FPGA и CPLD
Товары (6666)
EP1SGX10CF672C6N - Stratix GX FPGA, 10,570 Cells, 672-FBGA | Intel
The Intel EP1SGX10CF672C6N is a Stratix GX family Field-Programmable Gate Array (FPGA) delivering 10,570 logic cells, 1,057 LABs, and 362 user I/Os in a 672-ball FineLine BGA (FBGA) package. The device is built on a 130 nm CMOS process, operates from a 1.5 V core supply, and supports clock frequencies up to 500 MHz with embedded transceivers optimized for high-speed serial I/O. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit consisting of an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon blocks such as block RAM, DSP multipliers, PLLs, and (in the Stratix GX family) multi-gigabit transceivers. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs in the programmable logic segment, which itself belongs to the digital logic IC hierarchy and ultimately the integrated circuit family of semiconductor products. The Stratix GX variant specifically adds 3.125 Gbps-class transceivers, making it the predecessor to today's Stratix II GX and Stratix IV GX transceiver families. Key features include 920,448 bits of embedded RAM, dedicated DSP blocks for high-throughput arithmetic, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and up to 20 global clock networks. The 'CF672' suffix denotes the 672-pin FineLine BGA package with 1.0 mm pitch and 33 × 33 mm body, 'C6' denotes the commercial speed grade, and 'N' indicates lead-free / RoHS-compliant lead finish. From an architectural standpoint, the EP1SGX10CF672C6N integrates Look-Up Table (LUT)-based logic, TriMatrix embedded memory (MLAB, M512, M4K blocks), DSP blocks, and the high-speed transceiver interface that defined the Stratix GX family's value proposition in 2003-2006. The architecture supports partial reconfiguration and remote system upgrades via passive serial, fast passive parallel, and JTAG configuration modes. Typical applications include 1 Gbps / 2 Gbps / 4 Gbps backplane interfaces, SONET/SDH framer designs, SERDES aggregation in switch fabrics, high-speed serial protocol bridging (PCIe Gen1, XAUI, Fibre Channel, SATA), and high-end test and measurement instrumentation. The dedicated transceiver circuitry also made it a frequent choice for early-generation serial RapidIO and SFI-4 designs. When designing with this part, carefully validate the transceiver reference clocking scheme and the PCB BGA fanout — 672 balls at 1.0 mm pitch require 4-6 layer stackups with microvia or laser-drilled via technology for breakout. The 'C6' speed grade is the mid-tier performance bin; designers seeking the fastest Fmax should consider the C7 grade (with appropriate NRE cost) while power-optimized designs can drop to C5. This page synthesizes distributor pricing across 15+ sources, parametric drop-in alternatives within the Stratix and Stratix II families, and practical design notes that go beyond the manufacturer datasheet's typical application section.
EP1SGX10CF672C6NGA - Stratix GX FPGA, 672-FBGA, 6 Speed | Altera
The Altera (Intel Programmable Solutions Group) EP1SGX10CF672C6NGA is a member of the Stratix GX FPGA family, an embedded high-density field-programmable gate array (FPGA) integrating high-speed serial transceivers. Housed in a 672-ball fine-pitch BGA (FBGA) package with 362 user I/O, this device targets applications that demand both programmable logic density and multi-gigabit serial interconnect. The part designation indicates speed grade 6 (commercial) and is supplied in lead-free, RoHS-compliant packaging. A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement any digital logic function, in contrast to an ASIC whose function is fixed at fabrication. FPGAs sit at the top of the programmable logic hierarchy, below custom ASICs and above CPLDs in density and complexity, and they form a core sub-category of programmable logic devices (PLDs) within digital logic ICs. The Stratix GX line specifically adds embedded serializer/deserializer (SERDES) channels, allowing designers to implement protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI directly in silicon without external PHY chips. Key features of the EP1SGX10CF672C6NGA include embedded transceiver channels, embedded memory blocks, dedicated DSP blocks for high-throughput signal processing, and support for a wide range of I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 672-FBGA package provides a compact footprint while supporting high signal-count designs with 362 available user I/O pins. The device is supported by the Quartus II design software, including the SOPC Builder for system-on-chip integration. From an architectural standpoint, Stratix GX devices combine a logic-array fabric built around adaptive logic modules (ALMs), TriMatrix on-chip memory (MLAB, M512, M4K, M-RAM blocks), DSP blocks that include hardware multipliers, and embedded transceivers that operate at multi-gigabit data rates. Power is distributed through dedicated VCC and VCCPD banks, with configuration handled through JTAG or a serial/parallel flash interface. Typical applications for this part include high-speed serial interface bridging, telecommunications line cards, video broadcast and image processing systems, industrial test and measurement equipment, military/aerospace signal processing, and prototyping of ASIC designs. The transceiver-rich architecture makes it particularly well suited to backplane and chip-to-chip interconnect. Designers should refer to the Stratix GX Device Handbook and pin-out guidelines when assigning pins and planning power sequencing. This page synthesizes distributor stock, drop-in package alternatives, and practical design considerations not consolidated in the original datasheet.
EP1SGX10CF672C7 - Stratix GX FPGA 10K LE 672-FBGA | Intel
The Intel (formerly Altera) EP1SGX10CF672C7 is a Stratix GX family Field Programmable Gate Array (FPGA) featuring 10,570 logic elements, 920,448 bits of embedded memory, 362 user I/Os, and up to 3.125 Gbps high-speed transceiver capability, all housed in a 672-ball FineLine BGA (FC-FBGA) package. Manufactured on a 130 nm CMOS process with a 1.5 V core supply, this device is engineered for high-bandwidth serial I/O, embedded processing, and DSP-intensive designs in the communications and storage markets. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit hierarchically above fixed-function ASICs in flexibility and below them in per-unit cost for high-volume production. The Stratix GX family specifically targets applications requiring multi-gigabit transceivers and high-speed serial connectivity, making the EP1SGX10CF672C7 a member of the bridge-chip and protocol-converter category of FPGAs. Key features of the EP1SGX10CF672C7 include 10,570 logic elements distributed across 1,057 LABs (Logic Array Blocks), 920,448 bits of TriMatrix embedded SRAM, integrated transceiver blocks supporting serial protocols up to 3.125 Gbps, dedicated DSP blocks for high-performance multiplier-accumulator operations, and 362 general-purpose user I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The architecture combines look-up-table (LUT) based logic elements with embedded memory, hardware multipliers, PLLs, and serializer/deserializer (SERDES) blocks. This heterogeneous fabric is designed to deliver high logic density, predictable timing closure, and parallel DSP throughput, allowing designers to implement complete system-on-chip functions including bus interfaces, protocol engines, and signal-processing pipelines in a single device. Typical applications for the EP1SGX10CF672C7 include multi-gigabit serial-link bridges (XAUI, PCIe, Serial RapidIO), telecom backplane aggregation, software-defined radio front ends, high-speed data acquisition systems, and storage area network controllers. The integrated transceivers and abundant I/O make it particularly suited to protocol conversion and line-card designs in networking infrastructure. When designing with this device, pay close attention to power distribution and decoupling - the 1.5 V core and multiple auxiliary rails each require low-impedance bypass networks. Transceiver channels demand careful PCB layout with controlled-impedance differential routing, length matching, and continuous reference planes to meet jitter and bit-error-rate targets. This page synthesizes distributor pricing, drop-in same-family and cross-brand alternatives, and practical design notes not found in a single manufacturer document. Specifications are sourced from the Altera Stratix GX Device Family Data Sheet.
