Intel

EP2C35F672C7 - Cyclone II FPGA 33K LE 672-BGA | Intel

Артикул: EP2C35F672C7 ✗ Снят с производства
В наличии Отправка в течение 1–3 рабочих дней
1.2 V Vdss 672-BGA (FineLine BGA) Package 7 (commercial) Speed 483,840 bits (105 M4K blocks) Memory
От $119.95 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-08
Оптовые цены
Кол-во Цена за ед. Итого
1 $178.12 $178,12
10 $165.45 $1.654,50
100 $148.2 $14.820,00
500 $132.8 $66.400,00
1.000 $119.95 $119.950,00
ℹ️ Все цены указаны в USD

EP2C35F672C7 Обзор

The Intel (Altera) EP2C35F672C7 is a member of the Cyclone II family of low-cost FPGAs, delivering 33,216 logic elements, 483,840 bits of embedded RAM, and 475 user I/O pins in a 672-ball FineLine BGA package at the commercial speed grade 7. Built on a 90 nm low-k dielectric CMOS process, the Cyclone II family targets high-volume, cost-sensitive applications where ASIC-class integration is uneconomical, and the EP2C35 sits at the upper end of the density range for the series.

An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, embedded memory blocks, phase-locked loops, and a programmable interconnect fabric. The Cyclone II family is positioned within Intel's broader programmable logic hierarchy as the entry-to-mid-range tier, sitting above the original Cyclone and below the Stratix/Arria/Cyclone IV families. FPGAs enable parallel hardware implementation of DSP, glue logic, bus bridging, and custom peripherals that would otherwise require discrete logic or an ASIC.

Key features of the EP2C35F672C7 include four phase-locked loops (PLLs) for clock synthesis and de-skew, 35 embedded 18×18 multipliers enabling up to 250 MHz DSP performance, support for external memory interfaces including DDR, DDR2, and QDRII SRAM, and Nios II embedded processor soft-core compatibility. The device is supported by the Quartus II design software and offers in-system programmability via serial or parallel configuration interfaces. The 672-BGA package exposes the device's full I/O count, enabling parallel data buses and high-speed external memory connections.

The Cyclone II architecture combines look-up-table (LUT)-based logic elements with M4K embedded memory blocks (4 Kbit each, configurable as RAM, ROM, or FIFO). The embedded multipliers are true 18×18 hardware multipliers that accelerate DSP operations such as FIR filters and FFT butterflies without consuming general logic. The PLLs support clock multiplication, division, phase shifting, and external clock feedback, which is essential for source-synchronous memory interfaces and multi-clock-domain designs.

Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment pre-production, telecom line cards, low-cost software-defined radio front-end preprocessing, and education/development platforms. The combination of moderate logic density, embedded multipliers, and high I/O count makes the EP2C35 particularly attractive for designs transitioning from discrete DSP+microcontroller solutions to a single programmable device.

When designing with this device, allocate pin assignments early to match the BGA escape routing on the PCB, and use the Quartus II Pin Planner to verify I/O standards (LVTTL, LVCMOS, SSTL, LVDS) are supported on the chosen banks. The 672-BGA package requires via-in-pad or dog-bone fanout and controlled-impedance traces for high-speed signals. For new designs, evaluate the Cyclone IV E or Cyclone V families for active roadmap continuity, as Cyclone II is a legacy product family.

This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design considerations for the EP2C35F672C7 in a single reference, complementing the official Intel Cyclone II datasheet with cross-vendor substitution data, application context, and PCB layout guidance that engineer-focused product pages typically omit.

Аналоги без доработки для EP2C35F672C7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EP2C35F672C7 (тот же форм-фактор и посадочное место) — отличается по Speed Grade, Package, Process Technology, Operating Temperature, RoHS Status.

