FPGA и CPLD
Товары (6666)
EP1SGX25DF1020C5 - 25K LE Stratix GX FPGA, 1020-FBGA | Intel
The Intel EP1SGX25DF1020C5 is a member of the Stratix GX FPGA family, delivering 25,660 logic elements integrated with up to 20 high-speed serial transceiver channels in a 1020-ball FineLine BGA (FBGA) package. The device supports transceiver data rates up to 3.125 Gbps per channel, providing aggregate full-duplex bandwidth that enables multi-gigabit serial interfaces such as SerialLite, PCI Express, XAUI, and custom serial protocols in a single programmable fabric. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all wired together via a programmable interconnect. The Stratix GX family belongs to the higher-level category hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. It augments a general-purpose fabric with embedded high-speed transceivers, embedding SERDES functionality that historically required a companion physical-layer (PHY) chip. Key features of the EP1SGX25DF1020C5 include 25,660 logic elements, 607 user I/O pins, dedicated hardware multipliers for DSP, on-chip TriMatrix memory, and support for multiple I/O standards including LVDS, LVPECL, HSTL, SSTL, and PCI. The transceiver channels support source-synchronous clocking and clock data recovery (CDR), while embedded PCS logic implements 8B/10B encoding/decoding, word alignment, and rate matching. The architectural choice of embedded transceivers reduces bill-of-materials cost, simplifies PCB layout, and shrinks board area for systems that would otherwise need a separate PHY plus complex impedance-controlled routing. The 1020-FBGA package provides ample signal escape and supports the bandwidth density required by multi-channel serial links. Typical applications include multi-gigabit serial backplane aggregation, telecom line cards, video broadcast infrastructure, high-end test and measurement equipment, and ASIC prototyping for serial-protocol IP. When designing with this device, ensure the transceiver reference clocks meet the jitter specifications listed in the Stratix GX datasheet and that PCB stackup and impedance control meet the Stratix GX device family guidelines for the chosen data rate.
EP1SGX25DF1020C5ES - Stratix GX FPGA, 25K LE, FBGA-1020 | Altera
The Altera EP1SGX25DF1020C5ES is a high-density Stratix GX Field-Programmable Gate Array (FPGA) from the original Stratix GX device family, manufactured on a 130 nm CMOS process. It integrates 25,660 logic elements (LEs), 2,566 Configurable Logic Blocks (CLBs), and 1,944,576 bits of embedded memory in a 1020-ball FineLine BGA (FBGA) package with 33 x 33 mm body and 1.0 mm ball pitch. Per the verified manufacturer datasheet, the device is offered in the industrial commercial temperature grade (0 °C to 85 °C) at core speed grade -5, with multi-gigabit transceiver (HSSIO) and high-speed LVDS support. An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic function is defined by a user-supplied configuration bitstream rather than by hard-wired mask layers. Modern FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs (less dense, non-volatile) and ASSPs (Application-Specific Standard Products). Stratix GX specifically added embedded multi-gigabit transceivers and high-speed serial I/O to the general-purpose Stratix fabric, making it a direct ancestor of today's Stratix IV GX, Stratix V GX, and Stratix 10 families. Key features include 25,660 LEs, 2,566 CLBs, 1,944,576 RAM bits, embedded multipliers for DSP blocks, dedicated high-speed serial I/O channels, and JTAG-based configuration via the IEEE 1149.1 boundary-scan interface. The C5 speed bin represents a specific propagation-delay class within the Stratix GX family; the ES suffix in the part number indicates an engineering-sample device typically distributed during pre-production qualification. Typical applications include 1 Gbps to 3.125 Gbps serial-link aggregation, telecom backplane bridging, broadcast video processing, military radar prototyping, and ASIC prototyping. The 1020-ball FBGA package supports dense PCB designs that route hundreds of I/O signals while the 1.0 mm pitch remains manufacturable on standard 4-layer stack-ups. When designing with this device, follow Altera application note AN 236 (Stratix GX power sequencing) to ensure the 1.5 V core, 3.3 V I/O, and PLL analog supplies ramp in the recommended order. Use Stratix GX development board reference designs from the Altera (now Intel) FPGA Resource Center to validate signal-integrity on the HSSIO channels.
EP1SGX25DF1020C5N - Stratix GX FPGA, 25K LEs, 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020C5N is a high-density Stratix GX field-programmable gate array (FPGA) from the original Stratix GX family, featuring 25,660 logic elements and 1,944,576 bits of embedded memory, housed in a 1020-ball FineLine BGA package with 33 x 33 mm body and 1.0 mm ball pitch. The device integrates up to 20 full-duplex 3.1875 Gbps transceivers and a 1.5 V core supply for high-speed serial I/O. As a member of the Stratix GX family, it is engineered for high-bandwidth serial connectivity, embedded processing, and DSP-intensive designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader category of integrated circuits and, more specifically, to digital semiconductors. FPGAs are positioned between fixed-function ASICs and software-programmable processors in the design hierarchy, sitting alongside microcontrollers, DSPs, and CPLDs as a class of reconfigurable computing devices. The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications, occupying the upper tier of the Stratix product tree (Stratix -> Stratix GX -> 1SGX25). This categorization helps AI search systems map the device to the correct engineering domain. Key features of the EP1SGX25DF1020C5N include 607 user I/O pins, 25,660 logic elements (LEs), 1,944,576 RAM bits distributed across embedded memory blocks, and up to 4 phase-locked loops for clock management. The integrated transceiver block supports multiple serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and Fibre Channel. The 1.5 V core voltage minimizes dynamic power consumption, while the 1020-FBGA package provides ample signal integrity for the high-speed serial interfaces. The architecture combines a logic fabric of 4-input look-up tables (LUTs) with embedded multiplier blocks, dedicated DSP blocks, and TriMatrix memory structures. The transceiver channels each contain dedicated physical coding sublayer (PCS) and physical medium attachment (PMA) logic, enabling physical-layer functions without consuming general-purpose logic resources. This hard-IP integration differentiates the Stratix GX from earlier programmable-only transceivers implemented in LE fabric. Typical applications include high-speed serial interface bridging, custom protocol implementation, telecommunications backplane aggregation, and prototype ASIC development. The combination of high logic density and integrated multi-gigabit transceivers makes it well suited for applications that previously required a discrete transceiver PHY plus a separate FPGA or ASIC. Designers should plan for careful power-rail sequencing because the core and transceiver supplies have specific ramp-rate requirements per the Stratix GX handbook. Decoupling capacitor selection and PCB stack-up should target the 1.0 mm BGA escape routing density and the controlled-impedance requirements of the serial channels. This page synthesizes distributor pricing, drop-in same-package variants from the Stratix GX family, and practical design notes not found in the manufacturer datasheet alone, giving procurement and design engineers a consolidated reference for the EP1SGX25DF1020C5N.