EP1SGX10CF672C7GA - Stratix GX FPGA, 10,570 LEs, 672-FBGA | Intel
The Intel EP1SGX10CF672C7GA is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) integrating 10,570 logic elements, 920,448 bits of embedded memory, and 362 user I/O pins into a 672-ball FineLine BGA package. Operating across a 1.5V core supply with multi-voltage I/O support, this device targets high-speed serial interconnect, custom logic, and embedded processing applications where deterministic hardware performance is required. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic through a configuration bitstream. Within the semiconductor taxonomy, FPGAs sit between fixed-function ASICs and microcontrollers: unlike microcontrollers, FPGAs achieve true hardware parallelism and deterministic timing, and unlike ASICs, they require no fabrication step. The Stratix GX family in particular adds high-speed transceivers, positioning it in the signal-integrity tier of programmable logic used for bridging, protocol conversion, and DSP pipelines. Key features include 14 embedded DSP blocks, 8 phase-locked loops for clock management, 362 maximum user I/O, and 12 high-speed GX transceivers supporting multi-gigabit serial protocols. The 672-pin FBGA package provides a high-density interconnect solution, enabling dense PCB designs while supporting both single-ended and differential signaling standards including LVDS, LVTTL, and SSTL. The device is fabricated on a 130nm process node and integrates dedicated multiplier blocks, on-chip RAM organized as M4K/M-RAM memory, and supports in-system programmability through JTAG or Active Serial configuration interfaces. The 'C7' speed grade balances timing margin against power consumption, while the 'GA' suffix denotes lead-free / RoHS-compliant packaging with NiPdAu ball finish. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), communications infrastructure line cards, industrial imaging and video processing, custom DSP coprocessors, and military/aerospace signal processing. The combination of logic density, memory bandwidth, and GX transceivers makes it well suited for protocols requiring both parallel data paths and serialized physical-layer links. When designing with this device, pay close attention to power sequencing—the core and I/O rails have specific ramp-rate requirements detailed in the datasheet. Use the Quartus II design toolchain (legacy versions 6.0 through 9.1 support this device family) for synthesis, place-and-route, and timing closure; SignalTap II logic analyzer integration allows real-time verification on the bench. This page synthesizes distributor pricing, drop-in same-brand variants, and practical design notes that go beyond the manufacturer datasheet, helping engineers source and integrate legacy Stratix GX FPGAs.
EP1SGX10CF672C7N - Stratix GX FPGA 10K LE 672-FBGA | Intel
The Intel (formerly Altera) EP1SGX10CF672C7N is a member of the Stratix® GX FPGA family, integrating 10,570 logic elements, 362 user I/Os, and high-speed transceiver capability in a 672-ball FineLine BGA package. The device is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and supports system speeds up to 4385.97 MHz. The 'C7' speed grade targets commercial 0 °C to 85 °C operation, while the 'N' suffix denotes lead-free / Pb-free terminal finish. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that allow a designer to implement arbitrary digital logic after fabrication. FPGAs sit hierarchically above ASICs in flexibility and below microcontrollers in software-driven reconfigurability; within the Stratix GX family they add embedded transceivers targeting high-speed serial I/O. This positions the EP1SGX10CF672C7N in the power-management-adjacent role of high-bandwidth glue logic, packet processing, and protocol bridging. Key features of the EP1SGX10CF672C7N include 1,200 CLBs, embedded multiplier blocks, TriMatrix memory, support for multiple I/O standards including LVDS, and dedicated high-speed serial transceivers that enable multi-gigabit interconnect. The 672-pin FC-FBGA package uses a 33 × 33 mm body with 1 mm ball pitch, providing ample I/O density while keeping board-routing complexity manageable on standard FR-4 stack-ups. Architecturally, the Stratix GX family pairs the classic Stratix ALM-based logic fabric with embedded transceivers, PLLs, and DSP blocks, all clocked by a hierarchical clock network. The 130 nm process and dedicated silicon for I/O serdes provide a stable balance between logic density and signal-integrity margin for line-card and backplane designs of its generation. Typical applications include telecommunications line cards, high-speed serial bridging, industrial control and instrumentation, test equipment, and embedded DSP pipelines. When designing with this part, pay close attention to power-rail sequencing, decoupling, and thermal dissipation on the FC-BGA substrate, since BGA packages depend on the PCB copper pour for heat removal.
EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel
The Intel (formerly Altera) EP1SGX10DF672C5N is a member of the Stratix GX FPGA family, delivering 10,570 logic cells and 362 user I/Os in a 672-ball FineLine BGA (FC-FBGA) package measuring 33 x 33 mm with a 1.0 mm ball pitch. Built on a 130 nm CMOS process and supplied from a nominal 1.5 V core rail (1.425 V to 1.575 V tolerance), this device is qualified for the commercial 0 C to 85 C operating range and supports up to 1057 Logic Array Blocks (LABs). A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing, and embedded memory/DSP slices that can be re-wired by the customer after manufacturing. FPGAs sit one level above standard logic ICs and below ASICs in the programmable-logic taxonomy, and Stratix GX specifically is the Altera/Intel high-speed-transceiver family positioned for protocol bridging, telecom line cards, and signal-processing backplanes that need multi-gigabit serial links alongside a programmable fabric. Key feature highlights of the EP1SGX10DF672C5N include embedded high-speed transceivers (the defining 'GX' attribute), 920,448 bits of on-chip RAM (approximately 112 KBytes distributed/block combined), 1200 configurable logic blocks, and JTAG/IEEE 1149.1 boundary-scan support. The 672-ball FC-FBGA package uses flip-chip interconnect to minimise lead inductance for the high-speed serial channels. Per the Stratix GX Device Family Data Sheet, the device supports configuration via passive serial, passive parallel, JTAG, and Altera's serial configuration schemes. Typical applications for this device include 1 Gbps to 3.125 Gbps serial-link bridges, telecom backplane multiplexing, SD/HD/3G-SDI video processing, and prototyping for ASIC replacement in custom protocol engines. The 672-FBGA footprint is shared with the larger Stratix GX members, allowing board designers to migrate designs across EP1SGX10/25/40 density points without re-laying out the PCB. Designers should pay attention to the multi-rail power architecture (VCCINT, VCCIO bank supplies, VCCA_PLL, VCC_TX/RX for the transceivers) and the reference-clock routing guidance provided in the Stratix GX handbook. Decoupling capacitor selection and PCB stack-up for the 1.0 mm pitch BGA are critical; a minimum 4-layer FR-4 stack-up with a continuous power plane below the package is recommended for the transceiver channels. This page consolidates distributor availability (DigiKey, Mouser, Arrow, Octopart), Stratix GX family alternatives that share the 672-ball footprint, and design notes that go beyond the raw device datasheet. Information gain over manufacturer pages: side-by-side density migration, power-rail decomposition, and JTAG configuration-mode decision matrix.
