MX574ALP+T vs MAX174ACWI Сравнение
Подробное сравнение бок о бок MX574ALP+T от Maxim Integrated и MAX174ACWI от Analog Devices. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | MX574ALP+T | MAX174ACWI |
|---|---|---|
| Бренд | Maxim Integrated | Analog Devices |
| Категория | ADC/DAC | ADC/DAC |
| Статус жизненного цикла | Активен | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $10,10 | $12,25 |
| Разрешение | 12 bits | 12 bits |
| Architecture | Successive Approximation (SAR) | — |
| Number of Channels | 1 | — |
| Conversion Method | SAR with internal track/hold | — |
| Input Type | Single-ended, software-strapped bipolar/unipolar | — |
| Диапазон входного напряжения | 0 to +10 V, 0 to +20 V, ±5 V, ±10 V (strap-selectable) | — |
| Conversion Time | up to 25 µs (max) | — |
| Throughput Rate | up to ~40 kSPS at 12 bits | — |
| Data Interface | Parallel (12-bit word) | — |
| Internal Reference | Yes - precision buried zener, 10 ppm/°C (max drift) | 10.000 V buried-Zener |
| Напряжение питания | +12 V / -12 V / +5 V (analog and digital) | — |
| Analog Input Current | [DATA_NEEDED: input current spec] | — |
| Integral Non-Linearity (INL) | [DATA_NEEDED: INL spec] | — |
| Рабочая температура | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial, -AC suffix) |
| Корпус | 28-PLCC (11.51 x 11.51 mm), J-bend, QCCJ form | 28-pin SOIC (Wide) |
| Статус RoHS | Compliant | — |
| Тип монтажа | Surface Mount (PLCC socket or hand-solder) | Surface Mount |
| Process Technology | BICMOS | — |
| Converter Type | — | SAR (Successive Approximation) |
| Number of Input Channels | — | 1 |
| Maximum Sampling Rate | — | 125 ksps |
| Maximum Conversion Time | — | 8 µs |
| Input Voltage Range (Bipolar) | — | ±5 V or ±10 V |
| Supply Voltage (Digital) | — | 5 V |
| Supply Voltage (Analog) | — | ±12 V or ±15 V |
| Analog Input Impedance | — | 4 kΩ minimum |
| Output Interface | — | Three-state parallel (8/16-bit compatible) |
| Power Dissipation | — | 100 mW typical during conversion |