Intel
Speed Grade: C6
Process Technology: 90 nm CMOS
Сравнить с EP2C35F672C7 →
Intel
Process Technology: 90 nm CMOS
Operating Temperature: 0°C to 85°C (C6 speed grade, commercial)
RoHS Status: Lead-Free (per distributor listing)
Сравнить с EP2C35F672C7 →
Altera
Speed Grade: -7
Package: 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch
Process Technology: 90 nm CMOS
Сравнить с EP2C35F672C7 →
Altera
Speed Grade: C8 (commercial, 8 ns pin-to-pin)
Package: 672-BGA (FineLine BGA, 1.0 mm pitch)
Process Technology: 90 nm
Сравнить с EP2C35F672C7 →
Altera
Speed Grade: C8
Process Technology: 90 nm
Сравнить с EP2C35F672C7 →
Intel
Speed Grade: 8 (C8 core)
Package: 672-ball FineLine BGA (FBGA)
Process Technology: 90 nm CMOS SRAM
Сравнить с EP2C35F672C7 →
Intel
Speed Grade: 8
Package: 672-BGA (FineLine)
Operating Temperature: -40C to +100C (industrial)
Сравнить с EP2C35F672C7 →
Altera
Speed Grade: -7
Package: 672-ball FineLine BGA (FBGA-672)
Process Technology: 90 nm CMOS with low-k dielectric
Сравнить с EP2C35F672C7 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

EP2C35F672C6

✅ Прямая замена
Intel
📦 672-BGA (FineLine BGA)
Cyclone II · 33,216 · 483,840 · 475 · 2,076 · 70 · 4 · 1.15 V to 1.25 V

✓ В наличии

$95 / шт.

Открыть даташит →

EP2C35F672C6N

✅ Прямая замена
Intel
📦 672-BGA (FineLine BGA)
Cyclone II · 33,216 · 33,216 · 483,840 · 2076 · 33216 · 483840 bit · 475

✓ В наличии

$122.5 / шт.

Открыть даташит →

EP2C35F672C8N

✅ Прямая замена
Altera
📦 672-BGA (FineLine BGA)
Cyclone II · 33216 · 483840 · 475 · 35 · 4 · 90 nm

✓ В наличии

$77.14 / шт.

Открыть даташит →

EP2C35F672I8N

✅ Прямая замена
Intel
📦 672-BGA (FineLine BGA)
Cyclone II · Cyclone II · 33,216 · 483,840 · 35 · 132 · 475 · 4

✓ В наличии

$98.5 / шт.

Открыть даташит →

EP2C35F672C7 Максимальные параметры и электрические характеристики

Series Cyclone II
Logic Elements (LE) 33,216
Embedded Memory Bits 483,840 bits (105 M4K blocks)
User I/O Count 475
Embedded 18x18 Multipliers 35
PLLs 4
Корпус 672-BGA (FineLine BGA)
Speed Grade 7 (commercial)
Process Technology 90 nm low-k CMOS
Core Voltage 1.2 V
Рабочая температура 0C to +85C (commercial)
Configuration Interface Serial (AS) and Parallel (PS)
Memory Interface Support DDR, DDR2, QDRII SRAM
Тип монтажа Surface Mount
Статус RoHS Compliant

Руководство по цоколевке EP2C35F672C7 в корпусе 672-bga (fineline bga)

Цоколевка для EP2C35F672C7 (корпус 672-bga (fineline bga)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 672-bga (fineline bga) для EP2C35F672C7

Нет подробных данных о распиновке для EP2C35F672C7.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

EP2C35F672C7 подходит для 6 применениеs: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio Front-End Preprocessing, Telecom Line Card Glue Logic, Medical Imaging Data Acquisition, Education and FPGA Development Platforms.

🏭

Industrial Motor Control

The EP2C35F672C7 fits industrial motor control because its 33,216 LEs and 35 embedded 18x18 multipliers provide ample DSP throughput for field-oriented control (FOC) algorithms and PWM generation at switching frequencies of 10-20 kHz. The 475 user I/Os support multiple encoder interfaces (QEP, SSI, EnDat), analog feedback channels, and gate-driver control signals. The four PLLs enable precise synchronization between PWM timers and ADC sampling clocks, critical for current-loop stability. Compared to a microcontroller plus external DSP approach, the FPGA consolidates control loops, communication stacks (EtherCAT, CAN), and safety logic in a single device, reducing BOM cost. The commercial temperature grade suits factory-floor enclosures with controlled ambient temperature.

🎥

Video Surveillance and Image Processing

The EP2C35F672C7 supports multi-channel video surveillance with 483,840 bits of embedded RAM serving as line buffers for 720p HD video processing, and the 35 multipliers handle real-time image filtering (Sobel edge detection, motion estimation) at 30 fps. The 475 I/Os accommodate parallel camera interfaces (BT.656, BT.1120, LVDS) and DDR2 memory for frame buffering. The four PLLs generate pixel clocks and memory clocks with low jitter required for clean video capture. Compared to ASIC-based video processors, the FPGA enables algorithm updates in the field and supports multiple video standards (NTSC/PAL/HD-SDI) without hardware changes. The 672-BGA package supports the high pin count required for multi-channel deployments.