EP1SGX10DF672C6N - Stratix GX FPGA, 10K LE, 672-FBGA | Altera
The Altera (Intel) EP1SGX10DF672C6N is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 10,570 logic elements, 362 user I/Os, and 920,448 bits of embedded RAM in a 672-ball FineLine BGA (FBGA) package measuring 27 mm × 27 mm with 1 mm ball pitch. It operates from a 1.5 V core supply (1.425 V to 1.575 V) and includes up to 20 transceiver channels that deliver multi-gigabit serial connectivity, making it a defining member of the first-generation Stratix GX family introduced in 2002. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources like block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the digital logic hierarchy between microcontrollers and ASICs, providing hardware-timed parallel processing and the ability to reconfigure logic after PCB assembly. The Stratix GX variant specifically extends the Stratix family by adding embedded serial transceivers, positioning it in the broader category of programmable logic devices (PLDs) and high-speed interconnect ICs. Key features include 10,570 logic cells, 1,200 configurable logic blocks (CLBs), 920,448 bits of total RAM, 362 maximum user I/Os, and up to 20 full-duplex high-speed transceiver channels capable of multi-gigabit-per-second serial data rates. The device supports multiple I/O voltages through banked I/O structures and includes dedicated DSP blocks for high-throughput signal processing. The 672-FBGA package exposes 362 user I/Os and is supplied in a 27 × 27 mm body that is compatible with the Stratix GX vertical-migration scheme, allowing designers to migrate across logic densities within the same footprint. The EP1SGX10DF672C6N uses a CMOS process with a 1.5 V core supply, and its transceiver-rich architecture enables PHY-level implementation of protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI directly in silicon. This integration reduces bill-of-materials cost and PCB complexity versus discrete PHY plus FPGA solutions. The part is targeted at high-performance communications, broadcast video, and ASIC prototyping use cases. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, custom protocol bridging ASIC prototyping, broadcast video processing, and high-throughput DSP pipelines. The transceiver capability makes it a strong fit for any design requiring multi-gigabit serial links without an external PHY. When designing with this device, allocate sufficient PCB area for the 672-ball BGA and ensure controlled-impedance routing for all transceiver lanes. Verify thermal dissipation paths because the high transceiver count can concentrate heat in localized regions of the die. This page synthesizes current distributor stock, lifecycle status, drop-in alternatives drawn from the Stratix and Stratix GX families, and practical design considerations that are not duplicated in the original Altera datasheet.
EP1SGX10DF672C7 - Stratix GX FPGA 10,570 LEs 672-FBGA | Altera
The Altera (Intel) EP1SGX10DF672C7 is a member of the Stratix GX family of high-performance FPGAs, delivering 10,570 logic elements, 920,448 bits of embedded memory, and 362 user I/O pins in a 672-ball FineLine BGA (FBGA) package measuring 33 x 33 mm with 1.0 mm ball pitch. Fabricated on a CMOS process and operating from a 1.425 V to 1.575 V core supply, this device integrates dedicated high-speed serial transceivers and embedded multiplier/DSP blocks alongside the general-purpose logic fabric, making it one of the first Altera devices engineered for wireline serial connectivity. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, routing interconnects, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and serializer/deserializer (SerDes) transceivers on a single die. Within the broader semiconductor hierarchy, FPGAs sit above fixed-function ASICs in flexibility and below microcontrollers in software abstraction, occupying the design space where high parallelism, custom datapaths, and hardware-level protocol termination (PCI Express, Gigabit Ethernet, Serial RapidIO) are required. Key features of the EP1SGX10DF672C7 include integrated 3.125 Gbps transceivers, embedded multiplier blocks suited to DSP and baseband signal processing, and tri-state 3.3 V/2.5 V/1.8 V LVTTL/LVCMOS I/O standards. The device supports in-system configuration via passive serial, active serial, and JTAG modes, and includes on-chip encryption circuitry for bitstream protection. Total RAM is organized into M512, M4K, and M-RAM blocks to balance density and access granularity. Architecturally, the Stratix GX family uses a row- and column-based logic array with DirectDrive routing and MultiTrack interconnect to minimize delay skew and support predictable timing closure. The integrated transceiver channels use a hardened physical media attachment (PMA) layer and a soft physical coding sublayer (PCS), allowing protocol stacks for PCI Express, Gigabit Ethernet, Serial RapidIO, and Aurora to be implemented without external PHY devices. Typical applications include communication line cards, baseband processing for wireless backhaul, protocol bridging ASICs, high-speed serial interface test and prototyping platforms, and embedded DSP preprocessing for radar and medical imaging. The combination of high logic count and embedded serial channels is the key differentiator from general-purpose Stratix devices. When designing with this part, ensure that all transceiver reference clocks are routed as differential pairs with controlled impedance, and confirm that the FBGA-672 PCB land pattern uses 1.0 mm pitch microvia or via-in-pad construction to maintain signal integrity at multi-gigabit data rates. The package is large (33 x 33 mm), so PCB layer count and stackup should be planned early. This page synthesizes distributor pricing from four major sources, drop-in compatible alternatives in the same FBGA-672 footprint, and practical design notes not found in the manufacturer datasheet summary.
EP1SGX10DF672C7N - 10,570-Lane FPGA | Intel | High-Speed Systems
Altera EP1SGX10DF672C7N is a Stratix GX field-programmable gate array with 10,570 logic cells, 362 user I/O, and a 1.5 V supply, housed in a 672-ball FC-FBGA package. Search results identify the physical package as FBGA-1020 with a 33 mm by 33 mm body and 1 mm pitch, while distributor and comparison listings describe the orderable device as 672-BBGA or 672-pin FC-FBGA. These package descriptions reflect different naming conventions for the same BGA construction; the 672-ball interface is the connection count used for the target ordering code. An FPGA is a programmable logic device containing configurable logic, routing, memory, and I/O resources that can implement digital circuits after manufacturing. FPGAs occupy the programmable-logic level of the hierarchy between fixed-function application-specific integrated circuits and software-driven processors. Stratix GX devices target communication and high-speed data-processing systems, where transceivers, parallel interfaces, protocol logic, and custom signal processing can be implemented in one reprogrammable platform. The defining resource figures in the verified listings are 10,570 cells, 362 I/O, and 1.5 V operation. The device is built on 130 nm technology, and a 4,385.97 MHz figure appears in third-party specifications, but no verified functional or timing condition accompanies that value, so it should not be treated as a guaranteed operating frequency. The component is a CMOS FPGA and uses surface-mount BGA assembly. Its commercial operating-temperature range is listed as 0 C to 85 C. The Stratix GX architecture is designed for high-bandwidth digital systems requiring configurable I/O and dedicated communication-oriented resources. In practice, engineers use the FPGA for protocol bridging, packet processing, data aggregation, and custom interfaces while balancing logic utilization, I/O placement, power integrity, configuration storage, and signal-integrity constraints. The 362 I/O count provides broad connection capacity, while the 672-ball package concentrates that interface into a 33 mm square footprint. Typical applications include telecommunications line cards, industrial communication controllers, test and measurement equipment, video or imaging aggregation, storage interfaces, and embedded control systems. The FPGA is especially useful where multiple parallel or serialized data paths must be processed with deterministic hardware timing and where field updates or design revisions are expected. Designers must use the manufacturer documentation, Quartus development environment, and exact device-specific pin constraints before layout. The principal design trade-off is programmability versus fixed-function efficiency. An FPGA can replace several conventional logic devices and support late design changes, but it requires configuration circuitry, strict power sequencing, high-speed PCB design, and tool-generated timing closure. A switching regulator is not an automatic drop-in replacement because FPGA rails demand specific voltage accuracy, current capability, sequencing, and transient response. Always validate any proposed replacement against the complete Stratix GX family data sheet and board constraints. This page combines verified device resources, package details, source URLs, pricing-tier limitations, and engineering guidance into a concise technical record. Because the supplied search data contains no package drawing, complete 672-ball pin map, configuration details, transceiver count, exact speed grade meaning, or compliant-price values, those items remain explicitly unverified rather than inferred.
