EP1S25F672C7N - Stratix FPGA 25K LEs 672-BBGA | Intel / Altera
Артикул: EP1S25F672C7N ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $718.62 | $718,62 |
| 10 | $660 | $6.600,00 |
| 50 | $612 | $30.600,00 |
| 100 | $575 | $57.500,00 |
| 500 | $535 | $267.500,00 |
EP1S25F672C7N Обзор
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacture by a user-supplied configuration bitstream. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs, occupying the same general role as ASICs but offering in-system re-programmability, faster prototyping cycles, and lower non-recurring engineering cost. Within a digital system, an FPGA typically implements glue logic, custom datapaths, parallel DSP, packet processing, or even soft-core CPUs, making it a foundational component in the broader category of programmable logic devices (PLDs) and digital logic ICs.
Key features of the EP1S25F672C7N include up to 6 full-duplex high-speed transceiver channels (model-dependent), dedicated DSP blocks for 18 × 18 multipliers at full speed, distributed and TriMatrix embedded memory, up to 12 PLLs for clock management, and 473 user I/Os. The Stratix architecture uses look-up tables (LUTs), embedded memory blocks (M512, M4K, M-RAM), and high-speed I/O elements supporting DDR SDRAM interfaces. Configuration is via JTAG or passive/active serial schemes, and the device supports in-system programming for field updates.
Typical applications for the EP1S25F672C7N include high-end DSP designs (radar, baseband, video processing), communications infrastructure (line cards, protocol bridges, packet classification), test and measurement equipment, medical imaging accelerators, and military/aerospace signal processing. The combination of 25K logic elements and approximately 2 Mbit of block RAM in this BGA-672 footprint makes it well suited to mid-density datapath designs. The 0 to 85 °C commercial operating temperature grade further confirms its use in standard commercial and industrial environments rather than extended-temperature deployments.
When designing with this device, plan power-rail sequencing for VCCINT (1.5 V core), VCCIO (per bank, 1.2–3.3 V), VCC_PLL, and VCC_GXB if transceivers are used. Decoupling must follow Altera's recommended guidelines with multiple low-ESL ceramics close to each supply pin. Designers should also reference the Stratix Device Handbook and AN-224 for I/O termination and signal-integrity best practices. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond the manufacturer datasheet.
Аналоги без доработки для EP1S25F672C7N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1S25F672C7N (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Speed Grade, DSP Blocks, Family.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1S25F672C8N
✅ Прямая замена✓ В наличии
$179.4 / шт.
Открыть даташит →EP1S25B672C7N
✅ Прямая замена✓ В наличии
$620.15 / шт.
Открыть даташит →EP1S25F672C7
✅ Прямая замена✓ В наличии
$595 / шт.
Открыть даташит →EP1S25F672C6N
✅ Прямая замена✓ В наличии
$192.75 / шт.
Открыть даташит →EP1S25F672C5N
✅ Прямая замена✓ В наличии
$142 / шт.
Открыть даташит →EP1S20F672C7N
✅ Прямая замена✓ В наличии
$109.2 / шт.
Открыть даташит →EP1S25F672C7N Максимальные параметры и электрические характеристики
| Device Family | Stratix |
| Logic Elements (LEs) | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory Bits | 1,944,576 |
| Maximum User I/O | 473 |
| Number of I/O Pins | 672 (BGA balls) |
| Корпус | 672-BBGA (FineLine BGA), 35 × 35 mm, 1.27 mm pitch |
| Process Technology | 0.13 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Рабочая температура | 0 °C to 85 °C (commercial) |
| Тип монтажа | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial |
Руководство по цоколевке EP1S25F672C7N в корпусе 672-bbga (fineline bga), 35 × 35 mm, 1.27 mm pitch
Цоколевка для EP1S25F672C7N (корпус 672-bbga (fineline bga), 35 × 35 mm, 1.27 mm pitch). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP1S25F672C7N.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP1S25F672C7N подходит для 7 применениеs: High-Performance DSP / Baseband, Communications Line Cards, Test & Measurement Instrumentation, Video & Image Processing, Medical Imaging Accelerator, Military / Aerospace Signal Processing, Industrial Control & Machine Vision.
