S912XDT256F1MALR vs MC9S12XDT512MAA Сравнение
Подробное сравнение бок о бок S912XDT256F1MALR от NXP Semiconductors и MC9S12XDT512MAA от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
S912XDT256F1MALR - 16-bit MCU, 256KB Flash, 80MHz | NXP
S912XDT256F1MALR ✓ Активен
Сравнение характеристик
| Параметр | S912XDT256F1MALR | MC9S12XDT512MAA |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Активен | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $10,95 | $0,00 |
| Core | HCS12X (16-bit) | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | 16 KB | — |
| CPU Clock (Max) | 80 MHz | — |
| Корпус | 112-LQFP (20x20 mm) | 80-QFP (14x14 mm), Square, Gull Wing |
| Число выводов | 112 | — |
| Тип монтажа | Surface Mount (Gull Wing) | Surface Mount |
| Temperature Grade | Automotive | — |
| Рабочая температура | -40C to +125C | -40C to +125C (TA) |
| Supply Voltage (VDD) | 5 V (typ); 2.7 V to 5.5 V (range) | — |
| ADC | 10/12-bit (ATD) | — |
| Communication | CAN 2.0, SCI, SPI, IIC | — |
| PWM Channels | [DATA_NEEDED: channel count per device variant] | — |
| Timers | [DATA_NEEDED: timer count per device variant] | — |
| AEC-Q100 | Qualified (Automotive) | — |
| Статус RoHS | Compliant | — |
| Уровень MSL | 3 (168 hours) | — |
| Lead-Free | Yes | — |
| Packaging Style | Tape & Reel (R suffix) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Напряжение питания | — | [DATA_NEEDED: supply voltage range] |
| Packaging Method | — | Tray |
| Без галогенов | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |