DSPIC33EP128MU506-H/MR - 16-bit 128KB DSC 70 MIPS | Microchip
Артикул: DSPIC33EP128MU506-H/MR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $6.9 | $6,90 |
| 10 | $6.3 | $63,00 |
| 100 | $5.6 | $560,00 |
| 500 | $5.1 | $2.550,00 |
| 1.000 | $4.65 | $4.650,00 |
DSPIC33EP128MU506-H/MR Обзор
A digital signal controller combines the computational capability of a microcontroller with the math throughput of a digital signal processor in a single chip. Within the power-management hierarchy of embedded systems, the dsPIC33EP family sits above simple MCUs and below application processors, making it the standard choice for closed-loop control, digital power conversion, and signal-processing tasks that require deterministic real-time response.
Key features of this device include the 70 MIPS dsPIC33E core with DSP engine and single-cycle MAC, 128KB Flash with self-programming capability, integrated full-speed USB 2.0 OTG, multiple UART/SPI/I2C ports, high-speed 10/12-bit ADCs, and motor-control PWM peripherals. The MU sub-family specifically targets USB-connected applications, while its ECC logic and CRC module support safety-oriented designs.
Architecturally, the core uses a modified Harvard bus with separate program and data paths, hardware loop constructs, and dual operand fetch, allowing one multiply-accumulate per cycle. Flexible clocking via an internal fast RC oscillator with PLL or external crystal lets designers trade precision against BOM cost; the -H suffix indicates a 125C maximum ambient operating grade.
Typical applications include USB-connected industrial instruments, digital power supplies, BLDC/PMSM motor drives, and intelligent sensing nodes that must stream processed data over USB while running control loops at tens of kilohertz.
For design, budget the USB transceiver's 3.3V rail separately from the core supply via an on-chip regulator, and decouple the QFN exposed pad with a solid ground pour to keep ADC noise low.
This page adds distributor inventory data, same-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Аналоги без доработки для DSPIC33EP128MU506-H/MR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с DSPIC33EP128MU506-H/MR (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Program Memory Size, RoHS Status, Core.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
DSPIC33EP128MU506-I/MR
✅ Прямая замена✓ В наличии
$4.65 / шт.
Открыть даташит →DSPIC33EP128MU506-E/MR
✅ Прямая замена✓ В наличии
$4.6 / шт.
Открыть даташит →DSPIC33EP256MU506-H/MR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP64MU506-H/MR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP128MC506-H/MR
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$4.2 / шт.
Открыть даташит →DSPIC33EP256MU506-I/MR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP128MU506-H/MR Максимальные параметры и электрические характеристики
| Core | dsPIC33E 16-bit |
| Max CPU Speed | 70 MIPS |
| Program Memory Size | 128 KB Flash |
| Корпус | 64-pin QFN (MR) |
| Рабочая температура | -40C to +125C (-H grade) |
| USB | USB 2.0 full-speed OTG |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
| Description (distributor) | IC DSC 16BIT 128KB FLASH |
| Base Part Number | DSPIC33EP128MU506 |
| Packaging Suffix | /MR = 64-pin QFN |
Руководство по цоколевке DSPIC33EP128MU506-H/MR в корпусе 64-pin qfn (mr)
Цоколевка для DSPIC33EP128MU506-H/MR (корпус 64-pin qfn (mr)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для DSPIC33EP128MU506-H/MR.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
DSPIC33EP128MU506-H/MR подходит для 6 применениеs: USB-Connected Industrial Instruments, Digital Power Supplies, BLDC/PMSM Motor Drives, Intelligent Sensor Nodes, Medical and Lab Devices, Test and Measurement Accessories.
USB-Connected Industrial Instruments
The DSPIC33EP128MU506-H/MR fits USB-tethered measurement and control instruments because it integrates USB 2.0 full-speed OTG directly alongside a 70 MIPS DSP core, eliminating a separate USB interface chip. Its 128KB Flash holds instrument firmware plus a USB device stack, and multiple UART/SPI/I2C ports connect ADC front ends and DAC outputs. In a typical design the DSC runs the real-time sampling loop at tens of kilohertz while streaming processed results over USB; the 125C -H grade tolerates hot enclosures near power electronics where industrial-grade parts would be marginal.
Рекомендуется
Digital Power Supplies
The DSPIC33EP128MU506-H/MR is well suited to digitally controlled AC-DC and DC-DC converters: its high-speed PWM peripherals generate phase-shifted or interleaved switching patterns, the fast ADC synchronizes sampling to the PWM period for precise current-mode control, and the 70 MIPS DSP engine executes compensator math each cycle. USB OTG enables PC-based configuration of voltage setpoints and telemetry logging - a key advantage over non-USB DSCs. The 125C -H rating suits supplies in warm rack environments; design the layout so the QFN exposed pad grounds to a noise-free analog pour for clean ADC readings.
