DSPIC33EP256MU806T-I/MR - 60 MIPS DSC, 256KB Flash, USB | Microchip
Артикул: DSPIC33EP256MU806T-I/MR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $7.42 | $7,42 |
| 10 | $6.68 | $66,80 |
| 100 | $5.93 | $593,00 |
| 500 | $5.34 | $2.670,00 |
| 1.000 | $4.82 | $4.820,00 |
DSPIC33EP256MU806T-I/MR Обзор
A digital signal controller combines the computational core of a microcontroller with the DSP capability of a digital signal processor. In the embedded systems hierarchy, the dsPIC33EP family sits above general-purpose PIC16/PIC18 MCUs and below full DSP chips, offering a 16-bit modified Harvard architecture with DSP instruction extensions, hardware multiply-accumulate (MAC), and division support in a single-chip solution. This makes DSCs the workhorse of precision motor control, digital power conversion, and sensor-processing systems.
Key features include dual CAN 2.0B modules (ECAN), full-speed USB 2.0 with OTG support, three I2C and two SPI and four UART modules, an 11-channel high-speed 16-bit PWM with 1.04 ns resolution for motor control, up to 27 general-purpose timers across multiple 16/32-bit blocks, and a 10-bit, 1.1 Msps ADC. The device operates from a single 3.0V to 3.6V supply and integrates 51 general-purpose I/O lines.
The dsPIC33EP core uses a pipelined 16-bit architecture with X and Y data memory buses enabling simultaneous fetch of two operands for DSP MAC instructions, plus a hardware barrel shifter and modulo/bit-reversed addressing for FFT algorithms. The programmable PLL allows a 60 MIPS execution rate from an external crystal, and the flexible clock tree supports run-time switching for power-sensitive designs.
Typical applications include dual-motor control (dual PMSM/BLDC), digital power supplies with USB-connected supervision, industrial gateways bridging CAN and USB, and audio or sensor signal processing. The industrial -40C to +85C temperature grade (I suffix) suits harsh environments.
Design consideration: the dsPIC33EP core requires an external low-ESR VCAP/VDDCORE capacitor for stable 1.8V core regulation - follow the Microchip reference schematic exactly, as incorrect VCAP selection is the most common bring-up failure.
This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not found in the standard manufacturer datasheet.
Аналоги без доработки для DSPIC33EP256MU806T-I/MR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с DSPIC33EP256MU806T-I/MR (тот же форм-фактор и посадочное место) — отличается по Package, Core Architecture, Operating Temperature, Packaging, Supply Voltage.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
DSPIC33EP256MU806-I/MR
✅ Прямая замена✓ В наличии
$9.12 / шт.
Открыть даташит →DSPIC33EP512MU806-I/MR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP128MU806-I/MR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP256GM306T-I/MR
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →DSPIC33EP64MU806-I/MR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP256MU806T-I/MR Максимальные параметры и электрические характеристики
| Core | dsPIC33EP 16-bit DSC |
| Max CPU Speed | 60 MIPS |
| Family Max MIPS | 70 MIPS |
| Flash Program Memory | 256 KB (85.5K x 24) |
| RAM | 28 KB |
| Напряжение питания | 3.0 V to 3.6 V |
| Рабочая температура | -40C to +85C (I grade) |
| Корпус | 64-VQFN (9x9 mm) with exposed pad, 0.90 mm height |
| General Purpose I/O | 51 I/O |
| USB | USB 2.0 full-speed with OTG |
| CAN Modules | 2 x ECAN (CAN 2.0B) |
| UART Modules | 4 |
| SPI Modules | 2 |
| I2C Modules | 3 |
| Timers | 27 general purpose timers |
| High-Speed PWM | 16-bit high-speed PWM for motor control |
| ADC | 10-bit, 1.1 Msps |
| Тип монтажа | Surface Mount |
| Packing | Tape & Reel (T suffix) |
| Статус RoHS | Compliant |
Руководство по цоколевке DSPIC33EP256MU806T-I/MR в корпусе 64-vqfn (9x9 mm) with exposed pad, 0.90 mm height
Цоколевка для DSPIC33EP256MU806T-I/MR (корпус 64-vqfn (9x9 mm) with exposed pad, 0.90 mm height). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для DSPIC33EP256MU806T-I/MR.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
DSPIC33EP256MU806T-I/MR подходит для 6 применениеs: Dual Motor Control, Industrial CAN/USB Gateways, Digital Power Supplies, Embedded Audio and Sensor Signal Processing, Battery Management and Portable Industrial Equipment, Automation and Robotics I/O Nodes.
