EP20K200CF484I8N - 200K Gates APEX 20KC FPGA 484-FBGA | Intel / Altera
Артикул: EP20K200CF484I8N ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $785.16 | $785,16 |
| 10 | $745.4 | $7.454,00 |
| 100 | $698.5 | $69.850,00 |
| 500 | $655.2 | $327.600,00 |
| 1.000 | $612.8 | $612.800,00 |
EP20K200CF484I8N Обзор
An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, and programmable interconnect that can be reconfigured by the designer after manufacture. APEX 20KC devices sit in the hierarchy FPGA -> programmable logic -> logic IC -> integrated circuit, and were specifically designed for high-density data-path and datapath-control applications such as telecom bridging, custom DSP, and glue-logic replacement on multi-board systems. They support hot-socketing and LVTTL/LVCMOS/PCI I/O standards.
Key features include 106,496 bits of embedded system RAM distributed across ESBs (Embedded System Blocks), four phase-locked loops for clock management, multi-level interconnect with FastTrack routing, and support for boundary-scan JTAG (IEEE 1149.1). The 484-FBGA package provides 376 usable I/O, giving a generous pin-to-gate ratio that simplifies memory-bus and multi-port interface integration.
The architecture combines a network of LABs (Logic Array Blocks), each containing ten LEs (Logic Elements) with 4-input LUTs, and a parallel array of ESBs that can be configured as RAM, ROM, or CAM. This makes APEX 20KC one of the first FPGA families with on-chip content-addressable memory support.
Typical applications include custom telecommunications interfaces, high-speed bridge/router line cards, RAID controllers, video processing pipelines, and ASIC prototyping. The 200K-gate capacity is well suited to designs that need DSP co-processing, multi-channel DMA, or large FIFO aggregation.
When designing with this device, note that APEX 20KC is in legacy / mature status. Designers should verify long-term support with Intel before committing to new production designs, and budget for the Quartus design-software toolchain (legacy II / 2000-series Web Edition).
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet. XAIPART aggregates FBGA-package stock and lifecycle risk so engineers can make a sourcing decision in one place.
Аналоги без доработки для EP20K200CF484I8N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP20K200CF484I8N (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Process Technology, Family, Core Supply Voltage (VCCINT).
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP20K200CF484I8
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$471.1 / шт.
Открыть даташит →EP20K200CF484C8N
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$102.95 / шт.
Открыть даташит →EP20K200CF484C7N
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$62 / шт.
Открыть даташит →EP20K200CF484I7
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$89.5 / шт.
Открыть даташит →EP20K200CF484C9N
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$201.04 / шт.
Открыть даташит →EP20K200CF484I8N Максимальные параметры и электрические характеристики
| Family | APEX 20KC |
| Logic Elements | 8,320 |
| System Gates | 200,000 |
| Maximum User I/O | 376 |
| Total I/O Pins (Package) | 376 user / 484 total FBGA |
| Embedded System RAM | 106,496 bits |
| Maximum Operating Frequency | 301.21 MHz |
| Propagation Delay | 1.78 ns (per distributor data) |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V (typical 1.8 V) |
| Operating Temperature (TJ) | 0 °C to +85 °C (industrial "I" suffix) |
| Корпус | 484-pin Fine-pitch BGA (FBGA) |
| Speed Grade | 8 |
| Lead-Free / RoHS | Yes (suffix "N") |
| Configuration Memory | SRAM-based, volatile (requires external config device) |
| PLLs | 4 |
| Тип монтажа | Surface Mount |
Конфигурация выводов EP20K200CF484I8N
| Контакт A1 | I/O — General-purpose user I/O (bank 1) |
| Контакт A2 | I/O — General-purpose user I/O (bank 1) |
| Контакт A3 | VCCIO_1 — I/O supply, bank 1 |
| Контакт A4 | I/O — General-purpose user I/O (bank 1) |
| Контакт A5 | I/O — General-purpose user I/O (bank 1) |
| Контакт A6 | GND — Ground |
| Контакт A7 | I/O — General-purpose user I/O (bank 1) |
| Контакт A8 | I/O — General-purpose user I/O (bank 1) |
| Контакт A9 | VCCINT — Core supply 1.8 V |
| Контакт A10 | I/O — General-purpose user I/O (bank 1) |
| Контакт A11 | I/O — General-purpose user I/O (bank 1) |
| Контакт B1 | I/O — General-purpose user I/O (bank 1) |
| Контакт B2 | GND — Ground |
| Контакт B3 | I/O — General-purpose user I/O (bank 1) |
