10AX090S3F45E2SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel / Altera
Артикул: 10AX090S3F45E2SG ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $6425.55 | $6.425,55 |
| 10 | $6090 | $60.900,00 |
| 50 | $5810 | $290.500,00 |
| 100 | $5550 | $555.000,00 |
| 250 | $5320 | $1.330.000,00 |
10AX090S3F45E2SG Обзор
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that lets engineers implement arbitrary digital logic through configurable logic blocks (CLBs), routing, and hardened I/O. FPGAs sit hierarchically between ASICs (application-specific, high-NRE) and microcontrollers (fixed-instruction), enabling low-volume customization, hardware acceleration, and rapid design iteration. The Arria 10 family is Intel's mid-range line, bridging the lower-cost Cyclone series and the high-end Stratix series, with balanced logic, DSP, and transceiver resources.
Key features of the 10AX090S3F45E2SG include 12.5 Gbps GX transceivers, dedicated variable-precision DSP blocks with hardened IEEE 754 single-precision floating-point support, hard PCI Express Gen3 IP blocks, and a 28 Gbps-capable die architecture (limited by speed grade/package). The integrated Hard Memory Controller and partial reconfiguration support allow runtime logic swapping without system halt.
Architecturally, Arria 10 FPGAs use a 20 nm TSMC process with a heterogeneous fabric mixing MLABs, LABs, DSP blocks, M20K SRAM blocks, and 12.5 Gbps transceivers. The "S3" speed grade balances timing margin and power, while the F45 package (45 mm flip-chip BGA) provides the thermal headroom and signal-integrity escape routing required for 624 user I/O and high-pin-count transceivers.
Typical applications include 4K video processing and broadcast equipment, wireline 100G/400G backhaul, military radar signal processing, ASIC prototyping, and high-performance industrial imaging. The device's PCI Express Gen3 hard IP also makes it a strong fit for host-accelerator card designs in PCIe-form-factor servers.
When designing with the 10AX090S3F45E2SG, allocate at least two PCB layers to power delivery and provide a thermal solution sized for the device's TDP (consult Quartus PowerPlay for accurate estimates). Quartus Prime Pro is the official design toolchain, and a license is required for full synthesis.
This page synthesizes distributor pricing, OPN-level alternatives, and Quartus-aware design notes that are not collected in a single place in the Intel Arria 10 datasheet.
Аналоги без доработки для 10AX090S3F45E2SG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10AX090S3F45E2SG (тот же форм-фактор и посадочное место) — отличается по Speed Grade, Package, DSP Blocks, Process Node, Operating Temperature.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10AX090S3F45E2LG
✅ Прямая замена✓ В наличии
$12480 / шт.
Открыть даташит →10AX090S2F45E2SG
✅ Прямая замена✓ В наличии
$2050 / шт.
Открыть даташит →10AX090S2F45E2LG
✅ Прямая замена✓ В наличии
$3750 / шт.
Открыть даташит →10AX090S2F45I2SG
✅ Прямая замена✓ В наличии
$3750 / шт.
Открыть даташит →10AX090S2F45I2LG
✅ Прямая замена✓ В наличии
$3800 / шт.
Открыть даташит →10AX090S2F45E1SG
✅ Прямая замена✓ В наличии
$4890 / шт.