Dual Motor Control
The DSPIC33EP256MU806T-I/MR is purpose-built for dual-motor systems: Microchip's own datasheet title lists it as a DSC with Dual Motor Control, Dual CAN, and USB. At 60 MIPS with a high-speed 16-bit PWM module offering 1.04 ns pulse resolution, it can drive two independent PMSM or BLDC control loops with field-oriented control (FOC) running on a single chip. The 10-bit, 1.1 Msps ADC samples phase currents for both motors, while the 27-timer bank provides independent time bases for each loop. Placing one PWM per motor with hardware dead-time insertion removes CPU load from switching tasks; the trade-off is that both loops share one 60 MIPS core, so algorithm complexity must be budgeted at roughly 30 MIPS per motor.
Рекомендуется
Industrial CAN/USB Gateways
With two ECAN 2.0B controllers and a full-speed USB 2.0 OTG module in one chip, the DSPIC33EP256MU806T-I/MR bridges CAN fieldbus networks to USB-connected hosts without an external protocol converter. The dual CAN modules can interconnect two isolated CAN buses or run redundant-bus architectures at 1 Mbps, while the USB peripheral streams configuration data or firmware updates. Four UARTs add Modbus RTU or RS-485 connectivity alongside 51 I/O lines for local sensing. Typical deployment uses ECAN1 for the field bus and ECAN2 for diagnostics, with the 256KB Flash storing both protocol stacks - the paired MCP2551 transceivers and a USB-type connector complete the reference design.
Рекомендуется
Digital Power Supplies
The high-speed PWM with 1.04 ns resolution and fast 10-bit ADC makes this DSC well suited to digitally controlled AC-DC and DC-DC converters. The PWM's dedicated time base, dead-time, and fault inputs implement voltage-mode or current-mode control loops at switching frequencies well above 100 kHz, while the ADC triggers synchronously from the PWM to sample at the optimal point in each switching cycle - eliminating switching-noise-corrupted readings. The 60 MIPS core leaves ample headroom for compensation filters and PFC algorithms. USB connectivity enables power-supply telemetry and field firmware updates; the design consideration is ADC reference stability, which should use a precision external reference for sub-1% regulation accuracy.
Рекомендуется
Embedded Audio and Sensor Signal Processing
The dsPIC33EP DSP engine with hardware MAC, dual X/Y operand fetch, and bit-reversed addressing supports real-time FIR/IIR filtering and FFTs for audio effects, vibration analysis, and condition monitoring. The 28KB RAM accommodates a 1024-point FFT buffer with history, and 256KB Flash stores algorithm libraries plus communication stacks. For audio, the three I2C modules connect codecs, while two SPI modules interface high-speed ADCs for vibration sensing. The DSP instructions execute single-cycle MACs at 60 MIPS, delivering roughly 60 million MAC/s for filtering workloads. Developers should partition filter coefficients into Y-data space to exploit dual-bus fetches and enable the compiler's DSP library for pre-optimized kernels.
Рекомендуется
Battery Management and Portable Industrial Equipment
The device's integrated USB OTG supports battery-powered field instruments that both charge and communicate over a single connector. The 3.0V to 3.6V single-supply operation with an internal 1.8V core regulator simplifies the power tree to one LDO, and run-time clock switching lets firmware drop from 60 MIPS to low-speed idle between measurements, reducing average current. The multiple timers enable low-power periodic wake-ups, and the 10-bit ADC monitors pack voltage and temperature through the 51 I/O multiplexed channels. Tape & Reel packaging (T suffix) suits automated assembly of handheld and portable industrial products; the exposed-pad VQFN-64 provides good thermal spreading for enclosed, conduction-cooled housings.
