MCZ33903BD3EK
MCZ33903BD3EK - SBC CAN HS 3.3V 32-SOIC EP | NXP
The NXP MCZ33903BD3EK is a second-generation System Basis Chip (SBC Gen2) integrating a high-speed CAN transceiver, a LIN transceiver, and a 3.3 V logic supply in a 32-pin SSOP-EP (exposed pad) package, designed for automotive body and chassis ECUs. It operates from a 5.5 V to 28 V supply rail, supports CAN Normal/Sleep modes, and provides a regulated 3.3 V output for microcontroller power, simplifying BOM and PCB area for nodes that previously needed discrete transceivers plus a separate LDO.
A System Basis Chip is a multi-function analog/digital mixed-signal IC that consolidates the power, communication, and housekeeping blocks of a distributed automotive ECU onto one die. In the broader taxonomy, the SBC sits between discrete CAN/LIN transceivers (one function per chip) and full automotive microcontrollers (which now increasingly integrate the SBC inside the MCU package). The 33903 family is NXP's second-generation SBC, succeeding the 33390 series, and adds enhanced low-power Sleep mode current, watchdog, and SPI-configurable features.
Key features include a high-speed CAN physical layer compliant with ISO 11898, a LIN 2.x physical layer, a 3.3 V / ~100 mA auxiliary regulator for the host MCU, an SPI interface for control and diagnostics, and low Sleep-mode quiescent current optimized for always-on automotive networks. The exposed thermal pad on the 32-SSOP-EP package reduces junction-to-ambient thermal resistance and improves dissipation when the SBC delivers continuous current to its MCU load.
The device uses NXP's SMARTMOS technology, mixing high-voltage analog power stages with CMOS digital logic. CAN HS supports up to 1 Mbit/s bus speed, dominant output driver with slope control, and bus-fault diagnostics; the LIN block supports 20 kbit/s master/slave with integrated pull-up. Both bus pins survive automotive transient events typical of 12 V body and 24 V truck systems.
Typical applications include automotive body controllers, HVAC control modules, seat and mirror controllers, lighting ECUs, door modules, and CAN/LIN gateway nodes where one chip replaces a discrete CAN + LIN + 3.3 V LDO stack. The wide 5.5 V to 28 V input range covers both 12 V passenger and 24 V commercial vehicle battery systems.
When designing with this SBC, ensure the exposed pad is soldered to a sufficiently large copper pour (>=1 sq. in.) to keep junction temperature within SOA during 3.3 V regulator full load. Add bulk capacitance at VCC and a 100 nF decoupling capacitor close to each supply pin to meet automotive EMC and ESD requirements per ISO 7637.
This page compiles datasheet-grade specifications, distributor stock, drop-in pin-compatible alternatives (same 32-SSOP-EP footprint), and design-embedded guidance not duplicated on NXP's product brief, saving engineering time during component selection.
USD $4,10
В наличии
