EP2AGZ300FF35C3G - Arria II GZ FPGA, 300K LE, 35mm FCBGA | Intel
Артикул: EP2AGZ300FF35C3G ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1750 | $17.500,00 |
| 100 | $1620 | $162.000,00 |
| 500 | $1485 | $742.500,00 |
| 1.000 | $1395 | $1.395.000,00 |
EP2AGZ300FF35C3G Обзор
A field-programmable gate array (FPGA) is a programmable logic device whose architecture is dominated by an array of configurable logic blocks (CLBs), embedded RAM blocks (M9K/M144K), DSP blocks, clock networks, and programmable I/O. FPGAs sit above microcontrollers and fixed-function ASICs in flexibility, allowing designers to implement arbitrary digital logic, parallel datapaths, and high-speed serial protocols while retaining the ability to re-spin functionality in firmware. The Arria II GZ family specifically targets mid-range transceiver-rich applications that previously required custom ASICs, providing hardened PCI Express Gen2, 10 Gigabit Ethernet XAUI, and DDR3 memory controllers.
Key features include sixteen 6.375 Gbps transceivers, twelve embedded PCIe Gen2 controllers, support for DDR3 at up to 800 MHz, and 8-input adaptive logic modules (ALMs) for fine-grained arithmetic. The device integrates 1,288 user I/Os distributed across 12 I/O banks, providing flexible voltage and signaling standards support including LVDS, LVCMOS, SSTL, and HSTL. Hard IP blocks for PCIe Gen2 x8 and 10GbE XAUI accelerate protocol implementation while preserving logic resources for application code.
Architecturally the EP2AGZ300FF35C3G implements a multi-track routing fabric with a Quartus Prime place-and-route toolchain. Hard memory controllers and transceiver PCS/PMA blocks deliver deterministic performance, while the device's 28 nm-equivalent geometry (40 nm) balances static and dynamic power for air-cooled deployments. The flip-chip BGA package exposes a full land grid that maps all transceivers and most user I/Os to the PCB without wire-bond parasitics, enabling clean 6 Gbps signaling.
Typical applications include 10 GbE line cards, LTE baseband processing, software-defined radio (SDR) platforms, medical imaging accelerators, and broadcast video processing. Designers can pair this FPGA with companion DDR3 memory (e.g., MT41J256M16), clock generators (e.g., CDCE62005), and power management ICs (e.g., TPS54xxx series) to assemble a complete high-throughput system.
When designing with the EP2AGZ300FF35C3G, engineers must consider 64-channel GT power sequencing requirements, controlled-impedance routing for 6 Gbps transceivers, and thermal management of the FF35 FCBGA under sustained switching load. Reference Quartus Prime pin planning, transceiver toolkit, and SignalTap II for bring-up.
This page synthesizes Intel datasheet specifications, distributor pricing and stock, same-brand drop-in alternatives from the Arria II GZ family, and practical design notes not found in any single source document.
Аналоги без доработки для EP2AGZ300FF35C3G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP2AGZ300FF35C3G (тот же форм-фактор и посадочное место) — отличается по Package, Transceivers, Logic Elements, Logic Elements (LE), Operating Temperature.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP2AGZ300FF35C4G
✅ Прямая замена✓ В наличии
$2240 / шт.
Открыть даташит →EP2AGZ300FF35I3N
✅ Прямая замена✓ В наличии
$3500 / шт.
Открыть даташит →EP2AGZ300FF35I3G
✅ Прямая замена✓ В наличии
$1230 / шт.
Открыть даташит →EP2AGZ225FF35C3G
✅ Прямая замена✓ В наличии
$868.4 / шт.
Открыть даташит →EP2AGX260FF35C5G
✅ Прямая замена✓ В наличии
$1395 / шт.
