memory interfaces including DDR, DDR2, QDR, QDRII, and RLDRAM. The 308 I/Os support multiple I/O standards (LVDS, SSTL, HSTL, LVCMOS, LVTTL, PCI-X), enabling direct interfacing with memories, backplanes, and parallel ASIC/ASSP buses without external level translation. Stratix II architecture uses an adaptive logic module (ALM) as its fundamental building block, allowing the device to pack combinatorial and sequential logic more efficiently than the 4-input LUT-based architectures of its predecessors. Combined with dedicated on-chip multipliers and TriMatrix memory (M512/M4K/M-RAM), the EP2S90H484C4 is optimized for high-performance DSP, telecom baseband, and high-speed datapath designs that require parallel arithmetic pipelines. Typical applications include high-performance digital signal processing (DSP) for wireless base stations, telecom switching fabric, video and imaging processing pipelines, high-speed serial protocol bridging, ASIC prototyping, and military/aerospace signal processing platforms. The wide I/O count also suits parallel data-acquisition front ends and high-bandwidth packet processing engines. When designing with the EP2S90H484C4, plan a multi-layer PCB with dedicated power and ground planes, controlled-impedance routing for DDR2 memory interfaces, and matched-length clock traces. Decoupling must follow the Stratix II handbook reference design, with multiple bulk and high-frequency capacitors placed close to the package balls. Configuration can be loaded via JTAG, passive serial, or via an external EPC configuration device. This page synthesizes distributor pricing tiers, drop-in same-family alternatives with the same 484-FCBGA footprint, and design notes that complement (rather than duplicate) the manufacturer Stratix II Device Handbook.
EP2S90H484C4N - Stratix II FPGA 90,960 LE | Altera | BGA-484
Altera EP2S90H484C4N is a high-density Stratix II Field Programmable Gate Array (FPGA) delivering 90,960 equivalent logic elements (LEs), 4,548 LABs/CLBs, and 4,520,448 bits of embedded memory in a 484-ball flip-chip BGA (FCBGA) package. The device targets high-performance digital logic, DSP, and memory-intensive subsystems with up to 308 user I/O pins and on-chip multi-gigabit transceivers typical of the Stratix II family. The part number suffix C4N denotes a commercial-grade speed grade 4 device supplied in tray packaging. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, routing fabric, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers, all programmable after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), bridging the gap between fixed-function ASICs and software-driven processors. They are used to implement custom parallel datapaths, hardware-accelerated algorithms, and glue logic without the NRE cost of an ASIC, making them essential in prototyping, low-volume production, and high-bandwidth signal processing. Key features of the EP2S90H484C4N include 90,960 LEs backed by 4,548 LABs, approximately 4.5 Mbits of embedded SRAM distributed across TriMatrix memory blocks, 12 dedicated DSP blocks for fixed- and floating-point arithmetic, and 12 PLLs for clock synthesis and skew management. The H484 package exposes 308 user I/Os at a 1.0 mm ball pitch, supporting high-density board integration. The device operates from a 1.2 V core supply with separate VCCIO banks for mixed-voltage I/O standards such as LVDS, LVTTL, LVCMOS, and HSTL. Stratix II uses a 90 nm CMOS process with a novel adaptive logic module (ALM) architecture that improves logic utilization over the previous Stratix generation. The ALM combines look-up-table and register resources in a single 8-input fracturable structure, enabling tighter packing of wide arithmetic functions. Combined with up to 12 embedded transceivers (per family datasheet) capable of multi-gigabit-per-second serial links, the EP2S90 places as a high-end DSP and protocol-bridging platform. Typical applications include telecommunications baseband and framer designs, high-speed data acquisition, military/aerospace signal processing, ASIC prototyping, and broadcast video processing where 4.5 Mbits of block RAM and 12 DSP blocks are sized for packet buffers, FFT/iFFT pipelines, and forward-error-correction engines. The high logic capacity also suits multi-channel motor control and software-defined radio prototyping. When designing with the EP2S90H484C4N, plan the power tree carefully: 1.2 V core current can exceed several amps under heavy DSP utilization, and the H484 flip-chip BGA requires a multi-layer PCB with continuous ground and power planes under the device for thermal dissipation. Use Altera Quartus II design software for synthesis, place-and-route, and timing closure, and follow Stratix II pin connection guidelines to leave unused I/O pins configured as inputs with weak pull-ups. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix II family, application guidance, and practical design notes not found in the manufacturer datasheet alone.