Рекомендуется
BLDC/PMSM Motor Drives
For field-oriented control of brushless DC and permanent-magnet synchronous motors, the DSPIC33EP128MU506-H/MR combines motor-control PWM outputs with a 70 MIPS core able to run FOC loops at 10-20 kHz switching frequencies. Fast ADC channels sample phase currents and bus voltage, and quadrature encoder or Hall inputs close the position loop. The MU-series USB port provides commissioning and firmware-update access in servo drives. Choose the sibling MC506 variant if USB is unnecessary and BOM cost dominates; the packages and pinout match, so board reuse is straightforward.
Рекомендуется
Intelligent Sensor Nodes
The DSPIC33EP128MU506-H/MR serves sensing nodes that must preprocess signals locally - filtering, FFT, or calibration math - before sending data upstream. Its single-cycle MAC DSP instructions accelerate filtering in firmware, while the 128KB Flash retains both application logic and small data logs. USB OTG allows direct attachment to PCs or chargers for power and data, simplifying installation in point-sensing products. The 125C -H grade supports nodes mounted near machinery. Estimated power budgeting: enable low-power sleep between sampling events to keep average node current in the milliamp range.
Рекомендуется
Medical and Lab Devices
Benchtop lab instruments and portable medical accessories benefit from the DSPIC33EP128MU506-H/MR's combination of deterministic DSP control and USB connectivity. The DSC can run pump or valve control loops, digitize sensor channels, and present a USB CDC device class interface to host software without an external bridge chip. Its 16-bit core and hardware DSP handle signal conditioning such as digital filtering of bio-potential or pressure signals in real time. Designers should follow Microchip medical reference designs for isolation, and note that the 125C rating comfortably exceeds typical indoor medical equipment ambient requirements.
Рекомендуется
Test and Measurement Accessories
The DSPIC33EP128MU506-H/MR fits USB instruments such as data loggers, signal generators, and programmable loads. The 70 MIPS core with DSP MAC sustains waveform generation and analysis tasks, synchronized high-speed ADCs capture inputs, and USB OTG provides both the control channel and bus power - allowing bus-powered accessory form factors without a wall adapter. The 128KB Flash stores multiple instrument profiles, and the -H 125C grade permits operation inside rack-mounted equipment. Using the QFN-64 footprint gives a compact 9x9 mm controller section with the exposed pad improving thermal and ground performance.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для DSPIC33EP128MU506-H/MR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | DSPIC33EP128MU506-I/MR | DSPIC33EP128MU506-E/MR | DSPIC33EP256MU506-H/MR | DSPIC33EP64MU506-H/MR | DSPIC33EP128MC506-H/MR |
|---|---|---|---|---|---|---|
| Package | 64-pin QFN (MR) | 64-pin QFN (MR) - same | 64-pin QFN (MR) - same | 64-pin QFN (MR) - same | 64-pin QFN (MR) - same | 64-pin QFN (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB | 128 KB | 128 KB | 256 KB | 64 KB | 128 KB |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| USB OTG | Yes | Yes | Yes | Yes | Yes | No (MC family) |
| Temperature Grade | -40C to +125C (-H) | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Drop-in Compatible | - | Yes - pin-to-pin | Yes - pin-to-pin | Yes - pin-to-pin | Yes - pin-to-pin | Yes - pin-to-pin (no USB) |
Ключевые отличия
- Integrated USB OTG with DSP core (против DSPIC33EP128MC506-H/MR)
- Extended 125C rating (против DSPIC33EP128MU506-I/MR)
- Memory upgrade path in same footprint (против DSPIC33EP256MU506-H/MR)
Заметки по проектированию
Power the dsPIC33EP from a clean 3.3V rail. The device integrates an on-chip regulator for the core, which requires its dedicated regulator capacitor per the datasheet pin description - do not omit it or the core will brown out during USB transceiver activity. Estimated: the USB transceiver plus core at 70 MIPS draws tens of milliamps; size the 3.3V supply accordingly with headroom. Decouple every VDD pin with 0.1uF ceramics placed within 2 mm of the pin.
The 64-pin QFN (MR) exposes a large ground pad underneath the die. Connect it to the PCB ground plane through an array of thermal vias (typically 4x4 or more) to provide both electrical grounding and heat spreading. Estimated: without via support, the exposed pad connection can be unreliable after reflow due to solder wicking, degrading ADC noise performance and thermal margin. This is the single most common QFN layout pitfall with this family.
Keep the USB D+/D- traces as a 90-ohm differential pair, length-matched within a few millimeters, routed away from PWM and switching-node traces. The on-chip full-speed transceiver tolerates short stubs, but splitters or test points on the pair degrade eye margins. Separately, route analog ADC inputs over a quiet ground pour and add an RC anti-alias filter (e.g., 1k + 1nF, estimated) matched to your sampling rate.
Do not interchange the -H and -I grades in designs that exceed 85C ambient: the industrial -I variant is cheaper and pin-identical but will fail reliability requirements at 85-125C. Also verify configuration bits (FICD/FPOR) for the oscillator startup and watchdog settings after migrating code between family members, and re-run the USB compliance checklist if the crystal or PLL settings change.
Информация о соответствии
RoHS compliance and lead-free status per standard Microchip product classification; REACH, halogen-free and conflict-minerals declarations not stated in provided data - request formal certificate from Microchip.