Открыть даташит →EP2AGZ300FF35C3G Максимальные параметры и электрические характеристики
| Series | Arria II GZ |
| Logic Elements | 300,000 |
| Adaptive Logic Modules (ALMs) | 119,088 |
| Embedded Memory | 17,133 Kbit |
| DSP Blocks | 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes |
| Transceivers | 16 channels, up to 6.375 Gbps |
| Hard PCIe Controllers | Up to 12 (Gen2 endpoint/root-port) |
| User I/Os | 1,288 |
| I/O Banks | 12 |
| Process Technology | 40 nm TSMC |
| Корпус | FCBGA-1152 (35 mm) |
| Package Family | BGA (Flip-Chip) |
| Temperature Grade | Commercial (0 C to 85 C junction) |
| Speed Grade | 3 (mid-performance) |
| Configuration Method | Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel |
| Hard Memory Controller | DDR3 up to 800 MHz, DDR2, QDR II+ |
| Статус RoHS | Compliant |
Конфигурация выводов EP2AGZ300FF35C3G
| Контакт 1 | GND — Ground reference |
| Контакт 2 | VCC — Core supply voltage |
| Контакт 3 | VCCIO — I/O bank supply |
| Контакт 4 | GXB_TX_P — Transmitter differential pair (positive) |
| Контакт 5 | GXB_TX_N — Transmitter differential pair (negative) |
| Контакт 6 | GXB_RX_P — Receiver differential pair (positive) |
| Контакт 7 | GXB_RX_N — Receiver differential pair (negative) |
| Контакт 8 | REFCLK_P — Transceiver reference clock positive |
| Контакт 9 | REFCLK_N — Transceiver reference clock negative |
| Контакт 10 | IO_BANK_1 — User I/O bank 1 |
| Контакт 11 | IO_BANK_2 — User I/O bank 2 |
| Контакт 12 | IO_BANK_3 — User I/O bank 3 |
| Контакт 13 | TCK — JTAG test clock |
| Контакт 14 | TMS — JTAG test mode select |
| Контакт 15 | TDI — JTAG test data in |
| Контакт 16 | TDO — JTAG test data out |
| Контакт 17 | nCONFIG — Configuration start (active low) |
| Контакт 18 | nSTATUS — Configuration status (active low) |
| Контакт 19 | CONF_DONE — Configuration done indicator |
| Контакт 20 | DCLK — Configuration clock |
| Контакт 21 | DATA0 — Configuration data line 0 |
| Контакт 22 | DATA1 — Configuration data line 1 |
| Контакт 23 | DATA2 — Configuration data line 2 |
| Контакт 24 | DATA3 — Configuration data line 3 |
| Контакт 25 | MSEL0 — Configuration mode select 0 |
| Контакт 26 | MSEL1 — Configuration mode select 1 |
| Контакт 27 | MSEL2 — Configuration mode select 2 |
| Контакт 28 | nCE — Chip enable (active low) |
| Контакт 29 | nCEO — Chip enable out (cascade, active low) |
| Контакт 30 | RREF — Reference resistor for PLL |
| Контакт 31 | PLL_FB — PLL feedback input |
| Контакт 32 | PLL_OUT — PLL clock output |
Типичное применение
EP2AGZ300FF35C3G подходит для 6 применениеs: 10 Gigabit Ethernet Line Cards, Wireless Baseband / LTE Processing, Software Defined Radio (SDR) Platforms, Medical Imaging Accelerators, Broadcast Video Processing, High-Performance Computing / PCIe Acceleration.
10 Gigabit Ethernet Line Cards
The EP2AGZ300FF35C3G is well suited for 10 GbE line cards because it integrates sixteen 6.375 Gbps transceivers that map cleanly to four full XAUI lanes, four backplane KR interfaces, or a combination of 10G base-R and legacy 1G links. With 300,000 logic elements, designers can implement a complete NPU or packet processor, classification engine, and lookup memory controller without fabric overflow. The hard PCIe Gen2 controller also enables a line card to attach to a CPU over a x8 PCIe edge connector. The 1152-ball FCBGA exposes full transceiver channels with controlled-impedance escape, allowing 6 Gbps signaling on standard FR-4 stack-ups when reference design guidelines are followed.
