5CSEBA6U23C8SN vs 5CSEBA6U23I7LN Сравнение
Подробное сравнение бок о бок 5CSEBA6U23C8SN от Intel и 5CSEBA6U23I7LN от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
5CSEBA6U23C8SN - Cyclone V SE SoC FPGA, 110K LE, ARM Cortex-A9 | Intel
5CSEBA6U23C8SN ✓ АктивенСравнение характеристик
| Параметр | 5CSEBA6U23C8SN | 5CSEBA6U23I7LN |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1.420,00 | $184,83 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Designator | 5CSEBA6 (U23 speed grade, 8 speed) | — |
| Logic Elements | 110,000 | 110,000 |
| HPS Processor | Single ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 600 MHz | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| DSP Blocks | 224 (18x18 multipliers) | [DATA_NEEDED: variable-precision DSP block count] |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) | — |
| Hard Memory Controller | DDR2/DDR3 with ECC (HPS) | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, NAND, SD/MMC, I2C, SPI, UART | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART, SD/SDIO |
| Maximum User I/O | [DATA_NEEDED: user I/O count for U23 package] | — |
| LVDS Channels | Up to 17 (875 Mbps) | — |
| Process Technology | TSMC 28 nm low-power | — |
| Рабочая температура | [DATA_NEEDED: operating temperature grade] | — |
| Корпус | 672-ball UBGA (23x23 mm) | 672-pin UBGA (UBG-672) 23x23 mm |
| Тип монтажа | Surface Mount (BGA) | Surface Mount (BGA) |
| Уровень MSL | [DATA_NEEDED: MSL rating] | — |
| Статус RoHS | Compliant | Compliant (lead-free suffix) |
| Lead-Free | Yes | — |
| Processor Cores | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Clock | — | 925 MHz |
| Speed Grade | — | I7 (fast) |
| Temperature Range | — | Industrial (-40C to +100C junction) |
| Suffix L | — | Lead-free |
| Suffix N | — | Tray packaging |
| Hard Memory Blocks | — | [DATA_NEEDED: total M10K and MLAB bits] |
| Configuration Mode | — | JTAG and Active Serial (AS) |
| Process Node | — | TSMC 28 nm low-power |
| Design Toolchain | — | Intel Quartus Prime + SoC EDS |