🌐

Software-Defined Radio Front-End Preprocessing

The EP2C35F672C7 handles SDR front-end preprocessing where its 33K LEs implement digital down-conversion (DDC) chains, channelization filters, and Fast Fourier Transform (FFT) stages at baseband sample rates up to 100 MSPS. The 35 embedded 18x18 multipliers are essential for the polyphase filter banks and complex mixers used in digital channelizers. The 483 Kbits of embedded RAM store FFT twiddle factors and overlap-save buffers without external memory contention. The four PLLs generate the multiple clock domains needed for ADC sampling, DDC processing, and host interface transfer. The device's commercial speed grade 7 supports the timing closure required for 100 MSPS signal paths, and the Quartus II DSP Builder accelerates filter design.

📞

Telecom Line Card Glue Logic

The EP2C35F672C7 serves as glue logic on telecom line cards where it bridges legacy TDM buses (T1/E1, H.110) to modern packet-based backplanes and provides hardware acceleration for protocol termination. Its 33K LEs implement UTOPIA, POS-PHY, and Serial RapidIO interfaces without external PHY devices, and the 475 I/Os accommodate multiple T1/E1 framers and HDLC controllers. The embedded multipliers handle V.90 modem training sequences and echo-cancellation preprocessing. The 4 PLLs synthesize clocks from the backplane reference and generate the multiple TDM clock domains. The DDR2 memory controller interface allows connection to external packet buffers for traffic management.

💊

Medical Imaging Data Acquisition

The EP2C35F672C7 fits medical imaging front-ends such as ultrasound beamformers and endoscopy video processors where parallel DSP operations on multi-channel data streams are required. The 35 embedded 18x18 multipliers accelerate beamforming delay-and-sum operations across 64-128 channels, while the 483 Kbits of RAM buffer channel data between beamforming stages. The 475 I/Os interface to multi-channel ADC arrays (e.g. 16-channel ultrasound front-ends) and high-speed LVDS links to image-processing host processors. The four PLLs generate the precise phase-shifted clocks required for coherent beamforming. The Cyclone II is used in established FDA-cleared medical devices where design re-validation cost outweighs migration benefits.

🖥️

Education and FPGA Development Platforms

The EP2C35F672C7 is widely deployed on university and training boards (e.g. Altera DE2-115 development kit) where its 33K LEs and 475 I/Os provide sufficient resources for teaching digital design, computer architecture, and embedded systems curricula. The 672-BGA package exposes enough pins for student projects involving memory controllers, VGA/HDMI display interfaces, Ethernet MACs, and GPIO experiments. The 35 embedded multipliers enable DSP lab exercises, and the 4 PLLs demonstrate clock-management concepts. The Quartus II Web Edition (free) supports the EP2C35, making it ideal for cost-sensitive educational deployments. Established lab manuals, reference designs, and student project templates are widely available.