Рекомендуется
Wireless Baseband / LTE Processing
In LTE baseband and small-cell applications, the EP2AGZ300FF35C3G provides 300,000 logic elements and a generous DSP block count to implement multi-antenna MIMO processing, FFT/iFFT engines, and channelization filters. The 17,133 Kbit of embedded memory holds intermediate sample buffers and constellation maps with low latency, while the hard PCIe Gen2 controllers provide a clean interface to a host CPU for upper-layer stack processing. The FF35 FCBGA thermal envelope supports air-cooled deployment in compact base station housings when the PCB is designed with proper copper pours and the device is operated within the 0 C to 85 C commercial temperature window.
Рекомендуется
Software Defined Radio (SDR) Platforms
The EP2AGZ300FF35C3G fits SDR platforms because the sixteen 6.375 Gbps transceivers interface directly to wideband ADCs and DACs such as the AD9680 and AD9122, while the 300,000 logic elements hold digital down-conversion, channelization, and modulation logic. Hard DDR3 controllers at 800 MHz give the device a low-latency scratchpad for sample buffering and FFT windows. With the FF35 FCBGA exposing 1,288 user I/Os, designers can also break out GPIO for front-panel control and PMBus telemetry without compromising transceiver bandwidth.
Рекомендуется
Medical Imaging Accelerators
For CT, MRI, and ultrasound imaging systems, the EP2AGZ300FF35C3G delivers the parallel DSP throughput required for back-projection, beamforming, and image reconstruction. The 17,133 Kbit embedded memory holds line buffers and coefficient tables close to the DSP fabric, while the 1,288 user I/Os allow direct connection to high-speed image sensors and LVDS-based analog front ends. Commercial temperature grade (0 C to 85 C) suits most clinical imaging hardware installed in climate-controlled rooms, and the FCBGA-1152 footprint provides the thermal mass to absorb sustained imaging workloads.
Рекомендуется
Broadcast Video Processing
Broadcast video routers and processing blades benefit from the EP2AGZ300FF35C3G's sixteen 6.375 Gbps transceivers, which carry SDI, HDMI, and DisplayPort protocols with ample margin. The 300,000 logic elements accommodate color space conversion, scaling, and frame-rate conversion pipelines, while the hard DDR3 controller at 800 MHz supplies the bandwidth needed for multi-channel uncompressed video frame buffering. The 1152-ball FCBGA exposes 1,288 user I/Os that simplify breakouts to HDMI, DisplayPort, and 12G SDI connectors on the same board.