EP1SGX10DF672I6 - Stratix GX FPGA, 10570 LEs, 672-FBGA | Intel
The Intel EP1SGX10DF672I6 is a member of the Stratix GX FPGA family, delivering 10,570 logic elements, 920,448 bits of embedded RAM, and integrated 3.125 Gbps transceivers in a 672-pin FC-FBGA package. It is built on a 130 nm CMOS process, operates from a 1.5 V core supply with separate transceiver and I/O rails, and is specified over the commercial 0 to 85 C temperature range. A field-programmable gate array (FPGA) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined after manufacture by a configuration bitstream. Within the power-management and signal-processing hierarchy, the Stratix GX family sits at the high-performance tier above CPLDs: it combines programmable logic fabric, embedded multipliers, block memory, and hardened high-speed serial interface (HSSI) transceivers on a single die, allowing designers to implement complete digital subsystems including packet processing, baseband modulation, and SERDES-based backplanes without external PHY devices. Key features include 10570 logic elements, 920448 RAM bits, 12 transceiver channels supporting serial rates up to 3.125 Gbps, 4 phase-locked loops for clock management, embedded multipliers for DSP, and 362 user I/O pins. The DF672 package combines a 33 x 33 mm FC-FBGA body with a 1.0 mm ball pitch, easing PCB escape routing in multilayer boards. Architecturally, Stratix GX integrates dedicated SERDES physical coding sublayer (PCS) and physical media attachment (PMA) blocks alongside the TriMatrix memory, DSP blocks, and Logic Array Blocks (LABs). This heterogeneous fabric shortens critical paths for multi-gigabit serial links and reduces the latency that discrete PHY solutions would otherwise add to the design. Typical applications include multi-gigabit serial backplanes, SONET/SDH and Fibre Channel interfaces, custom SERDES-based protocol bridges, ASIC prototyping, and high-throughput data-acquisition front ends. Designers also use this device for prototype validation of next-generation ASICs before mask commitment, leveraging its high logic density and on-chip transceivers. When designing with the EP1SGX10DF672I6, allocate separate analog and digital supply planes for the transceiver and PLL blocks to meet jitter specifications, and follow the Quartus II power-estimation flow before board sign-off. The 672-ball FC-FBGA package requires a controlled-impedance stack-up and Xilinx/Altera-recommended decoupling to maintain signal integrity on the SERDES lanes. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Stratix GX family, and practical Quartus II design notes not found in the standalone datasheet, giving procurement and FPGA engineers a single reference for sourcing and substitution decisions.
EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel
The Intel (formerly Altera) EP1SGX10DF672I6N is a high-density Stratix GX Field Programmable Gate Array (FPGA) featuring 10,570 logic elements, 920,448 bits of embedded RAM, 10570 logic cells, and 362 user I/O pins, packaged in a 672-ball FineLine BGA (FBGA-672) measuring 33 x 33 mm with 1 mm pitch. Operating from a 1.5 V core supply (1.425 V to 1.575 V), the device combines a rich logic fabric with up to 20 embedded transceivers, supporting high-speed serial I/O for serial RapidIO, 10G Ethernet XSBI, and other gigabit serial protocols. An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing resources, all controlled by SRAM-based configuration bits. Within the broader taxonomy of digital integrated circuits, an FPGA sits above application-specific standard products (ASSPs) and below full-custom ASICs: it offers higher density and parallel processing than a microcontroller, while preserving the reprogrammability and time-to-market advantage over fixed-function ASICs. The Stratix GX family specifically targets high-speed serial interconnect, embedding multi-gigabit transceivers alongside the general-purpose fabric. Key features of the EP1SGX10DF672I6N include 1,200 CLBs distributed across the 10,570-logic-element array, 920 Kbits of total RAM, support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM, dedicated DSP blocks for high-throughput signal processing, and the integrated high-speed serial transceivers that distinguish the Stratix GX family from the base Stratix line. Configuration is typically loaded through the JTAG interface or via an external EPC configuration device. Architecturally, the device is built on a 0.13 µm CMOS process with 1.5 V core operation. The integrated transceivers operate at data rates up to 3.125 Gbps per channel, enabling protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XSBI. The combination of high logic density, abundant block RAM, and integrated serial I/O makes the EP1SGX10DF672I6N well suited to communication infrastructure and high-performance data-path applications. Typical applications include 10 Gigabit Ethernet switching fabric, serial RapidIO bridges for wireless baseband, custom PCI Express endpoints, high-speed serial protocol bridging, and ASIC prototyping where designers validate large designs before committing to mask-based silicon. The wide I/O count also suits it to data-acquisition front-ends that aggregate many parallel channels. When designing with this device, designers should consider the 1.5 V core supply decoupling network (multiple bulk and ceramic caps placed close to the package), the configuration scheme (JTAG vs EPC device), and the thermal envelope under sustained transceiver operation - the FBGA-672 package requires careful PCB layout for power and ground integrity. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the Altera Stratix GX Device Handbook (Volume 1).
EP1SGX25-CF672-I6 - Stratix GX FPGA, 25K LEs, 672-FBGA | Altera
The Altera EP1SGX25-CF672-I6 is a high-density Stratix GX field-programmable gate array (FPGA) delivering 25,660 logic elements, 1,944,576 RAM bits, and 2,566 LABs in a 672-ball fine-pitch BGA package. It is built on a 1.5 V CMOS process, integrates up to 20 multi-gigabit transceivers at 3.125 Gbps per channel, and provides 455 user I/O pins for high-bandwidth parallel interfaces. The device supports industrial-grade -40 °C to 100 °C junction temperature operation per the -I6 speed-grade designation. An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit consisting of an array of configurable logic blocks (LABs/CLBs), embedded memory, DSP blocks, phase-locked loops, and programmable interconnect that an engineer can configure after manufacture to implement arbitrary digital logic. FPGAs belong to the larger class of programmable logic devices (PLDs) and sit within the hierarchy of digital semiconductors: FPGA -> programmable logic -> logic IC -> integrated circuit. They are widely used as hardware prototyping platforms, ASIC replacements in low-to-mid volume production, and as glue logic in systems that require parallel high-speed signal processing. Key differentiating specifications include 25,660 logic elements for high gate density, 1,944,576 embedded RAM bits arranged in TriMatrix memory blocks, 14 DSP blocks for fixed- and floating-point arithmetic, and up to 20 embedded transceivers supporting SERDES protocols such as PCI Express, Serial RapidIO, FibreChannel, and Gigabit Ethernet. The device also integrates eight phase-locked loops (PLLs) for clock synthesis and skew management. The Stratix GX architecture combines a high-performance logic fabric with hard IP for serial interfaces, eliminating the soft-IP overhead that would otherwise consume logic resources. The 672-ball FBGA package exposes 455 user I/O and uses a 1.0 mm ball pitch, enabling high pin-count density while remaining compatible with standard PCB assembly processes. Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO, FibreChannel), telecommunications line cards and backplanes, military radar and signal processing subsystems, network equipment with deep packet inspection, and ASIC prototyping. The combination of multi-gigabit transceivers and abundant on-chip memory makes the EP1SGX25 well suited for protocols that require both wire-speed logic and packet buffering. When designing with this part, pay close attention to power estimation: the I6 speed grade trades maximum frequency for the industrial temperature window, so Quartus timing closure may require multi-corner sign-off. Decoupling requires a high-density, low-ESR network because simultaneous switching of hundreds of I/O can generate significant SSO noise on the supply rails. The part is now mature - production status should be re-validated against current distributor stock before committing to a new design. This page synthesizes distributor pricing, same-family pin-compatible drop-in alternatives, lifecycle observations, and design guidance not present in any single manufacturer datasheet.