Сводка рекомендуемых товаров

EP4CE40F672 Modern Cyclone IV E drop-in migration target Используется в: Industrial Motor Control AD2S1210 Resolver-to-digital converter for motor position feedback Используется в: Industrial Motor Control MT48LC16M16A2 DDR SDRAM for video frame buffering Используется в: Video Surveillance and Image Processing ADV7180 Video decoder for analog camera input Используется в: Video Surveillance and Image Processing AD9235 12-bit 65 MSPS ADC for IF sampling Используется в: Software-Defined Radio Front-End Preprocessing AD9763 14-bit DAC for baseband reconstruction Используется в: Software-Defined Radio Front-End Preprocessing DS21348 T1/E1 framer for telecom interface Используется в: Telecom Line Card Glue Logic MT48LC32M16A2 DDR SDRAM for packet buffer memory Используется в: Telecom Line Card Glue Logic ADS1271 24-bit delta-sigma ADC for medical signal acquisition Используется в: Medical Imaging Data Acquisition EP4CE75F672 Cyclone IV E migration with more logic for higher channel count Используется в: Medical Imaging Data Acquisition MT48LC4M32B2 SDRAM for processor and display frame buffer Используется в: Education and FPGA Development Platforms 88E1111 Marvell Используется в: Education and FPGA Development Platforms
What is the logic element count of EP2C35F672C7?
The EP2C35F672C7 contains 33,216 logic elements (LEs), placing it at the upper end of the Cyclone II density range. According to the Intel Cyclone II Device Handbook, each LE consists of a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic operations. This density supports medium-complexity designs such as industrial controllers, video pipelines, and multi-channel DSP front-ends.
What is the difference between EP2C35F672C7 and EP2C35F672C8N?
The EP2C35F672C7 is a commercial-temperature (0C to +85C) speed grade 7 device, while the EP2C35F672C8N is speed grade 8 (slower timing margin) with the N suffix indicating lead-free / Pb-free terminations. Both share the same 672-BGA package and 33,216 LEs. Engineers typically select C7 for tighter timing closure and C8N when lead-free compliance is required and additional timing margin is acceptable.
What is the difference between EP2C35F672C7 and EP2C35F672I8N?
The I suffix denotes the industrial temperature range of -40C to +100C versus the commercial 0C to +85C of the C-grade EP2C35F672C7. The I8N variant is speed grade 8 with lead-free terminations, suited for harsh-environment applications. Choose EP2C35F672C7 for indoor commercial products and EP2C35F672I8N for industrial or extended-temperature deployments, accepting the slower speed grade.
Where can I buy EP2C35F672C7 and what is the price?
The EP2C35F672C7 is available through major authorized distributors including DigiKey, Mouser, and Intel-direct channels, with distributor pricing of approximately $178.12 per unit at quantity 1 as of 2026-09-08. LCSC also lists the part from $58.99 in limited stock. Lead time varies by distributor; some channels ship immediately while others require 4-6 week lead time for factory orders.
Is EP2C35F672C7 in stock at distributors?
As of 2026-09-08, distributor stock is limited but available. Heisener lists 6,592 pieces and Intel-direct channels list 7,920 pieces. The Cyclone II family is in NRD (Not Recommended for New Designs) status, so long-term availability is constrained. For new production designs, consider Cyclone IV E or Cyclone V equivalents with active roadmaps and broader distributor stocking.
What is the lead time for EP2C35F672C7 orders?
Lead time for the EP2C35F672C7 varies by distributor channel as of 2026-09-08. Stock distributors such as DigiKey typically ship same-day, while Heisener advertises delivery in 5-7 days for in-stock units. Factory-direct orders from Intel for NRD parts can extend to 4-6 weeks depending on wafer availability. Always confirm lead time at quotation time given the part's NRD status.
EP2C35F672C7 vs LFE3-35EA-7FN672C - which is better for new designs?
The EP2C35F672C7 (Cyclone II, 90 nm) and LFE3-35EA-7FN672C (Lattice ECP3, 65 nm) both target similar mid-density applications, but Lattice's ECP3 uses a more modern 65 nm process offering lower power consumption and SERDES-capable transceivers. However, the LFE3 is in a different package footprint (672-FPBGA with different pinout), so it is NOT a drop-in replacement - PCB redesign would be required. For new designs, consider the Lattice ECP5 or Intel Cyclone V families instead.
