BSC9131NLN1HHHB - 800MHz e500 Processor | NXP
Артикул: BSC9131NLN1HHHB ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $36.6899 | $36,69 |
| 10 | $36.6899 | $366,90 |
| 100 | $36.6899 | $3.668,99 |
| 500 | $36.6899 | $18.344,95 |
| 1.000 | $36.6899 | $36.689,90 |
BSC9131NLN1HHHB Обзор
A system-on-chip, or SoC, integrates a processor core, memory interfaces, communications peripherals, and optional accelerators into one semiconductor package. Within the QorIQ product hierarchy, the BSC9131 combines the PowerPC e500 CPU, a StarCore DSP, MAPLE-B2F acceleration, IFC, and DDR3 support. This integration allows communications and embedded systems to execute control, signal-processing, and network workloads with one highly integrated device.
The verified product data highlights an 800 MHz e500 CPU, an 800 MHz StarCore DSP, MAPLE-B2F acceleration, integrated IFC, and DDR3 memory support. These functions suit workloads that require dedicated digital signal processing alongside general-purpose network processing. The 520-FCBGA package provides a large, complex interconnect surface, so PCB escape routing, power delivery, thermal design, and manufacturing validation require careful planning.
BSC9131NLN1HHHB is positioned for small-cell base stations, enterprise VoIP, smart-grid control, military and defense systems, and industrial applications. In these systems, the CPU can manage protocol and control tasks while the StarCore DSP accelerates signal-processing workloads. MAPLE-B2F acceleration provides another dedicated compute resource, while IFC and DDR3 interfaces support connected equipment and memory-intensive data paths.
A critical design consideration is that a 520-FCBGA is not a low-pin-count or low-risk package. Power rails, high-speed memory routing, thermal paths, and ball-assignment verification must follow the official device documentation and validated hardware design. Do not infer compatible regulators, memory devices, or peripheral ICs from general processor specifications without checking the manufacturer data.
This page consolidates verified distributor specifications, sourcing information, application context, and design cautions for BSC9131NLN1HHHB. It does not substitute for the complete NXP hardware manual, reference design, package drawing, or board-support package. Pricing reflects the supplied market observations as of 2026-10-23 and should be reconfirmed before procurement.
Аналоги без доработки для BSC9131NLN1HHHB — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
Для этого товара нет аналогов без доработки.
Запросить аналогиBSC9131NLN1HHHB Максимальные параметры и электрические характеристики
| Product Type | QorIQ Qonverge system-on-chip |
| Processor Core | PowerPC e500, 32-bit |
| Processor Frequency | 800 MHz |
| Core Count | 1 core |
| Digital Signal Processor | 800 MHz StarCore DSP |
| Accelerator | MAPLE-B2F accelerator |
| Communications Interface | Integrated IFC |
| External Memory Support | DDR3 |
| Диапазон рабочих температур | 0°C to 105°C |
| Корпус | 520-FCBGA (21 mm x 21 mm) |
| Число выводов | 520 balls |
| Тип монтажа | Surface mount |
| Architecture | 32-bit |
| Статус RoHS | RoHS compliant |
| Packaging Form | Multiple dry pack, bakeable tray |
| Observed LCSC Price | $36.6899 as of 2026-10-23 |
| Observed Heisener Price | $56.6250 per unit as of 2026-10-23 |
| Observed Heisener Stock | 4,928 pieces as of 2026-10-23 |
Руководство по цоколевке BSC9131NLN1HHHB в корпусе 520-fcbga (21 mm x 21 mm)
Цоколевка для BSC9131NLN1HHHB (корпус 520-fcbga (21 mm x 21 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для BSC9131NLN1HHHB.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
BSC9131NLN1HHHB подходит для 6 применениеs: Small-Cell Base Stations, Smart-Grid Control Equipment, Enterprise Voice over IP, Industrial Communication Controllers, Military and Defense Edge Systems, Real-Time Signal Processing.
Small-Cell Base Stations
BSC9131NLN1HHHB fits small-cell base-station processing because it combines an 800 MHz PowerPC e500 CPU with an 800 MHz StarCore DSP, MAPLE-B2F acceleration, IFC, and DDR3 support. The CPU can handle control and protocol tasks while the DSP and accelerator address signal-processing paths within one QorIQ Qonverge SoC. Its verified 0°C to 105°C range suits many installed equipment environments. The engineering trade-off is board complexity: designers must provide a 520-FCBGA-compatible multilayer PCB, dense power and memory routing, and thermal validation. Software availability and final RF architecture must also be confirmed before design release.
Рекомендуется
Smart-Grid Control Equipment
BSC9131NLN1HHHB is identified as a smart-grid control device and combines general-purpose e500 processing with StarCore DSP acceleration. The 800 MHz CPU supports network and supervisory tasks, while the DSP and MAPLE-B2F accelerator can accelerate suitable data-processing workloads. DDR3 support allows higher-capacity working memory than a compact microcontroller-class design, and the verified 0°C to 105°C range covers many industrial environments. Deployment still requires utility-specific protocol stacks, electromagnetic compliance, fault-injection testing, and a thermal design validated for the complete controller enclosure.