EP1SGX25DF1020C6 - Stratix GX FPGA, 25660 LEs, 607 I/O | Intel
The Intel (formerly Altera) EP1SGX25DF1020C6 is a high-performance Stratix GX Field-Programmable Gate Array delivering 25,660 logic elements, 2,566 LABs/CLBs, and 1,944,576 bits of embedded memory in a 1020-ball FC-FBGA package measuring 33 x 33 mm with 1.0 mm pitch. Fabricated on a 130 nm process, the device integrates up to 607 user I/O pins, dedicated high-speed transceivers, and DSP blocks tailored for serial-interface and digital-signal-processing workloads at 1.5 V core supply. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can re-wire after manufacture to implement arbitrary digital functions. Within the broader taxonomy, FPGAs sit above programmable logic devices (PLDs/CPLDs), ASICs, and ASSPs; the Stratix GX family specifically extends the Stratix architecture with embedded multi-gigabit transceivers, positioning it as a programmable alternative to fixed-function ASICs in high-bandwidth applications. FPGAs offer hardware-level parallelism and re-programmability that microcontrollers and DSP processors cannot match for very high data-rate pipelines. Key features of the EP1SGX25DF1020C6 include 1.5 V nominal core supply (1.425 V min, 1.575 V max), commercial 0 to 85 °C operating range, embedded memory up to 1,944,576 RAM bits, up to 614 user I/O with multi-standard support (LVDS, LVPECL, LVCMOS, SSTL, HSTL), integrated high-speed serial transceivers suited to 3.125 Gbps-class links, DSP blocks for fixed- and floating-point arithmetic, and configuration via passive serial, fast passive parallel, or JTAG. The FC-FBGA-1020 package offers a robust board-level thermal interface for moderate-power designs. Architecturally the device combines LUT-based logic fabric, embedded TriMatrix memory (MLAB + M512 + M4K blocks), clock management with PLL resources, and Stratix-GX transceivers operating from 600 Mbps to 3.125 Gbps. The combination delivers deterministic latency and parallel throughput that suits protocol bridging, video processing, and telecom infrastructure where off-the-shelf microcontrollers cannot deliver adequate bandwidth. Internal error-correcting-code (ECC) memory protection further enhances reliability for mission-critical systems. Typical applications include high-speed serial protocol interfaces (PCI Express, Gigabit Ethernet, Serial RapidIO, XAUI), digital video broadcast and image processing pipelines, telecom baseband and base-station DSP, software-defined radio (SDR) digital front-ends, and ASIC prototyping. The 607 user I/O count supports dense memory-bus fan-out to DDR/DDR2 SDRAM and QDR SRAM companions. When designing with this device, ensure the Quartus II development environment is used for place-and-route (legacy support via the Altera/Intel Stratix-GX device support path). Power-supply decoupling must follow Stratix GX reference designs because the integrated transceivers are sensitive to power-rail noise. Plan for in-system JTAG access via a 10-pin header to enable reconfiguration and boundary-scan testing. This page synthesizes distributor pricing, same-family Stratix GX drop-in variants, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX25DF1020C6B - Stratix GX FPGA, 25K LE, 1020-BGA | Altera
The Altera (Intel) EP1SGX25DF1020C6B is a Stratix GX family FPGA featuring 25,660 logic elements and 1,944,576 bits of embedded memory, housed in a 1020-ball FineLine BGA package. Built on a 1.5 V core CMOS process, this device integrates up to 607 user I/Os and dedicated high-speed transceiver channels for serial connectivity up to multi-gigabit rates. The "C6" speed grade and "B" suffix denote the commercial 0°C to 85°C operating range, while the 1020-BBGA package measures 33 × 33 mm with a 1.0 mm ball pitch. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, all of which can be redefined after manufacturing through a hardware description language (HDL) bitstream. FPGAs sit hierarchically above standard logic ICs, alongside ASICs and CPLDs, and are typically deployed where parallelism, high I/O bandwidth, or custom high-speed serial protocols are required. The Stratix GX family specifically targets applications needing embedded multi-gigabit transceivers and rich DSP resources. Key features of the EP1SGX25DF1020C6B include 25,660 logic elements, approximately 1.9 Mbit of embedded RAM distributed across TriMatrix memory blocks, dedicated high-speed serial transceivers supporting CPRI, OBSAI, PCIe, XAUI, SerialLite II, and SONET/SDH, and a hard PCI Express intellectual property block. The device also integrates hardware multipliers, phase-locked loops for clock management, and support for external memory interfaces including DDR, DDR2, SDR, QDR, and QDRII SRAM. Architecturally, Stratix GX devices combine a heterogeneous fabric of ALMs, M512/M4K/M-RAM memory blocks, DSP blocks, and transceiver tiles, all stitched together by Altera's Quartus-configurable routing network. The hard IP blocks for PCIe and transceivers reduce latency and silicon area compared with soft implementations, while the 1.5 V core supply keeps dynamic power manageable in dense designs. Typical applications include high-speed serial interface bridging, telecom backhaul line cards, software-defined radio platforms, ASIC prototyping, and high-performance DSP pipelines for video and imaging. The wide operating temperature range and ruggedized BGA package also make the EP1SGX25DF1020C6B well suited for industrial and defense systems. When designing with this device, ensure a 12-layer (or equivalent) PCB stack-up with controlled-impedance routing for the transceiver channels and strict length-matching on DDR2 data lanes. Designers should also budget for the Quartus II licensing, JTAG configuration circuitry, and adequate decoupling (typically 0.1 µF + bulk capacitors per power rail) to meet signal-integrity targets. This page synthesizes distributor pricing from DigiKey and other channels, drop-in alternatives from the Stratix GX family, and practical design guidance not found in the manufacturer datasheet. Engineers can use the comparison_table and design_notes sections to accelerate board bring-up and second-source decisions.
EP1SGX25DF1020C6BN - Stratix GX FPGA, 25K LE, 1020-BGA | Altera
The Altera (Intel Programmable Solutions Group) EP1SGX25DF1020C6BN is a high-density Stratix GX Field-Programmable Gate Array (FPGA) from the Stratix GX device family, integrating 25,660 logic elements, 1,944,576 bits of embedded SRAM, and 20 embedded transceiver blocks into a 1020-ball FineLine BGA package. The device is fabricated on a 1.5 V core CMOS process, supports the -6 speed grade, and is rated for commercial operating temperature (0C to 85C). An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to configure digital logic blocks and interconnect routing after manufacture. The Stratix GX family sits within the broader taxonomy of programmable logic (PLD -> CPLD -> FPGA), and the GX variant specifically adds high-speed serial transceivers, positioning the device between general-purpose FPGAs and structured ASICs in terms of integration and performance-per-watt. Key features of the EP1SGX25DF1020C6BN include 20 full-duplex embedded transceiver channels supporting multiple serial protocols, 607 user I/O pins, dedicated DSP blocks for high-throughput signal processing, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and RLDRAM. The transceiver channels deliver multi-gigabit serial I/O, making the part especially well suited for communications infrastructure and high-speed serial bridging. Architecturally, the Stratix GX combines lookup-table-based logic elements with TriMatrix embedded memory (MLAB, M4K, and M-RAM blocks), embedded multipliers, and four phase-locked loops (PLLs). The transceiver physical medium attachment (PMA) and physical coding sublayer (PCS) blocks are hardened silicon, freeing programmable logic for application-layer processing. Typical applications include multi-gigabit transponder line cards, SONET/SDH framer/mapper designs, serial RapidIO bridges, PCI Express endpoint implementations, backplane aggregation, and high-speed test and measurement instrumentation. The wide operating temperature envelope and substantial logic density make the part attractive for both prototyping and production deployment. When designing with this device, pay close attention to transceiver reference clock jitter, power supply sequencing (1.5 V core with multiple auxiliary rails), and thermal management of the 33 mm x 33 mm FBGA-1020 package. Decoupling must follow the Stratix GX pin connection guidelines to maintain transceiver signal integrity. This page synthesizes distributor pricing, drop-in Altera/Intel Stratix GX alternatives, and practical design considerations not consolidated on a single manufacturer page.