When should I choose EP2C35F672C7 over a newer Cyclone IV or Cyclone V?
Choose the EP2C35F672C7 only when maintaining an existing design with proven firmware, where redesign and re-qualification costs outweigh the benefits of a newer device. The Cyclone II is in NRD status with no new silicon revisions. For new designs, the Intel Cyclone IV E (EP4CE) family offers 60 nm process, lower power, and active lifecycle support. The EP2C35F672C7 remains appropriate for legacy industrial and military refresh programs.
What is the best drop-in replacement for EP2C35F672C7 in the same 672-BGA package?
The best drop-in replacements are the EP2C35F672C6 and EP2C35F672C6N, which share the same 672-BGA footprint and Cyclone II silicon with a slower speed grade 6. The C6N variant adds lead-free terminations. Both are pin-to-pin compatible with the EP2C35F672C7 and require no PCB changes. The N suffix on EP2C35F672C6N indicates Pb-free compliance for RoHS-targeted assemblies.
Can EP2C35F672C7 be replaced by a Cyclone IV E device in the same 672-BGA?
No, the Cyclone IV E family (e.g. EP4CE40F672, EP4CE75F672) shares the 672-FBGA package outline but has a different pinout and ball map, so direct drop-in is not supported. PCB redesign and full re-qualification would be required. The Cyclone II to Cyclone IV E transition is a migration path, not a drop-in substitution. Refer to Intel's Cyclone IV Device Migration Guide for the cross-reference design rules.
Where to download EP2C35F672C7 datasheet PDF?
The official datasheet and device handbook for the EP2C35F672C7 can be downloaded from Intel's documentation site at intel.com under the Cyclone II Device Handbook. The handbook contains electrical characteristics, timing models, pinout information, and configuration guidelines. Third-party distributors like DigiKey and Mouser also host datasheet PDFs on their product pages for convenient access.
Where to find EP2C35F672C7 pinout information?
The complete 672-BGA pinout for the EP2C35F672C7 is documented in the Intel Cyclone II Device Handbook, specifically in the pin connection guidelines chapter. The Pin Planner tool in Quartus II software also generates the pinout after I/O assignment. Engineer-friendly visual pinout diagrams are available on the XAIPART product page for this part, derived from the official Intel pin connection guidelines.
What embedded memory does EP2C35F672C7 have?
The EP2C35F672C7 contains 483,840 bits of embedded RAM organized as 105 M4K blocks of 4 Kbits each. Each M4K block can be configured as single-port RAM, simple dual-port RAM, true dual-port RAM, ROM, or FIFO with independent clock domains. This embedded memory supports buffer storage for video line buffers, packet FIFOs, and DSP coefficient storage without consuming external memory bandwidth.
What is the maximum I/O standard supported on EP2C35F672C7?
The EP2C35F672C7 supports LVTTL, LVCMOS, SSTL-2, SSTL-18, HSTL-18, HSTL-15, LVDS, and RSDS I/O standards across its 475 user I/O pins. The I/O banks are organized into 8 banks, each with independent VCCIO supply rails allowing mixed-voltage interfacing. The device supports DDR and DDR2 external memory interfaces with read/write leveling and dedicated DQS phase-shift circuitry.
What are the key specifications of EP2C35F672C7 that engineers should know?
Engineers evaluating the EP2C35F672C7 should know four key facts: 33,216 logic elements for moderate-complexity designs, 483,840 bits of embedded RAM in 105 M4K blocks, 475 user I/O pins supporting LVDS and DDR memory interfaces, and 4 PLLs with 35 embedded 18x18 multipliers for DSP. The 672-BGA package at speed grade 7 is the highest-performance commercial variant of the EP2C35 silicon, but the family is NRD with no new revisions.
What is the best Lattice equivalent for EP2C35F672C7?
The closest Lattice Semiconductor equivalent for the EP2C35F672C7 is the LFE3-35EA-7FN672C, which provides similar logic density in a 672-ball package. However, the LFE3-35EA uses a different pinout (672-FPBGA) and requires PCB redesign - it is NOT a drop-in replacement. For true Lattice drop-in alternatives, the Lattice ECP2M family in 672-FPBGA offers comparable density but with different silicon and toolchain.

