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TVP5150AM1PBS - Ultralow-Power NTSC/PAL/SECAM Video Decoder | TI
The Texas Instruments TVP5150AM1PBS is an ultralow-power NTSC/PAL/SECAM analog video decoder that converts baseband composite or S-Video inputs to 8-bit ITU-R BT.656 digital YCbCr 4:2:2 output (or discrete syncs), housed in a 32-terminal TQFP (PBS) package. It integrates a 9-bit high-speed analog-to-digital converter sampling at 27 MHz, two composite or one S-Video input channel with automatic gain control and clamping, and a robust sync detector. Operating from 1.65 V to 1.95 V (digital) and 1.65 V to 1.8 V (analog), it accepts NTSC (J, M, 4.43), PAL (B, D, G, H, I, M, N, Nc), and SECAM (B, D, G, K, K1, L) video standards. A video decoder is an integrated circuit that captures analog composite or S-Video signals and converts them into a digitized component video stream for downstream processing by application processors, SoCs, or display controllers. The device category hierarchy is: video decoder -> analog front-end -> interface IC -> semiconductor. Its role in a typical embedded vision system is to bridge analog cameras or legacy analog video sources (CVBS, Y/C) to modern digital processing pipelines, eliminating the need for external ADCs and sync separators while preserving signal integrity. Key features include a high-speed 9-bit ADC, fully differential CMOS analog preprocessing with AGC and clamping for best signal-to-noise performance, complementary 4-line adaptive comb filtering on both luminance and chrominance paths, Macrovision copy-protection support, and an ultralow-power architecture suited to portable designs. A Genlock/real-time control (RTC) output is generated for synchronizing downstream video encoders in multi-camera or PIP architectures. Technically, the TVP5150AM1 uses a differential analog front end that rejects common-mode noise and supports extended temperature operation from 0°C to 70°C in the PBS package variant. Its register-based I²C control interface exposes luminance, chrominance, hue, brightness, contrast, and sharpness adjustments to the host processor. Typical applications include portable media players, set-top boxes, digital video recorders, video capture cards, automotive infotainment rear-seat entertainment, IP cameras with analog CVBS input, and surveillance DVRs. The wide standard coverage and ultralow-power operation make it suitable for any embedded design that must decode legacy analog video. When designing with this part, pay attention to the I/O supply sequencing constraint: IO_DVDD must track the 1.8 V digital supply and must not be back-powered; an external power-on-reset (POR) or supply sequencing network may be required for multi-supply rails. Place the 27 MHz crystal or clock source within 5 mm of the XTAL pin and use a star-ground topology for the CVBS traces. This page synthesizes distributor pricing, pin-compatible TI replacements (TVP5150AM1PBSR, TVP5150AM1IPBS, TVP5151IPBSR), and practical PCB-layout guidance not found in the manufacturer datasheet alone.
TVP5150PBS - Ultralow-Power NTSC/PAL Video Decoder, 32-TQFP
The Texas Instruments TVP5150PBS is an ultralow-power NTSC/PAL video decoder housed in a 32-pin TQFP (PBS) package. It accepts analog composite or S-Video inputs and converts them to 8-bit ITU-R BT.656 digital video at standard definition, dissipating only 113 mW in typical operation and less than 1 mW in power-down mode. The integrated 9-bit high-speed ADC and fully differential CMOS analog preprocessing channels with clamping and AGC provide best-in-class signal-to-noise performance for mobile and embedded video capture. A video decoder is a mixed-signal interface IC that translates analog broadcast waveforms (NTSC, PAL, SECAM) into digital YCbCr pixel streams for downstream encoders, scalers, or SoCs. Within the broader power-management and interface taxonomy, the TVP5150 belongs to the video front-end category, sitting between an analog sensor or CVBS input and a digital video processor. Its ultralow-power architecture makes it a defining member of the low-power video decoder family, replacing legacy multi-chip decoder solutions with a single integrated device. Key features include support for NTSC (M, N, 4.43) and PAL (B, D, G, H, I, M, N) standards with ITU-R BT.601 sampling, two composite or one S-Video input with on-chip source selection, hardware scaling, brightness/contrast/hue/saturation controls, and a synchronous serial interface for host configuration. The macrovision detection circuitry and chroma trap filtering are integrated to simplify downstream software requirements. The TVP5150 uses a 27 MHz reference clock and produces ITU-R BT.656 output with embedded sync, or alternatively discrete syncs (HSYNC, VSYNC, FIELD) for processors that require them. A synchronous serial host port (I2C-compatible) configures video standard detection, scaling, output format, and test patterns. Internal PLLs regenerate the sample clock from the video input, eliminating the need for external line-locked crystals. Typical applications include portable media players, handheld DVRs, IP network cameras, video doorbells, machine-vision modules, and automotive rear-seat infotainment displays. The 32-TQFP footprint and low power budget make it especially suitable for battery-powered designs where thermal dissipation must be minimized. When designing with the TVP5150PBS, ensure the analog input traces are impedance-controlled (75 ohm) and routed away from digital switching nodes. The 27 MHz reference clock must be stable within 50 ppm to avoid chroma decoding artifacts. Decouple AVDD and DVDD separately with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of the supply pins. This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes that extend beyond the manufacturer datasheet, providing a single reference for engineers selecting or replacing the TVP5150PBS.
TVP5151IPBSR - Ultralow-Power NTSC/PAL/SECAM Video Decoder | TI
The Texas Instruments TVP5151IPBSR is an ultralow-power NTSC/PAL/SECAM video decoder housed in a 32-pin TQFP (PBS) package measuring 5x5 mm. It accepts composite (CVBS) and S-Video analog inputs and converts them to 8-bit ITU-R BT.656 digital video with embedded syncs, or to 8-bit 4:2:2 with discrete syncs. The decoder supports NTSC (J, M, 4.43), PAL (B, D, G, H, I, M, N, Nc), and SECAM (B, D, G, K, K1, L) standards with automatic standards detection and Macrovision copy-protection detection. A video decoder is a mixed-signal integrated circuit that digitizes analog baseband video from cameras, set-top boxes, or playback devices so a digital processor, image signal processor, or display controller can consume the stream. Within the converter family hierarchy, the TVP5151 belongs to video ADCs / video decoders, which sit under data converters, then signal conditioning, then analog front-end ICs. The part integrates a 9-bit ADC front-end, an analog front-end with automatic gain control, chroma processing, and a digital output formatter on a single die. Key specifications include ultralow power consumption (the decoder core draws only 138 mW from a 1.7 V analog and 1.8 V digital supply), a 32-terminal TQFP (PBS) plastic package, and an I2C-compatible host interface for programming output format, brightness, contrast, saturation, hue, and VBI data slicing. The TVP5151I industrial grade supports the -40 C to +85 C temperature range, while the standard TVP5151 supports 0 C to 70 C. The integrated anti-alias filter and 2D/3D comb filter reduce external BOM, enabling compact camera, surveillance, and consumer designs. Typical applications include portable media players, IP/security cameras, video capture cards, machine vision front-ends, digital photo frames, automotive infotainment displays (commercial grade only - TVP5150A is the automotive AEC-Q-qualified variant), and set-top box video output stages. The 138 mW consumption makes it particularly attractive for battery-powered camcorders and handheld capture cards. When designing with this device, ensure a clean analog supply with ferrite-bead isolation between the analog 1.8 V rail and digital 1.8 V rail. Provide a stable 14.31818 MHz VCO reference for the decoder's internal timing recovery. Use series 75-ohm termination at the analog video inputs and route them away from digital switching traces to minimize crosstalk into the ADC. This page synthesizes distributor pricing, drop-in cross-reference alternatives, design notes, and a parametric comparison table not bundled in the manufacturer datasheet, with all values anchored to TI's TVP5151 datasheet and current DigiKey/Mouser inventory as of 2026-10-20.
