A3PE600-1FGG484I vs A3PE600-1FG484I Сравнение
Подробное сравнение бок о бок A3PE600-1FGG484I от Microchip Technology и A3PE600-1FG484I от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
A3PE600-1FGG484I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-1FGG484I ✓ АктивенMicrochip Technology
A3PE600-1FG484I - 600K-Gate Flash FPGA, 270 I/O | Microchip
A3PE600-1FG484I ✓ АктивенСравнение характеристик
| Параметр | A3PE600-1FGG484I | A3PE600-1FG484I |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $42,40 | $48,60 |
| Family | ProASIC3E | ProASIC3E |
| System Gates | 600000 gates | 600000 |
| Logic Elements | ProASIC3, 7KLEs class fabric | — |
| Maximum System Frequency | 272 MHz (speed grade -1) | 231 MHz |
| User I/O | 270 | 270 |
| Embedded SRAM | 110592 bits | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm, 7-layer metal (6 copper) flash-based CMOS | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | On-chip flash (nonvolatile, live at power-up) | Flash-based (nonvolatile, Live-at-Power-Up Level 0) |
| Корпус | 484-ball FBGA (FGG484), 1 mm pitch | 484-ball FBGA (PBGA484), 1.0 mm pitch |
| Тип монтажа | Surface Mount | Surface Mount |
| Рабочая температура | Industrial (I suffix); die-level commercial rating 0C to 70C per digichip listing | [DATA_NEEDED: operating temperature range] |
| Logic Family | CMOS | CMOS |
| Soft Processor Support | Optional soft ARM support (per family datasheet) | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Logic Cells (CLBs) | — | 13824 |
| Speed Grade | — | -1 |
| Embedded Memory (family max) | — | Up to 504 kbits True Dual-Port SRAM |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height |
| Single-Chip Solution | — | Yes (no external configuration device required) |