EP20K600CB652C8 - APEX 20KC FPGA 600K Gates 652-BGA | Intel
Артикул: EP20K600CB652C8 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $165 | $1.650,00 |
| 100 | $142 | $14.200,00 |
| 500 | $120 | $60.000,00 |
| 1.000 | $105 | $105.000,00 |
EP20K600CB652C8 Обзор
The APEX 20KC architecture combines Look-Up Table (LUT)-based logic elements with embedded system blocks (ESBs) that can be configured as either dual-port RAM, single-port RAM, ROM, or CAM (Content-Addressable Memory). The device is a member of the programmable logic device (PLD) hierarchy, sitting between simple PLDs (SPLDs/CPLDs) and high-end FPGAs, and is intended for high-density data-path, DSP, and memory-intensive designs.
Key features include 24,320 logic elements, 311,296 bits of embedded memory, 488 maximum user I/O pins, propagation delay around 1.48 ns, and operating frequency up to 301.21 MHz. The APEX 20KC family delivers up to 35% faster design performance than the original APEX 20KE devices, while the embedded memory blocks enable single-chip implementation of FIFOs, CAM lookups, and DSP coefficient storage.
Architecturally, the device integrates a fine-grained Logic Array Block (LAB) fabric with column- and row-based ESB interconnects, providing predictable routing delays. The 1.8 V core with multi-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V PCI-compatible) allows direct interface to legacy and modern logic families without external level translators.
Typical applications include telecommunications line cards, high-speed network switches, DSP data-path acceleration, image processing pipelines, and ASIC prototyping. Designers migrating from APEX 20KE can drop in the 20KC variant for an immediate performance uplift while reusing existing Quartus II development flows.
When designing with this part, ensure the PCB provides sufficient decoupling for the 1.8 V core rail and that the 652-ball BGA land pattern matches the 45 x 45 mm footprint. Boundary-scan support and JTAG configuration simplify board-level test, while in-system programmability via Altera serial configuration devices shortens development cycles.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not found in the manufacturer datasheet alone, providing engineers with a single reference for sourcing, replacement, and PCB layout decisions.
Аналоги без доработки для EP20K600CB652C8 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP20K600CB652C8 (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Process Technology, Speed Grade, Device Type.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP20K600CB652C7
✅ Прямая замена✓ В наличии
$1320 / шт.
Открыть даташит →EP20K600CB652C7N
✅ Прямая замена✓ В наличии
$305 / шт.
Открыть даташит →EP20K600CB652C7ES
✅ Прямая замена✓ В наличии
$195 / шт.
Открыть даташит →EP20K600CB652C7E5
✅ Прямая замена✓ В наличии
$175 / шт.
Открыть даташит →EP20K600CB652C-8
✅ Прямая замена✓ В наличии
$86 / шт.
Открыть даташит →EP20K600CB652C8 Максимальные параметры и электрические характеристики
| Family | APEX 20KC |
| Device Type | SPLD / FPGA |
| System Gates | 600,000 |
| Logic Elements | 24,320 |
| Embedded Memory Bits | 311,296 |
| Maximum User I/O | 488 |
| Корпус | 652-BGA (45 x 45 mm, 1.27 mm pitch) |
| Process Technology | 0.15 µm (later revisions 0.18 µm) all-layer copper CMOS |
| Core Supply Voltage | 1.8 V |
| Propagation Delay | 1.48 ns |
| Maximum Operating Frequency | 301.21 MHz |
| Рабочая температура | 0 °C to +85 °C (commercial) |
| Тип монтажа | Surface Mount (BGA) |
| Configuration Method | JTAG / Altera serial configuration device |
Руководство по цоколевке EP20K600CB652C8 в корпусе 652-bga (45 x 45 mm, 1.27 mm pitch)
Цоколевка для EP20K600CB652C8 (корпус 652-bga (45 x 45 mm, 1.27 mm pitch)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP20K600CB652C8.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP20K600CB652C8 подходит для 6 применениеs: Telecommunications Line Cards, High-Speed Network Switches and Routers, DSP Data-Path Acceleration, Image Processing Pipelines, ASIC Prototyping, Industrial Control and Test Equipment.
Telecommunications Line Cards
The EP20K600CB652C8 is well suited to telecom line cards where 600,000 system gates and 311,296 bits of embedded memory let designers implement framing, HDLC controllers, and ATM segmentation-and-reassembly blocks in a single device. Its 488 user I/O pins drive parallel backplane interfaces and multi-channel T1/E1 framers without external bus expander logic. The 301 MHz internal fabric and 1.48 ns propagation delay meet the timing budget of OC-12 / STM-4 line-rate designs when properly pipelined in VHDL or Verilog.
Рекомендуется
High-Speed Network Switches and Routers
In network switches the EP20K600CB652C8's 24,320 logic elements support 10/100/1000 Ethernet MAC aggregation, VLAN tag processing, and Quality-of-Service queuing structures in a single FPGA. The embedded ESB memory blocks act as packet buffers and CAM lookups for MAC address tables, eliminating external TCAM chips in many designs. The 488 I/O pins interface to multiple PHY devices and to the switch fabric ASIC across wide parallel buses, while the 1.8 V core keeps overall board power dissipation manageable for dense line-card layouts.
Рекомендуется
DSP Data-Path Acceleration
The EP20K600CB652C8 accelerates DSP data paths such as FIR filters, FFT butterflies, and Reed-Solomon codecs by mapping arithmetic pipelines into dedicated logic and using the 311,296-bit embedded memory for coefficient ROM and delay-line storage. Distributed arithmetic implementations benefit from the high LUT count and predictable carry-chain timing. Designers can pair multiple EP20K600CB652C8 devices in a pipeline, with each device delivering up to 301 MHz operation to sustain real-time processing of baseband or audio sample streams.
Рекомендуется
Image Processing Pipelines
Image processing pipelines - including convolution, color-space conversion, and motion-estimation engines - fit naturally in the EP20K600CB652C8's high-logic-count fabric. The 488 I/O pins accommodate multi-channel video buses such as BT.656, Camera Link, or parallel RGB interfaces. Embedded memory buffers hold scan-line data and frame statistics, while the 301 MHz fabric sustains pixel-rate processing for standard-definition and many high-definition video formats when the design is carefully pipelined.
Рекомендуется
ASIC Prototyping
The EP20K600CB652C8 is widely used for ASIC prototyping because its 600K gates approximate mid-complexity ASICs and the Quartus II toolchain supports rapid design iteration. Engineers map gate-level netlists into the APEX 20KC fabric and use JTAG-based in-system programmability to swap prototypes quickly. Multi-FPGA partitioning tools can split a large ASIC across several EP20K600CB652C8 devices, exploiting the 488 I/O pins to interconnect daughter boards at high speed.
Рекомендуется
Industrial Control and Test Equipment
Industrial control and test-and-measurement systems leverage the EP20K600CB652C8's combination of high logic density, 488 I/O pins, and embedded memory to implement custom timing engines, waveform generators, and parallel bus capture logic. The 0 °C to +85 °C commercial temperature range suits factory-floor enclosures and laboratory instruments. Engineers use the FPGA to consolidate glue logic, microsequencer state machines, and protocol decoders that previously required multiple CPLDs and discrete logic.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP20K600CB652C8 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP20K600CB652C7 | EP20K600CB652C7N | EP20K600CB652C7ES | EP20K600CB652C-8 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 652-BGA (45 x 45 mm, 1.27 mm pitch) | 652-BGA (45 x 45 mm) - same | 652-BGA (45 x 45 mm) - same | 652-BGA (45 x 45 mm) - same | 652-BGA (45 x 45 mm) - same |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded Memory Bits | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 |
| Maximum User I/O | 488 | 488 | 488 | 488 | 488 |
| Maximum Frequency | 301.21 MHz | > 301.21 MHz (faster -7 grade) | > 301.21 MHz (faster -7 grade) | > 301.21 MHz (faster -7 grade) | 301.21 MHz (same -8 grade) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lead-Free / RoHS | Standard (non-N suffix) | Standard | Lead-free (RoHS) | Engineering sample | Standard |
Ключевые отличия
- Same-family speed-grade alternatives within identical CB652 footprint (против EP20K600CB652C7)
- Lead-free RoHS-compatible variant in same package (против EP20K600CB652C7N)
- Engineering-sample ordering options for low-volume prototyping (против EP20K600CB652C7ES / EP20K600CB652C7E5)
Заметки по проектированию
The EP20K600CB652C8 requires a tightly regulated 1.8 V core supply capable of delivering several amps during configuration and dynamic operation. Use a dedicated LDO or switching regulator with at least 20% current headroom above the calculated worst-case ICC, and place bulk decoupling (220 µF tantalum or polymer) within 25 mm of the BGA. Multiple 0.1 µF and 1 µF ceramic decoupling capacitors must be placed as close as possible to every power and ground ball pair to suppress simultaneous-switching-noise (SSN) on the 488 I/O pins.
Estimated: at maximum toggle activity across all 488 I/O pins and 50% logic utilization, the EP20K600CB652C8 may dissipate 4-6 W. The 652-ball BGA provides a low thermal resistance path through the PCB via inner power/ground planes and thermal vias; a minimum 4-layer stack-up with continuous inner ground planes is recommended. For high-utilization designs or sealed enclosures, attach a heatsink or use forced-air cooling to keep junction temperature below 100 °C for reliability margin.
Use a 652-ball BGA land pattern with 1.27 mm pitch and NSMD (non-solder-mask-defined) pads for best joint reliability. Escape routing on outer layers with via-in-pad or microvia technology is essential; 4/4 mil trace-and-space rules are typical. Maintain reference-plane continuity under the BGA to preserve signal integrity for high-speed I/O, and match trace lengths within ±50 mil for bus-oriented interfaces (DDR-style external memories or parallel video buses).
Avoid mixing APEX 20KC configuration schemes between board revisions: serial-configuration-device pinouts differ between EPC and EPCS families. Ensure JTAG chain order matches the Quartus II BSDL file when multiple FPGAs share a boundary-scan bus. Do not assume the -8 speed grade timing models apply to -7 or -3 grades - re-run static timing analysis whenever the speed grade is changed. Finally, verify that the 1.8 V supply ramps monotonically; some APEX 20KC devices fail to configure if VCC ramps non-monotonically.
Информация о соответствии
Standard EP20K600CB652C8 was released before RoHS directives took full effect and may use lead-bearing BGA balls; lead-free variant available as EP20K600CB652C8N. AEC-Q100 not applicable (FPGA is not an automotive-qualified part).
