EP2SGX30DF780I4 vs EP2SGX30DF780I3N Сравнение
Подробное сравнение бок о бок EP2SGX30DF780I4 от Intel и EP2SGX30DF780I3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
EP2SGX30DF780I4 ⚠ Последняя закупка
Сравнение характеристик
| Параметр | EP2SGX30DF780I4 | EP2SGX30DF780I3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Последняя закупка | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $178,25 | $171,00 |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements / Cells | 33,880 | — |
| Total RAM Bits | 1,369,728 | — |
| Number of LABs | 1,694 | — |
| User I/O Count | 361 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Nominal Supply Voltage (Core) | 1.2 V | — |
| Internal Operating Frequency | 622 MHz | — |
| Максимальная тактовая частота | 717 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Рабочая температура | -40C to +85C (Industrial) | — |
| Корпус | 780-ball FC-FBGA, 29x29 mm, 1 mm pitch | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch |
| Тип монтажа | Surface Mount (Flip-chip BGA) | Surface Mount |
| Статус RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Уровень MSL | [DATA_NEEDED: MSL level] | — |
| Number of Transceivers | [DATA_NEEDED: number of transceiver channels] | — |
| Number of PLLs / DLLs | [DATA_NEEDED: number of PLLs] | — |
| Logic Elements | — | 33,880 |
| Logic Cells | — | 33,380 |
| Configurable Logic Blocks (CLBs) | — | 33,880 |
| Total Memory Bits | — | 1,369,728 |
| Maximum Core Frequency | — | 622.08 MHz |
| Core Supply Voltage | — | 1.2 V |
| User I/O Pins | — | 361 |
| Operating Temperature Grade | — | Industrial |
| Lead Free | — | Yes |
| Speed Grade | — | I3 |