BSC9131NSE7KHKB - 1GHz QorIQ Qonverge SoC | NXP
Артикул: BSC9131NSE7KHKB ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $54.9669 | $54,97 |
| 10 | $54.9669 | $549,67 |
| 100 | $54.9669 | $5.496,69 |
| 500 | $54.9669 | $27.483,45 |
| 1.000 | $54.9669 | $54.966,90 |
BSC9131NSE7KHKB Обзор
A QorIQ Qonverge SoC integrates a processor complex, hardware acceleration, security, and communications functions into one package. Such devices belong to the embedded microprocessor hierarchy and use dedicated compute engines to accelerate network or signal-processing operations that would otherwise burden the main CPU. This makes the part relevant to packet processing, industrial networking, protocol conversion, and real-time communications equipment.
Verified listings identify IFC, DDR3, SEC, MAPLE-B2F acceleration, a StarCore DSP, and an e500 CPU as major functions. The combination allows heterogeneous processing: the e500 core can run control software while the StarCore engine handles suitable DSP workloads and MAPLE-B2F accelerates supported operations. However, memory width, speed, I/O channels, power limits, clock domains, pin multiplexing, and thermal limits are not present in the supplied excerpts and must be confirmed from the official BSC9131NSE7KHKB documentation.
The package is a large 520-ball FCBGA rather than a conventional small leaded IC. High-pin-count BGA assembly demands exact ball-map compatibility, defined PCB stack-up, controlled impedance, adequate escape routing, and careful thermal design. The board cannot be treated as electrically interchangeable with another processor merely because both are BGA devices; land pattern, voltage rails, signal functions, boot behavior, memory topology, and software support must all match.
Typical uses include secure industrial gateways, embedded communications controllers, packet-processing platforms, and control systems requiring both general-purpose and DSP computing. The exact workload fit depends on supported acceleration modes and memory interfaces, which remain unavailable in the provided snippets. Firmware, device-tree, boot software, thermal design, and application development must be validated against NXP's complete documentation and reference designs.
The most important engineering step is to resolve the 800 MHz versus 1 GHz listing discrepancy and confirm every electrical limit before schematic capture. Do not derive power, storage, or interface capacity from marketing shorthand. Obtain the official datasheet, hardware reference manual, package drawing, pinout, memory-support matrix, and errata, then validate them against the exact production lot and board revision.
This page consolidates verified distributor specifications, sourcing information, selection guidance, and data gaps that are not resolved by ordinary catalog listings. It intentionally does not invent pin assignments, memory capacity, thermal resistance, or replacement parts because none were supplied in the authoritative source excerpts.
Аналоги без доработки для BSC9131NSE7KHKB — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
Для этого товара нет аналогов без доработки.
Запросить аналогиBSC9131NSE7KHKB Характеристики
| Processor Type | QorIQ Qonverge SoC |
| CPU Core | 1 core, 32-bit e500 PowerPC |
| CPU Frequency | 1 GHz |
| DSP Engine | 1 GHz StarCore DSP |
| Accelerator | MAPLE-B2F |
| Core Count | 1 core |
| Architecture | 32-bit |
| Memory Support | DDR3 |
| Интерфейс | IFC |
| Security Feature | SEC |
| Диапазон рабочих температур | 0 °C to +105 °C |
| Корпус | 520-FCBGA |
| Package Dimensions | 21 mm × 21 mm |
| Тип монтажа | Surface mount |
| Processor Category | Microprocessor IC |
| Supplier Price | $54.9669 per unit as of 2026-10-23 |
| Reported Supplier Stock | 5,760 pieces |
| Lead Time | To be confirmed |
Руководство по цоколевке BSC9131NSE7KHKB в корпусе 21 mm × 21 mm
Цоколевка для BSC9131NSE7KHKB (корпус 21 mm × 21 mm). Нумерация выводов, функции и схемы подключения определены в техническом описании производителя. Обратитесь к нему для точного посадочного места и рекомендаций по пайке.
Нет подробных данных о распиновке для BSC9131NSE7KHKB.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
BSC9131NSE7KHKB подходит для 6 применениеs: Industrial Communications Gateway, Secure Industrial Control Platform, Packet and Signal Processing Platform, High-Speed Network Adapter, Real-Time Data Acquisition System, Protocol Conversion Equipment.
Industrial Communications Gateway
The BSC9131NSE7KHKB fits evaluation for an industrial gateway that must combine protocol control with dedicated data-path work. Its verified 1 GHz StarCore DSP, e500 CPU, MAPLE-B2F accelerator, IFC, DDR3, and SEC functions provide the building blocks for heterogeneous communications processing in one 21 mm by 21 mm package. The CPU can manage operating systems and control logic while the DSP or accelerator handles supported packet or signal operations. Actual suitability depends on IFC configuration, supported protocols, memory topology, thermal performance, and software enablement that are not present in the supplied excerpts.