TVP5154AIPNP - 4-Ch Video Decoder 128-HTQFP | Texas Instruments
The Texas Instruments TVP5154AIPNP is a 4-channel, low-power NTSC/PAL/SECAM video decoder with independent scalers, housed in a 128-pin HTQFP (PNP) PowerPAD package measuring 14x14 mm. Each of the four channels converts analog composite or S-Video inputs into 8-bit ITU-R BT.656 digital video output, with independent scaling and fast locking on a per-channel basis. The device shares a single external crystal across all four decoder channels, simplifying multi-camera security and surveillance designs. A video decoder is an integrated circuit that converts analog baseband video signals (such as those from legacy CCTV cameras, broadcast receivers, or DVD players) into digital component video that can be processed by a host processor, SoC, or FPGA. The TVP5154AIPNP belongs to the broader family of mixed-signal video interface ICs that sit between the analog front end and the digital video pipeline, classified as encoder/decoder/converter ICs within the Interface ICs product hierarchy. Multi-channel decoders like the TVP5154AIPNP are indispensable in modern security DVRs, automotive rear-view systems, and quad-display controllers. Key features include four independent decoder channels each supporting composite (CVBS) and S-Video (Y/C) inputs, automatic NTSC/PAL/SECAM format detection, on-chip anti-aliasing filters, and programmable hue/brightness/contrast/saturation controls. The integrated horizontal and vertical scalers allow each channel to downscale arbitrarily before output to BT.656, dramatically reducing the downstream host CPU load and DMA bandwidth. Internally, the TVP5154AIPNP uses a 9-bit ADC per channel combined with a digital comb filter for chroma/luma separation. The fast-lock PLL achieves full synchronization in under 150 ms, while a single 27 MHz crystal drives all four channels. The host interface is a standard I2C control port, and the video output bus is configurable for 8-bit BT.656 or discrete syncs. Typical applications include 4-channel CCTV security DVRs that record four camera feeds simultaneously, video capture cards for PCIe surveillance backplanes, automotive surround-view systems, and industrial machine-vision inspection rigs where multiple analog cameras are coordinated. Each application benefits from the decoder's small PCB footprint per channel and shared crystal economy. When designing with this device, allocate adequate PCB area for the exposed thermal pad beneath the HTQFP-128 package to dissipate approximately 0.6 W of total power across all four active channels. Decouple all four analog AVDD supplies independently and follow TI's recommended 75-ohm analog input termination at each CVBS pin. This page synthesizes distributor pricing, application notes, and pin-compatible alternatives consolidated from TI's product catalog and authorized distributors, providing practical guidance not always available in the bare datasheet.
TVP5154AIPNPR - 4-Ch PAL/NTSC/SECAM Video Decoder | TI
The Texas Instruments TVP5154AIPNPR is a 4-channel, low-power NTSC/PAL/SECAM video decoder with independent scalers and fast lock, housed in a 128-pin HTQFP (PNP) PowerPAD package measuring 14x14 mm. Each of the four independent channels converts analog composite video (CVBS) or S-Video signals into 8-bit ITU-R BT.656 digital output, with discrete syncs also available. The device operates from a 1.8 V core supply and a 3.3 V I/O supply, drawing very low power per channel which makes it well-suited to dense multi-channel surveillance designs. A video decoder is an analog-front-end IC that digitizes analog broadcast video formats (NTSC, PAL, SECAM) so that downstream processors, DSPs, FPGAs, or SoCs can perform image processing, encoding, or display. The TVP5154A's 4-channel architecture targets space-constrained multi-camera systems; each channel shares one external crystal, but exposes independent control registers, scalers, and output paths so that four simultaneous captures can run at different resolutions. Key features include four independent video-decoder channels, on-chip independent horizontal/vertical scalers, fast-lock PLL per channel, automatic standard detection, 8-bit ITU-R BT.656 / discrete-sync output, I2C control interface, low standby current, and integrated anti-aliasing filters. The fast-lock PLL shortens channel acquisition time, which is critical when sequentially switching between camera inputs. Technically, the TVP5154A uses a 9-bit ADC per channel followed by a comb-filter Y/C separator and a programmable scaler. The 128-pin HTQFP PowerPAD provides a low-thermal-resistance path (theta_JC in single-digit C/W range) so all four channels can operate continuously without active cooling. The device is qualified to the industrial temperature range (-40C to +85C). Typical applications include 4-channel CCTV/DVR surveillance capture cards, multi-channel video conferencing front-ends, automotive multi-camera DVRs, video capture PCIe/USB adapters, and broadcast monitoring equipment. When designing with this part, share one 27 MHz crystal across all four channels and decouple each analog supply pin individually. Place the PowerPAD solder stencil directly under the exposed pad and tie it to a solid analog ground plane for thermal dissipation.
TVP5158IPNPR - 4Ch NTSC/PAL Video Decoder, 128-HTQFP | Texas Instruments
The Texas Instruments TVP5158IPNPR is a four-channel high-quality NTSC/PAL video decoder that digitizes and decodes all popular base-band analog video formats into digital video output. Each of the four channels integrates a 10-bit 27-MSPS analog-to-digital converter (ADC) preceded by an analog input conditioning circuit that clamps the input to a reference and applies anti-alias filtering. The device is offered in a 128-pin HTQFP (PNP) package measuring 14x14 mm with an exposed thermal pad, targeting multi-channel security and machine-vision applications. A video decoder is a mixed-signal integrated circuit that converts analog composite video signals (such as those from CCTV cameras or legacy broadcast outputs) into a digital component video stream for downstream processing by a host processor, SoC, or DSP. The TVP5158 belongs to the broader category of video interface ICs within the interface and signal-chain family. It supports NTSC (J, M, 4.43) and PAL (B, D, G, H, I, M, N, Nc, 60) standards, providing global compatibility for surveillance equipment that must accept feeds from mixed regional cameras. Key features include four fully independent video processing channels, each with its own scaler, 2D noise reduction, auto-contrast enhancement, and flexible output formatting. Independent per-channel scaling allows different display resolutions per input without external logic, while integrated noise reduction cleans low-light analog camera feeds. An I²C control interface manages all programming. The HTQFP-128 (PNP) package provides manageable thermal performance for the four ADCs running simultaneously, suitable for security DVRs, video capture cards, and industrial inspection equipment. The architecture combines four parallel analog front-ends with per-channel digital decoders, enabling concurrent decoding of four composite video streams at up to 27 MSPS per channel. This high integration reduces the bill of materials for multi-channel DVRs by replacing four single-channel decoders plus glue logic with a single chip, simplifying board layout and reducing power consumption in space-limited surveillance chassis. Typical applications include multi-channel digital video recorders (DVRs), surveillance capture cards, multi-camera video mixing equipment, industrial machine-vision systems, and broadcast monitoring receivers. Each application leverages the four independent decoder channels and integrated scaling to consolidate what would otherwise require multiple discrete decoder chips into a single footprint. Designers should pay close attention to PCB layout around the four high-speed analog inputs: each analog input must be guarded by a ground ring and routed as a 75-ohm impedance-controlled differential pair to minimize crosstalk between channels. The exposed thermal pad must be soldered to a continuous ground plane to dissipate heat generated by four concurrent ADCs. This page synthesizes distributor pricing, same-brand alternatives (including the discontinued TVP5158IPNP base part), and practical layout notes that complement the manufacturer datasheet.
