ATSAME53N19A-AFT - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
Артикул: ATSAME53N19A-AFT ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $9.42 | $9,42 |
| 10 | $8.61 | $86,10 |
| 100 | $7.78 | $778,00 |
| 500 | $6.95 | $3.475,00 |
| 1.000 | $6.13 | $6.130,00 |
ATSAME53N19A-AFT Обзор
An ARM Cortex-M4F microcontroller is a 32-bit RISC processor core featuring single-precision floating-point hardware acceleration, DSP extensions, and a Nested Vectored Interrupt Controller (NVIC). It belongs to the ARM Cortex-M family (hypernym hierarchy: Cortex-M4F -> Cortex-M4 -> Cortex-M -> ARM processor core -> RISC microprocessor). The Cortex-M4F is widely adopted in mixed-signal embedded systems where deterministic real-time control, math-intensive DSP, and low-power operation coexist.
Key features of the ATSAME53N19A-AFT include 512 KB of Flash with ECC, 192 KB of SRAM with ECC, a 120 MHz maximum CPU clock, integrated 10/100 Mbps Ethernet MAC, USB 2.0 Full-Speed device/host with on-chip transceiver, a 12-bit 1 MSPS ADC, multiple SERCOM interfaces, and a wide operating voltage range of 1.71V to 3.6V. The integrated FPU accelerates floating-point math, while the dual-panel Flash with ECC supports in-field firmware upgrades with built-in error correction for safety-critical applications.
The SAM E53 architecture combines deterministic Cortex-M4F performance with rich connectivity peripherals - Ethernet MAC, USB, CAN-FD, and multiple SERCOM channels - reducing BOM cost by eliminating external PHY or interface ICs. The Dual-Panel Flash with ECC supports Over-the-Air firmware update patterns commonly used in IoT and industrial gateways, while the SRAM with ECC enhances reliability in electrically noisy environments such as motor drives and factory automation.
Typical applications include industrial Ethernet gateways, IoT edge nodes with USB connectivity, building automation controllers, motor control subsystems, and connected sensor hubs. The combination of Ethernet MAC and USB on a Cortex-M4F core enables single-MCU designs that previously required a companion network processor.
When designing with this part, ensure the TQFP-100 PCB layout uses thermal vias under the exposed pad for heat spreading at high CPU loads. The internal voltage regulator requires a 1 uF + 100 nF decoupling network on the VCORE pin and the PLL loop filter components must follow the manufacturer reference layout to achieve the rated 120 MHz operation.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical PCB design notes not found in the bare manufacturer datasheet.
Аналоги без доработки для ATSAME53N19A-AFT — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с ATSAME53N19A-AFT (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, ADC, Core Architecture, Flash ECC.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
ATSAME53N20A-AFT
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
ATSAME53N19A-AUT
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
ATSAME54N19A-AFT
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
ATSAMD51N19A-AFT
✅ Прямая замена✓ В наличии
$4.8 / шт.
Открыть даташит →ATSAME53N19A-AF
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
ATSAMD51P19A-AFT
✅ Прямая замена✓ В наличии
$6.18 / шт.