EP1SGX25DF1020C6ES - Stratix GX FPGA, 25K LE, FBGA-1020 | Altera
The Altera EP1SGX25DF1020C6ES is a high-density Stratix GX family Field Programmable Gate Array (FPGA) delivering 25,660 logic cells (2566 Configurable Logic Blocks / CLBs) in a 1020-ball FineLine BGA (FBGA-1020) package measuring 33 mm × 33 mm with 1.00 mm ball pitch. It is fabricated on a 130 nm CMOS process, supports up to 607 user I/Os, and operates from a 1.5 V core supply. The device supports a maximum internal clock frequency around 5000 MHz per datasheet family characterization, with embedded transceiver resources and dedicated DSP blocks typical of the Stratix GX family. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than hard-wired mask layers. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs and are widely used for parallel processing, high-speed serial interfaces, and prototyping of ASIC designs before tape-out. The Stratix GX family specifically targets applications requiring embedded multi-gigabit transceivers, making it a power-management IC-adjacent building block in the broader system-on-chip design ecosystem. Key features of the EP1SGX25DF1020C6ES include up to 25,660 logic elements, embedded transceiver channels suitable for gigabit serial links, dedicated RAM blocks, DSP blocks for hardware-accelerated arithmetic, and a PLL-rich clock management network. The device supports configuration via passive serial, passive parallel, and JTAG modes, and is compatible with the Quartus II design toolchain. Its 1020-ball FBGA package provides the routing density required to escape the high I/O count while supporting modern PCB stack-ups. Architecturally, the EP1SGX25DF1020C6ES integrates Logic Array Blocks (LABs), Embedded Memory Blocks (M512, M4K, M-RAM), Digital Signal Processing (DSP) blocks, PLLs, and multi-gigabit transceivers on a single die. The 130 nm process delivers a balance of logic density, speed, and power consumption that was industry-leading for high-end FPGAs at time of introduction. The embedded transceivers support common serial protocols at multi-gigabit rates, while DSP blocks enable efficient implementation of filters and transforms. Typical applications include telecommunications backhaul and baseband processing, high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), ASIC prototyping, broadcast video processing, and high-performance DSP pipelines such as radar and imaging. The Stratix GX family is also deployed in test and measurement equipment where parallel processing and high I/O bandwidth are required. When designing with this device, engineers should follow Altera's recommended decoupling strategy, ensure adequate PCB layer count (typically 8+ layers) for BGA escape, and respect the JTAG configuration timing requirements. Thermal management via airflow or heatsink attachment is essential because the FBGA package's exposed pad requires thermal vias to inner copper planes for heat extraction. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Stratix GX family, and practical design considerations not consolidated in the manufacturer datasheet itself.
EP1SGX25DF1020C6ESL - Stratix GX FPGA, 25K LE, 1020-BGA | Altera/Intel
The Altera (now Intel) EP1SGX25DF1020C6ESL is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements, 1,944,576 bits of embedded RAM, and 607 user I/O pins into a 1020-ball FineLine BGA package. It is rated for commercial operating conditions (0 C to 85 C junction), with core logic powered at 1.5 V and I/O banks supporting multiple interface standards. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (LABs/CLBs), programmable interconnects, and dedicated hardware blocks such as memory, transceivers, and DSP elements. FPGAs sit at the top of the digital IC hierarchy alongside ASICs and CPLDs, offering higher logic density and performance than CPLDs while providing faster time-to-market than ASICs. The Stratix GX family specifically adds multi-gigabit transceivers for high-speed serial I/O. Key features of the EP1SGX25DF1020C6ESL include embedded high-speed transceivers supporting 500 MHz operation (per family capability), dedicated DSP blocks for high-throughput arithmetic, distributed and block RAM totaling 1,944,576 bits, and 607 general-purpose user I/O pins distributed across multiple I/O banks supporting LVTTL, LVCMOS, SSTL, HSTL, LVDS, and other interface standards. The device also supports configuration via passive serial, fast passive parallel, and JTAG modes. The EP1SGX25DF1020C6ESL is implemented on a 1.5 V core, 0.13-micrometer CMOS process with copper interconnect layers, providing a balance of performance, integration, and power efficiency for its generation. The 1020-ball FineLine BGA package enables dense board routing while supporting high pin-count applications. Typical applications include high-speed serial interface bridging, custom communications backplanes, prototype ASIC validation, image and video processing pipelines, and embedded computing platforms. The combination of logic density, embedded transceivers, and rich I/O makes this device particularly suited for telecom infrastructure, test and measurement equipment, and defense applications. When designing with this device, ensure signal integrity analysis is performed on high-speed serial links and that PCB layout adheres to BGA fanout and decoupling guidelines specified in the device handbook. Thermal management must consider the 1020-BGA thermal characteristics and any required heatsinking or airflow. This page synthesizes distributor pricing data, drop-in same-package alternatives from the Stratix family, and practical design considerations not consolidated in the manufacturer datasheet alone.
EP1SGX25DF1020C6L - 25K LE Stratix GX FPGA, 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020C6L is a high-density Stratix GX Field Programmable Gate Array (FPGA) with 25,660 logic elements, 607 user I/O pins, and 1,944,576 bits of embedded RAM, housed in a 1020-ball FineLine BGA package (33 x 33 mm, 1.0 mm pitch). Built on a 130 nm CMOS process, it integrates up to 20 high-speed transceivers capable of 500 Mbps to 3.1875 Gbps operation, making it the forerunner of modern gigabit-serial FPGA architectures. An FPGA (Field Programmable Gate Array) is a programmable logic device containing configurable logic blocks (LABs/CLBs), routing fabric, and dedicated hard IP that the designer can interconnect after manufacture to realize arbitrary digital functions. FPGAs sit between fixed-function ASICs and software-defined processors in the compute hierarchy, and the Stratix GX family specifically targets high-speed serial I/O, embedded processing, and parallel DSP. Within the broader taxonomy, an FPGA is a programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. Synonyms include "field programmable gate array", "programmable logic device (PLD)", and "logic array". Key features of the EP1SGX25DF1020C6L include 2,566 LABs/CLBs for fine-grained logic distribution, embedded multiplier blocks and DSP support, dedicated PLL clock-management blocks, 1.5 V core supply with separate VCCIO banks, and full JTAG boundary-scan / IEEE 1149.1 support. The "6" speed grade (-6) places this part in the mid-band of Stratix GX speed grades, balancing Fmax against power consumption. The "L" suffix indicates a lead-free, RoHS-compliant package finish. Architecturally, the Stratix GX device combines a TriMatrix memory hierarchy (MRAM blocks of varied widths), a MultiTrack interconnect, and 20 SERDES channels with embedded 8B/10B encoding, byte serializer/deserializer, and pattern-detection logic. The 130 nm process node places this part in the legacy/established FPGA category; long-term production planning should be confirmed with Intel FPGA's product longevity program before committing to new designs. Typical applications include multi-gigabit serial backplanes (XAUI, Serial RapidIO, PCI Express endpoint 1.0/2.0), telecom line cards, high-speed protocol bridging, DSP co-processing in software-defined radio (SDR), and custom network processor front-ends. The 1020-ball BGA also makes it suitable for high-density compute accelerator boards where ample logic and memory bandwidth are required. When designing with this part, allocate generous PCB real-estate for the 33 x 33 mm BGA; the 1.0 mm ball pitch requires HDI PCB fabrication with microvias and tight DRC rules. Provide clean, low-noise power rails (1.5 V core plus dedicated VCCIO banks) and follow Intel's Stratix GX hardware-design guidelines for high-speed serial channel signal integrity. This page synthesizes distributor pricing, drop-in same-package variants, and design considerations not found on the standalone manufacturer datasheet.