TVP5160PNP - NTSC/PAL/SECAM 10-Bit Video Decoder HTQFP-128 | TI
The Texas Instruments TVP5160PNP is a high-quality digital video decoder that digitizes and decodes all popular baseband analog video formats into digital component video, integrating two 11-bit 60-MSPS analog-to-digital converters with analog preprocessors, fixed RGB-to-YUV color space conversion, and Macrovision detection. Housed in a 128-pin HTQFP (PNP) package measuring 14x14 mm, the device supports NTSC (J, M, 4.43), PAL (B, D, G, H, I, M, N, Nc, 60) and SECAM (B, D, G, K, K1, L) composite and S-Video inputs as well as component YPbPr and RGB (SCART) signals. A video decoder is an analog front-end IC that converts legacy analog video waveforms - originally designed for CRT displays - into digital YCbCr component streams for downstream processing by display controllers, scalar ASICs, video processors, or application processors. In the broader taxonomy the TVP5160 sits at: video decoder -> AFE (analog front end) -> display controller companion IC -> multimedia SoC ecosystem IC. Its 3D-YC/5-line comb filter provides robust chroma/luma separation for noisy or weak broadcast signals, while integrated AGC and clamping stages reduce the external BOM typically required around discrete ADCs. Key features include an integrated analog front-end containing two 11-bit 60 MSPS ADCs with clamping and AGC, fixed RGB-to-YUV color space conversion (eliminating external matrix math), robust sync detection optimized for weak and noisy signals as well as VCR playback, Macrovision detection, and 3D-YC / 5-line adaptive comb filtering. The decoder produces digital component video (YCbCr 4:2:2) on its output port for downstream processing. Operating voltage spans 3.0V to 3.6V (3.3V typical) with typical power dissipation of 904 mW. The HTQFP-128 footprint and 0 to 70C operating temperature range target commercial-grade LCD TV and monitor designs. Architecturally, the TVP5160 uses two time-interleaved 11-bit pipelined ADCs feeding an on-chip digital signal processor that performs sync separation, chroma demodulation, comb filtering, and color space conversion. The fixed RGB-to-YUV block is hard-wired (not programmable) which reduces silicon cost versus fully programmable decoders such as the TVP5150. The Macrovision detection path is a passive observer - it does not strip Macrovision, it copies to data so downstream content-protection logic can take the response. Typical applications include LCD TV main boards, monitor main boards, video capture cards, set-top box front-ends, and DVR/PVR baseband inputs. The TVP5160 is particularly useful when accepting multiple legacy input standards (composite CVBS, S-Video Y/C, component YPbPr, SCART RGB) on a single board because one decoder replaces several discrete solutions. The Macrovision detection path also enables DRM-aware DVR designs. When designing with this device, ensure that input ESD protection and 75-ohm termination are placed as close to the connectors as possible because the TVP5160's analog front-end is sensitive to PCB-level mismatches and ESD events. A 27 MHz crystal or external clock drives the ADC sample rate - tolerate +/- 50 ppm for broadcast-grade decoding. This page synthesizes distributor pricing, drop-in alternatives and practical design notes not found in the manufacturer datasheet, enabling a faster engineering decision for LCD TV and monitor main-board designs.
TXB0104-Q1 - 4-Bit Auto-Direction Level Translator | TI
The Texas Instruments TXB0104-Q1 is an automotive-grade 4-bit bidirectional voltage-level translator with automatic direction sensing and +/-15 kV ESD protection, available in a 14-pin TSSOP (PW) package. It translates between two independent supply rails: the A port tracks VCCA from 1.2 V to 3.6 V, while the B port tracks VCCB from 1.65 V to 5.5 V, enabling any-to-any translation between 1.2 V, 1.8 V, 2.5 V, 3.3 V and 5 V logic domains. A voltage-level translator is a logic-family device that allows integrated circuits operating at different supply voltages on the same PCB to exchange digital signals safely. Within the power-and-signal-management hierarchy, it sits alongside buffers and bus switches as a fundamental interface IC, preventing overvoltage damage and ensuring valid logic thresholds between low-voltage MCUs, FPGAs, and 5 V peripherals. Key features include auto-direction sensing, which eliminates the DIR control pins required by '245-style translators, a data rate of up to 100 Mbps, and VCC isolation: when either supply is at GND, all I/O enters Hi-Z. The AEC-Q100-qualified TXB0104-Q1 also carries +/-15 kV HBM ESD protection, exceeding the standard JESD ratings cited in the TI datasheet family. Architecturally, the TXB0104 uses a self-directed, edge-rate-driven one-shot scheme that detects the direction of each transition and briefly strengthens the opposite driver, allowing it to drive 4 channels in either direction without software intervention. The OE pin three-states all outputs for power sequencing and bus isolation. Typical applications include SPI and UART level conversion between 3.3 V MCUs and 5 V peripherals, GPIO expansion in automotive body and infotainment modules, and mixed-voltage FPGA I/O. Note that the push-pull architecture is not recommended for open-drain buses such as I2C or 1-Wire; use the TXS0104E-Q1 for those. Design consideration: keep unloaded outputs low-impedance driven or grounded, since the auto-direction circuitry can oscillate on lightly loaded or capacitively large nets; series resistors above 25 k-ohm are not supported. This page adds value beyond the TI datasheet by synthesizing distributor availability, drop-in alternatives (NXP NTS0304E, ADI ADG3304), and practical design notes for automotive level-shifter selection.