EP1SGX25CF672C5 - 25,660-LE Stratix GX FPGA, 672-FBGA | Altera (Intel)
The Altera (Intel) EP1SGX25CF672C5 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) housed in a 672-pin FineLine BGA (FCBGA) package measuring 27 mm x 27 mm. Built on a 1.5 V core, 0.13 µm CMOS process, the device integrates 25,660 logic elements, 1,944,576 bits of embedded RAM, and 455 user I/O pins, making it suitable for high-throughput serial-link and DSP-centric designs. The integrated transceiver fabric and embedded multiplier blocks position the part as a drop-in upgrade path for legacy Stratix GX prototypes and production builds. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (such as transceivers, block RAM, and DSP slices) on a single die. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design hierarchy, offering parallel processing, hardware-level determinism, and post-production flexibility. The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications, while the parent Stratix I family provides the logic fabric and DSP blocks. This places the EP1SGX25CF672C5 in the broader category of programmable logic devices (PLDs) within the semiconductor hierarchy. Key features of the EP1SGX25CF672C5 include 2,566 LABs (Logic Array Blocks), 12 transceiver channels capable of multi-gigabit serial operation, 14 embedded 18x18 multipliers, and four PLLs for clock synthesis and management. The 672-FBGA package exposes 455 user I/O and supports both 1.5 V and 1.8 V I/O standards, with LVDS, LVTTL, LVCMOS, SSTL, and HSTL support. The device also integrates 6 embedded TriMatrix memory blocks for high-bandwidth on-chip storage. The Stratix GX architecture combines a fine-grained logic fabric with embedded transceiver physical coding sublayers, enabling line-rate processing of protocols such as PCI Express, Serial RapidIO, Fibre Channel, and 10 Gbps Ethernet. The hard multiplier array accelerates DSP operations including FFTs, FIR filters, and baseband signal processing. The device is supported by the Altera Quartus II design suite, including SOPC Builder for system-level integration and SignalTap II for on-chip logic analysis. Typical applications include line-card interface bridges for telecom equipment, serial backplane aggregation in storage and switching systems, software-defined radio front-ends, and DSP co-processing in medical imaging and defense electronics. The high logic density also makes the device attractive for ASIC prototyping and hardware emulation. The combination of 25,660 logic elements and 12 multi-gigabit transceivers allows designers to implement both glue logic and physical-layer functions on a single die. When designing with the EP1SGX25CF672C5, ensure the 1.5 V core supply is decoupled with bulk ceramic and electrolytic capacitors per the Quartus II power distribution network guidelines. The 672-FBGA package requires a multi-layer PCB with microvia or via-in-pad technology; signal integrity analysis is recommended for all 12 serial links. The part operates over the commercial 0°C to +85°C temperature range and ships in tray packaging, which is standard for high-density FPGAs of this generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single, decision-ready reference for sourcing and integrating the EP1SGX25CF672C5.
EP1SGX25CF672C6 - Stratix GX FPGA 25K LE, 672-BGA | Intel
The Intel / Altera EP1SGX25CF672C6 is a member of the Stratix GX FPGA family that combines high-speed serial transceivers with a scalable, high-performance logic array, delivering 25,660 logic elements and 4 to 20 high-speed transceiver channels with embedded SERDES capability at data rates up to 3.1875 Gbps, housed in a 672-pin FineLine BGA package with 1.0 mm pitch and 27 x 27 mm body. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the customer after manufacturing, making it suitable for hardware acceleration, rapid prototyping, and custom compute pipelines. FPGAs sit hierarchically under programmable logic devices, then programmable logic, then digital ICs, and finally semiconductors. The Stratix GX family specifically targets applications where both rich parallel logic and multi-Gbps serial I/O are required, integrating clock data recovery (CDR) and SERDES channels directly on-die to simplify board layout and reduce BOM cost. Key features of the EP1SGX25CF672C6 include 2,852 Configurable Logic Blocks (CLBs), 455 user I/Os, 1,944,576 bits of embedded memory, and built-in transceiver support for protocols such as Gigabit Ethernet, PCI Express, SerialLite II, and XAUI. The device is built on a 130 nm CMOS process, supports a core voltage of 1.5 V, and operates over the commercial 0 C to +85 C temperature range. The package footprint is a 672-ball FineLine BGA optimized for high-speed signal integrity with matched-length routing and dedicated transceiver power/ground pin assignments. The transceiver architecture includes rate-matching logic compliant with IEEE 802.3 clause 36 for Gigabit Ethernet, ordered-set handling (e.g. /K28.5/+/D16.2/), and per-channel programmable pre-emphasis and equalization. Combined with on-chip PLLs and dedicated clock networks, this enables designers to implement multi-lane serial interfaces without external PHY devices. Typical applications include communications infrastructure (SONET/SDH, OTN, Gigabit Ethernet switches), high-performance digital signal processing for radar and beamforming, industrial automation with real-time control loops, ASIC prototyping, and custom hardware accelerators for data path offload. The device's combination of high logic density and integrated SERDES makes it especially well-suited to protocols requiring both parallel compute and serial connectivity. When designing with this device, allocate sufficient decoupling capacitance near each transceiver power pin and follow Altera's recommended PCB stack-up for 3.125 Gbps operation. Verify signal-integrity simulations against the Stratix GX device handbook guidelines, particularly for the 1.0 mm pitch BGA escape routing. Use the Quartus II design software for place-and-route and timing closure. This page synthesizes distributor pricing, drop-in same-package variants within the Stratix GX family, and practical design notes not consolidated in the manufacturer datasheet.
EP1SGX25CF672C6N - 25K LE Stratix GX FPGA 672-BGA | Intel / Altera
The Intel (formerly Altera) EP1SGX25CF672C6N is a high-density Stratix GX field-programmable gate array (FPGA) with 25,660 logic elements, 4,194,560 bits of embedded memory, and integrated 3.125 Gbps transceivers, packaged in a 672-ball FineLine BGA (FBGA-672). Built on a 130 nm CMOS process with a 1.5 V core supply and 20 channels of high-speed I/O, it belongs to the Stratix GX family designed for high-bandwidth serial interfacing in networking, communications, and signal-processing systems. The device carries a -6 speed grade and a commercial (0 °C to 85 °C) temperature rating, making it suited for general-purpose industrial and prototyping environments. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O resources are user-configurable after manufacture. In the broader IC taxonomy, an FPGA sits under programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Stratix GX specifically extends the Stratix family by adding embedded multi-gigabit transceivers, which historically made the family a workhorse for OC-48 / 2.5 Gbps backplane links, protocol bridging, and DSP co-processing in 1G/10G aggregation equipment. Key features of the EP1SGX25CF672C6N include 2,852 Configurable Logic Blocks (CLBs) organized into 2,566 Logic Array Blocks (LABs), 455 maximum user I/O pins, dedicated 18-bit x 18-bit hardware multipliers for DSP, embedded TriMatrix memory blocks, and up to 4 Mbit of on-chip RAM. The 672-pin FBGA package uses a 1.0 mm ball pitch on a 27 x 27 mm substrate, providing sufficient I/O density for wide parallel buses plus multiple transceiver differential pairs. Architecturally, the device integrates a network of Look-Up Tables (LUTs), carry chains for fast arithmetic, embedded memory, and Phase-Locked Loops (PLLs) for clock management. The 130 nm process and 1.5 V core balance cost against speed: faster than the older 0.18 µm Stratix, slower and lower-power than later 90 nm / 65 nm Stratix II/III generations. Designers typically pair this device with external DDR or QDR SRAM and PHY transceivers for serializer/deserializer (SerDes) links. Typical applications include 1G/10G Ethernet aggregation and switching line cards, SONET/SDH framer interfaces, custom DSP co-processors in software-defined radio (SDR) platforms, protocol-bridging ASIC replacement, and high-speed serial backplane prototyping. Designers also use it as an FPGA-based PCI Express endpoint or RapidIO bridge in telecom baseband cards. When designing with the EP1SGX25CF672C6N, pay attention to the 1.5 V core supply sequencing requirement (VCCINT before VCCIO), the need for a configuration device (EPCS or JTAG), and the maximum I/O toggle rate at the -6 speed grade. The 672-FBGA package requires a 4- to 6-layer PCB with microvia or via-in-pad construction to fan out the 1.0 mm ball pitch. This page synthesizes distributor pricing, same-package drop-in alternatives, and PCB-layout considerations not found in the standalone datasheet, providing engineers a single reference for sourcing, replacement, and design-in decisions.
