10AS057K2F35E2LG vs 10AS057K2F35E1HG Сравнение
Подробное сравнение бок о бок 10AS057K2F35E2LG от Intel и 10AS057K2F35E1HG от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
10AS057K2F35E1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA | Intel
10AS057K2F35E1HG ✓ АктивенСравнение характеристик
| Параметр | 10AS057K2F35E2LG | 10AS057K2F35E1HG |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $3.450,00 | $1.995,00 |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX |
| Logic Elements | 570,000 | 570,000 |
| Process Node | TSMC 20 nm | — |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Max Frequency | 1.5 GHz | — |
| DSP Blocks | [DATA_NEEDED: 18x19 multiplier count] | — |
| Embedded Memory (M20K) | [DATA_NEEDED: M20K block count and total bits] | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | 24 (up to 17.4 Gbps) |
| PCIe Hard IP | Gen3 x4 (rootport/endpoint) | Gen2/Gen3 x8 |
| User I/Os | 396 | — |
| Корпус | 1152-ball FCBGA, 35 mm x 35 mm, 1.0 mm pitch | 1152-ball FC-BGA (F35), 35x35 mm |
| Speed Grade | E2 (commercial/extended) | — |
| Рабочая температура | -40C to +100C (extended-industrial screening) | — |
| Configuration | SRAM-based, partial reconfiguration, SEU mitigation, ECC | — |
| Memory Interfaces | DDR3/DDR4 with hard PHY (HPS + FPGA) | — |
| Статус RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 29.4 Mbits (M20K + MLAB) |
| DSP Blocks (18x19 Multipliers) | — | 1,566 |
| Maximum User I/O Pins | — | [DATA_NEEDED: max user I/O] |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | — | 1.5 GHz |
| Memory Interfaces (FPGA side) | — | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 |
| Memory Interfaces (HPS side) | — | DDR4, DDR3, LPDDR3 |
| Process Technology | — | 20 nm TSMC |
| Operating Temperature Grade | — | Industrial |
| Supply Voltage (Core) | — | [DATA_NEEDED: Vcore] |