TXB0304RSVR - 4-Bit Bidirectional Level Translator 100Mbps | TI
The Texas Instruments TXB0304RSVR is a 4-bit bidirectional voltage-level translator with automatic direction sensing, designed for mixed-voltage systems. It operates with two separate power-supply rails, VCCA and VCCB, each configurable from 0.9V to 3.6V, and supports data rates up to 100 Mbps in a 16-pin UQFN (RSV) package measuring 2.6mm x 1.8mm, ideal for space-constrained designs. A voltage-level translator is a crucial component in modern electronics, allowing communication between ICs operating at different voltage levels. For example, a 1.8V microcontroller can interface with a 3.3V sensor or memory device without risking damage or logic errors. The TXB0304 belongs to the TXB family of auto-direction-sensing translators, part of TI's broader level-shifting portfolio that includes unidirectional and bidirectional solutions for various interface standards. Key features include a fully symmetric supply range (0.9V to 3.6V on both VCCA and VCCB), automatic direction sensing that detects data flow without external direction control, and a high data rate of 100 Mbps. The device also provides an isolation function: if either VCC input is at GND, all outputs are placed in a high-impedance state, preventing backflow current and protecting the system. Technically, the TXB0304 uses a one-shot circuit to accelerate rising edges, ensuring fast signal propagation even with capacitive loads. The architecture includes a pass-gate transistor with a pull-up resistor on each I/O pin, providing robust translation. The device is specified from -40C to +85C, is RoHS compliant and lead-free. Typical applications include SPI, I2C, UART, and GPIO interfacing between microcontrollers, sensors, memory, and peripherals at different voltage levels, particularly in IoT devices, portable electronics, and industrial control systems. Design tip: ensure both VCCA and VCCB are powered and place decoupling capacitors close to the power pins. Note that push-pull drivers are preferred; open-drain buses require external pull-ups sized carefully.
TXB0604 - 4-Bit Auto-Bidirectional Level Translator 345Mbps | TI
The Texas Instruments TXB0604 is a 4-bit non-inverting auto-bidirectional voltage level translator that uses two separate configurable power-supply rails: the A port tracks VCCA (0.9V to 2V) and the B port tracks VCCB (1.65V to 3.6V), with the constraint VCCA <= VCCB. It supports data rates exceeding 345Mbps with a 15pF load and over 190Mbps with a 100pF load, and is supplied in a 14-pin TSSOP (PWR) package with a 12-pin X2QFN (1.6x1.6mm) option (RWBR). A voltage level translator is an integrated circuit that allows digital signals to cross between different voltage domains, ensuring valid logic levels and signal integrity in mixed-voltage systems. Within the interface hierarchy, level shifters sit between logic devices and buses, and auto-bidirectional translators eliminate the direction-control pin by automatically sensing data flow. Key features include TI's patented architecture achieving high data throughput for memory-intensive interfaces like Quad-SPI between a Baseboard Management Controller (BMC) and Flash devices, without signal-integrity losses from excessive output parasitic capacitance. The device also provides partial power-down protection (Ioff), Vcc disconnect, Vcc isolation, and integrated pull-up resistors on the A and B ports. Wettable-flank packages enhance solder-joint inspection for automotive-quality assembly. Technically, the TXB0604 functions as both a voltage translator and a line redriver: a one-shot edge accelerator sharpens rising edges, reducing propagation delay, while boosted drive strength enables signal boosting over long-cable transmission. Compared to the legacy TXB0104 (100Mbps), the TXB0604 delivers over 3x the data rate with stronger capacitive load driving. Typical applications include Quad-SPI and Octal-SPI buses between BMCs and Flash memory, eSPI interfaces, and mixed-voltage processor-to-peripheral links in servers, networking equipment, and industrial systems. Design tip: always ensure VCCA <= VCCB, place decoupling capacitors close to both supply pins, and avoid floating unused inputs in partial power-down states. Pricing below is as of 2026-08-30.
TXE8124-Q1 - 24-Bit Automotive SPI I/O Expander | TI
The Texas Instruments TXE8124-Q1 is an automotive-grade 24-bit SPI bus I/O expander with interrupt output, reset input, and I/O configuration registers, operating from a 1.65V to 5.5V VCC supply and available in a VQFN-32 (RHB) package. An SPI I/O expander is a type of interface IC within the broader semiconductor hierarchy (interface IC -> I/O expander -> logic/integration device) that adds general-purpose parallel input/output pins to a microcontroller or processor using the four-wire Serial Peripheral Interface protocol. It belongs to the same product family as GPIO extenders and port expanders, and is the SPI counterpart to I2C expanders such as the PCX857x family, offering higher speed and deterministic timing. Key features include 24 configurable GPIO channels with individual I/O configuration registers, a dedicated interrupt output (INT) that flags input state changes to the host controller, and a reset input (RST) for rapid recovery of the register map to a known default state. The device supports both standard point-to-point SPI communication and daisy-chaining of multiple devices, allowing several expanders to share a single SPI chip-select in dense I/O designs. Performance scales with supply voltage: according to the Texas Instruments datasheet, the TXE8124-Q1 supports a 10MHz SPI clock when VCC is 3.3V to 5.5V and 5MHz when VCC is 1.65V to 5.5V. This voltage-flexible operation allows direct interfacing with 1.8V, 2.5V, 3.3V, and 5V logic domains without level translation in many systems. Typical applications include automotive body control modules, gateway ECUs, and infotainment boards that need additional GPIO for switches, push-buttons, sensors, LEDs, fans, and relay drivers when the host processor has exhausted its native GPIO. Daisy-chaining suits seat-control modules and door zones where dozens of switches must share one SPI port. When designing with this device, plan daisy-chain timing budgets around the 10MHz maximum clock and account for the added shift-register latency per cascaded device; also verify the interrupt output is polled or serviced before the register state can change again. This page synthesizes verified distributor and manufacturer data with drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet, giving engineers a single citable reference.
TXE8148DGGR - 48-Bit SPI I/O Expander 10MHz | Texas Instruments
The Texas Instruments TXE8148DGGR is a 48-bit SPI bus I/O expander with interrupt output, reset input, and I/O configurable registers, delivering 48 general-purpose I/Os across six 8-bit ports with 10 MHz SPI operation from a 1.65 V to 5.5 V supply in a 56-pin TSSOP package. An I/O expander is a peripheral interface IC that increases the number of input/output pins available to a host microcontroller or processor without changing the host silicon. In the digital system hierarchy it sits between the host bus master (SPI in this case) and the GPIO load, functioning as a bridge in the broader family of interface ICs. I/O expanders such as the TXE8148 offload pin-count-constrained MCUs, allowing one SPI bus to control dozens of additional digital signals with only four host wires plus chip select. Key features include per-I/O programmable open-drain or push-pull outputs, programmable pullup and pulldown resistors, bus-hold latchable inputs, maskable interrupts with an interrupt status register, and a fail-safe operating mode. The device also supports daisy-chaining of multiple TXE8148 units on a single SPI bus, and documentation is available to aid functional safety system design. Technically, the TXE8148 maintains a 10 MHz SPI bus frequency across the entire 1.65 V to 5.5 V VCC range, which is significant for mixed-voltage designs where many expanders derate speed at low supply. The six-port, eight-I/O-per-port register map gives engineers byte-aligned access to all 48 channels, and the reset input provides deterministic recovery of all registers to a known default state after a fault or watchdog event. Typical applications include industrial control panels that need many switch inputs and relay outputs, functionally safe systems requiring documented failure modes, and server or networking backplanes where a processor must monitor dozens of card-present, fault, and status signals. Design consideration: plan your interrupt strategy early - the maskable interrupt and status register let the host poll a single register instead of 48 GPIOs, but interrupt masks must be configured after every reset since registers return to defaults. This page synthesizes distributor pricing, availability, and practical design guidance not found in the manufacturer datasheet alone.
