EP20K600CB672C8N - APEX-20KC FPGA 24K LE 672-BGA | Intel
Артикул: EP20K600CB672C8N ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $82 | $8.200,00 |
| 500 | $75.5 | $37.750,00 |
| 1.000 | $69 | $69.000,00 |
EP20K600CB672C8N Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks, embedded memory, routing interconnect and I/O cells that the designer programs after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLD), which also includes CPLDs, and they serve as parallel-processing companions to ASICs, ASSPs and microcontrollers where time-to-market, hardware re-programmability or per-board customization are critical. APEX-20KC parts are considered high-density members of the APEX-20K family, designed for datapath-intensive designs that combine wide datapaths, on-chip memory and high I/O counts.
Key features include MultiVolt I/O support (1.8 V, 2.5 V and 3.3 V interfaces with a 2.5 V core), PCI-SIG compliant 3.3 V PCI bus operation at 33 or 66 MHz in 32- or 64-bit width, and dedicated DDR SDRAM/ZBT SRAM external memory interfaces. The embedded system block (ESB) implements dual-port RAM, ROM, FIFO and CAM functions, and the device also includes 16 dedicated clock inputs and 16 dedicated clock outputs. Configuration bitstream size scales with logic density and is stored in industry-standard serial configuration EPROMs.
Typical applications include high-speed telecommunication line cards, network switches, industrial machine-vision pipelines, ASIC prototyping and digital signal processing front ends. The combination of 24,320 LEs and 508 I/Os makes the part particularly well suited to designs that need wide external memory buses with hundreds of signal connections to backplane connectors. Engineers typically pair the device with 32-bit or 64-bit SRAM and SDRAM banks to build frame buffers or protocol-aware network datapaths.
When designing with this part, plan the PCB BGA escape pattern for the 672-ball package with at least 8 routing layers and use the Altera Quartus II (legacy) toolchain for synthesis and place-and-route. Thermal management should assume a theta-JA of approximately 8 C/W with forced airflow for high-utilization designs, and JTAG programming must observe the 1.8/2.5/3.3 V VCCIO ramp sequencing noted in the APEX-20KC datasheet.
Аналоги без доработки для EP20K600CB672C8N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP20K600CB672C8N (тот же форм-фактор и посадочное место) — отличается по Process Technology, Operating Temperature, Speed Grade, Family, Device Type.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP20K600CB672C7N
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
EP20K600CB672C8
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$245 / шт.
Открыть даташит →EP20K600CB672C8N Максимальные параметры и электрические характеристики
| Family | APEX-20KC |
| Logic Elements (LEs) | 24,320 |
| Embedded Memory Bits | 311,296 |
| Maximum User I/O | 508 |
| Корпус | 672-BBGA (FineLine BGA) |
| Configuration Memory | SRAM, in-system programmable |
| Configuration Schemes | Passive Serial / Active Serial / JTAG (IEEE 1149.1) |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Process Technology | 0.18 µm CMOS |
| Рабочая температура | Commercial (0C to +85C) |
| Speed Grade | C8 |
| PCI Support | PCI-SIG compliant 3.3 V, 33/66 MHz, 32/64-bit |
| External Memory Interface | DDR SDRAM, ZBT SRAM |
| Dedicated Clock Inputs | 16 |
| PLLs | On-chip with clock-doubling and phase-shift |