High-Performance DSP / Baseband
The EP1S25F672C7N's 25,660 logic elements and dedicated DSP blocks for 18 × 18 multipliers at full speed make it a strong fit for high-throughput DSP designs such as radar baseband, channel cards, and software-defined radio front-ends. At a 1.5 V core and 0–85 °C commercial grade, it operates in laboratory and telecom-shelf thermal envelopes with adequate cooling. Designers typically pair the FPGA with high-speed ADC/DAC companions and route differential LVDS or HSTL lines through the 473 user I/Os for raw datapath bandwidth. The 1,944,576 bits of TriMatrix memory hold FFT working sets, sample buffers, and coefficient tables without external SRAM, keeping latency deterministic for real-time signal chains.
Рекомендуется
Communications Line Cards
In telecom line cards and protocol bridges, the EP1S25F672C7N implements cell/packet classification, traffic shaping, and custom framer logic at wire rate. With up to 12 PLLs and high-speed LVDS I/O, it cleanly interfaces to network PHYs and SERDES framer ICs. The 1,944,576 bits of embedded RAM support large flow tables and FIFO buffering, while 473 user I/Os accommodate multiple backplane lanes and station-side interfaces. Compared with a software-only solution, the Stratix device offloads header parsing and table lookups deterministically. The 0–85 °C commercial temperature range matches central-office thermal specifications with proper airflow.
Рекомендуется
Test & Measurement Instrumentation
Arbitrary waveform generators, logic analyzers, and protocol testers benefit from the EP1S25F672C7N's combination of dense logic, 1.944 Mbit block RAM, and 473 user I/Os. Designers can implement deep acquisition memory, real-time triggering, and parallel DSP filter banks within a single device, reducing BOM and trace-routing complexity. The 672-ball BGA package supports dense PCB layouts required by multi-channel test gear, while the 1.5 V core and Stratix device family datasheet-documented 0–85 °C range suit laboratory environments. Compared with discrete logic implementations, this FPGA shortens development cycles through Quartus-supported IP libraries for FFTs, FIR filters, and high-speed serial interfaces.
Рекомендуется
Video & Image Processing
For video format conversion, real-time image filtering, and broadcast equipment, the EP1S25F672C7N's parallel DSP blocks and TriMatrix memory handle line buffers and frame stores efficiently. The 473 user I/Os support multi-channel digital video interfaces, while 12 PLLs synthesize the various pixel clocks needed for SD, HD, and 3G-SDI workflows. The 1.5 V core supply and BGA-672 thermal envelope fit 1U/2U rackmount chassis with appropriate heatsinking. The Stratix device family datasheet's documented commercial 0–85 °C temperature range aligns with broadcast-facility specifications. Compared with software-CPU solutions, the FPGA delivers deterministic latency critical for lip-sync and frame-accurate switching.
Рекомендуется
Medical Imaging Accelerator
Ultrasound beamforming, CT reconstruction, and MRI pre-processing boards use the EP1S25F672C7N to accelerate compute-intensive kernels such as FFT and FIR filtering at low latency. The 18 × 18 hardware multipliers in Stratix DSP blocks run at full speed, while the 1.944 Mbit block RAM holds beamforming coefficients and intermediate image data. The 0–85 °C commercial grade fits imaging-cart thermal environments with proper airflow. With 473 user I/Os, designers connect to multi-channel ADC front-ends and PCIe/DDR interfaces without external logic. Compared with previous-generation FPGAs, the EP1S25's TriMatrix architecture improves memory throughput by 30 percent, accelerating image reconstruction.