TXG1010 - 1-Bit ±10V Ground-Level Translator | Texas Instruments
The Texas Instruments TXG1010DSER is a 1-bit, fixed-direction, non-galvanic voltage and ground-level translator supporting logic-level shifting between 1.71V and 5.5V and ground-level shifting of up to ±10V, housed in a small 8-pin SOT-23 (DSE) surface-mount package. A level translator (also called a level shifter or voltage translator) is a logic IC that enables communication between digital circuits operating at different supply voltages, for example a 1.8V microcontroller driving a 5V peripheral. Within the signal-chain hierarchy, the TXG1010 belongs to the voltage-level-translation family of interface ICs. What distinguishes the TXG1010 family from traditional level translators is its ability to shift signals not only between different logic levels but also across different ground domains, solving the challenge of voltage translation between subsystems whose grounds differ by up to ±10V. Key features include a wide 1.71V to 5.5V logic-level translation range, ±10V ground-level shifting capability, a fixed-direction architecture that removes the need for a direction-control pin, and a single-channel (1-bit) topology that minimizes board area. The non-galvanic approach means there is no isolation barrier; the device tolerates ground potential differences rather than providing reinforced isolation, which is an important distinction from digital isolators. Technically, the device translates a logic input referenced to one ground domain into an output referenced to a second ground domain, while simultaneously performing standard low-voltage logic up- or down-translation. The fixed-direction design simplifies control logic and reduces pin count, making it suitable for one-way status, enable, and control signals. Typical applications include ground-offset compensation between a controller and a motor driver, level shifting in automotive and industrial subsystems where ground lift occurs under load, and interfacing between negative-rail or high-side circuitry and a low-voltage MCU. When designing with the TXG1010, remember that it is non-galvanic: sustained ground differences must remain within the ±10V rating, and it should not be used where safety isolation is required. Refer to the manufacturer datasheet for the exact truth table and supply sequencing requirements. This page synthesizes verified distributor and manufacturer data, practical design notes, and selection guidance not found in the datasheet alone. Pricing and stock figures are as of 2026-10-19.
TXG1021-Q1 - ±10V 2-bit Ground-Level Translator | TI
The Texas Instruments TXG1021-Q1 is an automotive-qualified 2-bit, fixed-direction, non-galvanic ground-level translator supporting DC ground shifts up to ±10V and logic-level shifting between 1.71V and 5.5V, with propagation delay under 5ns and data rates above 250Mbps in an 8-pin SOIC package. A ground-level translator is a specialized voltage translator that solves a problem conventional level shifters cannot: signals referenced to grounds that sit at different DC potentials. In a classic automotive or industrial system, heavy load currents lifted through shared harness returns create millivolt-to-volt offsets between a sensor ground and a controller ground. Standard level shifters interpret those offsets as logic errors, while a non-galvanic ground-level translator tolerates the DC offset directly on its inputs while still reproducing clean logic edges at the destination domain. Key features include AEC-Q100 qualification for automotive deployments, DC shift tolerance up to ±10V, AC noise rejection of 20VPP up to 45MHz, and common-mode transient immunity (CMTI) of 1kV/us. Channel-to-channel skew is below 0.20ns and propagation delay stays under 5ns, so the device does not become a timing bottleneck even in fast digital links. Quiescent power consumption is low at approximately 0.8mA per the manufacturer datasheet. Architecturally, the TXG102x family uses a non-galvanic coupling approach rather than isolation barriers, giving it near-zero added latency compared with digital isolators while still rejecting ground potential differences. This makes it attractive for bridging control grounds in battery-managed, motor-driven, or switched-load environments where return paths are far from ideal. Typical applications include automotive body-control and gateway modules, motor inverter gate-drive signaling across shifted grounds, industrial PLC I/O with grounded sensor offsets, and battery-management communication lines where cell-stacking creates ground potential differences. Design consideration: verify that expected DC ground offset stays within the ±10V rating under all load and fault conditions, and follow the datasheet layout guidance for the ground-shifted domain. This page adds value beyond the manufacturer datasheet by synthesizing drop-in alternatives, comparison tables, and practical design notes in one place.
TXG4042-Q1 - Automotive ±40V 4-bit Ground-Level Translator | TI
The Texas Instruments TXG4042-Q1 is an automotive-grade, ±40V, 4-bit fixed-direction ground-tolerant voltage level translator in a 2/2 push-pull configuration, housed in a 16-pin SSOP package. It supports DC ground shifts up to ±40V, AC noise rejection up to 130 VPP at 1 MHz, and a common-mode transient immunity (CMTI) of 1 kV/μs. The device delivers a maximum propagation delay of 8.5 ns, channel-to-channel skew of 2 ns, and supports data rates up to 100 Mbps. Low power consumption is 0.7 mA per channel at 1 Mbps with a 1.8 V supply, making it efficient for always-on automotive networks. The TXG4042-Q1 is specifically designed to interface low-voltage MCUs with high-voltage domains in systems where the grounds are not co-located, such as in EV traction inverters, motor drives, and industrial PLC I/O modules. A ground-level translator (also called a ground-level shifter) is a specialized class of voltage level translator that operates correctly even when the local ground reference of the input side differs substantially from the local ground reference of the output side. Unlike generic level shifters that only translate voltage thresholds, ground-level translators reject large common-mode DC offsets (typically ±25V to ±50V) between the two sides. This category of IC sits within the broader hierarchy of voltage translators -> interface ICs -> signal conditioning -> integrated circuits. They are essential in safety, motor-control, and renewable-energy systems where isolated high-side circuitry must communicate with low-voltage digital controllers over short, non-isolated links. Key features include robust ±40V DC ground-shift tolerance, high AC noise rejection of 130 VPP at 1 MHz, excellent 1 kV/μs CMTI for fast switching transients, push-pull output drivers with edge acceleration for clean edges at high data rates, and a wide 1.71 V to 5.5 V supply range on the low-voltage side. The fixed 2/2 direction (2 inputs / 2 outputs in one direction, 2 in the other) simplifies firmware and eliminates direction-control pins, reducing BOM cost and PCB area. AEC-Q100 qualification makes the TXG4042-Q1 suitable for automotive temperature grade 1 (-40 °C to +125 °C) operation. Architecturally, the TXG4042-Q1 uses TI's capacitorless, two-channel ground-shift topology with internal high-voltage blocking transistors on each channel. The high-voltage side tolerates continuous DC offsets via integrated clamping and ESD structures, while the input/output structures on the low-voltage side are optimized for sub-5 V CMOS logic levels. The device requires no external bootstrap capacitors, inductors, or programming resistors, simplifying PCB layout and reducing BOM count compared to digital isolator-based alternatives. Typical applications include EV traction inverter gate-driver communication, automotive HVAC and body controllers interfacing with high-side sensors, industrial PLC mixed-voltage I/O links, solar inverter string-monitoring interfaces, and battery-management system (BMS) communications across isolated high-voltage domains. It is also well-suited for medical imaging systems, white-goods motor drives, and any application requiring safe digital communication across non-isolated grounds with significant DC offset. When designing with the TXG4042-Q1, ensure the high-voltage side stays within ±40 V relative to the local ground. Place the VCC bypass capacitor as close as possible to the supply pin to maintain noise margins, and avoid long high-side traces to minimize parasitic coupling. For multi-channel applications, observe the 2 ns channel-to-channel skew budget to preserve signal alignment at the receiver. This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes that extend beyond the manufacturer datasheet, giving engineers actionable sourcing and design guidance in one place.
TXG4122 - ±40V Bidirectional I2C Ground-Level Translator | TI
The Texas Instruments TXG4122 is a dual (2-bit) bidirectional, non-galvanic voltage and ground-level translator designed specifically for I2C buses, housed in an 8-pin SOIC (D) package. It tolerates ground potential differences of up to ±40V, supports two separately configurable power-supply rails, and passes I2C signals at data rates up to 2 Mbps. A ground-level translator is a type of logic-level shifter within the broader family of signal interface and level-translation ICs. Unlike conventional voltage translators that shift logic thresholds between two supply domains, a ground-level translator tolerates a DC offset difference between the ground references of two subsystems while passing digital signals intact. This matters in systems where a shared I2C bus spans domains whose grounds sit at different potentials, such as battery-stacked architectures, grounded-inverter motor drives, shunt-referenced sensing, and isolated industrial networks where full galvanic isolation is not required but ground bounce or stacking offsets of tens of volts exist. Key features of the TXG4122 include the ±40V common-mode ground-offset tolerance, true bidirectional I2C signaling without direction-control pins, dual channels in a compact 8-SOIC footprint, and an operating temperature range of -40C to +125C for industrial and automotive-adjacent environments. The non-galvanic topology passes signals resistively/capacitively rather than through a digital isolator barrier, avoiding the propagation delay, quiescent power, and cost of optocoupler or digital-isolator approaches while still blocking the ground offset. Architecturally, the device supports two separate configurable power-supply rails, so the low-voltage controller side and the offset high-voltage side can each run at their own logic levels. Bidirectional open-drain I2C signaling (SDA and SCL) is preserved through the translator, keeping multi-master and clock-stretching behavior intact, which is essential for Standards-Mode (100 kHz) through Fast-Mode (up to the 2 Mbps supported rate) operation. Typical applications include I2C communication across stacked battery modules in energy-storage and e-mobility systems, communication equipment and industrial control where grounds are offset, and interfacing to sense elements riding on a high-voltage rail. Distributor listings note demonstrated use in industrial control, automotive electronics, and communication equipment. Design-wise, verify that the common-mode offset stays within the ±40V window under all fault and transient conditions, and keep pull-up resistor values appropriate for the 2 Mbps data rate so rise times remain within the I2C specification. This page synthesizes distributor listings, TI product data, and practical engineering guidance not found in a single source, offering an engineer-oriented view of the TXG4122.
TXS0102-Q1 - 2-Bit Auto-Direction Level Translator | TI
The Texas Instruments TXS0102-Q1 is an automotive-grade, 2-bit bidirectional voltage-level translator for open-drain and push-pull applications, offered in an 8-pin VSSOP (DCU) package. It supports data rates up to 24 Mbps and interfaces logic operating at different voltage levels without a direction-control pin. A voltage-level translator, or level shifter, is a logic IC that connects incompatible logic families or systems operating at different supply voltages, such as a 1.65V microcontroller communicating with a 3.3V or 5V peripheral. Within the signal-chain hierarchy, level translators sit between logic ICs and interface ICs, enabling safe chip-to-chip communication where voltage mismatch would otherwise damage a driver or fail to meet input thresholds. Key features include auto-direction sensing on both channels, A-port supply (VCCA) from 1.2V to 3.6V and B-port supply (VCCB) from 1.65V to 5.5V, an output-enable (OE) input referenced to VCCA that places all I/O in high impedance when low, and internal 10 kOhm pull-up resistors on the I/Os that make the device ideal for open-drain drivers such as I2C buses. The -Q1 suffix denotes AEC-Q100 qualification for automotive applications. Technically, the TXS0102 architecture uses two NMOS pass transistors with 10 kOhm pull-ups per I/O, allowing either port to drive the signal while the opposite side is pulled to its rail. This push-pull capability plus open-drain support distinguishes it from passive FET translators and fixed-direction buffers. Typical applications include I2C and SMBus level translation in automotive body electronics, UART and GPIO bridging in cluster and infotainment modules, and low-speed sensor interface translation between 1.8V MCUs and 3.3V peripherals. Design tip: tie OE to GND through a pull-down resistor to guarantee high impedance during power-up, and for push-pull drivers note that the internal 10 kOhm pull-ups limit edge rates at heavy capacitive loads.
TXS0108EQPWRQ1 - 8-Bit Auto-Direction Level Shifter | TI
The Texas Instruments TXS0108EQPWRQ1 is an automotive-grade, 8-bit bidirectional voltage level translator in a 20-pin TSSOP (PW) package, qualified per AEC-Q100 temperature grade 1 (-40C to +125C). It requires no direction-control signal because its auto-direction sensing architecture detects data flow on each channel independently, supporting both push-pull and open-drain applications. A voltage level translator (also called a logic level shifter or voltage translation IC) is an interface component in the broader logic and interface IC family that safely bridges digital devices operating at different supply domains, for example a 1.8V microcontroller talking to a 5V sensor. Level shifters protect low-voltage I/O from overvoltage while preserving logic thresholds, edge rates, and signal integrity across the voltage boundary. Key specifications include a wide VCCA range of 1.2V to 3.6V and VCCB range of 1.65V to 5.5V, enabling translation between almost any two common logic rails. Push-pull data rates reach 110 Mbps while open-drain operation supports 2 Mbps with integrated 10 kOhm pull-up resistors. The device also offers an OE pin for 3-state operation during power sequencing and classified HBM ESD level 2 and CDM level C6 robustness per TI data. Architecturally, the TXS0108E uses one-shot edge-rate accelerators on each channel to improve rise times, combined with a 4 kOhm series pass-gate element; this open-drain-friendly structure means it is not recommended for applications needing high drive strength such as direct LED loads. Typical applications include automotive infotainment and body-control module I/O translation, sensor and CAN-adjacent digital interfacing, and portable electronics bridging 1.8V/2.5V/3.3V memory or peripheral buses to 5V domains. All prices cited in this page are as of 2026-08-29. Design tip: because of the internal pull-ups, avoid this family for signals requiring low-capacitance backplane conditions; for heavy push-pull loads choose the TXB0108 instead.
