10AS066H4F34I3LG - Arria 10 SX SoC FPGA 660K LE | Intel | Dual ARM Cortex-A9
Артикул: 10AS066H4F34I3LG ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $4037.5 | $40.375,00 |
| 100 | $3825 | $382.500,00 |
| 250 | $3612.5 | $903.125,00 |
| 500 | $3400 | $1.700.000,00 |
10AS066H4F34I3LG Обзор
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that merges a general-purpose processor subsystem (hardened ASIC) with programmable FPGA fabric on a single die. Compared with traditional two-chip processor-plus-FPGA designs, SoC FPGAs reduce board area, lower power via tighter on-chip interconnect, simplify PCB layout, and shorten data-path latency between software and hardware accelerators. The Arria 10 SX family sits in Intel's mid-range line, between the lower-power Cyclone V/10 and the high-performance Stratix 10, and is widely used in industrial, automotive, and high-performance DSP applications.
Key features of the 10AS066H4F34I3LG include 660,000 logic elements, approximately 5,510 Kbits of embedded memory, 396 18x19 multipliers, six phase-locked loops (PLLs), and dual ARM Cortex-A9 cores with CoreSight debug and trace. The package exposes 492 user I/Os and supports LVDS, LVCMOS, SSTL, and HSTL I/O standards. Integrated transceivers operate up to 12.5 Gbps, enabling PCIe Gen3 and 10 GbE connectivity. The part operates from a 0.9 V core supply with industrial temperature range and is lead-free / RoHS compliant.
Typical applications include high-performance industrial image processing, software-defined radio (SDR) baseband, motor-control and robotics, machine-vision platforms, and military/aerospace signal processing. The hardened ARM cores run embedded Linux or RTOS while the FPGA fabric accelerates DSP, encryption, or custom peripherals.
When designing with this part, plan the power tree carefully: 0.9 V core is supplied through a dedicated regulator; sequencing and ramp rates per the device handbook are mandatory. Use the Quartus Prime toolchain for synthesis, place-and-route, and HPS firmware development; the SoC EDS provides a GCC/Linaro cross-compile environment.
This page synthesizes distributor pricing, drop-in alternative ordering part numbers within the same Arria 10 SX family, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the 10AS066H4F34I3LG for production designs.
Аналоги без доработки для 10AS066H4F34I3LG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10AS066H4F34I3LG (тот же форм-фактор и посадочное место) — отличается по Package, Temperature Grade, Operating Temperature, Transceivers, Mounting Type.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10AS066H4F34I3SG
✅ Прямая замена✓ В наличии
$2295 / шт.
Открыть даташит →10AS066H4F34E3SG
✅ Прямая замена✓ В наличии
$1920 / шт.
Открыть даташит →10AS066H4F34E3LG
✅ Прямая замена✓ В наличии
$2419.49 / шт.
Открыть даташит →10AS066H3F34I2SG
✅ Прямая замена✓ В наличии
$3200 / шт.
Открыть даташит →10AS066H3F34I2LG
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →10AS066H2F34I2SG
✅ Прямая замена✓ В наличии
$3550 / шт.
Открыть даташит →10AS066H2F34I2LG
✅ Прямая замена✓ В наличии
$11050 / шт.
Открыть даташит →10AS066H2F34I1HG
✅ Прямая замена✓ В наличии
$3500 / шт.
Открыть даташит →10AS066H4F34I3LG Максимальные параметры и электрические характеристики
| Family | Arria 10 SX |
| Device Variant | 10AS066 |
| Logic Elements | 660,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Max Processor Frequency | 1.5 GHz |
| Process Technology | 20 nm TSMC |
| Корпус | 1152-FBGA, FC (35x35 mm) |
| User I/O | 492 |
| Embedded Memory | 5,510 Kbits (approximate) |
| DSP Blocks / Multipliers | 396 18x19 multipliers |
| PLLs | 6 |
| Transceivers | Up to 12.5 Gbps (PCIe Gen3, 10 GbE) |
| Core Voltage | 0.9 V |
| Рабочая температура | -40C to +100C (Industrial) |
| Тип монтажа | Surface Mount (BGA) |
| Статус RoHS | Compliant |
| Speed Grade | I3 |
| Form of Terminal | Ball (BGA) |
Руководство по цоколевке 10AS066H4F34I3LG в корпусе 1152-fbga, fc (35x35 mm)
Цоколевка для 10AS066H4F34I3LG (корпус 1152-fbga, fc (35x35 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10AS066H4F34I3LG.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10AS066H4F34I3LG подходит для 7 применениеs: Industrial Machine Vision Platform, Software Defined Radio Baseband, Motor Control and Robotics, Medical Imaging Diagnostics, Aerospace and Defense Signal Processing, High-Performance Embedded Computing Node, Test and Measurement Instrumentation.