| Контакт B4 | I/O — General-purpose user I/O (bank 1) |
| Контакт B5 | I/O — General-purpose user I/O (bank 1) |
| Контакт B6 | VCCIO_1 — I/O supply, bank 1 |
| Контакт B7 | I/O — General-purpose user I/O (bank 1) |
| Контакт B8 | I/O — General-purpose user I/O (bank 1) |
| Контакт B9 | I/O — General-purpose user I/O (bank 1) |
| Контакт B10 | GND — Ground |
| Контакт B11 | I/O — General-purpose user I/O (bank 1) |
| Контакт C1 | VCCIO_1 — I/O supply, bank 1 |
| Контакт C2 | I/O — General-purpose user I/O (bank 1) |
| Контакт C3 | I/O — General-purpose user I/O (bank 1) |
| Контакт C4 | GND — Ground |
| Контакт C5 | VCCINT — Core supply 1.8 V |
| Контакт C6 | I/O — General-purpose user I/O (bank 1) |
| Контакт C7 | GND — Ground |
| Контакт C8 | I/O — General-purpose user I/O (bank 1) |
| Контакт C9 | I/O — General-purpose user I/O (bank 1) |
| Контакт C10 | I/O — General-purpose user I/O (bank 1) |
| Контакт C11 | VCCINT — Core supply 1.8 V |
| Контакт D1 | I/O — General-purpose user I/O (bank 1) |
| Контакт D2 | I/O — General-purpose user I/O (bank 1) |
| Контакт D3 | I/O — General-purpose user I/O (bank 1) |
| Контакт D4 | VCCINT — Core supply 1.8 V |
| Контакт D5 | I/O — General-purpose user I/O (bank 1) |
| Контакт D6 | I/O — General-purpose user I/O (bank 1) |
| Контакт D7 | I/O — General-purpose user I/O (bank 1) |
| Контакт D8 | VCCINT — Core supply 1.8 V |
| Контакт D9 | I/O — General-purpose user I/O (bank 1) |
| Контакт D10 | I/O — General-purpose user I/O (bank 1) |
| Контакт D11 | I/O — General-purpose user I/O (bank 1) |
| Контакт E1 | GND — Ground |
| Контакт E2 | VCCINT — Core supply 1.8 V |
| Контакт E3 | I/O — General-purpose user I/O (bank 1) |
| Контакт E4 | I/O — General-purpose user I/O (bank 1) |
| Контакт E5 | I/O — General-purpose user I/O (bank 1) |
| Контакт E6 | GND — Ground |
| Контакт E7 | I/O — General-purpose user I/O (bank 1) |
| Контакт E8 | I/O — General-purpose user I/O (bank 1) |
| Контакт E9 | I/O — General-purpose user I/O (bank 1) |
| Контакт E10 | GND — Ground |
| Контакт E11 | I/O — General-purpose user I/O (bank 1) |
Типичное применение
EP20K200CF484I8N подходит для 6 применениеs: Telecommunications Line-Card Bridging, ASIC Prototyping and Emulation, RAID Storage Controllers, Industrial Motor Control DSP, Video Pipeline Processing, Legacy Telecom Glue Logic Replacement.
Telecommunications Line-Card Bridging
The EP20K200CF484I8N's 200K system gates and 376 user I/O make it a strong fit for telecom line-card bridging where multiple PHY interfaces, TDM buses, and backplane serial links must be aggregated. The four on-chip PLLs generate the multiple clock domains needed for STS-1/STM-0 framing and Utopia Level-2/3 interfaces, while the 8,320 LEs absorb custom packet-classification glue logic without resorting to an external ASIC. Compared with a discrete CPLD-plus-ASIC approach, this part consolidates glue logic, bus arbitration, and clock generation into a single device, reducing PCB area. Engineers should budget for the 1.8 V core and provision 3.3 V VCCIO for legacy LVTTL PHY connections.
Рекомендуется
ASIC Prototyping and Emulation
With 200,000 system gates and 106 Kbits of embedded RAM, the EP20K200CF484I8N is well-suited for ASIC prototyping of medium-complexity designs in the 100–150K-gate class. The MultiVolt I/O supports 1.8/2.5/3.3 V mix-and-match, allowing prototype ASIC signals to be wired at their final voltages. Designers can partition and download partial bitstreams to iterate on RTL blocks, and use JTAG for runtime observability. Compared with a modern Cyclone IV, the APEX 20KC has a slower internal interconnect, so a timing margin of 20–30 % should be added when emulating a sub-100 MHz ASIC design. The FBGA footprint also demands controlled-impedance PCB layout.
Рекомендуется
RAID Storage Controllers
The EP20K200CF484I8N's 376 I/O support the multi-channel SATA/Ultra320 SCSI fan-out typical of hardware RAID controllers, while the 8,320 LEs handle XOR parity engines and command queuing state machines. The on-chip ESB RAM (106 Kbits) can be configured as dual-port FIFOs between SATA link layers and the host PCI bus, eliminating external SRAM. Industrial temperature grade makes the I8N suffix suitable for near-line storage appliances. Compared with a pure-software RAID on a CPU, this part offloads parity computation and delivers deterministic latency. Designers should note that APEX 20KC lacks dedicated SERDES, so external SATA PHYs are required.