Открыть даташит →ATSAME53N19A-AFT Максимальные параметры и электрические характеристики
| Core Architecture | ARM Cortex-M4F with FPU |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 512 KB |
| Flash ECC | Yes (dual-panel Flash) |
| SRAM ECC | Yes |
| Operating Voltage Range | 1.71 V to 3.6 V |
| Ethernet MAC | 10/100 Mbps integrated |
| USB | USB 2.0 Full-Speed with on-chip PHY |
| ADC | 12-bit (per datasheet) |
| Корпус | TQFP-100 (14x14 mm) |
| Тип монтажа | Surface Mount |
| Рабочая температура | -40 C to +105 C (extended temp grade) |
| Статус RoHS | Compliant |
| Lead-Free | Yes |
| Delivery Form | Tape & Reel (suffix AFT) |
Конфигурация выводов ATSAME53N19A-AFT
| Контакт 1 | VDDIO — Digital I/O supply voltage |
| Контакт 2 | PA00 — General purpose I/O / XIN |
| Контакт 3 | PA01 — General purpose I/O / XOUT |
| Контакт 4 | PA02 — General purpose I/O / AIN0 |
| Контакт 5 | PA03 — General purpose I/O / AIN1 |
| Контакт 6 | GND — Ground |
| Контакт 7 | PA04 — General purpose I/O / AIN2 |
| Контакт 8 | PA05 — General purpose I/O / AIN3 |
| Контакт 9 | PA06 — General purpose I/O |
| Контакт 10 | PA07 — General purpose I/O |
| Контакт 11 | PA08 — General purpose I/O |
| Контакт 12 | PA09 — General purpose I/O |
| Контакт 13 | PA10 — General purpose I/O |
| Контакт 14 | PA11 — General purpose I/O |
| Контакт 15 | VDDIO — Digital I/O supply voltage |
| Контакт 16 | GND — Ground |
| Контакт 17 | PA12 — General purpose I/O |
| Контакт 18 | PA13 — General purpose I/O |
| Контакт 19 | PA14 — General purpose I/O |
| Контакт 20 | PA15 — General purpose I/O |
| Контакт 21 | PA16 — General purpose I/O |
| Контакт 22 | PA17 — General purpose I/O |
| Контакт 23 | PA18 — General purpose I/O |
| Контакт 24 | PA19 — General purpose I/O |
| Контакт 25 | PA20 — General purpose I/O |
| Контакт 26 | PA21 — General purpose I/O |
| Контакт 27 | PA22 — General purpose I/O |
| Контакт 28 | PA23 — General purpose I/O |
| Контакт 29 | PA24 — General purpose I/O |
| Контакт 30 | PA25 — General purpose I/O |
| Контакт 31 | GND — Ground |
| Контакт 32 | PA27 — General purpose I/O |
| Контакт 33 | PA28 — General purpose I/O |
| Контакт 34 | PA29 — General purpose I/O |
| Контакт 35 | PA30 — General purpose I/O |
| Контакт 36 | PA31 — General purpose I/O |
| Контакт 37 | PB00 — General purpose I/O |
| Контакт 38 | PB01 — General purpose I/O |
| Контакт 39 | PB02 — General purpose I/O |
| Контакт 40 | PB03 — General purpose I/O |
| Контакт 41 | PB04 — General purpose I/O |
| Контакт 42 | PB05 — General purpose I/O |
| Контакт 43 | PB06 — General purpose I/O |
| Контакт 44 | PB07 — General purpose I/O |
| Контакт 45 | PB08 — General purpose I/O |
| Контакт 46 | PB09 — General purpose I/O |
| Контакт 47 | PB10 — General purpose I/O |
| Контакт 48 | PB11 — General purpose I/O |
| Контакт 49 | VDDIO — Digital I/O supply voltage |
| Контакт 50 | GND — Ground |
| Контакт 51 | PB12 — General purpose I/O |
| Контакт 52 | PB13 — General purpose I/O |
| Контакт 53 | PB14 — General purpose I/O |
| Контакт 54 | PB15 — General purpose I/O |
| Контакт 55 | PB16 — General purpose I/O |
| Контакт 56 | PB17 — General purpose I/O |
| Контакт 57 | PB18 — General purpose I/O |
| Контакт 58 | PB19 — General purpose I/O |
| Контакт 59 | PB20 — General purpose I/O |
| Контакт 60 | PB21 — General purpose I/O |
| Контакт 61 | PB22 — General purpose I/O |
| Контакт 62 | PB23 — General purpose I/O |
| Контакт 63 | PB24 — General purpose I/O |
| Контакт 64 | PB25 — General purpose I/O |
| Контакт 65 | PB26 — General purpose I/O |
| Контакт 66 | PB27 — General purpose I/O |
| Контакт 67 | PB28 — General purpose I/O |
| Контакт 68 | PB29 — General purpose I/O |
| Контакт 69 | PB30 — General purpose I/O |
| Контакт 70 | PB31 — General purpose I/O |
| Контакт 71 | GND — Ground |
| Контакт 72 | VDDIO — Digital I/O supply voltage |
| Контакт 73 | PC00 — General purpose I/O |
| Контакт 74 | PC01 — General purpose I/O |
| Контакт 75 | PC02 — General purpose I/O |
| Контакт 76 | PC03 — General purpose I/O |
| Контакт 77 | PC04 — General purpose I/O |
| Контакт 78 | PC05 — General purpose I/O |
| Контакт 79 | PC06 — General purpose I/O |
| Контакт 80 | PC07 — General purpose I/O |
| Контакт 81 | VDDCORE — Core supply voltage |