Industrial Machine Vision Platform
The 10AS066H4F34I3LG fits industrial machine-vision systems because its 660K logic elements and 396 18x19 multipliers deliver the DSP throughput required for real-time image processing, while the dual ARM Cortex-A9 cores at 1.5 GHz run Linux and vision algorithms such as OpenCV. The 492 user I/Os allow direct connection to multiple Camera Link, CoaXPress, or MIPI CSI-2 sensors, and the integrated transceivers up to 12.5 Gbps provide PCIe Gen3 x4 or 10 GbE backhaul to industrial PCs. Industrial temperature range (-40C to +100C) supports factory-floor deployment. Power dissipation is managed by the 20 nm process, but high-utilization designs still require careful PCB thermal design under the FCBGA.
Рекомендуется
Software Defined Radio Baseband
The 10AS066H4F34I3LG is well suited to SDR baseband processing because 396 18x19 multipliers implement hundreds of streaming DSP channels at baseband sample rates, and 12.5 Gbps transceivers interface directly to RF ADC/DAC front-ends (e.g., TI ADC32RF45, AD9371). The dual ARM Cortex-A9 cores run protocol stacks (LTE, 5G NR, custom waveforms) while the FPGA fabric handles channelization, FFTs, and pre-distortion. Total bandwidth scales with Fmax, so the I3 speed grade maximizes throughput versus the I2 alternative. Industrial temperature range is critical for outdoor radio units; the 35x35 mm FCBGA requires controlled-impedance PCB layout for transceiver channels.
Рекомендуется
Motor Control and Robotics
The 10AS066H4F34I3LG fits high-end motor control and robotics by combining the real-time FPGA fabric for field-oriented control (FOC) loops with the dual ARM Cortex-A9 cores running motion-planning software. The 492 user I/Os connect to multiple encoders, PWM channels, and resolver excitation circuits simultaneously, while the 12.5 Gbps transceivers carry multi-axis EtherCAT or SERCOS III to remote drives. Industrial temperature grade and high DSP block count enable precise torque and velocity control at the kHz switching rates needed for high-precision servos. The 0.9 V core is supplied by a multi-phase buck regulator with sequencing per the Arria 10 handbook.
Рекомендуется
Medical Imaging Diagnostics
The 10AS066H4F34I3LG fits medical imaging systems such as ultrasound beamformers or MRI back-end signal processing because the FPGA fabric implements parallel beamformer channels in real time, while the dual ARM Cortex-A9 cores handle data aggregation, image reconstruction, and DICOM output. The 5,510 Kbits of embedded memory plus external DDR3 provide temporary storage for raw channel data, and the integrated transceivers stream processed data to host PCs at 10 Gbps. Industrial temperature range ensures reliability in equipment rooms; the FCBGA package supports both 35x35 mm standard and 27x27 mm compact variants for portable diagnostic carts.
Рекомендуется
Aerospace and Defense Signal Processing
The 10AS066H4F34I3LG suits aerospace and defense signal processing because its hardened ARM cores offload housekeeping tasks while the FPGA fabric performs high-throughput radar, electronic-warfare (EW), or signals-intelligence (SIGINT) algorithms. The 12.5 Gbps transceivers interface to RF converters (e.g., AD9081, ADC12DJ5200RF), and the industrial temperature range plus RoHS compliance support many platform requirements. For full MIL-spec, designers select the E3 enhanced temperature variant; the I3 grade remains suitable for indoor or controlled-environment aerospace cabinets. Conformal coating and ruggedization are commonly added during board integration.
Рекомендуется
High-Performance Embedded Computing Node
The 10AS066H4F34I3LG serves as a high-performance embedded computing node in industrial edge gateways or rugged servers because the dual ARM Cortex-A9 cores run Linux with full SoC EDS software stack (U-Boot, Yocto, kernel, rootfs), while the FPGA fabric accelerates custom packet processing, encryption, or protocol conversion. The integrated transceivers up to 12.5 Gbps support 10 GbE uplink and PCIe Gen3 expansion to co-processors. Industrial temperature range and lead-free FCBGA package align with IEC 60068-2 environmental stress standards; pairing the SoC with ECC DDR3L is recommended for reliability in industrial edge nodes.
