EMC3R0N vs EMC5R0N Сравнение
Подробное сравнение бок о бок EMC3R0N от SP Industrial и EMC5R0N от Silicon Power. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EMC3R0N | EMC5R0N |
|---|---|---|
| Бренд | SP Industrial | Silicon Power |
| Категория | eMMC | Memory ICs |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $8,95 | $8,95 |
| Тип памяти | eMMC 5.1 managed NAND | eMMC 5.1 (JEDEC JESD84-B51) |
| NAND Technology | TLC NAND (with optional pSLC mode) | pSLC (pseudo-SLC, emulated from MLC/TLC) |
| Available Capacities | 32 GB, 64 GB, 128 GB | — |
| Host Interface | JEDEC eMMC 5.1, 8-bit, HS400 DDR | — |
| Sequential Read (max) | 320 MB/s | — |
| Sequential Write (max) | 240 MB/s | — |
| Program/Erase Cycles (TLC) | up to 3,000 P/E cycles per block | — |
| Рабочая температура | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Storage Temperature | -40C to +85C | — |
| VCC Supply Voltage | 2.7 V to 3.6 V (typ. 3.3 V) | — |
| VCCQ I/O Voltage | 1.7 V to 1.95 V or 2.7 V to 3.6 V | — |
| Корпус | BGA-153, 11.5 mm x 13 mm x 1.0 mm | 153-ball FBGA |
| Compliance | JEDEC eMMC 5.1 | — |
| Статус RoHS | Compliant | Compliant |
| Controller Features | ECC, wear leveling, bad-block management, command queueing, secure boot | — |
| Boot Partition Support | Yes (boot partitions 1 and 2) | — |
| Write Protect | Hardware and software write protect supported | — |
| Density | — | 16 GB |
| Endurance (P/E Cycles) | — | up to 30,000 |
| Interface Bus Width | — | 1-bit / 4-bit / 8-bit MMC |
| Maximum Clock Rate | — | 200 MHz (HS400 mode) |
| Supply Voltage - Flash (VCC) | — | 2.7 V to 3.6 V |
| Supply Voltage - Interface (VCCQ) | — | 1.7 V to 1.95 V or 2.7 V to 3.6 V |
| Тип монтажа | — | Surface Mount |
| Series | — | SP Industrial eMMC 5.1 Series |
| Family Variant | — | EMC5R0N (16GB pSLC); EMC3R0N (32/64/128GB TLC) |
| Managed NAND Features | — | Internal ECC, wear-leveling, secure erase/trim, write protection, partitions |