EP2A70F1508C9 vs EP2A70F1508C8 Сравнение
Подробное сравнение бок о бок EP2A70F1508C9 от Intel и EP2A70F1508C8 от Altera. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Последняя закупкаСравнение характеристик
| Параметр | EP2A70F1508C9 | EP2A70F1508C8 |
|---|---|---|
| Бренд | Intel | Altera |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Последняя закупка | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1.310,00 | $1.495,00 |
| Series | APEX II | APEX II (EP2A70) |
| Family | APEX II FPGA | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 67,200 | — |
| Total RAM Bits | 1,146,880 | — |
| Number of I/O | 1,060 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of PLLs | 4 | — |
| Number of Gates | [DATA_NEEDED: typical gate count] | — |
| Voltage - Supply (Core) | 1.425 V to 1.575 V | — |
| Тип монтажа | Surface Mount | Surface Mount (BGA) |
| Корпус / Типоразмер | 1508-BBGA, FCBGA | — |
| Supplier Device Package | 1508-FBGA (40 × 40 mm) | — |
| Рабочая температура | 0 °C to 85 °C | 0 °C to 85 °C (commercial) |
| Speed Grade | C9 | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel | — |
| Embedded Multiplier Blocks | Yes | — |
| Embedded Memory Type | Dual-port RAM (ESB) / ROM / FIFO | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Уровень MSL | [DATA_NEEDED: MSL level] | — |
| Device Family | — | APEX II |
| Logic Elements | — | 67,200 |
| Embedded RAM Bits | — | 1,146,880 |
| User I/O Count | — | 1060 |
| Maximum User I/O Pins | — | 1060 |
| Core Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Корпус | — | 1508-BBGA, FCBGA (40 x 40 mm) |
| High-Speed Interface Support | — | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| Тип памяти | — | Embedded dual-port RAM / ROM via ESBs |
| Architecture | — | Embedded array with LABs + ESBs |