EPF10K130EQC240-3 vs EPF10K100EQC240-3N Сравнение
Подробное сравнение бок о бок EPF10K130EQC240-3 от Altera и EPF10K100EQC240-3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EPF10K130EQC240-3 | EPF10K100EQC240-3N |
|---|---|---|
| Бренд | Altera | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Obsolete | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $105,00 | $49,95 |
| Series | FLEX-10KE | FLEX 10KE |
| Family | FLEX 10K Embedded Programmable Logic Device | FLEX 10KE (Embedded Programmable Logic Device) |
| Number of Gates | 342,000 system gates | — |
| Number of Logic Elements / Cells | 6,656 | — |
| Number of LABs / CLBs | 832 | — |
| Total RAM Bits | 65,536 (64 Kbit) | 49,152 |
| Number of User I/O | 186 | — |
| Number of EABs | [DATA_NEEDED: number of embedded array blocks] | — |
| Supply Voltage - Core | 2.375 V to 2.625 V | — |
| I/O Voltage | 2.5 V / 3.3 V | — |
| Speed Grade | -3 (commercial speed grade) | — |
| Рабочая температура | 0 °C to 70 °C (TA, commercial) | 0 °C to +70 °C (Commercial) |
| Тип монтажа | Surface Mount | Surface Mount |
| Корпус / Типоразмер | 240-BFQFP (PQFP, 32 x 32 mm) | — |
| Supplier Device Package | 240-PQFP (32 x 32) | — |
| Configuration Memory | SRAM (volatile, requires external config device) | — |
| Programmable Type | In-system programmable via JTAG or serial config EPROM | — |
| Статус RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Lead Shape | Gull-wing | — |
| Logic Elements / Cells | — | 4,992 |
| Total System Gates | — | 100,000 (typical) |
| Logic Array Blocks (LABs) | — | 624 |
| Embedded Array Blocks (EABs) | — | 16 |
| Maximum User I/Os | — | 189 |
| Number of PLLs | — | 4 |
| Propagation Delay | — | 0.6 ns |
| Maximum Internal Frequency | — | 200 MHz |
| Core Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 3.3 V (5 V tolerant with PCI clamping) |
| Process Technology | — | 0.22 µm CMOS |
| Package Type | — | 240-pin BFQFP (Power Quad Flat Pack) |
| JTAG Support | — | IEEE Std. 1149.1 boundary-scan |
| Lead-Free / RoHS | — | Pb-free matte tin (N suffix) |
| Configuration Memory Companion | — | EPC2LC20N or compatible |