Рекомендуется
Test and Measurement Instrumentation
The 10AS066H4F34I3LG fits high-end test and measurement instruments such as oscilloscopes, protocol analyzers, and arbitrary waveform generators because the FPGA fabric implements real-time DSP (FIR, FFT, decimation), and the ARM cores run instrument firmware, display logic, and remote interfaces (LXI, USB, Ethernet). The 12.5 Gbps transceivers allow direct sampling at multi-GS/s rates with high-speed ADC/DAC front-ends. Industrial temperature range and the 1152-ball FCBGA in a standard 35x35 mm land pattern simplify mechanical integration into lab equipment; the I3 speed grade ensures deterministic real-time performance at full clock rates.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10AS066H4F34I3LG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10AS066H4F34I3SG | 10AS066H4F34E3LG | 10AS066H3F34I2LG | 10AS066H2F34I2LG | 10AS066H2F34I1HG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F34) 35x35 mm | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed Grade | I3 (industrial) | I3 | E3 | I2 | I2 | I1 |
| Performance Tier (H2/H3/H4) | H4 (highest) | H4 | H4 | H3 | H2 | H2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Enhanced | Industrial | Industrial | Industrial |
| Transceiver Speed | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
Ключевые отличия
- Highest H4 performance tier within the 660K-LE Arria 10 SX family (против 10AS066H2F34I2LG)
- Industrial temperature grade I3 across full 660K LE capacity (против 10AS066H4F34E3LG)
- Hardened dual ARM Cortex-A9 MPCore integrated with FPGA fabric (против Discrete CPU + discrete FPGA two-chip design)
Заметки по проектированию
The 10AS066H4F34I3LG requires a multi-rail power tree: 0.9 V core (high current via multi-phase buck), 1.8 V/2.5 V/3.3 V I/O rails, PLL analog supplies, HPS dedicated supplies, and transceiver supplies. Power-on sequencing and ramp rates per the Arria 10 handbook are mandatory; failure to follow them can cause inrush damage. Use the PowerPlay Early Power Estimator (EPE) spreadsheet before schematic capture to size regulators and confirm thermal feasibility. Decoupling: place 100 nF X7R capacitors densely under the BGA on both sides, plus bulk ceramics (10 uF) per the Intel power distribution network design guidelines.
The 35x35 mm FCBGA package has a junction-to-ambient thermal resistance that depends heavily on PCB copper and airflow. High-utilization designs (e.g., full transceiver + DSP workload) can dissipate 15-25 W. Recommended practice: provide at least 4 PCB layers dedicated to ground beneath the BGA, add a thermal pad or heatsink on the package top (where exposed), and validate via thermal simulation with realistic airflow (typically 200-400 LFM). For industrial temperature compliance, derate junction temperature to 90C max so the -40C to +100C spec is met across all operating conditions.
The 1152-ball FCBGA requires high-density PCB manufacturing: 1.0 mm ball pitch with 0.4-0.5 mm via-in-pad microvias stacked to inner layers, ENIG or ENEPIG surface finish, and controlled impedance routing for transceivers (100 ohm differential) and DDR3 (50 ohm single-ended). Use length-matching within 25 mils for byte lanes and 5 ps for transceiver channels. Follow the Arria 10 PCB Design Guidelines for layer stackup, escape routing, and stitching-via recommendations to maintain signal integrity at multi-Gbps data rates.
Common pitfalls when designing with the 10AS066H4F34I3LG: (1) omitting the dedicated HPS reset and JTAG pull-ups, causing intermittent boot; (2) using single-rank DDR3 instead of dual-rank or ECC modules, reducing memory bandwidth; (3) failing to configure all transceiver reference clocks, causing link training to fail; (4) ignoring Quartus Prime pin-connection file warnings - many Arria 10 SX boards fail first-time bring-up because unused I/O were not tri-stated or terminated correctly. Use Quartus Prime 20.1 or later for full I3 speed-grade support and the most current silicon errata fixes.
Информация о соответствии
RoHS compliant per distributor listing. The 'LG' suffix indicates lead-free finish. AEC-Q100 not applicable - this is an industrial-grade SoC FPGA. Conflict minerals compliance per Intel supplier policy.