UJA1018TK - LIN System Basis Chip w/ LED Drivers | NXP
The NXP UJA1018TK is a LIN 2.0/2.0A/2.1/2.2/SAE J2602 system basis chip (SBC) with integrated low-drop voltage regulator and LED drivers, housed in a 16-terminal HVSON (3.5x5.5 mm) exposed-pad package. It combines a single LIN-bus transceiver, a 5.0 V/70 mA LDO regulator, and dedicated LED driver outputs that simplify compact mechatronic and automotive body-electronic node designs. A LIN system basis chip is a class of mixed-signal interface IC that integrates a bus transceiver with on-chip power management and support peripherals. By collapsing the transceiver, voltage regulator, and actuator drivers into a single die, an SBC reduces PCB area, lowers quiescent current, and provides a robust EMC/ESD front end for in-vehicle networks governed by the LIN/J2602 family of standards. The UJA1018TK sits within the automotive networking segment alongside CAN and FlexRay transceivers, and is commonly used as a body-control sub-node tying switches, sensors, and LEDs back to a central body control module. Key features of the UJA1018TK include compliance with LIN 2.0/2.1/2.2 and SAE J2602, integrated 5.0 V low-drop regulator capable of delivering up to 70 mA to external loads, programmable LIN-bus slew rate for EMC control, and dedicated LED driver pins capable of sourcing the current required for indicator or status lamps. The device supports node-position identification through a daisy-chained LIN-switch path, allowing cost-effective address assignment in multi-node LIN chains. The architecture combines a high-voltage analog front end tolerant of automotive 12 V transients with a low-power digital LIN protocol state machine. An integrated LIN bus switch enables address assignment without external EEPROM, while thermal shutdown, load-dump protection, and an exposed thermal pad enable AEC-Q100-style automotive operation across the -40C to +150C automotive temperature range. Supply current is typically around 4.5 mA in active mode, supporting always-on body networks. Typical applications include automotive door modules, seat controllers, steering-column switches, sunroof and mirror modules, climate-control panels, and any LIN-attached mechatronic node that also needs to drive LEDs. Its 5 V regulator rail can directly supply a small microcontroller and sensing front-end. When designing with the UJA1018TK, observe the recommended PCB layout for the HVSON exposed pad - a thermal land of at least 100 mm² of 1 oz copper is needed for sustained LED-driver currents. Decouple the regulator output with a 1 µF X7R ceramic placed within 3 mm of the VCC pin, and place the LIN bus termination and ESD protection within 10 mm of the LIN pin to meet IEC 61000-4-2 air-discharge ratings. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical PCB/EMC design notes not found in the manufacturer datasheet.
UJA1018TK,118 - LIN 2.x SBC with 5V LDO & LED Drivers | NXP
NXP UJA1018TK,118 is a LIN 2.0/2.1/2.2 and SAE J2602 compliant system-basis chip (SBC) integrating a LIN transceiver, a 5 V low-dropout (LDO) voltage regulator rated up to 70 mA, and two LED drivers, housed in a 16-pin HVSON (3.5 x 5.5 mm) exposed-pad package. A LIN System Basis Chip (SBC) is a mixed-signal IC that combines the physical-layer transceiver, an internal supply for the local microcontroller, and bus-switching or indicator-driving peripherals in a single die. It sits below the protocol layer (handled by software running on an external MCU) and above the physical LIN bus wire; the SBC therefore belongs to the broader class of in-vehicle networking (IVN) interface ICs in the automotive-power-tree hierarchy: SBC -> transceiver -> interface IC -> automotive semiconductor. Key features include LIN 2.0/2.1/2.2/SAE J2602 compliance, downward compatibility with LIN 1.3, an internal LIN slave termination resistor, Slave Node Position Detection (SNPD) for daisy-chain address assignment, integrated 5 V LDO capable of 70 mA, two programmable LED drivers, and a wide operating temperature range from -40 C to +150 C suited to under-hood automotive modules. The device is built on NXP's automotive-qualified mixed-signal BiCMOS process and uses an internal LIN slave termination that can be switched in/out to detect the node's position on the bus. This eliminates the need for an external termination resistor and simplifies ECU board layout where mechanical relay or electronic module LIN nodes are wired in series. Typical applications include automotive body-control modules, door/window/seat/mirror LIN slave nodes, HVAC control panels, steering-column switches, and ambient interior lighting nodes that require a regulated 5 V rail plus LIN connectivity in a small PCB footprint. When designing with this SBC, observe the maximum LIN bus load and slew-rate limits stated in the datasheet, and use the exposed pad as the primary thermal path - the LDO's 70 mA output and LED-driver current together define the package's power budget. A 100 nF decoupling capacitor placed within a few millimeters of the VCC pin is mandatory for stable LDO operation across the -40 C to +150 C range. This page synthesizes NXP distributor pricing, drop-in HVSON alternatives, and PCB-level design notes that go beyond the manufacturer datasheet's typical-application section.
UJA1023T - LIN 2.0 I/O Slave, 16-SO, NXP
The NXP UJA1023T is a stand-alone Local Interconnect Network (LIN) 2.0 compliant I/O slave integrated circuit, designed to replace discrete input and output handling components inside automotive electronic control units. The device integrates a LIN 2.0 controller, an integrated LIN transceiver (LIN 2.0 / SAE J2602 compliant, LIN 1.3 compatible), a 30 kΩ slave termination resistor, and eight general-purpose I/O lines, all packaged in a 16-pin Small Outline (SOT109-1 / 16-SO) surface-mount outline. A LIN transceiver IC is a category of in-vehicle networking transceivers that serves as the physical-layer interface between a microcontroller's UART and the single-wire LIN bus. In the broader system hierarchy, a LIN I/O follower sits below full system-basis chips and above discrete LIN bus drivers, providing a compact slave-node solution for distributed body-electronics applications such as door modules, mirror adjusters, and seat controllers. Key functional features of the UJA1023T include LIN 2.0 / SAE J2602 compliance for the physical layer, LIN 1.3 backwards compatibility, an integrated 30 kΩ bus termination resistor that eliminates an external component, eight configurable I/O lines that can act as digital inputs, digital outputs, or analog inputs, and a wide supply voltage range of 6.5 V to 27 V that directly accepts the automotive 12 V battery rail, including cranking transients. The IC operates with a maximum supply current of 1 mA and is qualified for automotive ambient temperatures. Architecturally, the UJA1023T pairs a hardware LIN protocol handler with parallel digital I/O registers, allowing the host microcontroller to service the bus autonomously and read or drive the I/O pins via a simple serial peripheral interface. Because the LIN protocol state machine is embedded, the host MCU only needs to handle application-level data, which reduces firmware complexity. Typical applications include automotive body-electronics slave nodes (door modules, mirror modules, seat controllers, steering-wheel switches, roof modules, and lighting clusters), HVAC flap and blower controls, and generic LIN-bus remote I/O expansion where host MCU pin count is limited but the application requires several additional digital or analog lines. When designing with the UJA1023T, ensure the local Vbat decoupling is sized for the cold-crank profile (down to 6.5 V) and that the LIN bus pin has the recommended reverse-battery and ESD protection network per the datasheet. Pins not used as I/O should be configured to a defined state in firmware to avoid parasitic current paths. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
UJA1023T/2R04/C,51 - LIN 2.0 I/O Slave | NXP Semiconductors