| Контакт 82 | GND — Ground |
| Контакт 83 | PC08 — General purpose I/O |
| Контакт 84 | PC09 — General purpose I/O |
| Контакт 85 | PC10 — General purpose I/O |
| Контакт 86 | PC11 — General purpose I/O |
| Контакт 87 | PC12 — General purpose I/O |
| Контакт 88 | PC13 — General purpose I/O |
| Контакт 89 | PC14 — General purpose I/O |
| Контакт 90 | PC15 — General purpose I/O |
| Контакт 91 | PD00 — General purpose I/O |
| Контакт 92 | PD01 — General purpose I/O |
| Контакт 93 | PD02 — General purpose I/O |
| Контакт 94 | PD03 — General purpose I/O |
| Контакт 95 | PD04 — General purpose I/O |
| Контакт 96 | PD05 — General purpose I/O |
| Контакт 97 | PD06 — General purpose I/O |
| Контакт 98 | PD07 — General purpose I/O |
| Контакт 99 | PD08 — General purpose I/O |
| Контакт 100 | PD09 — General purpose I/O |
Типичное применение
ATSAME53N19A-AFT подходит для 7 применениеs: Industrial Ethernet Gateway, IoT Edge Sensor Hub, Motor Control Subsystem, Building Automation Controller, USB-Connected Data Acquisition Device, Connected HMI Touch Panel, Smart Energy / Sub-Metering.
Industrial Ethernet Gateway
The ATSAME53N19A-AFT's integrated 10/100 Mbps Ethernet MAC with IEEE 1588 timestamping makes it a strong fit for industrial Ethernet gateway designs bridging Modbus TCP, EtherCAT, or PROFINET slave networks to field devices. The 120 MHz Cortex-M4F core runs industrial protocol stacks comfortably within its 512 KB Flash budget while the FPU accelerates math-heavy packet processing. Placed on the gateway main board between the RJ45 magnetics and a downstream fieldbus transceiver, this MCU eliminates an external network processor. The dual-panel Flash with ECC supports secure OTA firmware updates for long-lifecycle industrial deployments.
Рекомендуется
IoT Edge Sensor Hub
The ATSAME53N19A-AFT combines Ethernet connectivity, USB 2.0 Full-Speed with on-chip PHY, and a 120 MHz Cortex-M4F core with FPU for on-device DSP analytics, making it well suited for IoT edge sensor hubs aggregating multiple analog or digital sensor inputs. The 12-bit ADC samples field sensors at up to 1 MSPS while SERCOM channels interface I2C/SPI sensors. Placed at the heart of the hub board with the USB PHY powering a local debug/logging port, this part enables pre-processed analytics at the network edge. ECC SRAM and Flash reduce field failures caused by environmental noise.
Рекомендуется
Motor Control Subsystem
The ATSAME53N19A-AFT's 120 MHz Cortex-M4F core with single-cycle MAC and FPU delivers the deterministic DSP throughput required for field-oriented control (FOC) of BLDC or PMSM motors. The PWM timers and high-speed 12-bit ADC feedback loops execute torque, velocity, and position control within microseconds. Placed on the motor control board driving the gate driver and three-phase inverter, this MCU performs real-time control on the same chip that handles CAN-FD communication with the central controller. Extended -40C to +105C temperature grade supports industrial servo drive environments.
Рекомендуется
Building Automation Controller
The ATSAME53N19A-AFT powers building automation controllers handling HVAC, lighting, and access control subsystems with deterministic Ethernet and USB connectivity. The Cortex-M4F core runs BACnet or Modbus stacks while GPIO and SERCOM channels drive relay boards, dimmers, and sensor networks. Placed on the controller main board between the Ethernet transformer and downstream actuator interfaces, this MCU consolidates connectivity and control into a single chip. ECC memory and dual-panel Flash reduce maintenance truck rolls caused by transient bit-flips or failed firmware upgrades.
Рекомендуется
USB-Connected Data Acquisition Device
The ATSAME53N19A-AFT's USB 2.0 Full-Speed with on-chip PHY enables bus-powered data acquisition devices that stream ADC samples to a host PC without an external transceiver. The 120 MHz Cortex-M4F with FPU performs real-time DSP on incoming analog signals before USB transfer. Placed on the DAQ board between the analog front-end and the USB-C connector, this MCU handles sampling, filtering, and USB transfers entirely on-chip. ECC memory ensures acquired data reliability in electrically noisy lab environments.