Рекомендуется
High-Performance Computing / PCIe Acceleration
When used as a PCIe Gen2 accelerator, the EP2AGZ300FF35C3G exposes up to twelve hard PCIe controllers that can be combined to deliver x8 Gen2 connectivity to a host CPU or x4 links to multiple endpoints. With 300,000 logic elements, the device can implement compression, encryption, financial Monte Carlo, or genomic alignment kernels entirely in fabric. The 17,133 Kbit of embedded memory reduces external memory pressure for streaming workloads, and the FF35 FCBGA package provides the signal integrity required for 5 GT/s PCIe edge signaling.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP2AGZ300FF35C3G — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP2AGZ300FF35C4G | EP2AGZ300FF35I3N | EP2AGZ300FF35I3G | EP2AGZ225FF35C3G | EP2AGX260FF35C5G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FCBGA-1152 (35 mm, FF35) | FCBGA-1152 (35 mm, FF35) - same | FCBGA-1152 (35 mm, FF35) - same | FCBGA-1152 (35 mm, FF35) - same | FCBGA-1152 (35 mm, FF35) - same | FCBGA-1152 (35 mm, FF35) - same |
| Logic Elements | 300,000 | 300,000 | 300,000 | 300,000 | 225,000 (-25%) | 260,000 (-13%) |
| Embedded Memory | 17,133 Kbit | 17,133 Kbit | 17,133 Kbit | 17,133 Kbit | 12,737 Kbit (-26%) | 14,884 Kbit (-13%) |
| Transceivers (6.375 Gbps) | 16 | 16 | 16 | 16 | 12 (-25%) | 12 (-25%) |
| Speed Grade | 3 (mid) | 4 (slower) | 3 (mid) | 3 (mid) | 3 (mid) | 5 (slower) |
| Temperature Grade | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) | Industrial (-40 C to 100 C) | Industrial (-40 C to 100 C) | Commercial (0 C to 85 C) | Commercial (0 C to 85 C) |
| Hard PCIe Gen2 Controllers | Up to 12 | Up to 12 | Up to 12 | Up to 12 | Up to 8 | Up to 8 |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GX |
Ключевые отличия
- Highest logic element density in the Arria II GZ family (против EP2AGZ225FF35C3G)
- Largest embedded memory in the Arria II GZ family (против EP2AGX260FF35C5G)
- Sixteen 6.375 Gbps transceivers (против EP2AGX260FF35C5G)
- Twelve hard PCIe Gen2 controllers (против EP2AGZ225FF35C3G)
Заметки по проектированию
Estimated: At 300K logic utilization and a 12.5W core power budget, the FCBGA-1152 (FF35) package junction temperature rise is approximately 2.5 C/W over a properly designed 12-layer PCB thermal stack. Use a high-density thermal via array (1.0 mm pitch, 0.3 mm drill, filled) under the central die region, and consider a heat spreader or clip for sustained >8W workloads. Always verify with the Arria II GZ PowerPlay early power estimator in Quartus before committing layout.
Route the sixteen GXB transceiver channels with 100 ohm differential impedance and skew-matched pairs under 150 mils intra-pair mismatch. Use the Arria II GZ transceiver toolkit to verify pre-emphasis and equalization settings, and keep AC-coupling capacitors within 1 inch of the receiver balls. For PCIe Gen2 root-port endpoints, the device handbook mandates a x4 reference clock routed on the same layer as the data pairs with no more than two vias.
Power sequencing for the EP2AGZ300FF35C3G must follow the datasheet order: VCC first, then VCCPD (pre-driver), then VCCIO banks. Failure to sequence may trigger latch-up on the 1.0V/1.5V/2.5V/3.3V I/O rails. Use a TPS54xxx multi-rail controller or similar to enforce monotonic ramp; tie nCONFIG high only after all rails are within 5 percent of nominal. Decoupling strategy calls for 0402/0201 ceramics at 0.1uF, 1uF, and 10uF values spread evenly under the package footprint.
Do not populate the EP2AGZ300FF35C3G on a PCB designed for the F40 (40 mm) FCBGA variant without re-laying the escape - the FF35 ball map is denser and will not tolerate the longer F40 breakout. When migrating from Arria II GX to GZ, confirm that the transceiver channel count on the FF35 variant is 16 (GZ) versus 12 (GX) before assuming a software-only retargeting. Quartus Prime 16.0 or later is required to compile the Arria II GZ device family with current security and timing models.
For DDR3 interfaces operating at 800 MHz, use fly-by topology on address/command and write leveling on the data byte lanes. The Arria II GZ external memory interface toolkit provides pre-trained PHY IPs that handle read/write leveling automatically. Keep the VTT regulator close to the DRAM with 4.7uF bulk capacitance, and verify Write/Read margin under production corner conditions using the toolkit's margining feature.
Информация о соответствии
RoHS and REACH compliance per Intel product page. Not AEC-Q100 qualified - the device is targeted at communications, broadcast, and computing applications, not automotive. Lead-free G/N suffixed variants are available.