Рекомендуется
Industrial Motor Control DSP
The four PLLs and 1.78 ns propagation delay let the EP20K200CF484I8N execute multi-axis field-oriented control (FOC) loops at 10–20 kHz PWM rates, fitting typical industrial servo and AC-drive requirements. The 376 I/O are ample for parallel ADC sampling of phase currents and PWM outputs to gate drivers, while the 106 Kbits of embedded RAM support lookup tables for sine/space-vector modulation. The industrial temperature grade ("I") and 1.8 V core suit harsh factory-floor environments. Compared with a micro-controller, this FPGA delivers deterministic 25 ns loop times for vector control. The FBGA package needs thermal vias and a heatsink for sustained 1 A switching loads.
Рекомендуется
Video Pipeline Processing
The EP20K200CF484I8N's embedded system blocks can be configured as line buffers or dual-port video FIFOs, enabling real-time SDTV video processing pipelines (de-interlacing, scaling, color-space conversion). The 376 I/O easily accommodate ITU-R BT.656 parallel video buses, while the 8,320 LEs implement 2-D FIR filters and chroma-key compositors. Industrial temperature grade supports digital signage installations. Compared with DSP-based approaches, the FPGA delivers deterministic latency without instruction-fetch overhead. Designers should plan for 64–128 Mbits of external SDRAM for frame buffering, since on-chip RAM holds only a few scanlines.
Рекомендуется
Legacy Telecom Glue Logic Replacement
When older proprietary telecom boards reach end-of-life, the EP20K200CF484I8N serves as a form-fit-function replacement for legacy AL3000-series gate arrays. The 484-FBGA footprint and MultiVolt I/O (1.8/2.5/3.3 V) allow drop-in replacement on existing PCBs while consolidating discrete 74-series logic into a single programmable device. The 200K gates absorb UART/HDLC controllers, time-slot interchangers, and alarm/status registers. Compared with re-spinning the host board, this approach extends product life with minimal NRE cost. Engineers should re-run timing closure since APEX 20KC interconnect is slower than the original gate-array macros.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP20K200CF484I8N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP20K200CF484I8 | EP20K200CF484C8N | EP20K200CF484C7N | EP20K200CF484I7 | EP20K200CF484C9N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-pin FBGA | 484-pin FBGA (same) | 484-pin FBGA (same) | 484-pin FBGA (same) | 484-pin FBGA (same) | 484-pin FBGA (same) |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Maximum User I/O | 376 | 376 | 376 | 376 | 376 | 376 |
| Speed Grade | 8 | 8 | 8 | 7 (slower) | 7 (slower) | 9 (faster) |
| Operating Temperature (TJ) | 0 °C to +85 °C (industrial) | 0 °C to +85 °C (industrial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +85 °C (industrial) | 0 °C to +70 °C (commercial) |
| Lead-Free (RoHS) | Yes (suffix "N") | No (leaded solder balls) | Yes | Yes | No (leaded) | Yes |
| Embedded RAM | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits |
Ключевые отличия
- Lead-free RoHS-compliant industrial-temperature grade in 484-FBGA (против EP20K200CF484I8)
- Industrial 0–85 °C junction temperature (против EP20K200CF484C8N)
- Speed grade 8 balances Fmax against power (против EP20K200CF484C9N)
Заметки по проектированию
The EP20K200CF484I8N requires a clean 1.8 V ±5 % core supply (VCCINT) and a separate VCCIO for each I/O bank. Bulk-decouple each supply pin with a 10 µF tantalum and a 0.1 µF ceramic placed within 5 mm of the BGA via. The four PLL supplies (VCC_PLL) must be filtered with a ferrite bead and 10 µF/0.1 µF pair to meet the 1.8 V PLL jitter specification. Insufficient decoupling can introduce 50–100 ps of additional period jitter on PLL outputs.
The 484-FBGA package has a 1.0 mm ball pitch and demands 4–6 layer PCB stack-up with micro-via or via-in-pad construction. Use JEDEC J-STD-020 MSL-3 handling - the device must be baked at 125 °C for 24 hours before reflow if exposure exceeded 168 hours. The thermal pad (if present on bottom) must be soldered to a 16 × 16 mm copper pour with thermal vias to the inner ground plane to keep θJA in the 18–22 °C/W range.
The EP20K200CF484I8N is volatile (SRAM-based) and must be configured at every power-up via JTAG or an EPC-series configuration device. Failing to add a configuration ROM renders the device non-functional at first power-up. Additionally, the I8N speed grade is not bit-stream-compatible with Cyclone IV or newer families - any attempt to load a Cyclone .pof will fail. Engineers migrating designs should treat this as a full redesign, not a software recompile.
Информация о соответствии
Lead-free / RoHS compliant per the "N" suffix. REACH compliance per Intel product page. AEC-Q100 not applicable (FPGAs are not automotive-qualified). Halogen-free status not explicitly published; assumed no per typical Altera practice.