Рекомендуется
Military / Aerospace Signal Processing
Although the EP1S25F672C7N itself is a commercial 0–85 °C grade, its logic and memory architecture are well suited to legacy military signal-processing programs that qualified the part into flight or shipboard systems. Designers implement radar pulse compression, electronic-countermeasure (ECM) algorithms, and secure communication links in a single device. The 672-ball BGA supports ruggedized PCB stack-ups, and 473 user I/Os route to ADC/DAC and RF converter chains. Where the original commercial grade is acceptable per system spec, the EP1S25F672C7N provides 25,660 LEs and 1,944,576 bits of memory; for harsh-temperature deployments, the industrial-grade EP1S25F672I7N variant (not a drop-in) covers -40 °C to 100 °C.
Рекомендуется
Industrial Control & Machine Vision
Multi-axis motion controllers and machine-vision inspection systems leverage the EP1S25F672C7N to fuse encoder feedback, image pre-processing, and deterministic control loops. The dedicated DSP blocks accelerate PID loops and vision-pipeline kernels, while 1.944 Mbit of block RAM holds frame buffers and lookup tables for color-space conversion. The 473 user I/Os connect to encoder counters, PWM generators, and Camera Link or GigE Vision interfaces. The commercial 0–85 °C operating range suits factory-floor enclosures with appropriate airflow and conformal coating. Compared with discrete DSP or microcontroller approaches, the FPGA consolidates timing-critical logic into a single device, improving repeatability and BOM consolidation.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1S25F672C7N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1S25F672C8N | EP1S25B672C7N | EP1S25F672C7 | EP1S25F672C6N | EP1S25F672C5N | EP1S20F672C7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-BBGA (FineLine BGA, 35 × 35 mm, 1.27 mm pitch) | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 18,460 (-28%) |
| Maximum User I/O | 473 | 473 | 473 | 473 | 473 | 473 | 473 |
| Speed Grade | C7 | C8 (faster) | C7 (B-die) | C7 | C6 (slower) | C5 (slowest) | C7 |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Lifecycle Status | Obsolete (scarce stock) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Ключевые отличия
- Drop-in upgrade path to a faster speed grade (против EP1S25F672C8N)
- Second-source continuity via B-die revision (против EP1S25B672C7N)
- Cost-reduced variant with the same footprint (против EP1S25F672C6N)
- Lower-density sibling with identical I/O count (против EP1S20F672C7N)
Заметки по проектированию
The EP1S25F672C7N requires four separate supplies: VCCINT (1.5 V core), VCCIO (bank-dependent 1.2 V–3.3 V), VCC_PLL (1.5 V), and VCC_GXB (if transceivers are used). Sequence VCCINT before or simultaneously with VCCIO per the Stratix Device Handbook, and assert CONFIG_DONE only after supplies stabilize. Use a supervisor with adjustable threshold and sufficient bulk capacitance. Decoupling must combine multiple 0.1 µF, 0.01 µF, and bulk 10–22 µF ceramics placed within 100 mils of each power pin.
The 672-ball FineLine BGA at 1.27 mm pitch demands a microvia-compatible PCB stack-up with sequential lamination. Per Altera's reference design guidelines, route signals out of the inner rows using dog-bone fanout or via-in-pad if thermal dissipation allows. Provide at least four signal layers and dedicated power planes for VCCINT and VCCIO. Matched impedance for LVDS (100 Ω differential) and 50 Ω single-ended must be calculated against the chosen stack-up, and BGA balls should have non-solder-mask-defined (NSMD) pads for reliable assembly.
Do not assume all 672 BGA balls are user I/O: roughly 88 are power, 56 are GND, and the rest are configuration and JTAG pins, leaving 473 user I/O. Skipping CONFIG_DONE pull-up or mis-wiring nCONFIG/nSTATUS will prevent startup. Also, the EP1S25F672C7N is obsolete and Intel has migrated the design to Stratix II/III/IV/10 families—plan a forward-migration path in parallel. For volume orders, verify lead time and authenticity with the distributor's quality team to avoid counterfeit risk.
Информация о соответствии
RoHS, REACH, lead-free, and halogen-free status for EP1S25F672C7N are not present in the Verified Web Data and should be confirmed against the active distributor listing. The original Altera Stratix family was launched prior to broad RoHS mandates; post-2006 production runs are typically lead-free and RoHS-compliant, but a current compliance certificate must be obtained from the supplier.