Рекомендуется
Enterprise Voice over IP
BSC9131NLN1HHHB is listed as targeting enterprise VoIP and provides an 800 MHz e500 CPU alongside an 800 MHz StarCore DSP. That division of resources can support packet handling, call-control logic, media processing, and other real-time network functions in a single SoC. Integrated IFC and DDR3 support further fit connected communications equipment. Designers should verify codec requirements, network interfaces, boot support, and operating-system availability. The 520-FCBGA package also demands careful escape routing and power planning, making software fit and hardware implementation equally important selection criteria.
Рекомендуется
Industrial Communication Controllers
BSC9131NLN1HHHB can consolidate communications and control processing through its 800 MHz e500 core, 800 MHz StarCore DSP, IFC, and DDR3 interface. The CPU is suited to protocol stacks and supervisory logic, while DSP resources support selected real-time or filtering tasks. This integration may reduce system component count compared with separate processor and accelerator designs, but it does not eliminate external interface circuitry. A complete design still needs validated PHY and line-interface components, isolation requirements, EMC filtering, thermal analysis, and a multilayer PCB capable of supporting the 520-FCBGA land pattern.
Рекомендуется
Military and Defense Edge Systems
BSC9131NLN1HHHB is identified for military and defense applications and provides an 800 MHz e500 processor, an 800 MHz StarCore DSP, MAPLE-B2F acceleration, and DDR3 support in one SoC. This combination can support edge processing where network handling, deterministic control, and signal-processing tasks must share a platform. The verified 0°C to 105°C specification is only one environmental checkpoint; program-specific shock, vibration, radiation, security, and reliability requirements are not provided and must not be inferred. Procurement should therefore include exact qualification, traceability, software-support, and configuration reviews.
Рекомендуется
Real-Time Signal Processing
The 800 MHz StarCore DSP gives BSC9131NLN1HHHB dedicated real-time signal-processing capability while the 800 MHz e500 CPU handles general computation and system control. MAPLE-B2F acceleration adds another specialized compute path, making the SoC relevant to communications and industrial workloads that benefit from heterogeneous processing. DDR3 support can accommodate larger data buffers than a small microcontroller platform. Algorithm portability and accelerator utilization remain critical: developers must confirm compiler support, memory bandwidth, interrupt behavior, and deterministic timing. Board validation must account for the thermal and routing demands of the 520-FCBGA package.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для BSC9131NLN1HHHB — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар |
|---|---|
| Package | 520-FCBGA (21 mm x 21 mm) |
| Brand | NXP Semiconductors |
| Processor Core | PowerPC e500, 32-bit |
| Processor Frequency | 800 MHz |
| Core Count | 1 core |
| Digital Signal Processor | 800 MHz StarCore DSP |
| Memory Support | DDR3 |
| Operating Temperature Range | 0°C to 105°C |
Заметки по проектированию
Treat the 520-FCBGA as a complex multiconductor design rather than a conventional two-row IC. Before routing, obtain the official NXP ball map and stack-up requirements, identify every supply and ground ball, and reserve compliant escape paths for high-speed interfaces and DDR3. Verify via-in-pad, solder-mask, land, thermal-via, and impedance rules against the current package drawing; no unverified package geometry is assumed in this record.
Plan the complete power tree from the official BSC9131 documentation, including processor, DSP, accelerator, I/O, memory, and accelerator rails. Estimated: no power dissipation value is calculated because the supplied data does not provide current-versus-frequency or voltage-dependent current tables. Use measured or datasheet-derived worst-case loads, design startup sequencing and decoupling from the manufacturer guidance, and validate voltage tolerance, inrush, and rail coupling on hardware before production release.
The 520-FCBGA has a large thermal and escape-routing burden, but the supplied sources do not state theta_JA, theta-JC, junction limits, or power consumption. Therefore, no unsupported junction-temperature or thermal-resistance estimate is presented. Evaluate the complete board under worst-case e500, StarCore, MAPLE-B2F, memory, and I/O activity, include copper and thermal-via structures required by the package design, and verify temperature with both simulation and physical thermal testing in the final enclosure.
Do not substitute a processor merely because its clock rate matches 800 MHz. BSC9131NLN1HHHB combines a 32-bit e500 core, an 800 MHz StarCore DSP, MAPLE-B2F acceleration, IFC, DDR3, and a 520-FCBGA package. Verify boot media, firmware, peripheral topology, software drivers, pin assignments, memory compatibility, lifecycle status, and thermal constraints. The MCIMX6D7CVT08AC comparison in the supplied data uses a different 624-FCBGA and therefore is not a drop-in replacement.
Информация о соответствии
GlobalSpec's verified listing states that the tray is RoHS compliant. No verified REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 statement was supplied. The device is not an automotive component, so AEC-Q100 is treated as not applicable only for this product classification.
