BCM8073CIFBG - Dual 10GBASE-KR Transceiver | Broadcom
Артикул: BCM8073CIFBG ✓ АктивенBCM8073CIFBG Обзор
A 10GBASE-KR transceiver is a physical-layer semiconductor that converts parallel digital data into high-speed serial signals for transmission over printed-circuit-board backplanes and converts incoming serial signals back into parallel data. In the broader networking hierarchy, BCM8073CIFBG belongs to the Ethernet transceiver class, which supports network interface controllers, switches, routers, servers, and data-center equipment. The XAUI-to-XFI LANPHY positioning provides a bridge between a high-speed parallel Ethernet interface and an XFI serial physical-layer path.
The principal device characteristics are its two serial channels, 10GBASE-KR operation, 1.25 Gbps and 10 Gbps link-rate support, 3.3 V supply operation, and 324-ball BGA package. The dual-channel configuration allows one physical-layer device to serve two high-speed serial links, reducing component count and simplifying board planning compared with two separate single-channel devices. Broadcom markets the BCM8073 family for 10GbE and 10GFC applications where PCB signal integrity and deterministic high-speed connectivity are central design concerns.
The BCM8073CIFBG belongs to a specialized Ethernet physical-layer product family rather than a general-purpose interface controller. Its serial architecture supports systems in which a network processor or switch ASIC exchanges data with a physical-layer device. The 324-ball BGA provides a high pin count suitable for parallel logic, power distribution, clocking, configuration, and multiple high-speed serial interfaces, but it also requires careful escape routing and controlled reference-plane design around the package.
Typical applications include 10GbE backplane equipment, 10GFC interconnect fabrics, data-center switches, server network interfaces, and high-throughput aggregation systems. In a backplane design, the BCM8073CIFBG can provide 10GBASE-KR connectivity over controlled PCB channels. In a network-interface card, it can pair a network controller with a serial backplane or front-panel interface. Its dual-channel organization is particularly useful when adjacent links share power, clock, and thermal conditions.
The primary design consideration is PCB signal integrity at 10 Gbps. Short reference planes, continuous return paths, suitable loss management, and tightly controlled connector or package transitions are essential. Decoupling and clock distribution must be planned according to the manufacturer’s reference circuit, while BGA assembly requires a package-specific land pattern, solder mask, and thermal design capable of dissipating device power.
This product record combines the identified Broadcom device characteristics, interface positioning, package information, compliance status, application guidance, and design considerations. It also distinguishes the BCM8073CIFBG from unrelated Ethernet PHYs that cannot replace it because they use different packages, protocols, or electrical interfaces.
Аналоги без доработки для BCM8073CIFBG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Для этого товара нет аналогов без доработки.
Запросить аналогиBCM8073CIFBG Максимальные параметры и электрические характеристики
| Manufacturer | Broadcom Limited |
| Product Type | Dual-channel serial 10GBASE-KR transceiver |
| Number of Channels | 2 channels |
| Supported Data Rates | 1.25 Gbps and 10 Gbps |
| Primary Ethernet Protocol | 10GBASE-KR |
| Interface Positioning | 10GbE/10GFC XAUI-to-XFI LANPHY |
| Напряжение питания | 3.3 V |
| Package Type | 324-ball BGA |
| Package Shape | Square |
| Terminal Form | Ball |
| Number of Terminals | 324 balls |
| Mounting Method | Surface mount |
| Lead-Free Status | Lead free |
| Статус RoHS | ROHS3 compliant |
| Maximum Data Rate per Channel | 10 Gbps |
| Serializer Technology | XAUI-to-XFI serial interface |
Руководство по цоколевке BCM8073CIFBG в корпусе square
Цоколевка для BCM8073CIFBG (корпус square). Этот аналоговый компонент имеет выводы входа, выхода и питания. Обратитесь к техническому описанию производителя для конфигураций выводов балансировки нуля, коррекции и разрешения. Идеально подходит для схем обработки сигналов и усилителей.
Нет подробных данных о распиновке для BCM8073CIFBG.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
BCM8073CIFBG подходит для 6 применениеs: 10GbE Switch Backplanes, Data-Center Switch Line Cards, 10GFC Interconnect Fabrics, Server Network Interface Cards, High-Speed Network Aggregation, Industrial Network Control Equipment.
10GbE Switch Backplanes
BCM8073CIFBG fits a 10GbE switch backplane that requires two 10GBASE-KR channels in one high-density physical-layer device. Its 1.25 Gbps and 10 Gbps link-rate support provides a path for compatible low-speed training or fallback and full-rate backplane operation. Place the two serial channels toward controlled PCB channels and connect the XAUI-to-XFI LANPHY interface to the switching ASIC. The main engineering requirement is a 10 Gbps-ready stack-up with short escape routes, continuous reference planes, and impedance-controlled differential pairs.
Рекомендуется
Data-Center Switch Line Cards
BCM8073CIFBG can support the high-speed physical layer of a data-center switch line card where a host ASIC requires 10GBASE-KR links over short PCB channels. Its dual-channel arrangement reduces the number of separate PHY devices when two links share the same board constraints. The 3.3 V architecture and 324-ball BGA support dense integration, although assembly planning must address BGA escape routing, power delivery, and heat spreading. Validate channel loss, insertion loss, skew, and return loss against the complete PCB stack-up.