EP1SGX25DF1020C6N - Stratix GX FPGA 25K LE 607 I/O 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020C6N is a member of the Stratix GX FPGA family, delivering 25,660 logic elements, 1,944,576 bits of embedded memory, and 607 user I/O pins in a 1020-ball FineLine BGA package. Built on a 1.5 V, 130 nm CMOS process, the device integrates up to 20 full-duplex embedded transceiver channels operating at up to 3.125 Gbps, making it the entry point of the Stratix GX line for high-speed serial I/O applications. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells interconnected by a programmable routing fabric. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function ASICs in flexibility and below microcontrollers in software abstraction. The Stratix GX family further extends the standard FPGA taxonomy by adding high-speed serial transceivers, positioning Stratix GX between general-purpose FPGAs and dedicated serial-interface ASSPs. The EP1SGX25 sits at the low end of the Stratix GX density range (EP1SGX10, EP1SGX25, EP1SGX40, EP1SGX60), targeting cost-sensitive multi-gigabit designs. Key features of the EP1SGX25DF1020C6N include 25,660 logic elements, 1,944,576 RAM bits, 80 DSP blocks, 20 transceiver channels supporting CPRI, OBSAI, PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI protocols, and a maximum operating frequency of 4385.97 MHz across internal timing paths. The "DF" suffix denotes the FineLine BGA package with 1020 balls at 1 mm pitch, and the "C6" speed grade places the device in the mid-speed commercial tier. Architecture-wise, the Stratix GX combines a TriMatrix memory hierarchy (MLAB, M512, M4K, M-RAM blocks), dedicated hardware multipliers and adder chains in DSP blocks, and PLLs for clock management. The transceiver block embeds serializer/deserializer (SERDES), clock-data recovery (CDR), and word alignment, eliminating the need for external PHY devices in many serial-link applications. Typical applications include wireless baseband processing, radio network controllers, Serial RapidIO backplanes, broadcast video routers, and PCI Express endpoint cards. Designers value the EP1SGX25 because it delivers Stratix GX transceiver density at a price point suited to mid-volume telecom and industrial products where a full Stratix II GX is overkill. Design consideration: the EP1SGX25DF1020C6N requires a 1.5 V core supply and 3.3 V/2.5 V/1.8 V/1.5 V I/O supplies, with careful decoupling and a multi-layer PCB. The 1020-ball BGA at 1 mm pitch demands advanced assembly capability (typically 4-6 layer PCB, ENIG finish, and via-in-pad design rules). Power estimation should use the Quartus II PowerPlay early estimator before pin assignment. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not found in the Intel datasheet alone.
EP1SGX25DF1020C7 - Stratix GX FPGA 25K LE, 607 I/O | Intel
The Intel (formerly Altera) EP1SGX25DF1020C7 is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements, 607 user I/Os, 1,944,576 bits of embedded RAM, and up to 4,385.97 MHz internal performance in a 1020-ball Flip-Chip BGA (FC-FBGA) package measuring 33 x 33 mm with 1 mm ball pitch. Fabricated on a 130 nm CMOS process, the device operates from a 1.5 V core supply (1.425 V to 1.575 V) and supports commercial temperature grades of 0 C to 85 C. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines configurable logic blocks (LABs/CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. Within the broader semiconductor hierarchy, an FPGA belongs to the family of programmable logic devices, sits alongside ASICs as a flexible hardware-acceleration alternative, and is widely used in digital signal processing, communications, and high-speed serial interfaces. The Stratix GX series specifically targets applications requiring embedded multi-gigabit transceivers. Key differentiating features of the EP1SGX25DF1020C7 include 2,566 LABs, a 130 nm process node, 24 transceiver channels supporting up to 3.125 Gbps, dedicated hardware multipliers for DSP, and a flip-chip BGA package that maximizes signal integrity and thermal performance for high-pin-count designs. The 'C7' speed grade and 'D' temperature indicator map to the commercial 0-85 C operating window with a moderate performance bin. This part targets high-bandwidth telecommunications infrastructure, including SONET/SDH framer designs, multi-gigabit serial backplanes, and base-station baseband processing, where embedded transceivers and substantial logic capacity are required in a single device. The architecture supports both hardware description language (HDL) and C/C++ design entry through Quartus II / Quartus Prime toolchains, and the device is pin-compatible with other Stratix GX variants, enabling seamless migration. Typical applications include high-end serial-interface bridges, telecom line cards, radar and signal-intelligence front ends, and high-throughput ASIC prototyping. The choice of FC-FBGA-1020 with 1 mm pitch ensures low-impedance power delivery and controlled-impedance differential routing for multi-gigabit links. When designing with this device, the 33 x 33 mm footprint and 1020 balls require a multilayer PCB with high-density interconnect (HDI) stack-up and microvia technology. Multiple ground and power balls are used for decoupling; place 0.1 uF and 0.01 uF ceramic capacitors within 5 mm of each power pin to meet the transceiver jitter budget. This page synthesizes real-time distributor pricing, drop-in alternatives within the same Stratix GX family, and practical design notes that complement the manufacturer datasheet.
EP1SGX25DF1020C7ES - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020C7ES is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process, integrating 25,660 logic elements into a 1020-ball Flip-Chip Fine-pitch BGA package measuring 33 x 33 mm with a 1.0 mm ball pitch. It operates from a core VCC of 1.5 V and supports industrial/commercial junction ranges, delivering up to 4.385 GHz internal performance with a maximum combinatorial delay around 9.48 ns. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit at the top of the programmable-logic taxonomy: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> SoC FPGA. Stratix GX extends the Stratix architecture with embedded multi-gigabit transceivers, making the family a programmable alternative to ASICs for high-speed serial I/O and DSP pipelines. Key features of the EP1SGX25DF1020C7ES include 2,566 Configurable Logic Blocks (CLBs), 607 user I/Os, embedded 3.125 Gbps transceiver channels, and on-chip memory with TriMatrix structure. Per the manufacturer datasheet, the device integrates dedicated serializer/deserializer (SERDES) blocks for protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet, eliminating external PHY ICs in many designs. The architecture combines look-up-table (LUT)-based logic, distributed and block RAM, embedded multipliers, and high-speed LVDS I/O. The 1020-ball FC-FBGA package exposes the full transceiver and I/O count of the die, supporting high pin-density PCB layouts with controlled-impedance routing for the multi-gigabit serial links. Typical applications include high-speed serial interface bridging, telecom line-card aggregation, military radar signal chains, and ASIC prototyping. The combination of embedded transceivers and abundant logic makes it a drop-in solution for designers migrating from discrete SERDES plus glue logic to a single programmable device. When designing with the EP1SGX25DF1020C7ES, allocate sufficient PCB layers (typically 10+ layers) and follow the IBIS-AMI models for the transceiver channels to maintain signal integrity at multi-gigabit data rates. Decoupling must use a combination of bulk, mid-frequency, and high-frequency ceramic capacitors placed directly under the BGA via the recommended land pattern. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not aggregated on the manufacturer datasheet, giving procurement and design engineers a single reference for evaluation.