Рекомендуется
Automation and Robotics I/O Nodes
In factory automation, the DSPIC33EP256MU806T-I/MR serves as an intelligent I/O node combining dual ECAN for DeviceNet-style networks, four UARTs for legacy serial devices, and high-speed PWM for actuators and steppers. The 51 GPIO lines with interrupt-on-change support dense digital I/O, while SPI and I2C connect encoders and external ADCs. The 27 timers allow simultaneous pulse-width measurement and generation for quadrature encoder decoding. At -40C to +85C the part withstands cabinet and outdoor-panel environments. Program the ECAN modules with hardware filtering so bus traffic does not interrupt real-time control loops; 256KB Flash typically holds protocol, control, and diagnostic firmware with room for field upgrades.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для DSPIC33EP256MU806T-I/MR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | DSPIC33EP256MU806-I/MR | DSPIC33EP512MU806-I/MR | DSPIC33EP128MU806-I/MR | DSPIC33EP256GM306T-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same |
| Flash Program Memory | 256 KB | 256 KB | 512 KB | 128 KB | 256 KB |
| RAM | 28 KB | 28 KB | 52 KB | 28 KB | 28 KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| USB OTG | Yes (full-speed) | Yes (full-speed) | Yes (full-speed) | Yes (full-speed) | No |
| CAN Modules | 2 x ECAN | 2 x ECAN | 2 x ECAN | 2 x ECAN | 2 x ECAN |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Ключевые отличия
- Integrated full-speed USB 2.0 OTG (против DSPIC33EP256GM306T-I/MR)
- Dual ECAN plus USB in a single 64-pin part (против DSPIC33EP256MC504-I/PT)
- Scalable Flash within the same footprint (против DSPIC33EP512MU806-I/MR)
- Tape & Reel delivery for volume assembly (против DSPIC33EP256MU806-I/MR)
Заметки по проектированию
The dsPIC33EP core requires an external low-ESR VCAP capacitor (typically a ceramic 10uF or per datasheet table) on the VDDCORE pin for the internal 1.8V regulator. Omitting it or using a high-ESR part causes brown-out resets and erratic operation - it is the single most common dsPIC33EP bring-up failure. Per the Quickboards reference design discussion of VCAP requirements, place this capacitor as close to the pin as possible. Decouple all VDD pins with 0.1uF ceramics within 2 mm, plus one 10uF bulk cap near the package.
The 64-VQFN MR package has a large exposed thermal pad on the underside that connects to VSS. Solder it to a grounded copper pour with an array of thermal vias (about 5x5, 0.3 mm drills) - this is both the primary ground return and heat-spreading path. For probe accessibility during debugging, fan out ECAN, USB (D+/D-), and PGC/PGD pins first, since QFN rework after assembly is difficult. Keep the USB differential pair at 90 ohm matched length if the USB peripheral is used.
Configure configuration words (FICD, FOSC, FWDT) deliberately at project start: JTAG/ICSD pin selection and oscillator startup settings lock out ICSP access if set wrong, potentially requiring HV reprogramming. With dual ECAN, remember that shared peripheral pin-select (PPS) mappings on the 64-pin device can silently reassign pins - audit the PPS map after every peripheral addition. Also budget the 60 MIPS core: two FOC motor loops plus CAN stacks can saturate it; use the DMA-driven ADC conversions where possible to offload the CPU.
The high-speed PWM edges driving motor bridges are the dominant EMI source. Insert the hardware dead-time and use the slew-rate control features of the PWM module rather than slowing firmware-driven edges. Route PWM outputs away from the analog ADC input traces, and place a ground guard ring around the ADC reference path. For USB compliance testing, add a common-mode choke and TVS array on the D+/D- lines per the Microchip USB hardware design guidelines.
Информация о соответствии
RoHS compliance per standard Microchip current-catalog product status. AEC-Q100 qualification not stated in the provided data for this part; use the -E/H automotive-variant families if automotive qualification is required.