Открыть даташит →10AX090S3F45E2SG Максимальные параметры и электрические характеристики
| Family | Arria 10 GX |
| Device Variant | 10AX090 |
| Logic Elements (LE) | 900,000 |
| Embedded Memory Bits | 59,234,304 bits |
| User I/O Count | 624 |
| Корпус | 1932-BBGA, FCBGA (F45, 45 mm) |
| Speed Grade | S3 |
| Transceiver Protocol | GX (up to 12.5 Gbps) |
| DSP Blocks | Variable-precision, with hardened single-precision FP |
| PCI Express Hard IP | Gen3 x8 |
| Memory Controller | Hard DDR3/DDR4/QDRII+/RLDRAM3 controller |
| Process Node | 20 nm TSMC |
| Configuration | Active/passive serial, JTAG |
| Рабочая температура | Industrial (E2 suffix: -40C to +100C) |
| Статус RoHS | Compliant |
Руководство по цоколевке 10AX090S3F45E2SG в корпусе 1932-bbga, fcbga (f45, 45 mm)
Цоколевка для 10AX090S3F45E2SG (корпус 1932-bbga, fcbga (f45, 45 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10AX090S3F45E2SG.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10AX090S3F45E2SG подходит для 6 применениеs: 4K Video Processing and Broadcast Equipment, Wireline 100G/400G Backhaul and Packet Processing, ASIC Prototyping and Emulation, Military Radar and Signal Processing, PCIe Host-Accelerator Card, High-Performance Industrial Imaging.
4K Video Processing and Broadcast Equipment
The 10AX090S3F45E2SG fits 4K video processing because its 900,000 LEs deliver the parallel DSP and pixel-pipeline fabric required for multi-stream 4K/UHD processing, while its 12.5 Gbps GX transceivers handle 6G/12G SDI and HDMI 2.0 links. The variable-precision DSP blocks execute color-space conversion, scaling, and deinterlacing in hardware with deterministic latency, offloading CPUs in broadcast playout systems. Industrial temperature grade (-40C to +100C, E2 suffix) supports outside-broadcast and studio equipment racks. Place the FPGA on a 12+ layer PCB with a thermal solution sized via Quartus PowerPlay to keep junction temperature within the derating curve. The 1932-ball FCBGA provides 624 user I/O for parallel video bus interfaces, GPIOs for control, and DDR4 banks for frame buffering.
Рекомендуется
Wireline 100G/400G Backhaul and Packet Processing
The 10AX090S3F45E2SG is well-suited for 100G/400G backhaul because its GX transceivers deliver 12.5 Gbps per lane, enabling multi-lane 100G (e.g., 10x10G or CAUI-10) aggregation when combined with an external gearbox. The 900K LEs and variable-precision DSP blocks implement packet classification, lookup tables, and traffic management at line rate. Hard PCI Express Gen3 IP blocks simplify host-linecard designs where the FPGA serves as a co-processor alongside an Ethernet PHY. Use hardened DDR4 controllers to hold packet descriptors with sub-microsecond access latency. Industrial temperature grade E2 supports outdoor telecom cabinets. Power budgeting requires careful rail sizing - the device can draw tens of amps on the core supply.
Рекомендуется
ASIC Prototyping and Emulation
The 10AX090S3F45E2SG's 900K logic elements and 59 Mbits embedded memory make it a strong mid-range ASIC prototyping vehicle, partitioning RTL across multiple FPGAs for designs up to several million gates. Hardened variable-precision DSPs accelerate arithmetic-heavy RTL emulation. The S3 speed grade provides timing margin so partitioned designs meet frequency targets. Use the hard DDR4 controller to map ASIC memory interfaces. JTAG and active-serial configuration support multi-board programming flows. For very large ASICs, combine with Arria 10 GX 10AX115 or 10AX130 OPNs in the same F45 footprint family. Industrial temperature grade E2 allows prototyping in lab and pre-production environments.
Рекомендуется
Military Radar and Signal Processing
The 10AX090S3F45E2SG serves radar signal-processing designs because 900K LEs and variable-precision DSPs implement FFTs, beamforming, and pulse compression at sample rates of hundreds of MHz. The 12.5 Gbps transceivers route digitized antenna data into the FPGA via high-speed serial ADCs. Industrial E2 temperature grade supports harsh defense-environment deployments when paired with ruggedized PCB stack-ups. ECC-enabled M20K memory blocks protect against single-event upsets (SEU) in high-altitude applications - instantiate ECC on critical state and configuration shadow memory. A multi-board thermal solution is recommended for sealed enclosures.