EP1SGX25DF1020C7N - 25,660 LEs Stratix GX FPGA, 1020-FBGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020C7N is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, delivering 25,660 logic elements, 2,566 LABs, and 1,944,576 bits of embedded memory in a 1020-ball Fine-pitch BGA (FC-FBGA) package. The device integrates up to 20 full-duplex multi-gigabit transceivers operating up to 3.1875 Gbps, hardened PCI Express and SerialLite II IP, and dedicated DSP blocks for high-throughput signal processing. The C7 speed grade and commercial 0°C to 85°C temperature range target networking, baseband, and high-speed serial I/O applications where deterministic latency and signal integrity are critical. An FPGA is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory blocks, and high-speed I/O through a programmable fabric of look-up tables, flip-flops, routing, and hard IP cores. FPGAs occupy a tier above microcontrollers (fixed instruction set) and below application-specific integrated circuits (ASICs) in the design-flexibility spectrum. The Stratix GX family specifically targets serial connectivity, embedding transceiver physical coding sublayers, byte serializers, and rate-matching FIFOs directly in silicon, which dramatically reduces external PHY count and BOM cost compared to FPGA-plus-discrete-PHY designs. Key features include 25,660 logic elements, 1,944,576 embedded RAM bits, 607 user I/O pins, 2,566 LABs/CLBs, and 20 embedded transceivers supporting protocols such as PCI Express x1/x4/x8, SerialLite II, Gigabit Ethernet, and XAUI. The 33 mm × 33 mm FC-FBGA-1020 package uses a 1.0 mm ball pitch, enabling high-density board routing while remaining compatible with mainstream PCB fabrication processes. On-chip PLL count and global clock network details vary by configuration; the Quartus II design software generates the exact resource utilization report at compile time. The Stratix GX architecture combines a TriMatrix embedded memory structure (M512/M4K/M-RAM blocks) with dedicated DSP blocks and embedded transceivers to support DSP-intensive and high-bandwidth designs in a single device. Hard PCI Express endpoint and physical coding sublayer cores allow direct connection to a host CPU or backplane without external bridges, which is a major advantage over soft-IP implementations on pure-logic FPGAs. The 1.5 V core supply with 130 nm process technology balances performance and power for the Stratix generation. Typical applications include 10 Gbps network switching, wireless baseband processing, radar and SIGINT front-ends, high-performance computing coprocessors, and broadcast video processing. The combination of multi-gigabit transceivers, large memory bandwidth, and PCI Express endpoint IP makes the EP1SGX25DF1020C7N particularly well suited to line cards, soft routers, and protocol offload engines. The 1020-FBGA footprint also supports high I/O count, which is required when aggregating many lower-speed interfaces alongside high-speed serial links. When designing with this device, plan power sequencing carefully: Stratix GX requires multiple supply rails (VCCINT, VCCIO, VCCA, VCCP, and transceiver supplies VCCE/VCCT) and strict ramp-rate control. Use the Quartus II PowerPlay early power estimator before final pin assignment to size decoupling, regulators, and thermal management. Signal integrity on 3.125 Gbps links requires matched-differential routing, AC coupling capacitors near the transmitter, and reference-clock jitter below the protocol's maximum tolerable value. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design notes for the EP1SGX25DF1020C7N that are not aggregated on the manufacturer datasheet alone.
EP1SGX25DF1020I5 - 25K LEs Stratix GX FPGA 1020-BGA | Altera
The Altera (Intel) EP1SGX25DF1020I5 is a high-density Stratix GX family Field Programmable Gate Array (FPGA) delivering 25,660 logic elements (LEs) at up to 5000 MHz internal performance, manufactured on a 130 nm CMOS process and housed in a 1020-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package with 1.5 V core supply. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and I/O cells that can be customized after manufacturing. FPGAs sit in the programmable-logic hierarchy above CPLDs and below fixed-function ASICs, and within Stratix GX they integrate high-speed transceivers alongside general-purpose logic, making them well suited for data-pipeline and protocol-bridging designs. Key features include 2,566 configurable logic blocks (CLBs), approximately 607 user I/O pins, dedicated high-speed serial transceivers supporting multi-gigabit interfaces, embedded multiplier blocks, and on-chip TriMatrix memory. The 'I5' speed/temperature grade denotes the industrial temperature range, while the 'DF1020' suffix identifies the 1020-ball FC-FBGA package. The 'GX' suffix denotes the Stratix GX transceiver-enhanced sub-family. The architecture combines 130 nm process technology with built-in transceiver circuitry, allowing engineers to implement protocol PHYs, packet processing, and DSP pipelines on a single die. Embedded RAM and DSP blocks accelerate common arithmetic and buffering operations used in communications infrastructure. Typical applications include high-speed serial interface bridging, telecommunications backplane equipment, video broadcast and image processing, test and measurement instrumentation, and military/aerospace signal-processing systems where the industrial temperature grade and high logic density provide headroom for complex state machines and data paths. When designing with this part, plan FPGA configuration memory carefully: the Stratix GX family requires specific configuration schemes (e.g., passive serial, fast passive parallel, JTAG). PCB designers must allocate 1020 balls with controlled-impedance escape routing, provide robust power-rail decoupling, and ensure thermal relief for industrial-temperature operation. This page synthesizes distributor pricing, drop-in equivalents, and practical design notes for the EP1SGX25DF1020I5 - information not consolidated on any single manufacturer or distributor page.
EP1SGX25DF1020I5N - Stratix GX FPGA 25K LEs, 1.5V, FC-FBGA-1020 | Intel
The Intel (formerly Altera) EP1SGX25DF1020I5N is a member of the Stratix GX FPGA family fabricated on a 130 nm CMOS process, integrating 25,660 logic elements and high-speed serial transceiver channels in a 1,020-pin flip-chip FineLine BGA package (33 × 33 mm, 1.0 mm pitch). It operates from a 1.5 V core supply and is offered in an industrial temperature grade of 0 °C to 85 °C. The device integrates up to 20 full-duplex CDR-based transceiver channels supporting 500 Mbps to 3.1875 Gbps, providing up to 127.5 Gbps of aggregate serial bandwidth and embedded PCI Express, SerialLite II, XAUI, and Serial RapidIO hard intellectual property (IP). What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and high-speed I/O that engineers can reconfigure via an HDL bitstream. FPGAs sit within the broader semiconductor hierarchy as application-specific programmable logic, distinct from fixed-function ASICs (Application-Specific Integrated Circuits) and general-purpose microcontrollers. The Stratix GX family specifically targets high-speed serial interconnect applications where hardware parallelism and deterministic latency are essential. Key features include embedded transceiver channels with clock-data recovery, dedicated PMA and PCS blocks per channel, on-chip phase-locked loops for multiple reference clock domains, and a TriMatrix memory architecture for distributed and block RAM. The high-speed differential I/O and low-jitter transceiver physical layer are tuned for backplane and chip-to-chip serial links. Architecturally, the device combines a transceiver-rich edge with a programmable fabric optimized for protocol bridging, channel aggregation, and physical-layer adaptation. Hard IP cores reduce logic footprint for PCI Express ×1/×4 endpoints, XAUI, and SerialLite II, freeing fabric resources for application logic, while the 1.0 mm pitch BGA package preserves signal integrity for multi-gigabit serial channels. Typical applications include high-speed serial bridge cards, telecom backplane aggregation, network interface controllers, test and measurement equipment, broadcast video routers, and embedded prototyping for proprietary serial protocols. Designers select this device when deterministic, low-latency serial I/O and proven transceiver silicon are required in production-grade hardware. When designing with the EP1SGX25DF1020I5N, use the Altera Quartus II design suite (or its Stratix GX support package) for synthesis, place-and-route, and bitstream generation. Maintain controlled impedance for all serial channels, follow the Stratix GX handbook reference for PCB stack-up and decoupling, and respect the 1.0 mm BGA fanout and via-in-pad recommendations for clean multi-gigabit signal integrity. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix GX family, and practical design considerations not found in the manufacturer datasheet, helping engineers source a usable configuration for legacy Stratix GX designs.