EP2S90H484C5 - 90K LE Stratix II FPGA, 484-BGA | Intel / Altera
The Altera (now Intel) EP2S90H484C5 is a Stratix II family Field Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,520,488 bits of embedded memory, and 308 user I/O pins in a 484-ball FineLine BGA (FC-HFBGA) package. Built on a 90nm process technology, the device operates from a 1.2V core supply and supports up to 609.76 MHz internal clock frequency, delivering high-density programmable logic for DSP, telecommunications, and high-speed serial applications. What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacturing rather than at the fab. FPGAs occupy the category hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II family specifically targets high-performance signal processing and ASIC prototyping, combining embedded multipliers, TriMatrix memory blocks, and high-speed transceivers in a single device. Key features of the EP2S90H484C5 include 4,548 LABs (Logic Array Blocks), 12 embedded DSP blocks for hardware multiplication, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, and up to 12 high-speed transceiver channels. The device supports configuration via passive serial, JTAG, and Altera-enhanced configuration modes, with built-in error detection and correction (EDC) for configuration RAM. Technically, the EP2S90H484C5 implements an adaptive logic module (ALM) architecture that achieves approximately 2.5x the logic capacity of previous-generation Stratix devices at the same silicon area. The fine-grained ALM combines look-up tables, adders, and registers in 8-bit groupings, optimizing for both register-rich and arithmetic-intensive designs. Typical applications include high-performance ASIC prototyping, wireless baseband signal processing, high-definition video processing, military radar and sonar systems, and test & measurement equipment. The 484-ball FCBGA package supports high I/O count designs requiring numerous LVDS, DDR memory interfaces, and parallel processing buses. Designers should pay attention to power distribution network design on the FCBGA - the 1.2V core requires substantial decoupling (typically 100uF bulk plus per-pin 0.1uF/1nF ceramics) and proper power sequencing to prevent inrush damage. Thermal management is critical: at full utilization the device can dissipate 10-15W, requiring thermal vias under the package and forced-air cooling in most deployments. This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not found in the manufacturer datasheet alone, enabling faster BOM decisions and design-in for engineers working on Stratix II based systems.
EP2SGX130GF1508C3 - Stratix II GX 132K Logic Elements FPGA | Intel
The Intel EP2SGX130GF1508C3 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,748,840 total memory bits, and 734 user I/O pins, housed in a 1508-ball FineLine BGA (FBGA-1508) package at 40 x 40 mm with 1.0 mm ball pitch. Built on a 90 nm CMOS process with 1.2 V core operation, the device integrates up to 20 transceiver channels supporting multi-gigabit serial I/O for high-speed connectivity. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources (memory, transceivers, DSP blocks) on a single die. FPGAs occupy a unique tier in the semiconductor hierarchy between general-purpose processors (CPUs, MCUs) and application-specific integrated circuits (ASICs): they offer ASIC-class parallelism and throughput while retaining firmware-level reconfigurability. The Stratix II GX family specifically targets high-speed serial I/O and signal-processing workloads, sitting within the broader categories of programmable logic -> logic ICs -> integrated circuits -> semiconductors. Key features of the EP2SGX130GF1508C3 include 132,540 logic elements, 6,627 LABs (Logic Array Blocks), 717 MHz maximum internal operating frequency, and integrated PCI Express hard IP. The device supports LVDS, LVTTL, LVCMOS, and LVPECL I/O standards across 734 user I/Os distributed in 12 banks, enabling flexible mixed-voltage interfacing. Embedded RAM totals 6,748,860 bits distributed across MRAM and M4K blocks, providing high-bandwidth on-chip storage for packet buffers and DSP coefficient tables. The 90 nm process node delivers a balance of power efficiency and operating frequency for the Stratix II GX architecture. Up to 20 full-duplex transceiver channels support protocols including PCI Express, XAUI, Serial RapidIO, and custom serial interfaces up to 6.375 Gbps. Cyclone-to-Stratix migration is supported through Quartus II design tools, and the device family is supported by the Altera Quartus II design suite for synthesis, place-and-route, and timing analysis. Typical applications include high-end telecommunications line cards, military radar and signal processing, medical imaging backplanes, ASIC prototyping, and high-performance computing acceleration. The 1508-ball FBGA package supports high signal-density boards required for multi-gigabit serial designs. The Stratix II GX family is well-suited to wireline backhaul, test and measurement equipment front ends, and custom hardware accelerators where deterministic latency and parallel processing are required. Design consideration: the 1.2 V core supply requires multiple decoupling capacitors placed adjacent to the dedicated VCC pins per the pin connection guidelines. The 40 x 40 mm package demands controlled-impedance PCB stack-up and matched-length routing for transceiver channels. Junction temperature must remain below the 100 C commercial operating limit for C3 speed grade parts, requiring thermal vias beneath the package thermal pad. This page synthesizes distributor availability, Stratix II GX family cross-references, and practical design considerations not consolidated in the manufacturer datasheet, supporting faster sourcing decisions for engineers evaluating EP2SGX130-class FPGAs.
