EP20K400FC784-3 vs EP20K400FC784-2 Сравнение
Подробное сравнение бок о бок EP20K400FC784-3 от Intel и EP20K400FC784-2 от Altera. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP20K400FC784-3 | EP20K400FC784-2 |
|---|---|---|
| Бренд | Intel | Altera |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Obsolete | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $175,00 | $175,00 |
| Family | APEX 20K (MultiCore) | APEX 20K |
| Typical Gates | 400,000 | — |
| Maximum System Gates | 1,052,000 | — |
| Logic Elements | 21,168 | 16,640 |
| Maximum RAM Bits | 212,992 | — |
| Embedded System Blocks (ESBs) | 100 | — |
| PLLs | 4 | — |
| User I/O Pins | 488 | — |
| Корпус | 784-ball FineLine BGA (FC) | 784-Ball FineLine BGA (FC) |
| Speed Grade | -3 | -2 (industrial) |
| Рабочая температура | Commercial (0°C to +85°C) | [DATA_NEEDED: exact Tj range] |
| I/O Standards | MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 2.5 V |
| Process Technology | 0.18 µm CMOS | 0.22 µm CMOS SRAM |
| Configuration Method | Serial or parallel, SRAM-based | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: not confirmed in provided data] |
| Уровень MSL | [DATA_NEEDED: MSL rating] | 3 (per Partstack listing) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Device Family Member | — | EP20K400C |
| Typical System Gates | — | 400,000 |
| Maximum User I/O Pins | — | 488 (784-BGA) |
| Embedded RAM (ESB) | — | 212 Kbits |
| Maximum Block RAM | — | [DATA_NEEDED: block RAM organization per ESB] |
| Maximum Frequency (internal) | — | [DATA_NEEDED: fmax, datasheet-dependent] |
| MultiVolt I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Supported I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT |
| Configuration Mode | — | Serial / Parallel SRAM-volatile (external PROM required) |
| Тип монтажа | — | Surface Mount (BGA) |
| Peak Reflow Temperature | — | 220 °C (per Partstack listing) |
| Hot Socketing | — | Supported |
| JTAG / Boundary-Scan | — | IEEE 1149.1 compliant |