Рекомендуется
10GFC Interconnect Fabrics
The BCM8073CIFBG is identified for 10GbE and 10GFC XAUI-to-XFI LANPHY use, making it applicable to high-bandwidth 10GFC interconnect fabrics. Two channels can support parallel traffic paths when the host fabric and board channel permit simultaneous 10 Gbps operation. Use the manufacturer reference circuit to define supply filtering, reference-clock distribution, reset behavior, and configuration. Board-level qualification should include insertion loss, differential impedance, pair skew, crosstalk, and connector or package-transition behavior.
Рекомендуется
Server Network Interface Cards
BCM8073CIFBG is appropriate for a server network-interface card that connects a network controller or host ASIC to a 10GBASE-KR backplane or internal interconnect. Its dual-channel design can consolidate two high-speed links while the XAUI-to-XFI LANPHY arrangement connects the physical layer to a compatible host interface. Power integrity is central because a 3.3 V high-speed transceiver must maintain clean references and supplies across both active channels. Keep sensitive clock and serial routes away from noisy switching nodes and follow the exact manufacturer ball assignment.
Рекомендуется
High-Speed Network Aggregation
BCM8073CIFBG can be used in aggregation equipment where several 10 Gbps links converge on a switching or packet-processing ASIC. The device provides two 10GBASE-KR physical channels and supports the 10GbE XAUI-to-XFI LANPHY interface identified for the family. This arrangement suits compact systems that require more serial bandwidth than a single copper-pair Ethernet PHY can provide. Design the PCB so each high-speed lane has a controlled impedance and uninterrupted reference plane, while accounting for connector loss, via stubs, and crosstalk between adjacent links.
Рекомендуется
Industrial Network Control Equipment
BCM8073CIFBG can serve high-speed industrial network-control equipment when a controller uses a 10GBASE-KR link over a qualified backplane rather than conventional copper pairs. Its 1.25 Gbps and 10 Gbps operating points support systems that need both lower-rate link operation and full 10 Gbps throughput. The 324-ball BGA is suited to multilayer industrial control boards, but designers must apply the manufacturer’s decoupling, clocking, and layout instructions. Confirm environmental qualification and operating-temperature limits before using the device in deployed industrial equipment.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для BCM8073CIFBG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар |
|---|---|
| Package | 324-ball BGA |
| Brand | Broadcom |
| Product Type | Dual-channel serial Ethernet transceiver |
| Ethernet Protocol | 10GBASE-KR |
| Maximum Data Rate | 10 Gbps |
| Supported Data Rates | 1.25 Gbps and 10 Gbps |
| Supply Voltage | 3.3 V |
| Number of Channels | 2 channels |
| Interface Positioning | 10GbE/10GFC XAUI-to-XFI LANPHY |
| RoHS Status | ROHS3 compliant |
Ключевые отличия
- Two 10GBASE-KR channels in one physical-layer device (против Single-channel Ethernet PHY designs)
- Purpose-built XAUI-to-XFI LANPHY positioning (против Conventional copper-pair Ethernet PHYs)
- High-density 324-ball BGA integration (против Low-pin-count Ethernet transceiver packages)
Заметки по проектированию
Treat the 10GBASE-KR channels as controlled-impedance high-speed differential pairs. Use the Broadcom reference design and package ball map to define pair geometry, via transitions, and layer changes; minimize stubs, maintain pair symmetry, and preserve a continuous reference plane beneath the routes. Validate insertion loss, return loss, differential impedance, skew, and crosstalk against the complete PCB stack-up before releasing the layout.
Plan the 3.3 V power grid around the manufacturer’s supply-ball and decoupling recommendations. Place low-inductance capacitors close to the relevant power and ground balls, provide adequate copper area for current delivery, and separate noisy switching paths from reference-clock and serial-data routing. Review voltage tolerance, power-sequencing requirements, and supply-current limits against the exact Broadcom datasheet before schematic release.
The 324-ball BGA requires assembly and thermal planning rather than a simple two-layer escape strategy. Use the manufacturer’s recommended board footprint, solder-mask and paste pattern, and package-specific assembly profile. Provide thermal-via and copper-spreading arrangements where the package data calls for them. Complete the thermal calculation with device power dissipation and the selected PCB construction so the junction-temperature target is met.
Coordinate the XAUI, XFI, reference-clock, configuration, and power routes as one constraint set. Keep the two high-speed channels separated from noisy digital and power-conversion nodes, maintain repeatable escape geometry around the BGA, and observe any lane-deskew requirements in the manufacturer interface specification. Do not copy a generic BGA layout: confirm every ball assignment and differential pair against the BCM8073CIFBG package documentation.
Информация о соответствии
Exact-MPN product listings identify BCM8073CIFBG as lead free and ROHS3 compliant. No formal REACH, AEC-Q100, halogen-free, or conflict-minerals declaration was identified.