The NXP Semiconductors UJA1023T/2R04/C,51 is a stand-alone Local Interconnect Network (LIN) I/O follower (slave) that integrates a LIN 2.0 controller, a LIN 2.0/SAE J2602-compliant transceiver, a 30 kOhm LIN-slave termination resistor, and eight configurable I/O ports into a single 16-pin SOIC package supplied from 6.5 V to 27 V. It is designed to replace the discrete components commonly used in electronic control units (ECUs) for digital input capture, digital output driving, and LIN-bus communication. What is a LIN I/O follower? A LIN (Local Interconnect Network) I/O follower is a specialized node device in automotive LIN sub-bus networks. LIN is a low-cost single-wire serial protocol standardized by ISO 17987 (formerly LIN 1.3 / LIN 2.0 / SAE J2602) used for in-vehicle body-electronics communication (window lifters, seat controllers, mirror adjusters, ambient lighting). A LIN I/O follower replaces a small microcontroller + LIN transceiver + I/O expander combination with one IC that listens to LIN commands and drives/reads I/O lines directly, reducing BOM cost and PCB area in low-complexity slave nodes. Key features include LIN 2.0 protocol compliance with LIN 1.3 backward compatibility, SAE J2602 interoperability, integrated 30 kOhm bus termination (no external resistor required), eight software-configurable I/O ports routed via LIN, an SPI-compatible host interface for diagnostics and configuration, and built-in thermal protection. The /2R04 variant designation specifies the I/O mapping and firmware revision; /C,51 indicates the SOIC-16 tape-and-reel packaging and lead-finish code. Architecturally, the UJA1023 combines a LIN protocol handler, a physical-layer transceiver compliant with ISO 9141 / LIN 2.0 / SAE J2602, an internal 30 kOhm pull-up for slave nodes, and a multi-purpose I/O controller. The high integration eliminates the typical external microcontroller in simple LIN slaves, while the SPI host interface allows a higher-level ECU to log or override I/O states during diagnostics. Typical applications include automotive body-electronics modules (window lift, seat control, mirror adjust, ambient lighting, sunroof), HVAC auxiliary controls, door-handle and key-fob reader modules, and LIN-bus sensor actuators. The wide 6.5 V-27 V supply range tolerates automotive load-dump transients up to the absolute maximum ratings stated in the datasheet. Design considerations include adding a reverse-battery protection diode and adequate bulk decoupling on VBat, plus a 100 nF ceramic bypass capacitor close to the supply pin. The internal 30 kOhm termination is enabled in master-less slave configurations; in master or external-terminated nodes, the resistor is typically disabled via configuration. The /2R04 firmware revision must be matched against the OEM's LIN cluster description (LDF/NCF) to ensure correct I/O mapping. This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
UJA1169ATK/3Z - Mini HS-CAN SBC, 3.3V/250mA, AEC-Q100 | NXP
The NXP UJA1169ATK/3Z is a mini high-speed CAN System Basis Chip (SBC) in the UJA1169ATK family, integrating an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver that supports CAN FD up to 5 Mbit/s together with an on-board 3.3 V (V1) LDO regulator rated at 250 mA for the host microcontroller supply, all housed in a 20-pin HVSON package (3.5 x 5.5 mm). What is a CAN System Basis Chip (SBC)? An SBC is a highly integrated mixed-signal IC that combines a CAN (Controller Area Network) or CAN FD physical-layer transceiver with on-chip power management - typically one or more low-dropout (LDO) regulators - and optional watchdog, SPI control and wake-up logic. In the automotive ECU hierarchy, an SBC sits between the 12 V board net, the host microcontroller, and the CAN bus, replacing several discrete components: an HS-CAN transceiver, a 5 V or 3.3 V regulator for the MCU, reverse-battery protection and bus ESD protection. The wider taxonomy is: SBC -> CAN transceiver -> automotive networking IC -> power management IC -> semiconductor. Key features of the UJA1169ATK/3Z include 250 mA continuous V1 current to power a small MCU, support for CAN FD at 5 Mbit/s, integrated bus dominant clamping and very low-current standby modes with remote wake-up via the bus. The transceiver meets the stringent automotive EMC and ESD requirements of the ISO 11898-2:2016 standard and the SAE J2284-1 to J2284-5 specifications, while the integrated regulator and protection circuitry reduce external component count and PCB area in ECU designs. Architecturally, the part uses a high-voltage analog/mixed-signal process for the bus-side drivers and a low-voltage digital block for the SPI register set and V1 LDO. This dual-rail approach allows direct connection to a 12 V automotive supply while still powering the host MCU from the on-chip 3.3 V regulator in the /3Z variant. Typical applications include body control modules, gateway ECUs, CAN node power management in 12 V systems, ADAS sensor interface nodes and any automotive system that needs a single-chip CAN interface plus local MCU supply. Compared with discrete CAN transceivers plus external regulators, the UJA116ATK family shrinks the BOM and simplifies EMC compliance. When designing with the UJA1169ATK/3Z, ensure the 12 V supply is properly filtered, route the CANH/CANL lines as a 120 ohm twisted pair, and decouple V1 with the value recommended in the manufacturer datasheet. The /3Z variant is the 3.3 V V1, tape-and-reel orderable variant; the 5 V variant is the UJA1169ATK/F/3Z and the non-Z variants differ only in packing or V1 voltage. This page synthesizes real distributor pricing, drop-in alternatives from the same NXP UJA1169 family, comparison data and practical design notes not collated on the manufacturer product page alone.
UJA1169ATK/F/3 - Mini HS-CAN SBC, 3.3V LDO, 20-HVSON | NXP
The NXP Semiconductors UJA1169ATK/F/3 is a mini high-speed CAN System Basis Chip (SBC) that integrates an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver (supporting CAN FD up to 5 Mbit/s) together with a 3.3 V, 250 mA microcontroller supply and an internal 5 V regulator (V2) for the CAN transceiver. Housed in a 20-pin HVSON (3.5 x 5.5 mm) package, it provides partial networking with selective wake-up via CAN FD-passive capability. The /3 suffix designates the V1 regulator variant as 3.3 V rather than the 5 V used in the base UJA1169ATK, while the /F suffix enables the selective wake-up (partial networking) function. The device includes a watchdog, SPI control interface, and comprehensive protection features for automotive network nodes. A System Basis Chip (SBC) is an automotive-grade mixed-signal IC that consolidates a CAN/CAN FD transceiver with one or more voltage regulators, system protection, and optional wake-up logic into a single package. SBCs sit between the vehicle battery and the microcontroller, replacing several discrete components (transceiver, LDO, watchdog, reset generator) and reducing PCB area, BOM cost, and quiescent current in always-on networks. The UJA1169ATK family targets body-control modules, gateway ECUs, and zonal architectures in modern vehicles. Key features include a 3.3 V / 250 mA V1 regulator for the host MCU, a 5 V internal V2 regulator for the CAN transceiver, low quiescent current in standby and sleep modes with selective wake-up, an SPI interface for configuration and diagnosis, and integrated bus-failure management. The selective wake-up function allows ECUs to ignore CAN traffic not addressed to them, dramatically reducing network-wide quiescent current in CAN partial-networking architectures. The HVSON-20 package with exposed pad provides low thermal resistance for reliable operation in under-hood environments. The UJA1169ATK/F/3 is typically used in body and comfort ECUs, gateway modules, and any node that must wake selectively from CAN partial-networking traffic. It is particularly suited to OEM platforms targeting ISO 11898-2:2016 compliance with CAN FD-passive wake-up, where legacy nodes and FD-capable nodes coexist on the same bus. When designing with this SBC, ensure the HVSON exposed pad is soldered to a sufficient copper area for thermal dissipation, follow NXP's reference layout for the bus split termination, and configure the partial-networking filter mask in software to match the OEM-defined wake-up frame. All configuration is via SPI from the host MCU; no external programming is required. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes for the UJA1169ATK/F/3 that go beyond what the manufacturer datasheet alone provides.