EP2SGX130GF1508C3N - Stratix II GX FPGA, 132K LEs, 20x Transceivers | Intel
The Intel EP2SGX130GF1508C3N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) delivering 132,540 equivalent logic elements, 6,627 Logic Array Blocks (LABs), 734 user I/Os, and up to 6,747,840 bits of embedded memory, housed in a 1508-ball FineLine BGA (FBGA) package measuring 40 x 40 mm with 1 mm ball pitch. Built on a 90 nm CMOS process, it integrates up to 20 high-speed transceivers operating at up to 6.375 Gbps, making it a turnkey solution for serial connectivity in communications, broadcast, and high-performance computing systems. What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device whose logic, interconnect, and I/O behavior can be defined by the user after manufacture. FPGAs occupy a position between standard logic ICs and ASICs in the hardware hierarchy: programmable logic > FPGA > high-speed serial interface > system-on-chip. The Stratix II GX family specifically targets designs that need hard IP for multi-gigabit transceivers and embedded memory, eliminating the silicon cost and risk of building those blocks from soft logic. Key specifications include 132,540 logic elements, 6,627 LABs, 734 user I/Os, 6,747,840 embedded RAM bits, 56 (18x18) hardware multipliers, 12 PLLs, and 8.25 Mbits of TriMatrix memory. Internal clocking supports up to 717 MHz for fabric logic and 717 MHz for memory blocks, while the 20 transceiver channels each deliver up to 6.375 Gbps. Supply voltage operates at 1.15 V to 1.25 V for the core, with separate transceiver and auxiliary rails defined in the datasheet. Architecturally, the device combines an 8-input adaptive logic module (ALM) fabric, dedicated DSP blocks for multiplication and accumulation, and physical coding sublayer (PCS) and physical medium attachment (PMA) hard IP per transceiver channel. The TriMatrix memory hierarchy (MLAB, M512, M4K, M-RAM) gives designers 6.75 Mbits of distributed and block RAM with port widths up to 144 bits, supporting high-throughput buffering for video, packet processing, and baseband datapaths. Typical applications include 10G/40G Ethernet line cards, SONET/SDH framer/mapper ICs, HD-SDI and 3G-SDI broadcast video routers, high-end test and measurement equipment, medical imaging accelerators, and defense/aerospace signal processing platforms. The combination of transceivers, DSP blocks, and on-chip memory allows a single Stratix II GX to replace multi-chip ASIC + memory solutions while preserving reconfigurability for evolving protocols. When designing with the EP2SGX130GF1508C3N, plan PCB power delivery for the 1.15-1.25 V core rail carefully; a 1508-ball FCBGA of this size typically requires a multi-phase VRM and extensive decoupling. Signal-integrity for the 6.375 Gbps transceiver channels demands controlled-impedance differential routing, length matching within the tolerance stated in the transceiver chapter, and AC-coupling capacitors at every serial link pin pair. This page synthesizes distributor pricing, datasheet sources, parametric comparison, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a single decision-ready reference for the EP2SGX130GF1508C3N.
EP2SGX130GF1508C4 - 132K LE Stratix II GX FPGA | Intel
The Intel (formerly Altera) EP2SGX130GF1508C4 is a high-density Stratix II GX field-programmable gate array (FPGA) with 132,540 logic elements, 6,748,160 bits of embedded memory, and embedded transceivers, housed in a 1508-ball flip-chip BGA (FC-FBGA) package measuring 40 x 40 mm with 1 mm pitch. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit at the top of the programmable logic hierarchy (CPLD < FPGA < SoC FPGA) and provide hardware-level parallelism, on-chip block RAM, DSP blocks, and high-speed serial transceivers. The Stratix II GX family specifically targets high-bandwidth serial I/O applications requiring multi-gigabit transceivers. Key features include 132,540 logic elements, 6,748,160 embedded memory bits, 6744 18x18 multipliers, 4 phase-locked loops, and embedded transceivers supporting up to 6.375 Gbps operation per the Stratix II GX architecture. The 90 nm process technology operates at a core voltage of 1.2 V (1.15 V to 1.25 V range) and the device supports up to 717 MHz internal operation. The architecture combines an adaptive logic module (ALM) fabric with embedded transceiver channels optimized for serial connectivity standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. The 734 user I/O pins connect to 20 global clock networks and support a wide range of single-ended and differential I/O standards including LVDS, LVPECL, HSTL, and SSTL. Typical applications include high-speed serial interface bridging in communications infrastructure, custom protocol development in test and measurement, ASIC prototyping with transceivers, baseband processing in wireless base stations, and high-performance DSP pipelines. The 1508-ball FC-BGA package supports the high pin density required for the 734 user I/Os plus dedicated transceiver and clock pins. When designing with this device, plan PCB escape routing carefully because the 1 mm pitch FC-BGA requires HDI stack-up with microvia-in-pad or staggered via technology. Decoupling strategy must follow Altera's Stratix II GX Power Distribution Network (PDN) guidelines, and JTAG configuration with EPCS serial configuration devices is recommended for production. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.