EP20K600CB652I8 - APEX 20KC 600K Gates FPGA | Intel | 652-BGA
Артикул: EP20K600CB652I8 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132 | $1.320,00 |
| 100 | $118.5 | $11.850,00 |
| 500 | $105 | $52.500,00 |
| 1.000 | $92 | $92.000,00 |
EP20K600CB652I8 Обзор
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O cells can be programmed by the customer after manufacture, enabling rapid prototyping and time-to-market for digital designs. APEX 20KC sits within Altera's PLD hierarchy as: programmable logic device (PLD) -> complex PLD (CPLD/FPGA) -> SRAM-based FPGA -> high-gate-count FPGA family -> APEX 20KC. It belongs to the broader taxonomy of programmable logic devices and digital integrated circuits.
Key features of the EP20K600CB652I8 include embedded MultiCore Interconnect (MultiPLL) clock networks, support for LVCMOS, LVTTL, PCI, and SSTL I/O standards, in-system programmability via the IEEE 1149.1 JTAG interface, and on-chip RAM blocks for distributed memory and FIFO applications. The device integrates a Lookup Table (LUT)-based logic array element with FastTrack interconnect, providing deterministic routing delays across the 600K-gate fabric.
Architecturally, the APEX 20KC family combines logic array blocks (LABs), embedded system blocks (ESBs) for RAM/ROM, and a hierarchical interconnect. The CB652 package designation indicates 652 ball-grid-array pins in FineLine BGA format with a 1.27 mm pitch, giving a substantial 45 mm × 45 mm board footprint appropriate for high I/O density. The I8 speed grade reflects the slowest of the three speed bins, prioritizing timing closure margin over absolute throughput.
Typical applications include telecommunications line cards, industrial control and factory automation backplanes, ASIC prototyping, high-speed data acquisition front-ends, and military/aerospace digital signal processing platforms. The 600K-gate capacity supports moderately complex datapaths, protocol bridges, and parallel processing engines.
When designing with this part, ensure JTAG chain integrity, observe the 1.8 V VCCINT/VCCIO decoupling guideline with 0.1 µF ceramic capacitors near each supply pin, and budget PCB layers to maintain signal integrity on the 1.27 mm BGA pitch. The I8 speed grade reduces Fmax margin; consider I7 or I9 grades if higher performance is required.
This page consolidates distributor pricing, drop-in same-brand alternatives from the APEX 20K family, and practical design notes not found in any single source.
Аналоги без доработки для EP20K600CB652I8 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP20K600CB652I8 (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Operating Temperature, Device Type, Speed Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP20K600CB652I7N
✅ Прямая замена✓ В наличии
$158 / шт.
Открыть даташит →EP20K600CB652I7
✅ Прямая замена✓ В наличии
$149 / шт.
Открыть даташит →EP20K600CB652C9N
✅ Прямая замена✓ В наличии
$128 / шт.
Открыть даташит →EP20K600CB652C9
✅ Прямая замена✓ В наличии
$142.5 / шт.
Открыть даташит →EP20K600CB652C8N
✅ Прямая замена✓ В наличии
$115 / шт.
Открыть даташит →EP20K600CB652C8
✅ Прямая замена✓ В наличии
$105 / шт.
Открыть даташит →EP20K600CB652C7N
✅ Прямая замена✓ В наличии
$305 / шт.
Открыть даташит →EP20K600CB652I8 Максимальные параметры и электрические характеристики
| Family | APEX 20KC |
| Series | EP20K600 |
| System Gates | 600,000 |
| Logic Elements / Cells | 24,320 |
| Maximum Operating Frequency | 301.21 MHz |
| Propagation Delay (tpd) | 1.78 ns (CMOS) |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V nominal (1.71 V to 1.89 V) |
| Рабочая температура | -40 °C to +85 °C (Industrial) |
| Корпус | 652-ball FineLine BGA (S-PBGA-B652) |
| Package Code | BGA, square |
| Ball Pitch | 1.27 mm |
| Package Body Size | 45 mm × 45 mm |
| User I/O Lines | 488 |
| Dedicated Clock Inputs | 4 |
| Programming Interface | IEEE 1149.1 JTAG (in-system) |
| Тип монтажа | Surface Mount |
Руководство по цоколевке EP20K600CB652I8 в корпусе 45 mm × 45 mm
Цоколевка для EP20K600CB652I8 (корпус 45 mm × 45 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP20K600CB652I8.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP20K600CB652I8 подходит для 7 применениеs: Telecommunications Line Cards, ASIC Prototyping, Industrial Control Backplanes, High-Speed Data Acquisition, Aerospace Digital Signal Processing, Image Processing Pipelines, Legacy Military Communication Systems.
Telecommunications Line Cards
The EP20K600CB652I8's 600K system gates and 488 user I/O lines make it well-suited for telecom line card aggregation, where the FPGA functions as a multi-protocol bridge between T1/E1 framers, ATM UTOPIA interfaces, and Ethernet MACs. Its 1.78 ns CMOS propagation delay enables backplane arbitration at 50 MHz bus speeds, while 4 dedicated clock inputs simplify multi-clock-domain designs. Industrial temperature rating (-40 °C to +85 °C) supports outdoor DSLAM and CO deployments where ambient temperatures vary widely.
Рекомендуется
ASIC Prototyping
With 24,320 logic cells and 600K gates, the EP20K600CB652I8 can prototype mid-complexity ASICs before mask production, including peripheral controllers, custom microprocessors, and DSP datapaths. The 652-ball BGA footprint and JTAG-based configuration support rapid design iteration, while embedded system blocks (ESBs) provide distributed RAM for register-file emulation. Engineers commonly partition large ASICs across multiple APEX 20KC devices in a multi-FPGA prototyping rig.