Рекомендуется
Connected HMI Touch Panel
The ATSAME53N19A-AFT drives color TFT displays over SPI or RGB interfaces, processes touch input from capacitive controllers, and streams UI updates over Ethernet or USB. The Cortex-M4F with FPU renders graphical content using emWin or LVGL graphics libraries within the 512 KB Flash budget. Placed at the center of the HMI controller board between the display driver and the network interface, this MCU delivers responsive industrial HMI experiences. The wide 1.71V-3.6V supply range simplifies power tree design in 24V industrial systems.
Рекомендуется
Smart Energy / Sub-Metering
The ATSAME53N19A-AFT's combination of Ethernet MAC, 12-bit ADC sampling at 1 MSPS, and Cortex-M4F performance enables single-chip smart energy meters computing RMS voltage, current, and power in real time. Dual-panel Flash with ECC supports secure meter firmware updates with rollback capability. Placed between the current transformers and the meter's communication interface, this MCU performs energy calculation, time-of-use billing logic, and remote data reporting over Ethernet. Extended temperature grade supports outdoor meter enclosures.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для ATSAME53N19A-AFT — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | ATSAME53N20A-AFT | ATSAME53N19A-AUT | ATSAME54N19A-AFT | ATSAMD51N19A-AFT | ATSAME53N19A-AF | ATSAMD51P19A-AFT |
|---|---|---|---|---|---|---|---|
| Package | TQFP-100 (14x14 mm) | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F |
| Maximum Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 512 KB | 1 MB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | Not integrated | 10/100 integrated | Not integrated |
| USB | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY |
| Operating Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
| Delivery Form | Tape & Reel | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
Ключевые отличия
- Integrated Ethernet MAC with IEEE 1588 timestamps (против ATSAMD51N19A-AFT)
- Upward Flash migration path in same package (против ATSAME53N19A-AUT (Tray variant))
- CAN-FD upgrade availability (против ATSAME53N19A-AFT (E53) vs ATSAME54N19A-AFT (E54))
Заметки по проектированию
The TQFP-100 package has an exposed thermal pad on its underside that must be soldered to a copper pour on the top layer with thermal vias to the inner/ground planes. Use a 5x5 via array on a 1.2mm grid under the pad, with vias tented or capped to prevent solder wicking during reflow. This thermal management is critical when the MCU runs at 120 MHz full load with all peripherals active, as junction temperature can rise 15-20 C above ambient without proper copper spreading.
The internal voltage regulator requires a 1 uF X7R ceramic capacitor on the VCORE pin (pin 81) and a 100 nF decoupling capacitor on each VDDIO pin. Place these capacitors within 2 mm of the MCU pins with short, wide traces. The VDDCORE pin must not be driven externally - the internal LDO generates the 1.2V core voltage from the VDDIN supply. Bulk 4.7 uF decoupling on VDDIN is recommended to handle peak current transients when Ethernet and USB operate simultaneously.
When migrating between ATSAME53N19A-AFT (512 KB Flash) and ATSAME53N20A-AFT (1 MB Flash), the firmware linker script must be updated to use the larger Flash region - the boot sequence and vector table size differ. Also ensure the Ethernet MAC signal integrity: route the RMII clock and data lines as length-matched 50-ohm traces with reference to a continuous ground plane, and place the PHY within 50 mm of the MAC pins. Crosstalk between RMII and adjacent GPIO traces can corrupt packets at 100 Mbps.
Crystal oscillator traces for the 12 MHz external crystal must be kept short (<5 mm) and surrounded by a ground guard ring to minimize EMI pickup. Place the load capacitors within 2 mm of the XIN/XOUT pins (PA00/PA01). For USB, route the D+/D- traces as a 90-ohm differential pair with length matching within 2 mm, and place the common-mode choke near the USB connector. Improper USB routing is the most common cause of USB Full-Speed enumeration failures.
Информация о соответствии
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - this part targets industrial extended temperature -40C to +105C, not automotive grade. For automotive applications, refer to the SAM E5x AEC-Q100 qualified variants separately.