Справочные инженерные данные для EP2C35F672C7 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EP2C35F672C7 when you need the highest-performance commercial-temperature variant of the Cyclone II EP2C35 family in the 672-BGA package, and your design has existing firmware and PCB designed for this part. For new designs, migrate to the Cyclone IV E (EP4CE40F672) or Cyclone V family for active roadmap and lower power. Choose the EP2C35F672C6 or EP2C35F672C6N as drop-in replacements if the EP2C35F672C7 is out of stock and 15% slower Fmax is acceptable. Choose the EP2C35F672C8N if lead-free compliance and slower timing margin are both acceptable. Choose the EP2C35F672I8N only for industrial temperature applications. All four alternatives share the 672-BGA package and identical firmware, enabling rapid substitution without PCB changes.

Сравнение с аналогами

Параметр Этот товар EP2C35F672C6 EP2C35F672C6N EP2C35F672C8N EP2C35F672I8N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 672-BGA (FineLine BGA) 672-BGA (FineLine BGA) - same 672-BGA (FineLine BGA) - same 672-BGA (FineLine BGA) - same 672-BGA (FineLine BGA) - same
Logic Elements 33,216 33,216 33,216 33,216 33,216
Embedded Memory (bits) 483,840 483,840 483,840 483,840 483,840
Speed Grade 7 (commercial) 6 (commercial, slower) 6 (commercial, slower, Pb-free) 8 (commercial, slowest) 8 (industrial, slowest)
Temperature Range 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) -40C to +100C (industrial)
Lead-Free / Pb-Free No (standard SnPb) No (standard SnPb) Yes (Pb-free) Yes (Pb-free) Yes (Pb-free)
Lifecycle Status NRND NRND NRND NRND NRND

Ключевые отличия

  • Highest commercial speed grade in EP2C35 family (против EP2C35F672C8N)
  • Same silicon as C6N and C8N alternatives (против EP2C35F672C6N)
  • Commercial temperature vs industrial I-grade (против EP2C35F672I8N)

Заметки по проектированию

The 672-BGA FineLine package requires via-in-pad or dog-bone fanout for signal escape. Use 0.4 mm pitch BGA with microvia technology (stacked or paired microvias) to route signals out of the inner ball grid. Plan PCB stackup with at least 6 layers: top BGA escape, 2 ground planes, 2 signal layers, and bottom for components. Maintain 50 ohm controlled impedance for high-speed signals (LVDS, DDR) and 100 ohm differential impedance for LVDS pairs. Use the Intel Cyclone II Board Design Guidelines for reference stackup recommendations.

The EP2C35F672C7 requires multiple supply rails: VCCINT (1.2 V core), VCCIO (3.3 V, 2.5 V, 1.8 V, or 1.5 V per bank), VCCA_PLL (2.5 V for PLLs), and VCCPD (3.3 V for pre-drivers). Decoupling requires 100 nF X7R ceramic capacitors within 100 mils of every supply pin, plus bulk 10-100 uF tantalum or polymer capacitors on each rail. Estimated: at 50% logic utilization and 100 MHz toggle rate, the core current can reach 1-1.5 A requiring a switching regulator with at least 2 A capacity on VCCINT. Use the Early Power Estimator (EPE) tool in Quartus II for accurate budget.

Common pitfalls with the EP2C35F672C7 include: (1) exceeding I/O bank VCCIO mixing limits - all I/Os in a bank must share the same VCCIO voltage, (2) forgetting to enable the clock multiplexing for PLL cascading which causes lock failures, (3) misconfiguring the configuration mode pins (MSEL) which results in the device not entering user mode, and (4) overlooking the need for a configuration device (EPCS) when using AS mode - the FPGA will not boot without proper serial flash. Always verify the configuration chain with the Quartus II programmer before debugging logic issues.

Estimated: at full logic utilization (~85%) and high toggle rate, the EP2C35F672C7 can dissipate 2-4 W requiring thermal management. The 672-BGA package has a theta_JA of approximately 15-20 C/W on a JEDEC 4-layer test board. For enclosed industrial enclosures with ambient up to 70C, attach a small heatsink or use thermal vias in the BGA land pattern to conduct heat to inner copper planes. Use the Quartus II PowerPlay Power Analyzer to compute accurate dissipation from the actual design utilization.

For DDR and DDR2 external memory interfaces, follow the Cyclone II External Memory Interface Handbook guidelines: use matched-length traces within +/- 25 mils for the byte lane, place series termination resistors (Rs) at the FPGA output for the address/command/clock signals (typically 25-33 ohm), and provide proper VREF decoupling. The DQS phase-shift circuitry requires the PLL to be configured correctly with proper feed-back and external feedback paths. Use the Quartus II TimeQuest timing analyzer with the memory interface IP to validate timing closure before PCB fabrication.

Информация о соответствии

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
No
Без галогенов
Unknown
Конфликтные минералы
Compliant

The base EP2C35F672C7 uses SnPb (lead-containing) terminations and is NOT RoHS compliant. For RoHS compliance, select the EP2C35F672C6N, EP2C35F672C8N, or EP2C35F672I8N variants with the N suffix. REACH compliance is maintained across all variants. The Cyclone II family is NRD (Not Recommended for New Designs) - new designs should target Cyclone IV E or Cyclone V families.

Данные проверены: 2026-09-08 — данные проверены и курируются командой компонентной инженерии XAIPART

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Итого: $0.00 USD
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1
RFQ отправлен
2
Предложение получено
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Заказ оформлен
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Оплата
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Отправлено
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Доставлено
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