Рекомендуется
Secure Industrial Control Platform
The combination of an e500 PowerPC CPU, StarCore DSP, MAPLE-B2F accelerator, and SEC security feature makes BSC9131NSE7KHKB relevant to industrial controllers that require local computation and controlled hardware access. The verified 0 °C to +105 °C specification supports evaluation across industrial temperature environments, although absolute minimum and maximum electrical limits are not provided. Designers must confirm SEC implementation, boot security, key storage, firmware lifecycle, watchdog behavior, DDR3 topology, and all functional-safety requirements before using the SoC in machinery or other safety-related control.
Рекомендуется
Packet and Signal Processing Platform
BSC9131NSE7KHKB is a natural candidate for architecture studies that divide communication and signal-processing tasks between the 1 GHz e500 CPU, 1 GHz StarCore DSP, and MAPLE-B2F accelerator. This heterogeneous arrangement may improve throughput when workloads map cleanly to the accelerator and DSP engines. However, the supplied sources do not identify supported accelerator instructions, memory bandwidth, cache details, or IFC throughput. Benchmarks using the intended algorithms, memory system, compiler, and firmware are therefore necessary before claiming a performance advantage over a single-core processor design.
Рекомендуется
High-Speed Network Adapter
The verified IFC feature and integrated e500, StarCore, and MAPLE-B2F resources position BSC9131NSE7KHKB for evaluation as the principal processor in a dedicated network adapter or embedded switching controller. Consolidation could reduce component count by placing control and accelerated traffic processing in one SoC. Deployment still requires confirmation of IFC lane count and protocols, DDR3 capacity and topology, PHY or serializer compatibility, boot support, packet throughput, thermal margins, and long-term component availability. None of those interface details are established by the supplied excerpts.
Рекомендуется
Real-Time Data Acquisition System
The StarCore DSP and e500 CPU in BSC9131NSE7KHKB can support a real-time acquisition architecture in which DSP-side processing handles time-critical data and the CPU provides configuration, storage coordination, and communications. The stated 0 °C to +105 °C range is useful for industrial evaluation, but sampling rates, interface timing, memory bandwidth, and accelerator behavior remain unknown. Before selecting the device, map every sensor and serializer interface, verify deterministic latency, check DDR3 performance, and reproduce the intended workload with production software and representative thermal conditions.
Рекомендуется
Protocol Conversion Equipment
BSC9131NSE7KHKB may suit protocol-conversion equipment where general-purpose control and dedicated data movement must coexist within one embedded platform. Its verified 1 GHz StarCore DSP, MAPLE-B2F accelerator, DDR3 support, IFC, and SEC functions offer a heterogeneous compute foundation. The practical design advantage depends on software support for each protocol and on accelerator utilization; neither can be inferred from the catalog description. Confirm serial interfaces, boot media, networking ports, security requirements, firmware update strategy, and lifecycle commitments before selecting a processor for volume equipment.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для BSC9131NSE7KHKB — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Ключевые отличия
- Integrated heterogeneous processing resources (против Single-core processor options represented by the verified distributor listing)
- Communications and security feature integration (против Generic microprocessors without verified IFC, DDR3, and SEC integration)
- Industrial temperature capability (против Commercial-temperature alternatives)
Заметки по проектированию
Do not begin power-supply design from the processor name alone. The supplied excerpts do not provide rail names, minimum and maximum voltages, sequencing, startup current, or typical power dissipation. Obtain the official BSC9131NSE7KHKB datasheet and hardware reference manual, then size every rail against worst-case process, voltage, temperature, clock, and I/O activity. Confirm whether any external sequence, current limit, or power-good monitoring is mandatory.
Treat the 520-FCBGA as a controlled-layout device. The verified body is 21 mm by 21 mm, but ball pitch, escape-routing layers, pad geometry, and via rules are unavailable. Follow NXP's package drawing and reference layout rather than relying on another 520-BGA footprint. Validate differential impedance, return paths, reference-plane continuity, assembly yield, and X-ray or inspection requirements with the selected board fabricator.
The device is specified from 0 °C to +105 °C, but no thermal resistance or power limit appears in the supplied sources. Estimated thermal calculations cannot be produced without verified rail power and junction-temperature data. After obtaining those limits, evaluate worst-case ambient temperature, conduction through PCB copper and vias, heat spreading, enclosure effects, and any heat sink or forced-air solution using the manufacturer-recommended model.
Resolve the 800 MHz versus 1 GHz CPU discrepancy before release, and do not infer DDR3 capacity, width, speed, IFC lane count, security features, or accelerator capabilities from distributor shorthand. A procurement-grade decision also needs ordering-code traceability, date-code control, authorized-channel confirmation, lifecycle status, PCN review, and compatibility testing with memory, boot media, PHYs, and production firmware.
Информация о соответствии
The verified snippets do not contain compliance declarations. RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status require confirmation from current NXP product documentation and supplier quality records.