EP1SGX25CF672C7 - Stratix GX FPGA 25K LE | Altera 672-BGA
The Altera (Intel FPGA) EP1SGX25CF672C7 is a member of the Stratix® GX family of FPGAs, built on a 130 nm CMOS process and offering 25,660 logic elements (cells) and 1,944,576 embedded memory bits in a 672-ball FC-FBGA package. The device integrates up to 455 user I/Os and high-speed embedded transceiver circuitry, making it a member of Intel FPGA's transceiver-equipped programmable logic families. Stratix® GX devices combine general-purpose FPGA fabric with multi-gigabit transceivers, on-chip memory and DSP blocks to support bandwidth-intensive designs. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic cells, interconnect, and I/O blocks can be configured by the end user after manufacture. FPGAs sit between fixed-function ASICs and software-driven processors in terms of flexibility and performance, and are used for custom datapaths, parallel DSP, prototyping, and glue logic. Stratix GX specifically targets high-speed serial I/O applications, complementing the fabric with embedded transceivers for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO and XAUI. Within the broader programmable logic taxonomy: FPGA -> programmable logic device -> logic IC -> integrated circuit. Key features of the EP1SGX25CF672C7 include 2,566 Logic Array Blocks (LABs), 1,944,576 RAM bits, up to 455 user I/Os and integrated transceiver channels capable of multi-gigabit operation. The device operates from a 1.5 V core supply and supports the commercial 0 °C to 85 °C temperature range (C-grade suffix). The 672-ball FineLine BGA package measures 33 × 33 mm with a 1.0 mm ball pitch and is lead-free, though the variant on this page is documented by some sources as RoHS non-compliant (alternates with an "N" suffix carry the Pb-free / RoHS-compliant marking). The EP1SGX25CF672C7 is built on the Stratix GX architecture: each LAB contains ten Logic Elements (LEs) with a 4-input LUT-based look-up table, carry chain, and register file. Embedded TriMatrix memory blocks, DSP blocks for up to ~90 GMACs of throughput, and PLLs are distributed across the fabric. Configuration is via passive serial, fast passive parallel, or JTAG; design entry uses Altera Quartus II / Quartus Prime with IP cores for transceiver protocols. The transceiver blocks support serial rates sufficient for 3.125 Gbps backplane and chip-to-chip links typical of the generation. Typical applications include high-speed serial interface bridging (PCI Express endpoints, Gigabit Ethernet MACs, XAUI backplanes), custom datapath / glue logic for telecom line cards, software-defined radio and signal-intelligence platforms, and prototyping of ASIC designs prior to tape-out. Stratix GX was widely adopted for high-speed serial I/O in line-card and backplane designs, where deterministic latency and protocol-specific IP are critical. The 672-BGA fine-pitch package requires careful PCB layout with matched-length transceiver traces and controlled-impedance routing. When designing with this device, allocate sufficient PCB layers (typically 8+), enforce length matching on all transceiver lanes, and follow Altera's Stratix GX PCB layout guidelines for ball-out and decoupling. Use Quartus II with the Stratix GX device library and the dedicated transceiver Toolkit for link bring-up; ensure the configuration scheme (EPC or JTAG) and clocking topology are validated before tape-out.
EP1SGX25CF672C7N - 25K LE Stratix GX FPGA 672-FBGA | Altera
The Altera (now Intel) EP1SGX25CF672C7N is a member of the Stratix GX family of high-performance FPGAs, integrating 25,660 logic elements with up to 20 channels of embedded multi-gigabit serial transceivers, each supporting data rates up to 3.1875 Gbps. Packaged in a 672-ball FineLine BGA (FC-FBGA) measuring 33 x 33 mm with 1 mm pitch, the device targets high-bandwidth serial I/O applications such as backplanes, line cards, and protocol bridging. It features 1,944,576 bits of embedded memory, 256 logic array blocks (LABs), and 455 user I/O pins, with a core voltage of 1.5 V and a commercial operating temperature grade of 0 to 85 C. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory interfaces, and DSP blocks. Stratix GX devices are positioned in the FPGA hierarchy as high-speed-transceiver-equipped parts - that is, FPGA -> SRAM-based programmable logic -> transceiver-enabled FPGA -> Stratix GX family. The GX suffix denotes integrated multi-gigabit transceivers (MGTs) with embedded CDR (clock data recovery) and SERDES, distinguishing the family from general-purpose Stratix devices. The EP1SGX25CF672C7N sits in the mid-density tier of the original Stratix GX lineup, bridging cost-sensitive designs that still need multi-gigabit serial links. Key features of the EP1SGX25CF672C7N include up to 20 transceiver channels organized in groups of four, on-chip phase-locked loops (PLLs) for clock synthesis and jitter cleanup, dedicated Double Data Rate (DDR) memory interfaces, and TriMatrix embedded memory blocks that can be configured as RAM, ROM, or FIFO. The transceiver blocks support multiple industry-standard protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet when paired with the appropriate soft logic and PHY IP. The 1 mm-pitch FC-FBGA package enables high-density board routing while remaining compatible with conventional multilayer PCB fabrication processes. The internal architecture pairs a fine-grained logic fabric with column- and row-based I/O structures, giving designers predictable timing closure and high utilization rates. Configuration is volatile SRAM, requiring a configuration device (typically an EPCS or EPCQ serial flash) to load the bitstream at power-up. The design entry flow is supported by the Altera Quartus II development environment, with mature IP catalogs for transceiver and memory controller instantiation. Per the original Stratix GX family data sheet, the part is fabricated in a 1.5 V CMOS process with copper interconnect, with the device core divided into multiple voltage islands for the logic fabric, transceivers, and I/O. Typical applications include 10 Gbps line card interfaces for telecommunications switches, serial RapidIO and PCI Express endpoint bridging in storage and embedded computing, high-speed serial backplane aggregation in router and switch fabrics, protocol converter ASIC/FPGA replacement designs, and test equipment requiring flexible multi-protocol serial I/O. The 455 available user I/Os also support parallel LVDS interfaces and high-speed external memory buses, which combined with the on-chip memory make the device well suited for buffer and queue management in networking line cards. A primary design consideration when using the EP1SGX25CF672C7N is the transceiver reference clock and power architecture: each MGT quad requires a clean, low-jitter reference clock and dedicated analog supply rails (1.5 V, 2.5 V) that must be heavily decoupled. PCB layout must follow the Stratix GX transceiver design guidelines for controlled-impedance differential traces, AC-coupling capacitors, and guard ground vias to achieve the rated 3.1875 Gbps bit-error-rate performance. Designers should also budget configuration flash storage and consider dual-boot or remote update paths for in-field firmware revision management. This page synthesizes distributor stock, current pricing, and a same-family drop-in alternatives matrix not found in the original manufacturer datasheet, giving component engineers and procurement specialists a single reference for sourcing and substitution decisions.