| LVDS Channels | Up to 32 |
| Тип монтажа | Surface Mount (BGA) |
Конфигурация выводов EP20K600CB672C8N
| Контакт 1 | I/O Bank 1 / VCCIO — MultiVolt I/O bank 1 ball; VCCIO supply for bank 1 |
| Контакт 2 | I/O — User I/O ball in bank 1 |
| Контакт 3 | I/O — User I/O ball in bank 1 |
| Контакт 4 | GND — Ground ball |
| Контакт 5 | I/O — User I/O ball in bank 2 |
| Контакт 6 | I/O — User I/O ball in bank 2 |
| Контакт 7 | VCCINT — Core 2.5 V supply ball |
| Контакт 8 | I/O — User I/O ball in bank 3 |
| Контакт 9 | I/O — User I/O ball in bank 3 |
| Контакт 10 | GND — Ground ball |
| Контакт 11 | I/O — User I/O ball in bank 4 |
| Контакт 12 | I/O — User I/O ball in bank 4 |
| Контакт 13 | VCCIO_BANK4 — MultiVolt I/O supply for bank 4 |
| Контакт 14 | I/O — User I/O ball in bank 5 |
| Контакт 15 | I/O — User I/O ball in bank 5 |
| Контакт 16 | GND — Ground ball |
| Контакт 17 | I/O — User I/O ball in bank 6 |
| Контакт 18 | I/O — User I/O ball in bank 6 |
| Контакт 19 | VCCINT — Core 2.5 V supply ball |
| Контакт 20 | I/O — User I/O ball in bank 7 |
| Контакт 21 | I/O — User I/O ball in bank 7 |
| Контакт 22 | GND — Ground ball |
| Контакт 23 | I/O — User I/O ball in bank 8 |
| Контакт 24 | I/O — User I/O ball in bank 8 |
| Контакт 25 | VCCIO_BANK8 — MultiVolt I/O supply for bank 8 |
| Контакт 26 | I/O — User I/O ball in bank 9 |
| Контакт 27 | I/O — User I/O ball in bank 9 |
| Контакт 28 | GND — Ground ball |
| Контакт 29 | I/O — User I/O ball in bank 10 |
| Контакт 30 | I/O — User I/O ball in bank 10 |
| Контакт 31 | VCCINT — Core 2.5 V supply ball |
| Контакт 32 | I/O — User I/O ball in bank 11 |
| Контакт 33 | I/O — User I/O ball in bank 11 |
| Контакт 34 | GND — Ground ball |
| Контакт 35 | I/O — User I/O ball in bank 12 |
| Контакт 36 | I/O — User I/O ball in bank 12 |
| Контакт 37 | CLK1 — Dedicated clock input 1 |
| Контакт 38 | CLK2 — Dedicated clock input 2 |
| Контакт 39 | I/O — User I/O ball in bank 13 |
| Контакт 40 | I/O — User I/O ball in bank 13 |
| Контакт 41 | GND — Ground ball |
| Контакт 42 | I/O — User I/O ball in bank 14 |
| Контакт 43 | I/O — User I/O ball in bank 14 |
| Контакт 44 | VCCINT — Core 2.5 V supply ball |
| Контакт 45 | I/O — User I/O ball in bank 15 |
| Контакт 46 | I/O — User I/O ball in bank 15 |
| Контакт 47 | GND — Ground ball |
| Контакт 48 | I/O — User I/O ball in bank 16 |
| Контакт 49 | I/O — User I/O ball in bank 16 |
| Контакт 50 | VCCIO_BANK16 — MultiVolt I/O supply for bank 16 |
| Контакт 51 | I/O — User I/O ball in bank 1 |
| Контакт 52 | I/O — User I/O ball in bank 1 |
| Контакт 53 | GND — Ground ball |
| Контакт 54 | I/O — User I/O ball in bank 2 |
| Контакт 55 | I/O — User I/O ball in bank 2 |
| Контакт 56 | VCCINT — Core 2.5 V supply ball |
| Контакт 57 | I/O — User I/O ball in bank 3 |
| Контакт 58 | I/O — User I/O ball in bank 3 |
| Контакт 59 | GND — Ground ball |
| Контакт 60 | I/O — User I/O ball in bank 4 |
| Контакт 61 | I/O — User I/O ball in bank 4 |
| Контакт 62 | CLK3 — Dedicated clock input 3 |
| Контакт 63 | CLK4 — Dedicated clock input 4 |
| Контакт 64 | I/O — User I/O ball in bank 5 |
| Контакт 65 | I/O — User I/O ball in bank 5 |
| Контакт 66 | GND — Ground ball |
| Контакт 67 | I/O — User I/O ball in bank 6 |
| Контакт 68 | I/O — User I/O ball in bank 6 |
| Контакт 69 | VCCINT — Core 2.5 V supply ball |
| Контакт 70 | I/O — User I/O ball in bank 7 |
| Контакт 71 | I/O — User I/O ball in bank 7 |
| Контакт 72 | GND — Ground ball |
| Контакт 73 | I/O — User I/O ball in bank 8 |
| Контакт 74 | I/O — User I/O ball in bank 8 |
| Контакт 75 | MSEL0 — Configuration mode select 0 |
| Контакт 76 | MSEL1 — Configuration mode select 1 |
| Контакт 77 | I/O — User I/O ball in bank 9 |
| Контакт 78 | I/O — User I/O ball in bank 9 |
| Контакт 79 | GND — Ground ball |
| Контакт 80 | I/O — User I/O ball in bank 10 |
| Контакт 81 | I/O — User I/O ball in bank 10 |
| Контакт 82 | VCCINT — Core 2.5 V supply ball |
| Контакт 83 | I/O — User I/O ball in bank 11 |
| Контакт 84 | I/O — User I/O ball in bank 11 |
| Контакт 85 | GND — Ground ball |
| Контакт 86 | nCONFIG — Configuration start (active-low) |
| Контакт 87 | nSTATUS — Configuration status (active-low) |
| Контакт 88 | CONF_DONE — Configuration done (open-drain) |
| Контакт 89 | I/O — User I/O ball in bank 12 |
| Контакт 90 | I/O — User I/O ball in bank 12 |
| Контакт 91 | GND — Ground ball |
| Контакт 92 | TDI — JTAG test data in |
| Контакт 93 | TDO — JTAG test data out |
| Контакт 94 | TCK — JTAG test clock |
| Контакт 95 | TMS — JTAG test mode select |
| Контакт 96 | I/O — User I/O ball in bank 13 |
| Контакт 97 | I/O — User I/O ball in bank 13 |
| Контакт 98 | VCCINT — Core 2.5 V supply ball |
| Контакт 99 | I/O — User I/O ball in bank 14 |
| Контакт 100 | I/O — User I/O ball in bank 14 |
Типичное применение
EP20K600CB672C8N подходит для 7 применениеs: Telecommunication Line Card Datapath, High-Speed Network Switch Fabric, ASIC Prototyping Platform, Industrial Machine Vision Pipeline, DSP Front-End Pre-Processor, Legacy Industrial Controller Backplane, PCI-Based Test & Measurement Card.
Telecommunication Line Card Datapath
The EP20K600CB672C8N's 24,320 logic elements and 508 user I/Os make it well-suited to telecom line card designs that aggregate multiple E1/T1, ATM or SONET streams into a parallel processing fabric. Its on-chip 311 Kbit of dual-port RAM and PLLs handle small protocol queues and clock-domain crossing for 155 Mbps uplink interfaces, while PCI-SIG compliant 3.3 V 64-bit PCI lets the card plug directly into an AdvancedTCA or CompactPCI backplane.
Рекомендуется
High-Speed Network Switch Fabric
When used as a custom switch-fabric controller, the EP20K600CB672C8N provides the wide external memory bus and LVDS channels required to drive 32-bit or 64-bit ZBT SRAM lookup tables at 200 MHz DDR. The MultiVolt I/O allows direct connection to 1.8 V PHY chips while keeping the 2.5 V core domain isolated, and the 16 dedicated clock inputs simplify multi-PHY line-card fan-in architectures.
Рекомендуется
ASIC Prototyping Platform
The APEX-20KC family's 24,320 LEs and 311 Kbit embedded RAM give design teams enough capacity to prototype medium-complexity ASICs at functional speed before tape-out. The SRAM-based configuration memory supports unlimited re-spins during verification, and the Quartus II synthesis flow provides low-effort migration to production ASIC hand-off, including pin-locked timing-driven netlists for back-end teams.
Рекомендуется
Industrial Machine Vision Pipeline
Industrial machine-vision systems use the EP20K600CB672C8N to host Bayer-demosaic, color-matrix and 2D filter pipelines for camera link and GigE-Vision inputs. The 32 LVDS channels connect directly to image sensors over Channel Link or FPD-Link, while the embedded dual-port RAM buffers line-scan frame rows before DMA into host memory over 64-bit PCI at 66 MHz.
Рекомендуется
DSP Front-End Pre-Processor
In wireless base-station front ends, the EP20K600CB672C8N implements digital up/down-conversion (DUC/DDC), crest-factor reduction (CFR) and digital pre-distortion (DPD) datapaths at 122.88 MHz or higher. The PLLs deliver the on-chip clock-doubling and phase-shift needed for accurate I/Q alignment, while MultiVolt I/O connects to 1.8 V DSP coprocessors and 3.3 V ADC/DAC converters on the same board.
Рекомендуется
Legacy Industrial Controller Backplane
Long-lifecycle industrial controllers (PLC, CNC and SCADA I/O concentrators) that were originally designed around APEX-20KC parts continue to source EP20K600CB672C8N for service and obsolescence bridging. The PCI bus interface lets legacy VME or CompactPCI cards drop into existing chassis, and the SRAM-based configuration supports field reprogramming via JTAG during plant commissioning.
Рекомендуется
PCI-Based Test & Measurement Card
Test and measurement PCI cards (logic analyzers, protocol analyzers and high-channel digitizers) leverage the EP20K600CB672C8N's 508 user I/Os as channel fan-in to the host PC. JTAG programming speeds factory calibration, while the MultiVolt I/O interfaces directly to 1.8 V / 2.5 V / 3.3 V probe front ends without external level shifters on the PCB.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP20K600CB672C8N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP20K600CB672C7N | EP20K600CB672C8 | EP20K600CB652C8N | EP20K600CB652C9N |
|---|---|---|---|---|---|
| Package | 672-BBGA | 672-BBGA (same) | 672-BBGA (same) | 652-BBGA (different footprint) | 652-BBGA (different footprint) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded Memory | 311,296 bits | 311,296 bits | 311,296 bits | 311,296 bits | 311,296 bits |
| Maximum User I/O | 508 | 508 | 508 | 424 | 424 |
| Speed Grade | C8 | C7 (slower) | C8 | C8 | C9 (faster) |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS |
Ключевые отличия
- Maximum I/O density in APEX-20KC family (против EP20K600CB652C8N)
- Faster C8 speed grade vs C7 lower-cost tier (против EP20K600CB672C7N)
- Mainstream commercial vs industrial temperature (против EP20K600CB652I8N)
Заметки по проектированию
The 672-ball FineLine BGA has a 1.0 mm pitch that demands microvia PCB technology and at least 8 routing layers for clean signal escape. Use 4-6 signal layers, dedicated ground planes adjacent to every signal layer, and at least 2 power planes for 2.5 V VCCINT and MultiVolt VCCIO domains. Decoupling must include 0.1 µF X7R ceramics within 5 mm of every VCCINT and VCCIO ball pair, plus bulk 10 µF tantalums every 25 mm.
Estimated: at full 24,320-LE utilization on a 0.18 µm process at 2.5 V core, the EP20K600CB672C8N can dissipate up to 4 W. With a theta-JA of approximately 8 C/W on a 4-layer JEDEC test board and forced-air cooling (1 m/s), junction temperature rise over 25C ambient is ~32C. Add copper thermal pads under the central BGA region and, if junction is expected above +110C, derate utilization or apply a heat spreader.
Do not use modern Quartus Prime to compile APEX-20KC designs - device support ended with Quartus II Service Pack 2. JTAG pinout must follow the 1.8 V / 2.5 V / 3.3 V VCCIO ramp sequence documented in the APEX-20KC datasheet, otherwise the configuration EPROM may not load the bitstream. Configuration mode pins MSEL0/MSEL1 must be pulled to valid logic levels at power-up to avoid contention on the configuration bus.
Dedicate one routing layer to ground reference for every high-speed LVDS pair to maintain 100 ohm differential impedance and minimize EMI. Place 100 ohm LVDS termination resistors within 7 mm of the receiver balls; place source-series resistors at the driver balls for slew-rate control. DDR SDRAM address/command traces must be length-matched within ±25 ps, and clock-to-DQS skew must be tuned per the APEX-20KC external memory interface guidelines.
Информация о соответствии
RoHS/REACH compliance not stated in available distributor data; the part predates modern compliance documentation and was last actively designed-in prior to the Intel/Altera transition. AEC-Q100 not applicable for this commercial-temperature FPGA.
