DSPIC33EP128MU202-H/SP - 16-bit 70 MIPS DSC 128KB Flash | Microchip
Артикул: DSPIC33EP128MU202-H/SP ✓ АктивенDSPIC33EP128MU202-H/SP Обзор
A digital signal controller combines the peripheral set and processing style of a microcontroller with the multiply-accumulate (MAC/DSP) engine of a digital signal processor. In the semiconductor hierarchy, the dsPIC33EP sits within the 16-bit MCU/DSC class, occupying the space between general-purpose microcontrollers and dedicated DSPs, making it a single-chip solution for control loops and signal processing tasks.
Key features include the 16-bit dsPIC33E CPU with DSP instruction extensions and two 40-bit accumulators, 128 KB (128 x 1024 bytes) of self-programmable Flash, 16 KB of RAM, a 12-bit analog-to-digital converter, USB connectivity (the MU suffix denotes the USB-capable family member), and the wide -40C to +125C operating range associated with the -H temperature suffix.
Architecturally, the dsPIC33E core executes most instructions in a single cycle at up to 70 MIPS and integrates a hardware DSP engine for multiply-accumulate, barrel shifting, and bit-reversed addressing, offloading filtering and transformation tasks from software-only implementations. Enhanced peripherals on the MU202 family members reduce external component count in mixed-signal designs.
Typical applications include digital power supplies and power conversion, motor control (BLDC, PMSM, ACIM), USB-connected industrial sensors, and embedded control systems that require both fast control loops and modest signal-processing throughput.
A key design consideration: the SP (28-pin SDIP) package is a through-hole dual in-line package, convenient for prototyping and legacy sockets, but requires attention to supply decoupling and the USB crystal layout for reliable high-speed operation.
This page synthesizes distributor availability data, pin-compatible drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone.
Аналоги без доработки для DSPIC33EP128MU202-H/SP — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с DSPIC33EP128MU202-H/SP (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Program Memory Size.
DSPIC33EP256MU202-H/SP
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP128MC202-H/SP
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP64MU202-H/SP
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP128GP202-H/SP
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP128MC202-I/SP
✅ Прямая замена ⚠️ Характеристики не провереныУточнить цену
Открыть даташит →DSPIC33EP128MU202-H/SP Максимальные параметры и электрические характеристики
| Core Architecture | 16-bit dsPIC33E DSC core |
| Program Memory Size | 128 KB Flash |
| RAM Size | 16 KB |
| Maximum CPU Speed | 70 MIPS |
| ADC Resolution | 12-bit |
| Корпус | 28-pin SDIP (SP), through-hole |
| USB Interface | Yes (USB-capable MU family) |
| Тип монтажа | Through Hole |
| Product Type | Digital Signal Controller (DSC) / Microcontroller IC |
| Разрядность шины данных | 16 bit |
| Instruction Set | dsPIC33E with DSP (MAC) engine |
| Рабочая температура | -40C to +125C (H suffix) |
Руководство по цоколевке DSPIC33EP128MU202-H/SP в корпусе 28-pin sdip (sp), through-hole
Цоколевка для DSPIC33EP128MU202-H/SP (корпус 28-pin sdip (sp), through-hole). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для DSPIC33EP128MU202-H/SP.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
DSPIC33EP128MU202-H/SP подходит для 6 применениеs: Digital Power Supplies, Motor Control, USB-Connected Industrial Sensing, Embedded Control and Automation, Audio Signal Processing, Prototyping and Legacy System Maintenance.
Digital Power Supplies
The DSPIC33EP128MU202-H/SP fits digital power conversion because its 70 MIPS dsPIC33E core with hardware multiply-accumulate executes voltage-mode and current-mode control loops with deterministic latency. The integrated 12-bit ADC samples feedback rails for compensator calculations, while high-resolution PWM peripherals drive switching stages. Its -40C to +125C temperature grade suits harsh power environments, and the 128 KB Flash holds multiple firmware profiles plus fault diagnostics. The key trade-off versus analog controllers is software development effort, repaid by programmable loop tuning and digital telemetry.
Рекомендуется
Motor Control
For BLDC, PMSM, and ACIM drives, the DSPIC33EP128MU202-H/SP provides the 70 MIPS dsPIC33E core needed to run field-oriented control (FOC) at tens of kHz with the DSP engine handling Park/Clarke transforms. The 12-bit ADC captures phase currents and bus voltage for closed-loop torque control, and the -H temperature grade supports thermally demanding drive enclosures. The 28-pin SDIP package simplifies prototyping of drive boards. Choose the MC202 sibling if USB telemetry is not required, since it targets motor control peripherals specifically.
Рекомендуется
USB-Connected Industrial Sensing
The MU family USB peripheral makes this DSC well suited to sensor nodes that stream data to a PC or gateway. The 70 MIPS core performs filtering and FFTs on incoming 12-bit ADC data before USB transmission, offloading the host processor. The 128 KB Flash accommodates USB stack, calibration tables, and logging firmware simultaneously, and the extended temperature range permits use in factory-floor enclosures. Through-hole SDIP mounting eases prototyping of measurement jigs and instrumentation fixtures that later migrate to SMD packages.
