EP3SE260F1152C4L vs EP3SE260F1152C3N Сравнение
Подробное сравнение бок о бок EP3SE260F1152C4L от Intel и EP3SE260F1152C3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
EP3SE260F1152C4L ⚠ Последняя закупкаIntel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ АктивенСравнение характеристик
| Параметр | EP3SE260F1152C4L | EP3SE260F1152C3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Последняя закупка | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1.950,00 | $7.500,00 |
| Family | Stratix III E | — |
| Logic Elements (LE) | 255,000 | — |
| Adaptive Logic Modules (ALMs) | 10,200 | — |
| Total Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/O Pins | 744 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 0.9 V | 1.1 V |
| Корпус | 1152-ball FC-FBGA | 1152-BBGA, FCBGA |
| Рабочая температура | 0C to +85C (Commercial) | 0 C to +85 C (Commercial) |
| Maximum Frequency | 375 MHz | — |
| Transceivers | Integrated high-speed transceivers | Integrated high-speed transceivers |
| Memory Interfaces | DDR2/DDR3 with hard controllers | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | AS, AP, PS, FPP, JTAG |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Статус RoHS | Compliant | Compliant |
| Series | — | Stratix III E |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 744 |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |