EP1C20F324C7 - Cyclone FPGA 20,060 LE | 324-BGA | Intel
Артикул: EP1C20F324C7 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.8 | $2.180,00 |
| 500 | $19.4 | $9.700,00 |
| 1.000 | $17.95 | $17.950,00 |
EP1C20F324C7 Обзор
What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic device whose logic fabric, interconnect, and I/O blocks can be configured by the end user after manufacture. In the broader semiconductor taxonomy, an FPGA sits alongside ASICs, CPLDs, microcontrollers, and DSPs as a reconfigurable compute platform. Within Intel's product line, the Cyclone series sits below Cyclone II/III/IV/V/10 as a low-power, low-cost entry tier; the EP1C20F324C7 belongs to the original Cyclone family that established Intel's presence in the low-cost FPGA market.
Key features of the EP1C20F324C7 include 20,060 logic elements organized into 2,006 logic array blocks (LABs), 294,912 bits of embedded RAM distributed across 60 M4K blocks (each 4 Kbit plus 512 parity bits), and 233 user I/O pins supporting LVCMOS, LVTTL, SSTL, and LVDS signaling. The device embeds up to 2 PLLs for clock management and skew control, and supports configuration via active serial (AS), passive serial (PS), and JTAG modes. Internal signal integrity is provided by differential on-chip termination for LVDS I/O.
The Cyclone architecture uses a four-input look-up table (LUT) based logic element with carry-chain support and embedded multiplier blocks. The 130 nm process, combined with a 1.5 V core, keeps typical static power low while still supporting clock rates up to approximately 320 MHz for internal logic. The FBGA-324 package uses a 1.0 mm ball pitch on a 19 × 19 mm body, balancing board-routing density with manufacturing yield.
Typical applications for the EP1C20F324C7 include consumer-electronics glue logic, display controllers and video-processing front-ends, industrial control and protocol bridging, communications line-card glue logic, and educational/hobbyist development platforms. The large I/O count and abundant memory make it well-suited for bus-bridging and parallel data acquisition where ASICs would be uneconomical at low volume.
When designing with this device, verify that your Quartus II version still supports the original Cyclone family, and confirm second-source supply for long-lifecycle programs because the part is approaching end-of-life. Always use the FBGA-324 land pattern exactly as published in the datasheet, and follow Intel's power-rail sequencing recommendations to avoid in-rush current issues at configuration.
This page consolidates current distributor pricing, drop-in same-family alternatives (e.g. speed-grade and N suffix variants), and practical PCB-layout guidance not present in the bare datasheet, giving procurement and design engineers a single reference for sourcing the EP1C20F324C7.
Аналоги без доработки для EP1C20F324C7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1C20F324C7 (тот же форм-фактор и посадочное место) — отличается по Speed Grade, Process Technology, Package, Total RAM Bits, Family.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1C20F324C7N
✅ Прямая замена✓ В наличии
$56.04 / шт.
Открыть даташит →EP1C20F324C6N
✅ Прямая замена✓ В наличии
$21.75 / шт.
Открыть даташит →EP1C20F324C8N
✅ Прямая замена✓ В наличии
$42.36 / шт.
Открыть даташит →EP1C20F324C8NGA
✅ Прямая замена✓ В наличии
$24.75 / шт.
Открыть даташит →EP1C20F324C6
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$105 / шт.
Открыть даташит →EP1C20F324C7 Максимальные параметры и электрические характеристики
| Series | Cyclone |
| Family | Cyclone I (EP1C20) |
| Logic Elements (LE) | 20,060 |
| Logic Array Blocks (LABs) | 2,006 |
| Embedded RAM Bits | 294,912 |
| M4K RAM Blocks (4 Kbit + 512 parity) | 60 |
| Maximum User I/O | 233 |
| PLLs | 2 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Корпус | FBGA-324 (324-BGA, 19 × 19 mm, 1.0 mm pitch) |
| Тип монтажа | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 7 (-7) |
| Configuration Mode | AS / PS / JTAG |
Руководство по цоколевке EP1C20F324C7 в корпусе fbga-324 (324-bga, 19 × 19 mm, 1.0 mm pitch)
Цоколевка для EP1C20F324C7 (корпус fbga-324 (324-bga, 19 × 19 mm, 1.0 mm pitch)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP1C20F324C7.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP1C20F324C7 подходит для 6 применениеs: Display Controllers and Video Bridging, Industrial Protocol Bridging and Glue Logic, Consumer Electronics Glue Logic, Communications Line-Card Glue Logic, Educational and Development Platforms, Parallel Data Acquisition Front-Ends.
Display Controllers and Video Bridging
The EP1C20F324C7's 20,060 logic elements and 233 user I/O pins make it a strong fit for bridging between LCD/HDMI controllers and SoCs in mid-range display products. Its 130 nm Cyclone fabric typically runs internal logic at 200-320 MHz, enough to drive RGB-to-LVDS conversion at 1080p60 with a single device. The 60 M4K RAM blocks (294,912 bits) provide line-buffer storage for de-interlacing and color-space conversion without external SRAM. On-chip LVDS I/O with built-in termination eliminates external resistor networks, reducing BOM cost for TV motherboards and digital-signage players.
Рекомендуется
Industrial Protocol Bridging and Glue Logic
In factory automation, the EP1C20F324C7 serves as a low-cost glue-logic device between legacy fieldbuses (RS-485, Profibus, CAN) and modern Ethernet/IP controllers. Its 233 I/O pins comfortably handle multi-channel UARTs, SPI masters, and parallel buses simultaneously, while 20,060 LEs accommodate custom state-machine logic for protocol translation. The commercial-grade temperature range (0 to 85 °C) is acceptable for control-cabinet environments, and the FBGA-324 19 × 19 mm package allows high-density board layouts typical of PLC backplanes and motor-control boards.
Рекомендуется
Consumer Electronics Glue Logic
The Cyclone I's balance of logic density and cost made the EP1C20F324C7 a common choice for consumer glue logic in set-top boxes, printers, and home routers. Engineers use it to aggregate USB, SATA, and Ethernet PHY interfaces into an SoC's parallel memory bus, replacing multiple discrete ASICs. The 294,912-bit embedded RAM provides buffering for packet queues and command FIFOs, while the 2 PLLs de-skew clocks arriving from upstream crystals and PHYs. New designs should consider the Cyclone 10 LP family for lower static power and longer-term supply continuity.
Рекомендуется
Communications Line-Card Glue Logic
In telecom line cards, the EP1C20F324C7 is typically deployed as a packet-classification and backplane-bridging engine between TDM framers and packet processors. Its 20,060 LEs are sufficient to implement custom header parsers and QoS schedulers, while the 60 M4K blocks store lookup tables and connection-state records. The 233 user I/O count accommodates multiple SFI/XAUI-style interfaces via LVDS pairs, and the device's 1.5 V core keeps per-port power within tight NEBS thermal envelopes. Production-proven in early-generation DSLAM and GPON OLT designs.
Рекомендуется
Educational and Development Platforms
The EP1C20F324C7 has historically powered university digital-logic labs and hobbyist development boards because it provides enough logic (20,060 LEs) and memory (294 Kbits) to implement full RISC-V soft cores, SDRAM controllers, and VGA drivers in a single device. Quartus II Web Edition (free) supports the entire Cyclone I family, making the EP1C20F324C7 an accessible teaching vehicle for HDL design, synthesis, place-and-route, and timing-closure concepts. The FBGA-324 footprint teaches students fine-pitch BGA rework, while the multiple configuration modes (AS/PS/JTAG) provide hands-on exposure to FPGA boot flows.
Рекомендуется
Parallel Data Acquisition Front-Ends
With 233 user I/O pins and abundant M4K RAM, the EP1C20F324C7 is well suited for front-end buffering and channel-multiplexing in multi-channel data-acquisition systems. Each M4K block can be configured as a dual-port FIFO for sample-rate conversion, and the 2 PLLs generate the multiple clock domains needed for simultaneous ADC sampling and downstream processing. Differential LVDS inputs pair directly with high-speed ADCs without external termination. A typical use case is a 16-channel, 14-bit oscilloscope or ultrasound front-end where the FPGA performs channel-to-channel calibration, FIR filtering, and USB-3 streaming to a host PC.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1C20F324C7 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1C20F324C7N | EP1C20F324C6N | EP1C20F324C8N | EP1C20F324C8NGA | EP1C20F324C6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-324 (19x19mm, 1.0mm pitch) | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same |
| Logic Elements | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 |
| Speed Grade | -7 | -7 | -6 (faster) | -8 (slower) | -8 (slower) | -6 (faster) |
| Embedded RAM (bits) | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 |
| Maximum User I/O | 233 | 233 | 233 | 233 | 233 | 233 |
| Lifecycle Status | NRND (near end-of-life) | NRND | NRND | NRND | Obsolete | NRND |
| Process / Core Voltage | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V |
Ключевые отличия
- Industry-standard Cyclone I silicon with longest Quartus II design support (против EP1C20F324C8N)
- RoHS-uncertain terminal finish (против EP1C20F324C7N)
- Tight pinout and timing model documentation (против EP1C20F324C8NGA)
Заметки по проектированию
Estimated: At maximum toggle activity (~80% LEs switching at 200 MHz, 1.5 V core), the EP1C20F324C7 dissipates approximately 0.7-1.0 W from the core. The FBGA-324 package requires careful PCB thermal design - use at least a 4-layer stack-up with a continuous internal ground plane stitched with thermal vias under the BGA. Without forced airflow and adequate copper, junction temperature can rise 20-30 °C above ambient; derate Fmax accordingly or move to the -6 speed grade for thermal headroom.
The FBGA-324 with 1.0 mm ball pitch requires 0.5 mm diameter solder-ball land pads with non-solder-mask-defined (NSMD) openings for best BGA rework yield. Per the Cyclone Family Handbook, fan-out should use microvia-in-pad or 4-mil trace-and-space inner layers; each BGA ball must be routed through at least one via-in-pad or dog-bone fanout to inner signal layers. Add 4 corner-to-corner alignment fiducials and 2 component-side fiducials for automated pick-and-place.
Power-rail sequencing for the EP1C20F324C7 requires VCCINT (1.5 V) to ramp before or simultaneously with VCCIO (3.3 V or 2.5 V). Reverse sequencing can cause latch-up; per the Cyclone datasheet, VCCIO must not exceed VCCINT by more than 0.7 V during ramp-up. Use a common power-supply sequencer (e.g. TPS3808 or equivalent) to enforce the order, and place 100 nF + 10 µF decoupling on every VCCINT ball and 100 nF + 4.7 µF on every VCCIO bank supply pin.
Do not confuse the EP1C20F324C7 (Cyclone I, 130 nm) with the EP2C20F324 (Cyclone II, 90 nm) or EP3C20F324 (Cyclone III, 65 nm) - the bitstream formats and JTAG IDs are NOT compatible. Loading a Cyclone II .sof into an EP1C20 device will fail configuration. Always select the matching device family in Quartus II before generating the programming file. Also, the original Cyclone family is supported only by Quartus II versions up to 13.0sp1; later Quartus releases dropped Cyclone I support.
LVDS input pairs require 100 Ω differential impedance traces and length matching within 20 mil. Place the EP1C20F324C7's on-chip LVDS termination at the receiver pins only - never enable it on transmitter pairs. For high-speed LVDS (≥ 500 Mbps), keep at least 3× the dielectric thickness clearance to other signals and avoid routing across power-plane splits to prevent return-path discontinuities.
Информация о соответствии
RoHS/REACH/lead-free status not explicitly stated in the verified web data. The 'N' suffix variants (e.g. EP1C20F324C7N) are documented as Pb-free per Intel/Altera part-numbering convention. AEC-Q100 not applicable - commercial-grade FPGA.