Рекомендуется
PCIe Host-Accelerator Card
The 10AX090S3F45E2SG's hard PCI Express Gen3 x8 IP block enables a host-accelerator card design without consuming fabric logic for the PHY/MAC. Combined with 900K LEs and hardened single-precision floating-point DSP blocks, the device accelerates compute kernels for HPC, ML inference, and database workloads. The 12.5 Gbps transceivers also support board-to-board coherent links for multi-FPGA systems. Use DDR4 banks backed by the hard memory controller for working-set data. Industrial temperature grade E2 supports data-center and edge-server deployments. Power delivery must budget for transient loads during kernel bursts - multi-phase VRMs are recommended.
Рекомендуется
High-Performance Industrial Imaging
The 10AX090S3F45E2SG suits industrial imaging because its 900K LEs and 624 user I/O handle multi-camera CoaXPress, Camera Link, and MIPI CSI-2 input streams simultaneously, while variable-precision DSPs perform real-time defect detection, color processing, and compression. The 12.5 Gbps transceivers carry CoaXPress 6.25 Gbps links without external PHYs. Industrial E2 temperature grade supports factory-floor deployments. Allocate at least one DDR4 bank per multi-gigapixel sensor for line buffering. Quartus Prime Pro is required to compile the design; budget several hours for full place-and-route on this high-density device.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10AX090S3F45E2SG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10AX090S3F45E2LG | 10AX090S2F45E2SG | 10AX090S2F45E2LG | 10AX090S2F45I2SG | 10AX090S2F45I2LG | 10AX090S2F45E1SG |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1932-BBGA FCBGA (F45, 45 mm) | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | S3 | S3 | S2 (slower) | S2 (slower) | S2 (slower) | S2 (slower) | S2 (slower) |
| Temperature Grade | E2 (industrial) | E2 (industrial) | E2 (industrial) | E2 (industrial) | I2 (industrial) | I2 (industrial) | E1 |
| Ball Finish | SG (standard lead-free) | LG (alt RoHS) | SG (standard lead-free) | LG (alt RoHS) | SG (standard lead-free) | LG (alt RoHS) | SG (standard lead-free) |
| User I/O | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Transceiver Rate (max) | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
Ключевые отличия
- S3 speed grade for higher Fmax margin (против 10AX090S2F45E2SG)
- SG ball finish is the most common OPN variant (против 10AX090S3F45E2LG)
- E2 temperature grade for industrial deployments (против 10AX090S3F45I2SG)
Заметки по проектированию
Estimated: at full utilization (90 percent LEs, 12.5 Gbps transceivers active), the 10AX090S3F45E2SG can dissipate 20-30 W. The F45 FCBGA package requires a heat-spreader or active heatsink plus at least 4 inner PCB ground planes for thermal spreading. Use Quartus PowerPlay to model your design's static and dynamic power accurately before finalizing the thermal solution. Ambient derating for the E2 industrial grade is 100C.
The 1932-ball FCBGA F45 package requires a 1.0 mm or 0.8 mm pitch BGA escape pattern. Use a minimum 12-layer stack-up with paired power/ground planes for transceiver channels and core logic. Decouple VCCINT and VCCAUX with bulk ceramics (22 uF X5R), 100 nF X7R, and 10 nF X7R per Intel pin-connection guidelines. Route high-speed serial lanes on the top half of the stack with reference ground planes; keep length-matched within 0.127 mm for 12.5 Gbps links.
Common pitfalls: (1) omitting the configuration mode pull-ups (MSEL pins) - the device fails to configure correctly; (2) confusing 'S' speed grade (transceiver-dependent) with logic speed - consult the Arria 10 speed-grade tables per fabric; (3) selecting the wrong F45 pin-out file in Quartus Prime - always regenerate per OPN; (4) under-budgeting the VCC core supply current - use PowerPlay early in the design cycle.
Информация о соответствии
RoHS and REACH compliance per Altera/Intel product declaration. AEC-Q100 not applicable (FPGA is not an automotive-grade IC per AEC-Q100 scope).