EP1SGX25CF672I6 - 25K LEs Stratix GX FPGA, 672-FBGA | Intel
The Intel (formerly Altera) EP1SGX25CF672I6 is a high-density Stratix GX field-programmable gate array (FPGA) combining 25,660 logic elements (LEs) with embedded high-speed transceivers, housed in a 672-ball fine-line ball-grid array (FBGA) package. It provides 1,944,576 bits of embedded RAM organized across 2,566 logic array blocks (LABs), 455 user I/O pins, and operates from a 1.5 V core supply (1.425 V to 1.575 V) with industrial-grade junction temperature range of -40C to 100C. The 130 nm CMOS process delivers system performance up to 5000 MHz internal clocking and integrates 20 dedicated transceiver channels supporting multi-gigabit serial protocols, including Gigabit Ethernet, SerialLite, RapidIO, and PCI Express (x1, x4, x8) using the Stratix GX hard IP block. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit in the programmable logic device (PLD) family that combines configurable logic blocks (CLBs/LABs), programmable routing, dedicated DSP blocks, block RAM, and high-speed serial interfaces on a single die. FPGAs sit in the hierarchy: programmable logic -> logic device -> digital IC -> integrated circuit -> semiconductor. The Stratix GX family targets high-bandwidth communications, broadcast video, and data-acquisition systems that require both parallel DSP throughput and multi-gigabit serial I/O without an external PHY. Key differentiating features of the EP1SGX25CF672I6 include embedded serializer/deserializer (SERDES) channels capable of data rates up to 3.125 Gbps per channel, dedicated Double Data Rate (DDR) SDRAM interface circuitry with read/write leveling, 16 DSP blocks delivering up to 224 GMACS performance, and a configurable logic fabric backed by TriMatrix memory architecture. The 672-pin FBGA (27 mm x 27 mm body, 1 mm pitch) supports high signal-count designs while preserving PCB routability through peripheral and array I/O banks. Typical applications include multi-gigabit serial backplanes, broadcast video editing systems, software-defined radio, high-end test and measurement instrumentation, networking line cards with SERDES bridging, and PCI Express endpoint cards. The industrial temperature grade and embedded transceivers make it well suited for telecom baseband, defense signal processing, and storage area network (SAN) switching. When designing with the EP1SGX25CF672I6, follow Altera's Stratix GX pin connection guidelines for the 672-FBGA package, ensure proper decoupling of each transceiver supply rail (VCCA_PLL, VCCH, VCCL), and observe the differential reference clock routing requirements for jitter compliance. Quartus II development software (now Quartus Prime) is required for synthesis, place-and-route, and transceiver configuration.
EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel
The Intel (Altera) EP1SGX25CF672I6N is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements and 2,852 Configurable Logic Blocks (CLBs) into a 672-ball FineLine BGA package (27 mm x 27 mm, 1 mm pitch). The device is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and provides 455 user I/O pins along with up to 20 dedicated high-speed transceivers for serial interconnect. An FPGA (Field-Programmable Gate Array) is a semiconductor logic device whose function is defined by the customer after manufacturing via a configuration bitstream, as opposed to an ASIC whose function is fixed at tape-out. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLD) -> logic IC -> integrated circuit. The Stratix GX sub-family extends the general-purpose Stratix architecture with embedded multi-gigabit transceivers, targeting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, andXAUI. This positions the EP1SGX25CF672I6N at the high-end of the Stratix GX lineup, suitable for serial-bandwidth-intensive designs. Key specifications include 25,660 logic cells, 2,852 CLBs / 2,566 LABs, 455 user I/Os, an operating temperature range of -40 °C to +85 °C (industrial grade, indicated by the I6 suffix), and a lead-free FBGA-672 package. The 'I6' ordering code denotes an industrial-grade temperature range and speed grade 6. The device also integrates dedicated DSP blocks, TriMatrix embedded memory, and a flexible PLL network, giving designers on-chip signal-processing and clock-management resources that eliminate the need for companion logic devices. Typical applications include high-speed serial interface bridges, custom protocol controllers for telecom and datacom line cards, digital video broadcast equipment, and ASIC prototyping. The integrated transceivers run at multi-gigabit data rates, enabling designs that would otherwise require a separate PHY device. When designing with this device, ensure the Quartus II toolchain (Stratix GX device support) is used for synthesis, place-and-route, and bitstream generation. Verify the FBGA-672 PCB land pattern matches the 27 x 27 mm, 1 mm pitch footprint and that decoupling and high-speed serial channel routing follow Intel's Stratix GX hardware reference manual guidance. This page synthesizes distributor pricing, drop-in Stratix GX alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX25CF672I7 - Stratix GX 25K LEs, 672-FBGA FPGA | Intel
The Intel (formerly Altera) EP1SGX25CF672I7 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements, 2,566 combinational logic blocks (CLBs), and up to 1,944,576 bits of embedded memory in a 672-ball FineLine BGA (FC-FBGA) package. Built on a 130 nm CMOS process and operating from a nominal 1.5 V core supply, the device supports embedded high-speed serial transceiver macros that earned the Stratix GX family its name. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks, programmable routing channels, embedded memory blocks, DSP blocks, and (in modern families) hard IP such as transceivers, PLLs, and memory controllers. FPGAs sit at the top of the programmable-logic hierarchy (FPGA > CPLD > PLD > programmable logic) and are used when processors and fixed-function ASICs cannot meet throughput, latency, or parallelism requirements. Key features of the EP1SGX25CF672I7 include the military temperature grade (-65C to +135C), a 4.7 MHz (one source lists 4385.97 MHz) maximum internal clock frequency, a CLB combinatorial delay of approximately 9.48 ns (sibling part figure), and 455 LAB/CLB rows on the Stratix GX fabric. The FC-FBGA-672 package uses 1.00 mm ball pitch and measures 27.00 x 27.00 mm, requiring controlled-impedance PCB design for SERDES links. Typical applications include high-speed serial interface bridging (XAUI, Serial RapidIO, Fibre Channel), telecom line cards, military/aerospace signal processing boards, and ASIC prototyping platforms where the SERDES-rich fabric minimizes external PHY count. When designing with this device, plan the power-decoupling network around the transceiver supply rails first: each high-speed serial link draws significant current and is highly sensitive to rail noise. Use the Quartus II design toolchain (since succeeded by Quartus Prime) for place-and-route and timing closure.
EP1SGX25CF672I7N - Stratix GX FPGA, 25,660 LEs, 672-FBGA | Intel
The Intel EP1SGX25CF672I7N is a high-density Field Programmable Gate Array from the Stratix GX family, featuring 25,660 logic elements (LEs) and 2,566 configurable logic blocks (CLBs) in a 672-ball Fine-pitch BGA (FC-FBGA) package with 1.0 mm ball pitch. Built on a 130 nm CMOS process, the device supports up to 4,385.97 MHz internal clock operation and offers 3.75 Gbps embedded transceiver capability typical of the Stratix GX signal-conditioning fabric. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnects, and embedded memory into a single semiconductor die. In the system hierarchy, an FPGA sits between a general-purpose microcontroller and a custom ASIC: it provides the flexibility of software-defined logic with the deterministic performance of dedicated silicon. FPGAs are widely used for protocol bridging, signal processing, and high-speed serial I/O where standard processors cannot meet latency or throughput requirements. Key features of the EP1SGX25CF672I7N include a 1.5 V core supply, military-grade temperature screening (MILITARY marking per distributor data), embedded 3.125 Gbps transceivers, and DSP blocks for high-speed signal processing. The device includes on-chip TriMatrix memory, PLLs for clock management, and dedicated serial-deserializer (SERDES) channels for backplane and chip-to-chip links. The 672-ball FC-FBGA package exposes roughly 488 user I/O pins (per Stratix GX family datasheet). Typical applications include high-speed serial interface bridging, telecom baseband processing, military and aerospace signal processing, and test & measurement instrumentation. The wide transceiver count and DSP throughput make it well suited for parallel multi-protocol aggregation where deterministic latency matters. When designing with this part, allocate at least 4 PCB layers for power and ground planes, and follow Intel/Altera decoupling guidelines for Stratix GX - a minimum of 0.1 uF and 0.01 uF capacitors within 250 mils of each VCC pin. Note that EP1SGX25CF672I7N is a legacy Stratix GX device; modern Stratix IV/V may be considered for new designs. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Stratix GX family, and practical design notes that go beyond the manufacturer datasheet - enabling faster BOM decisions and PCB reuse across legacy Stratix GX variants.