Рекомендуется
Embedded Control and Automation
In PLC-style control nodes, the DSPIC33EP128MU202-H/SP combines UART, SPI, and I2C communication with DSP throughput for timing-critical sequences. The dsPIC33E core's deterministic single-cycle instruction execution supports precise timing loops without RTOS overhead, and 128 KB Flash stores protocol stacks and parameter sets. Its -40C to +125C rating covers unconditioned industrial cabinets. Designers value the through-hole SP package for retrofit boards and serviceable industrial assemblies where soldered SMD parts complicate field repair.
Рекомендуется
Audio Signal Processing
The hardware DSP engine of the DSPIC33EP128MU202-H/SP executes FIR and IIR filtering, sample-rate conversion, and audio effect algorithms at audio rates, while the 12-bit ADC and peripheral set handle line-level capture for cost-sensitive audio products. The 70 MIPS budget leaves headroom for multiple concurrent filter channels, and USB enables direct digital audio transport to host systems without external bridge chips. For higher-fidelity designs, pair with a dedicated audio codec on the SPI or I2C bus to move the analog boundary off the general-purpose ADC.
Рекомендуется
Prototyping and Legacy System Maintenance
The 28-pin SDIP through-hole package is the primary reason engineers select the /SP suffix for prototyping: it mounts in breadboards, wire-wrap sockets, and legacy DIP footprints without adapters. When maintaining discontinued industrial equipment designed around 28-pin through-hole controllers, this part retrofits existing sockets directly, and the -H extended temperature grade matches harsh-duty original specifications. The 70 MIPS performance and 128 KB Flash also allow consolidating functions that previously needed multiple legacy chips into one socket-compatible upgrade.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для DSPIC33EP128MU202-H/SP — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | DSPIC33EP256MU202-H/SP | DSPIC33EP128MC202-H/SP | DSPIC33EP64MU202-H/SP | DSPIC33EP128GP202-H/SP | DSPIC33EP128MC202-I/SP |
|---|---|---|---|---|---|---|
| Package | 28-pin SDIP (SP) | 28-pin SDIP (SP) - same | 28-pin SDIP (SP) - same | 28-pin SDIP (SP) - same | 28-pin SDIP (SP) - same | 28-pin SDIP (SP) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | dsPIC33E, 70 MIPS | dsPIC33E, 70 MIPS | dsPIC33E, 70 MIPS | dsPIC33E, 70 MIPS | dsPIC33E, 70 MIPS | dsPIC33E, 70 MIPS |
| Flash | 128 KB | 256 KB | 128 KB | 64 KB | 128 KB | 128 KB |
| RAM | 16 KB | 16 KB (verify in datasheet) | 16 KB | 16 KB (verify in datasheet) | 16 KB | 16 KB |
| USB Peripheral | Yes (MU family) | Yes (MU family) | No (MC family) | Yes (MU family) | No (GP family) | No (MC family) |
| Temperature Grade | -H (extended, -40C to +125C) | -H (extended) | -H (extended) | -H (extended) | -H (extended) | -I (-40C to +85C) |
| ADC Resolution | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
Ключевые отличия
- USB connectivity in the 28-pin SDIP footprint (против DSPIC33EP128MC202-H/SP)
- Double the Flash headroom (против DSPIC33EP64MU202-H/SP)
- Extended temperature operation (против DSPIC33EP128MC202-I/SP)
Заметки по проектированию
Estimated: dsPIC33EP devices at 70 MIPS draw core current in the tens of milliamps range; size your 3.3 V regulator with headroom above the datasheet IDD specification plus all GPIO sink/source current. Place a 0.1 uF ceramic capacitor at each VDD/VSS pin pair of the 28-pin SDIP package and one bulk 4.7-10 uF capacitor near the supply entry. For USB applications, verify VUSB pin decoupling per the Microchip family datasheet USB section before release.
Although the SP package is through-hole, signal integrity rules still apply. Keep the PGD/PGC ICSP traces short and reserve a standard 5-pin header (MCLR, VDD, GND, PGD, PGC) for programming with PICkit or ICD tools. Route the crystal for the USB-capable clock configuration close to the OSC pins with short return paths. Avoid running switching-node traces from adjacent power circuitry under the DIP socket area, where the open package geometry offers less ground shielding than SMD ground pours.
The -H temperature suffix must be matched to your thermal environment: substituting an -I grade part (-40C to +85C) in an application that reaches +125C will violate absolute maximum ratings. Also note the family differences on the shared 28-pin SP footprint: MC and GP variants lack USB, so firmware built on the MU202 USB stack will not function on those pin-compatible replacements. Verify Flash budget before substituting the 64 KB variant for the 128 KB part.
Информация о соответствии
Verified distributor data did not include explicit RoHS/REACH/lead-free statements for this suffix. Confirm compliance certificates on the Microchip product page before release.