Рекомендуется
Industrial Control Backplanes
The 488 I/O lines of EP20K600CB652I8 accommodate dense PLC backplanes interfacing with sensor arrays, motor drivers, and serial fieldbuses such as Profibus, Modbus, or CAN. Industrial temperature operation ensures reliable performance in factory automation enclosures where ambient temperatures range from -20 °C to +70 °C. The 1.27 mm BGA pitch allows compact PCB designs typical of modular PLC chassis, while the 4 dedicated clock pins support deterministic cycle-time scheduling for real-time control loops.
Рекомендуется
High-Speed Data Acquisition
The 301.21 MHz internal frequency and 1.78 ns tpd of EP20K600CB652I8 suit high-speed ADC interface designs, where the FPGA performs digital down-conversion, FIR filtering, and packetization of digitized waveforms. The 24,320 logic cells provide ample resources for parallel processing of multiple ADC channels at 100-200 MSPS, while 488 I/O lines accept LVDS data streams directly from modern converters. Industrial temperature grade supports outdoor radar and sonar receiver installations.
Рекомендуется
Aerospace Digital Signal Processing
Obsolescence-tolerant aerospace programs continue to use EP20K600CB652I8 for flight-control test equipment, radar pre-processing, and avionics bus monitoring. Its 600K-gate capacity supports complex FFT engines and adaptive beamforming at radar IF frequencies. The BGA package provides mechanical robustness under vibration, while the industrial temperature range accommodates military environmental specifications. Legacy aerospace supply chains maintain qualified stock through authorized brokers with full traceability documentation.
Рекомендуется
Image Processing Pipelines
The EP20K600CB652I8's embedded system blocks (ESBs) can be configured as dual-port RAM buffers for line-scan image pipelines, while 488 I/O lines accept parallel camera link or LVDS sensor data at rates up to 600 Mbps per channel. The 600K-gate capacity supports convolution engines, color space conversion, and histogram accumulation for machine vision applications. Industrial temperature grade permits deployment in factory-floor vision systems without additional thermal management.
Рекомендуется
Legacy Military Communication Systems
The EP20K600CB652I8 remains deployed in legacy MIL-STD-188 and Link 16 communication systems where program longevity exceeds 20 years and re-design certification cost is prohibitive. The device's 1.8 V operation and 488 I/O lines support secure modem architectures with embedded encryption and forward error correction. Maintainers source the part through qualified military distributors with full lot traceability and conformance testing per MIL-PRF-38535.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP20K600CB652I8 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP20K600CB652I7N | EP20K600CB652I7 | EP20K600CB652C9N | EP20K600CB652C8N | EP20K600CB652C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 652-ball FineLine BGA | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Speed Grade | I8 | I7 (faster) | I7 (faster) | C9 (commercial, I9 speed) | C8 (commercial, I8 speed) | C7 (commercial, I7 speed) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C | -40 °C to +85 °C | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Core Voltage | 1.8 V (1.71 V to 1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User I/O Lines | 488 | 488 | 488 | 488 | 488 | 488 |
Ключевые отличия
- Bitstream-compatible speed-grade upgrade path (против EP20K600CB652I8)
- Industrial temperature grade compliance (против EP20K600CB652C8N)
- Largest logic capacity in APEX 20K family (против EP20K400CB652I8)
Заметки по проектированию
The 652-ball FineLine BGA package with 1.27 mm pitch requires PCB microvia technology (laser-drilled stacked vias) and a minimum 6-layer stack-up. Recommended stack-up: top signal / GND / inner signal / inner power / power / bottom signal. Place a 0.1 µF X7R ceramic decoupling capacitor within 5 mm of every VCCINT and VCCIO ball, supplemented by 10 µF tantalum or polymer caps at each supply island. The 45 mm × 45 mm body demands symmetric escape routing to avoid differential via length mismatch.
Configuration memory selection is critical: APEX 20KC devices are SRAM-based and lose their configuration on power-down, requiring an external configuration PROM such as EPC16 or EPCQ64. Do not attempt to operate the device without a valid configuration bitstream or it will remain in user-I/O tri-state indefinitely. JTAG chain integrity must be verified before any production deployment, as broken TDI/TDO links manifest as silent configuration failures.
Estimated: at 100% logic utilization on the 24,320-cell fabric with toggle rate of 12.5% and 1.8 V VCCINT, the EP20K600CB652I8 dissipates approximately 1.5 W (input values: 24,320 cells × 0.05 mW/cell = 1.2 W core, plus 0.3 W I/O). The 45 mm × 45 mm BGA provides sufficient copper pour for natural convection cooling. For chassis-mounted designs with restricted airflow, add a 10 °C/W heat spreader or aluminum plate bonded to the package top with thermal interface material.
LVDS I/O standards on EP20K600CB652I8 require 100 Ω differential impedance traces with matched pair length within 0.5 mm. Route LVDS pairs on an inner signal layer with continuous GND reference above and below. PCI-compliant I/O at 66 MHz requires source-series termination (22-33 Ω) at the FPGA driver. SSTL-2 I/O for DDR interface support demands 1.25 V VTT termination with proper length-matched fly-by topology.
Информация о соответствии
RoHS, lead-free, and halogen-free status not specified in verified distributor data. APEX 20KC parts were manufactured 2000-2008, predating widespread lead-free BGA adoption; many early production lots use tin-lead BGA balls. Request Material Declaration and Certificate of Conformance from distributor to verify compliance before shipping into EU markets. AEC-Q100 not applicable as this is an FPGA, not a discrete automotive IC.