EP1SGX25CF780I6 - Stratix GX FPGA 25K LE 780-BGA Industrial | Altera
The Altera EP1SGX25CF780I6 is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements, 1,944,576 RAM bits, and 597 user I/Os into a 780-ball FineLine BGA package. The part operates on a 1.5 V core supply (industrial -40°C to +100°C junction range, I6 speed grade) and is rated for up to 20 channels of embedded SERDES transceivers capable of 3.1875 Gbps, making it one of Altera's first FPGA families to combine high-speed serial channels with a high-density programmable logic fabric. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, programmable interconnect, and I/O cells. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function Application-Specific Integrated Circuits (ASICs) and software-programmable processors. The Stratix GX family extends the generic Stratix architecture by integrating multi-gigabit transceivers (MGTs) on-chip, allowing designers to implement protocol bridges, backplane SERDES, and chip-to-chip links without external PHY chips. Designers configure the device via SRAM-based LUTs, so on-board configuration memory is required at every power-up. Key features of the EP1SGX25CF780I6 include 25,660 logic elements, 1,944,576 embedded RAM bits distributed across TriMatrix memory blocks, dedicated DSP blocks for fixed- and floating-point math, and 20 high-speed transceiver channels with embedded Clock Data Recovery (CDR). The 780-pin FineLine BGA (also catalogued as 780-BBGA) gives designers 597 usable user I/Os and is the largest package offered in the EP1SGX25C speed/power bin, supporting pin-compatible migration to denser Stratix GX family members in the same package. The I6 industrial speed bin balances timing margin against power dissipation. The architectural backbone pairs a 1.5 V core with eight global clock networks, embedded PLLs for transceiver and logic clock synthesis, and hard IP for PCI Express, RapidIO, and Serial RapidIO when used with the appropriate soft IP core. Triple-speed Ethernet MACs, DDR SDRAM controllers, and QDR II SRAM interfaces can be instantiated in the logic fabric. Typical applications include multi-gigabit backplane SERDES for line cards and switches, PCIe endpoint and root-complex designs, RAID controller pre-processing pipelines, and high-end ASIC prototyping. The on-chip CDR also suits the part to proprietary chip-to-chip links in storage area networks and broadcast video routing. When designing with this device, allocate sufficient PCB area for the 780-ball BGA fan-out, plan multi-rail decoupling carefully (1.5 V core plus PLL/transceiver analog supplies), and load the configuration bitstream from a supported EPC configuration device at every power-up. The I6 industrial speed grade is appropriate for production hardware but is not AEC-Q100 qualified, so automotive programs should evaluate newer Cyclone or Arria families. This page synthesizes distributor pricing, Stratix GX drop-in alternatives from the same Altera/Intel family, and PCB thermal/layout guidance not collected in any single manufacturer document.
EP1SGX25DE672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
The Altera EP1SGX25DE672C7 is a member of the Stratix GX family of high-performance FPGAs, integrating up to 25,660 logic elements, 1,944,576 RAM bits, and embedded transceivers optimized for high-speed serial I/O in a 672-pin BGA package. The Stratix GX family targets applications requiring multi-gigabit serial connectivity, including communications backplanes, storage-area networking, and broadband access equipment. The device operates from a -40C to +85C ambient temperature range and is offered in the C7 speed grade. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that combines programmable logic blocks, programmable interconnects, and programmable I/O cells. The Stratix GX product line extends this architecture with dedicated high-speed transceiver channels, supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and Fibre Channel. FPGAs are situated within the taxonomy of programmable logic devices (PLD) -> logic devices -> integrated circuits, and serve as silicon platforms for digital signal processing, glue logic, and ASIC prototyping. The EP1SGX25DE672C7 features up to 25,660 logic elements, 1,944,576 bits of embedded RAM, and embedded transceiver circuitry. Designers can leverage the Quartus II design environment for synthesis, place-and-route, and timing closure. The 672-ball BGA package supports high-density board designs where board area and trace density must be maximized. Typical applications include serial backplane interfaces, SONET/SDH framers, fibre channel storage switches, and protocol bridges for telecom equipment. The combination of transceiver capability and DSP-friendly fabric makes this device well suited to communications infrastructure and high-performance data acquisition. When designing with this device, ensure 8-layer or higher PCB stack-up to maintain signal integrity on transceiver channels, and follow Altera's Stratix GX hardware user guide for power-sequencing and decoupling recommendations. The 672-BGA package requires careful thermal management; refer to the device family datasheet for junction-to-ambient thermal resistance. This page synthesizes distributor pricing, package-compatible drop-in alternatives, and design considerations tailored to the EP1SGX25DE672C7 to assist engineers in component selection and second sourcing. Information here complements the official Altera device handbook.
EP1SGX25DF1020C4 - Stratix GX FPGA 25K LE, 1020-pin FBGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020C4 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package, integrating 25,660 logic elements with up to 1,944 Kbit of embedded memory and dedicated 3.125 Gbps transceiver channels. It is built on a 1.5 V core, 0.13 um CMOS SRAM process and is qualified for commercial-temperature operation (C4 speed grade). An FPGA is a reprogrammable integrated circuit that implements arbitrary digital logic through a configurable array of Look-Up Tables (LUTs), flip-flops, and programmable interconnect. FPGAs sit alongside ASICs, microcontrollers, and CPLDs in the programmable logic hierarchy and are typically chosen when design parallelism, high-speed serial I/O, or rapid prototyping is required. The Stratix GX family in particular adds embedded multi-gigabit transceivers (MGTs), positioning it above general-purpose FPGAs but below dedicated ASSPs for high-speed serial. Key features of the EP1SGX25DF1020C4 include 25,660 logic elements, 80 DSP blocks, 20 embedded transceiver channels running up to 3.125 Gbps, a 17 x 17-bit hardware multiplier per DSP block, and dedicated phase-locked loops for clock management. The device also integrates TriMatrix memory (M512, M4K, and M-RAM blocks), supporting up to 1,944 Kbit of RAM, and offers a configurable I/O architecture with LVDS, LVTTL, LVCMOS, SSTL, and HSTL support. The architecture combines embedded transceivers, dedicated DSP blocks, and abundant memory on a single die, enabling high-throughput designs in communications, video imaging, and high-speed serial backplane applications. The high-speed transceiver channels support standards such as Serial RapidIO, 10 Gigabit Ethernet XAUI, and PCI Express x1/x4. Typical applications include 10 Gbps Ethernet line cards, SONET/SDH framer interfaces, Serial RapidIO bridges, high-end broadcast video routers, and base-station digital signal processing. The combination of MGTs and DSP blocks also makes it suitable for software-defined radio pre-processing. When designing with this device, pay close attention to power supply sequencing (core 1.5 V must come up before I/O and analog supplies), thermal management via the exposed die paddle, and JTAG configuration timing. The 1020-ball FBGA requires a controlled-impedance, multi-layer PCB with matched-length traces for the transceiver channels. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes for the EP1SGX25DF1020C4 in a form factor not found in the manufacturer datasheet alone.