M1AFS1500-1FG256I vs M1AFS1500-1FGG256 Сравнение
Подробное сравнение бок о бок M1AFS1500-1FG256I от Microchip Technology и M1AFS1500-1FGG256 от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ АктивенMicrochip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ АктивенСравнение характеристик
| Параметр | M1AFS1500-1FG256I | M1AFS1500-1FGG256 |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $205,00 | $172,23 |
| Logic Capacity | 1,500,000 system gates | — |
| User I/O | 119 | — |
| Processor Core | ARM Cortex-M1 (M1 variant) | — |
| Memory Resource | 276480 bits | — |
| Configuration Technology | Flash-based, nonvolatile | — |
| Process Technology | 130 nm CMOS, 7-layer metal | — |
| Core Supply Voltage | 1.5 V | — |
| System Performance | up to 350 MHz | — |
| Корпус | 256-LBGA (FG256) | — |
| Тип монтажа | Surface Mount | — |
| Рабочая температура | -40C to +85C (industrial grade, suffix I) | — |
| Speed Grade | -1 (standard) | -1 |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Analog Functionality | Fusion configurable analog blocks | — |
| Clock Management | Integrated clock generation and management circuitry | Integrated clock generation and management circuitry |
| Статус RoHS | Non-Compliant (contains lead, per distributor data) | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free Status | Contains Lead | — |
| Series | — | Fusion (M1AFS1500) |
| System Gates | — | 1,500,000 |
| Logic Cells | — | 38,400 |
| Embedded Processor | — | ARM Cortex-M1 |
| Максимальная тактовая частота | — | 350 MHz |
| Number of I/Os | — | 119 |
| Напряжение питания | — | 1.5 V |
| Technology | — | CMOS, 130 nm |
| Configuration Memory | — | Flash-based (non-volatile) |
| Корпус / Типоразмер | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Способ монтажа | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Packaging | — | Tray |
| Integrated Analog Blocks | — | Yes (configurable analog conditioning and conversion) |
| Integrated Flash Memory Blocks | — | Yes |