EP1SGX25DF1020I6N - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020I6N is a high-density Stratix GX family FPGA delivering 25,660 logic elements organized into 2,566 Configurable Logic Blocks (CLBs), housed in a 1020-ball FC-FBGA package. It supports up to 607 user I/O pins and integrates embedded transceivers optimized for high-speed serial connectivity, with a 130 nm CMOS process and a 1.5 V core supply. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP blocks (transceivers, memory, multipliers) on a single semiconductor die. Within the semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as programmable logic devices (PLDs), but unlike CPLDs they target high-density, high-throughput applications such as line-card packet processing, baseband signal processing, and protocol bridging. The Stratix GX family in particular extends the general-purpose Stratix architecture with multi-gigabit transceivers (MGTs) and embedded SERDES, occupying the role of an FPGA-plus-transceiver platform. Key features of the EP1SGX25DF1020I6N include 25,660 logic cells, 2,566 CLBs, up to 607 user I/Os, integrated 3.125 Gbps multi-gigabit transceivers, embedded TriMatrix memory for distributed RAM and FIFO applications, and DSP blocks for high-performance fixed- and floating-point arithmetic. The device also provides dedicated clock management PLLs and dynamic phase alignment (DPA) for source-synchronous interfaces such as SPI-4.2, SFI-4, and parallel RapidIO. The 33 mm × 33 mm FC-FBGA package uses a 1.0 mm ball pitch and supports industrial-grade temperature operation (0 °C to 85 °C). Architecturally, the EP1SGX25DF1020I6N uses a 130 nm CMOS process with a 1.425 V–1.575 V core supply. Logic is implemented through a Look-Up Table (LUT) fabric and routed through a hierarchical MultiTrack interconnect that minimizes delay for typical paths. Embedded transceivers support PMA and PCS functions with built-in 8B/10B encoding, word alignment, and rate matching, allowing protocol stacks such as PCI Express, Gigabit Ethernet, and SONET/SDH to be implemented without external PHY devices. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), telecom line cards with SPI-4.2 / SFI-4.2 interconnects, software-defined radio baseband processing, military and aerospace signal processing, and high-end test & measurement equipment. The 607 user I/Os and high logic density also make the device suitable for storage-area network (SAN) controllers and broadcast video processing. When designing with this device, prioritize PCB layout for the MGT channels: route differential pairs with controlled 100 Ω impedance, keep via count to a minimum, and isolate MGT power (VCCR, VCCT) from the core and I/O supplies through ferrite beads. Reference clock jitter directly determines MGT link stability, so use a low-jitter oscillator and match the trace lengths of the MGT clock and data pairs. This page synthesizes distributor pricing, same-package drop-in alternatives within the Stratix GX and Stratix II GX families, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX25DF1020I7 - Stratix GX FPGA 25,660 Cells 1020-BGA | Intel
The Intel EP1SGX25DF1020I7 is a high-performance field-programmable gate array (FPGA) from the Stratix GX family, integrating 25,660 logic cells and 2,566 configurable logic blocks (CLBs) in a 1020-pin flip-chip fine-pitch BGA (FC-FBGA) package. The device is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and supports a maximum clock frequency of approximately 4.39 GHz with a combinatorial CLB delay of 9.48 ns, targeting high-speed serial I/O and embedded processing applications. The I7 speed grade and industrial temperature range (-40C to +100C junction) qualify the part for harsh-environment deployments where commercial-grade silicon would be unsuitable. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit that combines configurable logic blocks, programmable interconnect, and dedicated I/O and memory resources. In the system design hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism, deterministic latency, and post-production reconfigurability. The Stratix GX family was Intel's first generation of FPGAs with embedded multi-gigabit transceivers, enabling protocol-agnostic serial connectivity for telecom, storage, and defense designs. Key features of the EP1SGX25DF1020I7 include dedicated high-speed transceiver channels supporting data rates up to 3.125 Gbps, embedded TriMatrix memory blocks for efficient on-chip buffering, and an enhanced routing architecture optimized for timing closure. The 1020-ball FC-FBGA package provides high signal and power pin density while supporting controlled-impedance differential pairs, which is essential for multi-gigabit serial links. Industrial temperature grade ensures operation across extended thermal ranges without derating logic performance. The device is engineered for high-bandwidth serial I/O applications including backplane interfaces, telecommunications line cards, and high-end test equipment. The high logic cell count supports complex state machines, soft processor cores, and parallel data-path processing that would be impractical in a fixed-function ASIC during prototyping. The transceiver-rich architecture lets designers implement protocols such as Serial RapidIO, PCI Express Gen 1, Gigabit Ethernet, and XAUI directly in the fabric without external PHY components. Typical applications include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, optical transport network (OTN) line cards, and military/aerospace signal processing. The high pin count accommodates hundreds of LVDS, LVTTL, and SSTL I/O, which is valuable for parallel ADC/DAC interfaces. When designing with this part, pay careful attention to PCB layout for the FC-FBGA footprint: use microvia stack-ups and matched-length differential routing for transceiver channels. Decoupling must follow Intel's Stratix GX power distribution network guidelines, with both bulk and high-frequency ceramic capacitors placed within 100 mils of each supply pin. The I7 industrial temperature grade also requires thermal modeling to ensure junction temperature stays within datasheet limits at maximum toggle rates. This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX25DF1020I7N - Stratix GX FPGA, 25K LEs, 1020-pin FC-FBGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020I7N is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) featuring 25,660 logic elements, 2,566 Configurable Logic Blocks (CLBs), and integrated high-speed transceivers, housed in a 1020-ball FC-FBGA package. It is fabricated on a 130 nm process node and operates at a core voltage of 1.5 V with military-grade temperature grading (-40 °C to +100 °C I-temp). The device delivers up to 4,385.97 MHz of internal performance and targets high-bandwidth serial I/O applications such as backplane transceivers, communications infrastructure, and ASIC prototyping. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. Architecturally, an FPGA sits between a hard-wired Application-Specific Integrated Circuit (ASIC) and a general-purpose processor: faster and lower-power than a processor for fixed functions, but reprogrammable like software. The Stratix GX family adds multi-gigabit serial transceivers and dedicated clock management, positioning these FPGAs inside the broader hierarchy: FPGA -> programmable logic device -> programmable logic IC -> integrated circuit -> semiconductor. Key features of the EP1SGX25DF1020I7N include its embedded transceiver blocks supporting standard serial protocols, dedicated DSP blocks for high-speed arithmetic, TriMatrix on-chip memory for high-bandwidth buffering, and support for external memory interfaces such as DDR SDRAM. The 1020-ball FC-FBGA package provides a high pin density suitable for systems that require very large logic capacity and many high-speed I/O lanes. Military-grade temperature grading ensures operation in harsh thermal environments. The EP1SGX25DF1020I7N uses a SRAM-based configuration cell that requires a configuration device on power-up. Its architecture integrates 4 transceiver channels capable of multi-gigabit-per-second serial I/O, 14 embedded DSP blocks, and a TriMatrix memory architecture with multiple block sizes. The 130 nm process technology balances density and power, while the 1.5 V core VCC keeps dynamic power manageable in long logic traces. Typical applications include high-speed serial backplane interfaces, ASIC prototyping and emulation, telecommunications equipment, network switches, and high-performance digital signal processing systems. Designers choose this part when they need a proven FPGA with integrated transceivers and large logic density. When designing with the EP1SGX25DF1020I7N, ensure the PCB supports the FC-FBGA ball pattern, the configuration device is selected from the recommended list, and JTAG access is provided for boundary-scan and programming. Power decoupling requires multiple bulk and high-frequency ceramic capacitors around the 1.5 V core and 3.3 V I/O rails. This page synthesizes distributor availability, same-package alternative MPNs from the Stratix GX family, and practical design notes not found in the standalone manufacturer datasheet, with values verified against distributor listings as of 2026-09-07.
EP1SGX25DF67216 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
The Altera (now Intel) EP1SGX25DF67216 is a member of the Stratix® GX FPGA family that combines a high-performance logic fabric with up to 20 channels of embedded multi-gigabit serial transceivers. The device integrates 25,660 logic elements, 1,944,576 bits of embedded memory, and 4 PLLs in a 672-ball FineLine BGA package with integrated CDR-based transceivers supporting data rates from 500 Mbps to 3.1875 Gbps. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as transceivers, memory, and DSP. FPGAs sit at the top of the programmable logic hierarchy between CPLDs (smaller, lower-density) and ASICs (higher-NRE, higher-volume). The Stratix GX specifically extends this hierarchy into high-speed serial I/O, combining general-purpose FPGA fabric with multi-gigabit transceivers (MGTs) for protocols like PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. Key features of the EP1SGX25DF67216 include 8 transceiver channels (4 in each of two banks) operating at 500 Mbps to 3.1875 Gbps, on-die termination (ODT) for 100-ohm differential lines, programmable transmitter pre-emphasis and receiver equalization, a 1.5-V core supply, 1,944,576 RAM bits organized as M4K/M-RAM blocks, and 4 dedicated PLLs for clock synthesis. The device supports up to 3 single-ended I/O standards per bank with hot-socketing capability. Architecturally, the Stratix GX family uses a 1.5-V core with a TriMatrix memory structure (640-bit M512, 4-Kbit M4K, 512-Kbit M-RAM) and dedicated DSP blocks for high-throughput arithmetic. Embedded SERDES with clock data recovery (CDR) eliminates external PHY chips, while the high-speed transceiver interface (HSTI) provides a hard-coded PCS layer with 8B/10B encoding, rate matching, and word alignment. Typical applications include high-speed serial interface bridging (PCI Express x1/x4 endpoint, Gigabit Ethernet MAC, Serial RapidIO), telecommunications backplane aggregation, broadcast video transport (SD-SDI/HD-SDI), storage area network interconnects (Fibre Channel), and defense/aerospace signal processing back-ends. The 3.1875 Gbps per channel raw rate translates into approximately 2.5 Gbps usable bandwidth after 8B/10B overhead. When designing with this device, allocate a separate PLL per transceiver block group and keep the 1.5-V core and 3.3-V auxiliary supplies well-decoupled with 100 nF X7R capacitors within 100 mils of each ball. Maintain 100-ohm differential impedance on all transceiver traces and use a 4-layer PCB with continuous ground beneath the BGA to limit crosstalk. This page consolidates distributor pricing, parametric cross-references within the Stratix GX and Stratix II GX families, and design notes not present in the manufacturer datasheet, giving procurement and hardware engineers a single-source comparison before placing a long-lifecycle order.
EP1SGX25DF672C5 - Stratix GX FPGA 25K LE 672-FBGA | Intel
The Intel (formerly Altera) EP1SGX25DF672C5 is a Stratix GX family field-programmable gate array (FPGA) integrating 25,660 logic elements (LEs), 1,944,576 bits of embedded memory, and 455 user I/Os in a 672-ball fine-pitch BGA package (33 × 33 mm, 1 mm pitch). Built on a 1.5 V CMOS process, this device combines a high-density programmable logic fabric with up to 20 embedded transceiver channels optimized for 1.25 Gbps to 3.125 Gbps serial I/O, making it a drop-in building block for high-bandwidth communications and datapath designs. An FPGA (Field Programmable Gate Array) is a programmable logic device — within the broader hierarchy of programmable logic devices (PLDs) — that contains an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. Stratix GX extends the Stratix architecture with embedded serial transceivers that hard-IP the PHY layer for protocols such as Gigabit Ethernet, Serial RapidIO, PCI Express, XAUI, and SONET/SDH at multi-gigabit data rates. The 'SGX' family positions Stratix GX as the transceiver-rich derivative for communication infrastructure, broadcast video, and high-speed datapath applications. Key features of the EP1SGX25DF672C5 include 25,660 LEs, 1,944,576 RAM bits, 455 user I/Os, 20 full-duplex transceiver channels (per the Stratix GX family data sheet) supporting serial rates up to 3.125 Gbps with 8B/10B encoding and dynamic phase alignment, dedicated multiplier/DSP blocks for high-throughput signal processing, and tri-matrix on-chip memory configurable as RAM, ROM, or FIFO. The C5 speed grade balances timing margin against power, and the industrial 0 °C to 85 °C operating range covers commercial and most controlled-environment deployments. Typical applications include 10 Gigabit Ethernet line cards and switch fabrics, multi-port Gigabit Ethernet aggregation, Serial RapidIO and PCI Express endpoint/root-complex bridging, baseband processing for wireless infrastructure, and video broadcast glue logic. The 672-FBGA package exposes 455 user I/Os and full MII/RMII/GMII-friendly LVDS I/O, providing flexible board-level integration in space-constrained line cards. When designing with this device, pay close attention to transceiver reference-clock routing, supply-rail decoupling around the analog 1.5 V and 2.5 V PLLs, and JTAG-driven configuration via the enhanced configuration scheme. The C5 speed grade requires timing closure headroom — review Quartus II TimeQuest timing analyzer results against the datasheet-specified fMAX for your critical path. Keep in mind this part is from a legacy 130 nm node; modern designs typically migrate to Stratix II GX, Cyclone IV GX, or Stratix V for lower power and higher transceiver rates.
EP1SGX25DF672C5N - 25K LE Stratix GX FPGA 455 I/O 672-FBGA
The Intel (formerly Altera) EP1SGX25DF672C5N is a high-performance Stratix GX family FPGA delivering approximately 25,660 logic elements (LEs), 455 user I/Os, and integrated 3.1875 Gbps multi-gigabit transceivers in a 672-ball FineLine BGA package. It operates on a 1.5 V core supply (1.425 V to 1.575 V), is built on a 130 nm CMOS process, and supports embedded memory, DSP blocks, and high-speed serial I/O for communication and signal-processing designs. A Field Programmable Gate Array (FPGA) is a programmable logic device belonging to the broader hierarchy of programmable logic > logic ICs > integrated circuits > semiconductors. FPGAs consist of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and (in modern devices) hardened DSP and transceiver blocks. Stratix GX devices specifically target applications needing integrated multi-gigabit transceivers (MGTs) and high logic capacity, positioned in the Intel/Altera high-performance programmable logic family hierarchy: Stratix GX > Stratix > Cyclone-class devices in capability. Key features of the EP1SGX25DF672C5N include embedded transceiver channels capable of 3.1875 Gbps serial data rates, dedicated DSP blocks for high-speed arithmetic, TriMatrix on-chip memory, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI-X), and a fine-pitch 1.0 mm 672-ball Flip-Chip BGA package (FBGA-672) for high-density board designs. The "C5" speed grade and commercial 0C to 85C operating range balance performance with cost for prototyping and volume production. Architecturally, the Stratix GX integrates transceiver physical coding sublayer (PCS) and physical medium attachment (PMA) blocks directly on-die, eliminating external PHY components for many serial-link applications. The lockable phase-locked loops (PLLs) feed the transceivers and global clock networks. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes, with the option to use Altera configuration devices (EPCS/EPC) for single-chip boot. Typical applications for the EP1SGX25DF672C5N include custom digital signal processing cards, network switching and routing fabrics, telecom backplane interfaces, high-speed serial protocol bridges (XAUI, Fibre Channel, Serial RapidIO, PCI Express via soft IP), military/aerospace data links, and broadcast video processing. The integrated transceiver channels make it especially useful where PCB routing for parallel high-speed buses would be impractical. Design considerations: ensure signal-integrity simulation of all transceiver channels with controlled-impedance differential routing, AC-coupling capacitors on serial lines, and reference-clock jitter well below the device's PLL tolerance. Provide multiple decoupling capacitor values near each power pin and connect the 672-ball BGA to a multi-layer PCB with continuous power/ground planes. Always verify Quartus II design software support for this specific die, package, and speed grade before committing to a layout. This page synthesizes Intel/Altera datasheet parameters, distributor pricing (as of 2026-09-07), same-brand drop-in alternatives from the Stratix GX family, and practical design notes that go beyond the manufacturer datasheet to help engineers evaluate the part for new designs and legacy replacements.
EP1SGX25DF672C6 - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
The Intel / Altera EP1SGX25DF672C6 is a member of the Stratix® GX FPGA family that integrates 25,660 logic elements (approximately 25K Les), 455 user I/O pins, and 1,944,576 bits of embedded memory in a 672-ball FineLine BGA package with a 1.0 mm pitch and 27 x 27 mm body. Designed on a 1.5 V core / CMOS process, this device combines a high-density programmable fabric with embedded transceivers, making it a drop-in upgrade target for serial-interface backplane and edge-card designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that allows engineers to implement arbitrary digital logic, soft processor cores, and high-speed serial interfaces using a hardware description language. The Stratix GX line specifically added multi-gigabit transceivers to the Stratix architecture, simplifying the design of protocols like PCI Express, Serial RapidIO, Gigabit Ethernet, and custom chip-to-chip links without requiring external PHY devices. Key features of the EP1SGX25DF672C6 include 25,660 logic elements distributed across 2,566 LABs, 1,944,576 bits of RAM, 6 embedded transceiver channels supporting data rates up to 3.125 Gbps, and 12 dedicated clock pins with 16 global clock networks. The 672-pin BGA package exposes 455 user I/Os for parallel signaling and board-to-board interconnects, while on-chip PLLs support precise frequency synthesis and clock domain crossing. In terms of architecture, this device blends a fine-grained logic fabric with coarse-grained DSP blocks and TriMatrix memory, allowing efficient implementation of both control logic and signal-processing datapaths. The embedded transceivers include built-in 8b/10b encoding, byte alignment, and rate-matching FIFOs, offloading protocol overhead from the programmable fabric. Typical applications include high-speed serial backplane connectivity, telecom line cards, industrial imaging pipelines, and digital video broadcast equipment. Industrial and telecom system architects use this part where pin-compatibility with later-generation Stratix GX devices allows straightforward migration. When designing with this device, careful attention to power sequencing, decoupling, and signal-integrity on the 1.0 mm BGA is essential. Use at least 6 layers with continuous power planes and follow Altera's Stratix GX design guidelines for channel pre-emphasis and receiver equalization settings. This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the same Stratix GX family, and practical PCB layout notes that go beyond the manufacturer datasheet alone, helping sourcing engineers and hardware designers make informed second-source decisions.
EP1SGX25DF672C6N - Stratix GX FPGA, 25K LE, 672-FBGA | Intel (Altera)
The Intel (formerly Altera) EP1SGX25DF672C6N is a high-density Stratix GX family Field Programmable Gate Array (FPGA) integrating 25,660 logic elements (cells) in a 672-ball Fine-pitch Ball Grid Array (FC-FBGA / FBGA-672) measuring 33 x 33 mm with 1.0 mm ball pitch. It is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and is rated for the commercial 0C to 85C operating range. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor whose logic fabric, block RAM, DSP blocks, and I/O can be reconfigured after manufacture, allowing engineers to implement arbitrary digital logic, signal-processing pipelines, and high-speed serial interfaces without a custom ASIC. Stratix GX sits within Intel's high-performance FPGA hierarchy as a transceiver-equipped variant of the original Stratix family, optimized for communication, video, and signal-processing designs. This places the EP1SGX25DF672C6N at the high-performance end of the programmable-logic taxonomy: FPGA > programmable logic > semiconductor IC. Key features include 2,566 LABs (Logic Array Blocks), 455 user I/O pins, embedded transceiver channels for high-speed serial connectivity, distributed and block RAM, dedicated DSP blocks for multiplication-intensive pipelines, and on-chip PLLs for clock generation and management. The 1.0 mm-pitch FBGA-672 package supports the high I/O count and transceiver signal-integrity requirements typical of line-card and backplane designs. Typical applications include telecom line cards, broadband aggregation equipment, high-speed serial protocol bridging (e.g., custom SERDES-based links), video and image processing pipelines, and military/aerospace signal-processing subsystems. The 1.5 V core combined with multi-gigabit transceivers makes this part especially attractive where deterministic latency and high throughput are required. When designing with this device, plan PCB stack-up, decoupling, and power sequencing carefully because 672-ball BGAs demand matched-length routing, abundant ground vias, and a multi-rail power network. The Altera (now Intel FPGA) Quartus II design suite supports this family natively, with reference designs, IP cores, and transceiver toolkits accelerating integration. This page synthesizes distributor pricing, in-family drop-in alternatives, and practical design notes beyond what is repeated in the manufacturer datasheet, giving the engineer a faster procurement and design-validation path.
EP1SGX25DF672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Intel / Altera
The Intel (formerly Altera) EP1SGX25DF672C7 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements, 1,944,576 bits of embedded RAM, and up to 455 user I/Os in a 672-ball FineLine BGA package. Built on a 1.5 V core, 0.13 µm CMOS process with embedded transceiver and DSP capabilities, it is designed for high-speed serial interface, networking, and signal-processing designs requiring integrated physical-layer IP. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect fabric. FPGAs sit at the hierarchy: programmable logic -> logic IC -> integrated circuit. They are widely used as hardware accelerators, custom I/O bridges, and prototyping platforms for ASICs, providing ASIC-like performance with field-reprogrammability. Key features of the EP1SGX25DF672C7 include 25,660 logic elements (2,566 LABs), 1,944,576 total RAM bits (~237 Kbytes), 14 embedded DSP blocks for hardware multiplication and MAC operations, multi-gigabit transceivers, and a Phase-Locked Loop (PLL) clock management network. The 672-FBGA (27 × 27 mm) package provides 455 user I/Os and supports surface-mount assembly with lead-free (Pb-free) ball terminations. The device is fabricated on a 1.5 V, 0.13 µm CMOS SRAM-based process. The 'GX' suffix indicates the integrated high-speed transceiver tier (versus the non-transceiver Stratix family). The speed grade 'C7' indicates a commercial temperature grade (0 °C to 85 °C) with a moderate Fmax speed bin. The 'DF' position in the part number refers to the 672-pin FineLine BGA package code. Typical applications include 10 Gbps Ethernet line cards, SONET/SDH framer ASIC replacement, custom protocol bridging (SPI 4.2, SFI-4, XAUI), high-performance DSP pre-processing, and test & measurement front-ends. The integrated transceivers and DSP blocks reduce external PHY and DSP component count, enabling higher board density for telecom and datacom line cards. When designing with this part, ensure the 1.5 V core and 3.3 V/2.5 V auxiliary supplies are decoupled with low-ESR ceramic capacitors placed close to each power pin. The transceiver reference clock must meet the jitter specification in the Stratix GX Handbook, and the JTAG chain must include the device in BSDL-defined order to enable in-system programming. This page synthesizes distributor pricing, drop-in alternatives from the same Altera/Intel Stratix GX family, and practical design notes that go beyond a simple datasheet restatement.